EP2157358A2 - Dispositif d'éclairage à semi-conducteur - Google Patents

Dispositif d'éclairage à semi-conducteur Download PDF

Info

Publication number
EP2157358A2
EP2157358A2 EP09166343A EP09166343A EP2157358A2 EP 2157358 A2 EP2157358 A2 EP 2157358A2 EP 09166343 A EP09166343 A EP 09166343A EP 09166343 A EP09166343 A EP 09166343A EP 2157358 A2 EP2157358 A2 EP 2157358A2
Authority
EP
European Patent Office
Prior art keywords
lighting device
light source
semiconductor light
led
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09166343A
Other languages
German (de)
English (en)
Other versions
EP2157358A3 (fr
Inventor
Peter Hummel
Stefan Mannhardt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Publication of EP2157358A2 publication Critical patent/EP2157358A2/fr
Publication of EP2157358A3 publication Critical patent/EP2157358A3/fr
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F21V23/002—Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V27/00—Cable-stowing arrangements structurally associated with lighting devices, e.g. reels 
    • F21V27/02—Cable inlets
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to a lighting device with at least one semiconductor light source and a carrier element for supporting the at least one semiconductor light source.
  • LED light-emitting devices typically have to be cooled in order to avoid overheating of the light-emitting diodes, and are provided with corresponding ones.
  • Heat sinks connected. In order to achieve sufficient convection on the heat sink, the heat sink is usually attached to a lamp outside and thus touched.
  • the heatsinks to touchable surfaces or the LED lighting devices to the heatsink must be electrically isolated and in addition creepage distances and clearances between LED lighting devices and heat sink are observed. This deteriorates the thermal connection of the LED lighting devices and reduces their life.
  • An electrically insulating assembly between an LED lighting device with metal core board and the heat sink is expensive.
  • the installation of the LED lighting device can not be done simply by screwing, for example, taking into account the creepage and clearance, but must be clamped consuming, pressed or glued. This results in a poorer thermal coupling and an increased mechanical effort.
  • the lighting device has at least one semiconductor light source and at least one carrier element for carrying at least one semiconductor light source in each case.
  • the lighting device may be configured as a lamp or light.
  • the semiconductor light source is separated from the carrier element by means of one or more insulating bodies.
  • the lighting device further comprises an at least partially translucent cover, wherein a cavity for receiving the at least one semiconductor light source is formed by the cover and the carrier element.
  • the at least one light source is protected against external influences, in particular against contact by a user, protected on all sides and insulated.
  • the support member is electrically isolated from the at least one light source, this can be mounted without further electrical insulation, for. B. on a heat sink.
  • a complex electrical isolation to a control gear (with the SELV or SELV equivalent components such as an optocoupler) and a spatial separation can be omitted.
  • the operating device can be significantly more space-saving and cost-effective. The no longer required galvanic separation also increases the efficiency of the device.
  • the common base support is preferably a housing for a driver, but may also be another element, for. B. a heat sink, a housing part and so on.
  • a letting device which has at least one labyrinth (that is to say an intertwined, branched or unbranched path system) for passing at least one electrical line into the cavity.
  • labyrinth that is to say an intertwined, branched or unbranched path system
  • an application-independent electrical contacting of the elements in the cavity from outside the cavity through the air and creepage distances is made possible so that no straight-line voltage path to a live point exists.
  • This makes a particularly compact and safe design possible.
  • the support member may, for example, a heat-distributing board, a heat sink and / or a housing have, even in functional combination, for. B. a cooling housing of a lamp ('Luminaire').
  • the board is preferably designed as a metal core board.
  • the board can have thermal vias. For example, since now serving as a carrier element metal core board is touched, it can be mounted on a heat sink in any way, for. B. by means of screws, gluing, clamping or ratcheting. This results in a very good thermal connection.
  • the thermal coupling of the carrier element specifically with a heat sink and / or a circuit board can be improved in particular by a screw, in the case of a heat sink, for example by screwing directly on large cooling surfaces, which has an increased life and light output result.
  • the insulating body has one or more plastic layers and / or one or more ceramic layers.
  • a plastic composite layer ("composite film") of two or more layers or layers is preferred in order to be able to maintain electrical insulation even if one of the layers is damaged.
  • a sufficiently thick simple insulating layer or a plurality of individual insulating layers can be used.
  • the insulating body is preferably made of a thin material, for. B. plastic with a thickness of not more than 0.2 mm.
  • this is only to be understood as an example and depends, inter alia, on the material chosen (ceramic, plastic, etc.), the requirements of the insulation, environmental conditions, etc.
  • a thinner insulation body is usually preferable. As a result, a high insulation is achieved at the same time good shape.
  • a lighting device in which the cover at least one translucent optical element for guiding the at least one light source having outgoing light rays.
  • the at least one optical element preferably comprises a lens and / or a reflector.
  • the labyrinth can be formed at least partially in the carrier element, in the cover or between the carrier element and the cover.
  • a lighting device is preferred in which at least part of the insulating body forms at least part of the labyrinth, preferably as part of a wall of the labyrinth.
  • the labyrinth can preferably also be designed so that it is introduced from below by means of electrically insulating elongated passages / channels laterally to the electrical contacts (or generally to current-carrying elements) in the cavity.
  • a supply line will then run up to contacting first in the channel into the cavity and then turn in the cavity laterally to the contact zone. This prevents a straight path between the outside of the cavity and the live parts therein, and the clearance and creepage distances can be maintained with a sufficiently compact design.
  • the electrically insulating feedthroughs for the connecting lines form part of a housing for a control gear, z. B. an LED driver.
  • the housing and the passages are integral (without gaps, etc., interposed therebetween).
  • these housings, which preferably consist of electrically insulating material, constitute a basic support for the LED device.
  • tested triple-insulated connecting wires which may be prefabricated or not prefabricated, for electrically connecting the electrical or electronic components present in the cavity be used.
  • the insulating body has an upstanding portion of the support member and in which the labyrinth extends at least partially between the upstanding portion and the cover.
  • the insulating body is cup-shaped.
  • the bottom of the bottom of the shell is preferably on the support member, in particular flat, while on the top of the bottom (in the shell) arranged at least one light source, for. B. glued, pressed or clamped, is.
  • the shell edge then corresponds to the upstanding area.
  • a lighting device is preferred in which the semiconductor light source has at least one light-emitting diode.
  • the nature of the at least one light emitting diode is not limited.
  • a lighting device may be preferred in which the semiconductor light source has at least one LED lamp, that is to say a hosed, ready-to-connect LED lighting means.
  • the semiconductor light source has at least one multi-chip LED module which has a plurality of mounted on a common substrate, in particular surface-mounted, LED chips, and optionally further components such.
  • the type of LEDs is not limited.
  • the individual LEDs each monochrome or multicolor, z. B. white, radiate. If there are several light emitting diodes, they can be lit in the same color (monochrome or multicolored) and / or in different colors. So an LED module likes several single LEDs, including single LED chips, ('LED clusters'), which together can give a white mixed light, e.g. B. in 'cold white' or 'warm white'.
  • the LED cluster preferably comprises light-emitting diodes which shine at least in the primary colors red (R), green (G) and blue (B).
  • single or multiple colors can also be generated by several LEDs simultaneously; Combinations RGB, RRGB, RGGB, RGBB, RGGBB etc. are possible.
  • the color combination is not limited to R, G and B (and A).
  • one or more amber LEDs 'amber' (A) may also be present to produce a warm white hue.
  • LEDs with different colors these can also be controlled so that the LED module radiates in a tunable RGB color range.
  • phosphor LED blue chips can also be used, e.g. B. in surface mounting technology z. B. ThInGaN or ThInGAlP technology.
  • an LED module can also have several white single chips, which can be a simple scalability of the luminous flux can be achieved.
  • the individual chips and / or the modules can be equipped with suitable optics for beam guidance (primary optics), z. B. Fresnel lenses, collimators, concentrators and so on.
  • suitable optics for beam guidance primary optics
  • z. B. Fresnel lenses, collimators, concentrators and so on instead of or in addition to inorganic light emitting diodes, z. B. based on InGaN or AlInGaP, organic LEDs (OLEDs) are generally used. Also z. B. diode lasers are used.
  • a lighting device is preferred in which at least one control component, in particular driver, for controlling the at least one semiconductor light source is arranged in the cavity on the carrier element and electrically insulated therefrom.
  • at least one control component in particular driver, for controlling the at least one semiconductor light source is arranged in the cavity on the carrier element and electrically insulated therefrom.
  • at least one electronic element such as a logic module or miniaturized resistors, capacitors, inductors, etc.
  • Such electronic elements may also be mounted on the multi-chip LED module.
  • the semiconductor light source for. B. an LED module, in particular LED multichip module, is insertable into the insulating body, in particular suitable for use.
  • the lighting device preferably also has a, in particular can be operated with mains voltage. Control gear without galvanic isolation between its primary side and its secondary side. Such an operating device achieves a particularly compact design. It is particularly preferred if the lighting device is designed as a lamp or luminaire and the operating device (electrically isolated) can be integrated into a lamp or lamp head, possibly also in a socket of a lamp, etc.
  • This lighting device can be used in any type of luminaire and / or with each protection class. This lighting device can be used in particular like a "standard lamp”.
  • a lighting device which is designed as a retrofit device, for. B. as a retrofit lamp.
  • FIG. 1 shows a lighting device 1, in which a semiconductor light source in the form of a light-emitting diode (LED) 2 is mounted on a cup-shaped, electrically insulating composite plastic film 3 as an insulating body.
  • the composite plastic film 3 in turn sits with a bottom of its bottom surface on a support member in the form of a metal core plate 4, wherein from the bottom laterally revolving one of them upstanding side wall.
  • the LED 2 is thus electrically separated by means of the composite plastic film 3 on the metal core plate 4.
  • a hood-shaped cover 5 is fixed, which surrounds the composite plastic film 3, so that a cavity 6 for receiving the LED 2 is formed by the cover 5 and the metal core board 4.
  • the metal core board 4 thus also carries the cover 5.
  • a driver 7 is mounted on the composite plastic film 3 in a manner analogous to the LED 5, which driver serves to control a supply current to the LED 2.
  • the driver 7 is connected to the LED 2 via an electrical connection line 8.
  • two supply lines 9,10 present are connected to the driver 7 and the LED 2 and are each guided on opposite sides of the cavity 6 to the outside.
  • the bushings are each designed as a labyrinth 11, d. h. That the bushings do not lead straight outward, whereby an air and creepage distance between the outside opening of the labyrinth 11 and the next live point (terminal 12 of the LED 2 on the one hand and terminal of the driver 7 on the other hand) is extended.
  • the clearance and creepage distance is at least 6.5 mm and thus meets the luminaire requirements according to DIN EN 60598-1.
  • the creepage distance and creepage distance can also be designed to be shorter or longer depending on the requirement (safety requirements, voltage level, ambient conditions, etc.).
  • the labyrinth 11 has a lateral passage 13 in the cover 5, which leads into a gap 14 formed circumferentially between the side wall of the cover 5 and the upstanding side wall of the composite plastic film (insulation) 3.
  • the supply lines 9, 10 are led from there to the respective element 2, 7 to be connected.
  • the length of the resulting minimum clearance and creepage distance is composed of the length of the bushing 13, the height of the gap 14 between the bushing 13 and the edge of the composite plastic film 3 and the shortest direct line from the edge to a live point 12 and is more than 6.5 mm in this embodiment.
  • the cover 5 has, above the LED 2, a light-permeable region 15, through which light emitted by the LED 2 can emerge.
  • the light-permeable region 15 has a lens 16 Beam guide, which adapts to its LED 2 side facing the shape of the LED 2 and adheres to this gap a uniform gap width. As a result, the majority of the light emitted by the LED 2 is emitted to the outside.
  • the circumferential side wall 17 of the lens 16 is designed as a reflector.
  • the cover 5 can be screwed by screw holes 18 to the metal core board 4.
  • the metal core board 4 can now be connected without special consideration of an electrical insulation with a cooling body 19 provided with cooling fins, in particular simply screwed.
  • the heat is dissipated here partly by means of noise radiation and partly by means of convection from the heat sink 19.
  • the heat sink 19 is actively cooled by means of a fan 20.
  • the lighting device 1 shown can be used with or without a heat sink 19 as a standalone luminaire ('Luminaire'), or as a lamp for installation in a luminaire.
  • FIG. 2 shows a lighting device 21, in which now a plurality of surface-mounted LED chips, which are outlined for clarity only by means of the individual LED 2, with the driver 7 on a common ceramic AlN substrate ('Submount') 22 are applied. These elements 2,7,22 thus form a multi-chip LED module.
  • This multichip module 2, 7, 22 is now applied to an insulating layer 23 made of ceramic.
  • the metal core board 4 carrying the insulating layer 23 then constitutes the LED module carrier.
  • the cover 5 furthermore has a pressing means in the form of a downward direction (directed towards the cavity 6).
  • At least partially circumferential projection 24 which is dimensioned so that it pushes the substrate 22 down on the insulation 23 in the assembled state of the cover 5 and thus supports or ensures the seat of the multi-chip module 2,7,22.
  • the projection 24 are - not shown here - passages for the supply lines 9,10 available.
  • the LED 2 can correspond to an LED submount with LED chips mounted thereon, the LED submount then resting on an (inner) metal core board 22 as a module carrier, which in turn rests on the insulating body 23 and subsequently on the (outer) Metal core board 4 rests.
  • the lighting device 21 may be configured as a lamp or light.
  • FIG. 3 shows obliquely from the front an LED module substrate 25 of a multi-chip LED module and the substrate 25 fitting receiving cup-shaped insulation 26 of a lighting device 27 according to another embodiment.
  • the LED module substrate 25 here has a hexagonal basic shape, in which instead of the corners of the hexagon ster fashioneren 28 are introduced.
  • the submount mounted thereon with the plurality of white LED chips mounted thereon and corresponding driver logic is not shown on the visible front side of the LED module substrate 25.
  • the LED module substrate 25 is formed as a metal core board.
  • an LED module for example, an LED module of the OSTAR series can be used, which is offered by the company OSRAM Opto Semiconductors GmbH, z. B. type LEW E3A, or an LED module of the type Ariche AX32X1 Fa. Seoul Semiconductor.
  • an insulating body for an LED module in which the LED module can be used, wherein the insulating body surrounds the LED module laterally completely.
  • a side wall of the insulating body preferably surrounds the LED module laterally completely.
  • the insulating body projects beyond the LED module.
  • the insulating body is preferably made in one piece.
  • the Isolation body is preferably completely closed, ie, without feedthroughs.
  • the shape of the cross-sectional contour of the inside of the side wall of the insulating body (here: hexagonal) corresponds to the shape of the outer cross-sectional contour of the LED module or its module carrier, preferably matching.
  • Shown is also a system of insulation body and incorporated therein LEU module.
  • the insulating body 26 is constructed in one piece to achieve good insulation. In the case of a plastic insulating body, it is preferably injection-molded. In the case of a ceramic insulating body 26 preferred here, it is preferably pressed as a one-piece green body and then sintered. It is preferred a material which is both good electrical insulating and good heat conducting, z. B. aluminum nitride (AlN) ceramic having a thermal conductivity of about 180 W / (m ⁇ K).
  • So can be dispensed with a labyrinth, z.
  • a labyrinth, z. Example by dispensing with the upstanding portion (side wall) of the insulator, which may be particularly advantageous for the simple production of a ceramic insulation.
  • a diffractive element and / or a (CPC, CHC, CEC, freeform, etc.) concentrator may also be used for light guidance.
  • the optics can be transparent and / or translucent (opaque).
  • FIG. 4 shows a lighting device 31 according to a third embodiment, in which now in contrast to the in FIG. 1 and FIG. 2
  • the cover 32 is not on the support member 4 (here: a lamp housing or a dedicated heat sink) is attached. Rather, the carrier element 4 and the cover 32 are now jointly on a base support 33, which is designed here as an electrically insulating driver housing for serving as an LED operating device LED driver 34.
  • the supply lines 9, 10 lead from the driver 34 to the LED module or the LED chips 2 used here.
  • the driver 7 of the LED module can then be dispensed with, or the drivers 7 and 34 work in a division of labor, as shown here , Instead of a driver 7 but can still be present another element, for. B. a sensor element.
  • tubular cable bushings 36 For this purpose, the housing 33 on the support side 35 projecting tubular cable bushings 36. These line bushings 36 fit between the support element 4 seated on the support side 35 and the cover 32 resting on the support side 35 and surrounding the support element 4. Alternatively, bushings may be incorporated in the support element 4 and / or in the support surface of the cover 32.
  • the cable bushings 36 thus extend into the cavity 6, is formed by the cover 32 and the support member 4.
  • the feedthroughs 36 form a labyrinth for the supply lines 9, 10, since there is no linear connection to a live part in the cavity; Rather, the respective supply line 9, 10 must extend laterally to the pipe direction after exiting the duct 36.
  • the length of the air and creepage distance is determined in each case firstly by the lateral spacing of the bushings 36 from a live part and secondly by the height of the bushings 36.
  • the cover 32 is now stirred in several pieces and comprises at least one support edge 37, on the light emitting side, a lid 38 is placed.
  • the lid 38 has at least the transparent area 15 analog to FIG. 1 and FIG. 2 on, as well as the substrate 22 of the LED module on the insulation 23 pressing projections 24 or pins.
  • the projections 24 press the substrate 22 on the insulating layer 23 and on the support member 4.
  • the support member 4 can on the support side 35th the driver housing 33 are attached with all suitable types of attachment, for. B. glued, screwed, pressed, etc.
  • the LED module is firmly pressed by simple means.
  • FIG. 5 shows a lighting device 39 according to a fourth embodiment with a similar structure as the lighting device 31 from FIG. 4 which now but now to receive a plurality of separately manufactured LED or, as shown here, LED modules is set up, which are electrically interconnected, for. B. in series, and are supplied via the common driver 34 with power.
  • the cover For receiving a plurality of LED modules, the cover here has a plurality of projections 24 per module position. The LED modules are pressed by the projections 24 onto a common carrier element 4.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
EP09166343A 2008-08-22 2009-07-24 Dispositif d'éclairage à semi-conducteur Withdrawn EP2157358A3 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102008039364A DE102008039364A1 (de) 2008-08-22 2008-08-22 Halbleiter-Leuchtvorrichtung

Publications (2)

Publication Number Publication Date
EP2157358A2 true EP2157358A2 (fr) 2010-02-24
EP2157358A3 EP2157358A3 (fr) 2010-03-24

Family

ID=41254650

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09166343A Withdrawn EP2157358A3 (fr) 2008-08-22 2009-07-24 Dispositif d'éclairage à semi-conducteur

Country Status (4)

Country Link
EP (1) EP2157358A3 (fr)
KR (1) KR20100023758A (fr)
CN (1) CN101655194A (fr)
DE (1) DE102008039364A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202010016472U1 (de) 2009-12-15 2011-03-24 Isensee, Gerrit Ragnar Ulrich Friedrich, Maspalomas Modul zur Simulation einer belegten Sitzkontaktmatte in Fahrzeugen
DE102010038921A1 (de) * 2010-08-04 2012-02-09 Osram Ag Optische Vorrichtung und Beleuchtungseinheit mit optischer Vorrichtung
EP3217084A1 (fr) * 2016-03-10 2017-09-13 H4X e.U. Lampe
IT201800003641A1 (it) * 2018-03-16 2019-09-16 Castaldi Lighting S P A Proiettore ad elevata compattezza.

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010029227A1 (de) * 2010-05-21 2011-11-24 Osram Gesellschaft mit beschränkter Haftung Leuchtvorrichtung
DE102010043295B4 (de) 2010-11-03 2020-10-08 Lisa Dräxlmaier GmbH Lichtemittermodul
DE102010043296B4 (de) 2010-11-03 2020-10-08 Lisa Dräxlmaier GmbH Lichtemittermodul mit Umlenkoptik
DE102011005047B3 (de) 2011-03-03 2012-09-06 Osram Ag Leuchtvorrichtung
CN102679187B (zh) * 2011-03-07 2016-06-01 秦彪 用于照明的led光模组和led芯片
CN102927484B (zh) * 2012-11-26 2013-11-20 殷逢宝 一种大功率led灯具
DE202013103294U1 (de) * 2013-07-23 2014-10-27 Zumtobel Lighting Gmbh LED-Beleuchtungsmodul
DE202014102430U1 (de) 2014-05-23 2015-05-27 Bernd Mitecki Leuchtvorrichtung umfassend mindestens eine Halbleiterlichtquelle und Fassadenleuchtvorrichtung mit mindestens eine Halbleiterlichtquelle
DE102017105722A1 (de) 2017-03-16 2018-09-20 Siteco Beleuchtungstechnik Gmbh LED-Leuchtenmodul mit flächigem Träger für LEDs
CN107218543A (zh) * 2017-07-21 2017-09-29 厦门乾照照明有限公司 一种led投光灯
DE102019100527A1 (de) 2019-01-10 2020-07-16 Hans-Peter Wilfer Abdeckelement zur Abdeckung einer in einer planen Geräteoberfläche verbauten LED
DE102024121162A1 (de) * 2024-07-25 2025-07-17 Diehl Aerospace Gmbh Leuchte für eine Passagierkabine eines Passagierflugzeuges auf Basis eines H-Profils

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9103560U1 (de) * 1991-03-23 1991-06-27 Brökelmann, Jaeger & Busse GmbH & Co, 5760 Arnsberg Lampenfassung, insbesondere für Halogenlampen
DE202007008258U1 (de) 2007-04-30 2007-10-31 Lumitech Produktion Und Entwicklung Gmbh LED-Leuchtmittel

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040120140A1 (en) * 2002-03-27 2004-06-24 Fye Michael E. Illuminated graphics using fluorescing materials
EP1590831A2 (fr) * 2003-02-05 2005-11-02 Acol Technologies S.A. Dispositifs photoemetteurs
US20050077616A1 (en) * 2003-10-09 2005-04-14 Ng Kee Yean High power light emitting diode device
DE202004001720U1 (de) * 2004-02-05 2004-04-08 Lian-Hwau Molding Enterprise Co., Ltd., YungKang Autoleuchte
JP2005347471A (ja) * 2004-06-02 2005-12-15 Seiko Epson Corp 光源装置及びプロジェクタ
ATE465374T1 (de) * 2004-11-01 2010-05-15 Panasonic Corp Lichtemittierendes modul, beleuchtungsvorrichtung und anzeigevorrichtung
US7262438B2 (en) * 2005-03-08 2007-08-28 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. LED mounting having increased heat dissipation
JP3998027B2 (ja) * 2005-07-25 2007-10-24 松下電工株式会社 Ｌｅｄを用いた照明器具
US8465175B2 (en) * 2005-11-29 2013-06-18 GE Lighting Solutions, LLC LED lighting assemblies with thermal overmolding
CN101846247B (zh) * 2005-12-22 2013-04-17 松下电器产业株式会社 具有led的照明器具
US7708452B2 (en) * 2006-06-08 2010-05-04 Lighting Science Group Corporation Lighting apparatus including flexible power supply
TWM304736U (en) * 2006-07-06 2007-01-11 Augux Co Ltd Illuminating source structure for heat dissipation type LED signal lamp
US20080080187A1 (en) * 2006-09-28 2008-04-03 Purinton Richard S Sealed LED light bulb
DE102006048230B4 (de) * 2006-10-11 2012-11-08 Osram Ag Leuchtdiodensystem, Verfahren zur Herstellung eines solchen und Hinterleuchtungseinrichtung

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9103560U1 (de) * 1991-03-23 1991-06-27 Brökelmann, Jaeger & Busse GmbH & Co, 5760 Arnsberg Lampenfassung, insbesondere für Halogenlampen
DE202007008258U1 (de) 2007-04-30 2007-10-31 Lumitech Produktion Und Entwicklung Gmbh LED-Leuchtmittel

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202010016472U1 (de) 2009-12-15 2011-03-24 Isensee, Gerrit Ragnar Ulrich Friedrich, Maspalomas Modul zur Simulation einer belegten Sitzkontaktmatte in Fahrzeugen
DE102010038921A1 (de) * 2010-08-04 2012-02-09 Osram Ag Optische Vorrichtung und Beleuchtungseinheit mit optischer Vorrichtung
DE102010038921B4 (de) * 2010-08-04 2021-03-25 Osram Gmbh Optische Vorrichtung und Beleuchtungseinheit mit optischer Vorrichtung
EP3217084A1 (fr) * 2016-03-10 2017-09-13 H4X e.U. Lampe
AT518330A3 (de) * 2016-03-10 2019-04-15 H4X Eu Leuchte
US10480770B2 (en) 2016-03-10 2019-11-19 H4X E.U. Lamp
AT518330B1 (de) * 2016-03-10 2021-03-15 H4X Eu Leuchte
IT201800003641A1 (it) * 2018-03-16 2019-09-16 Castaldi Lighting S P A Proiettore ad elevata compattezza.

Also Published As

Publication number Publication date
DE102008039364A1 (de) 2010-03-04
EP2157358A3 (fr) 2010-03-24
KR20100023758A (ko) 2010-03-04
CN101655194A (zh) 2010-02-24

Similar Documents

Publication Publication Date Title
EP2157358A2 (fr) Dispositif d'éclairage à semi-conducteur
DE102010043918B4 (de) Halbleiterlampe
EP2499420B1 (fr) Dispositif d'éclairage
DE102013216961B4 (de) Zusammenbau einer Halbleiterlampe aus separat hergestellten Bauteilen
DE102010030702A1 (de) Halbleiterlampe
EP2198196B1 (fr) Lampe
EP2507548B1 (fr) Lamp del pour reequpment
EP2815177B1 (fr) Module d'éclairage
WO2008017652A1 (fr) Lampe
EP2783153B1 (fr) Corps de refroidissement de dispositif d'éclairage à semi-conducteur comprenant des parties en matière plastique
EP2459926A1 (fr) Dispositif d'éclairage et procédé de fabrication d'un dispositif d'éclairage
DE102010029593B4 (de) LED-Modul mit Doppeldiffusor
EP2313683B1 (fr) Dispositif d'éclairage
DE102010003680A1 (de) Halbleiterlampe
DE102014110087A1 (de) Licht emittierendes Modul, Beleuchtungsvorrichtung und Beleuchtungsausstattung
DE102014215939A1 (de) Beleuchtungsvorrichtung und Verfahren zum Herstellen einer solchen
DE102010034664B4 (de) Lichtquelle
DE202013009386U1 (de) Halbleiterleuchtvorrichtung
DE102007056270B4 (de) Beleuchtungseinheit mit einer LED-Lichtquelle
EP2443389A1 (fr) Corps de refroidissement pour éléments luminescents à semi-conducteur
WO2014063975A1 (fr) Dispositif d'éclairage pourvu d'un corps de refroidissement et au moins d'une source lumineuse semi-conductrice
DE102018218175A1 (de) Leuchte und scheinwerfer

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

AX Request for extension of the european patent

Extension state: AL BA RS

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

AX Request for extension of the european patent

Extension state: AL BA RS

17P Request for examination filed

Effective date: 20100621

17Q First examination report despatched

Effective date: 20100715

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: OSRAM AG

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: OSRAM GMBH

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: OSRAM GMBH

RIC1 Information provided on ipc code assigned before grant

Ipc: F21S 8/00 20060101AFI20131213BHEP

Ipc: F21Y 101/02 20060101ALN20131213BHEP

Ipc: H01L 33/00 20100101ALI20131213BHEP

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

INTG Intention to grant announced

Effective date: 20140312

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20140723