EP2248406A4 - Dissipateur thermique - Google Patents

Dissipateur thermique

Info

Publication number
EP2248406A4
EP2248406A4 EP08730843A EP08730843A EP2248406A4 EP 2248406 A4 EP2248406 A4 EP 2248406A4 EP 08730843 A EP08730843 A EP 08730843A EP 08730843 A EP08730843 A EP 08730843A EP 2248406 A4 EP2248406 A4 EP 2248406A4
Authority
EP
European Patent Office
Prior art keywords
heatsink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08730843A
Other languages
German (de)
English (en)
Other versions
EP2248406A1 (fr
Inventor
Shailesh N Joshi
Arthur K Farnsworth
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Development Co LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co LP filed Critical Hewlett Packard Development Co LP
Publication of EP2248406A1 publication Critical patent/EP2248406A1/fr
Publication of EP2248406A4 publication Critical patent/EP2248406A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
EP08730843A 2008-02-27 2008-02-27 Dissipateur thermique Withdrawn EP2248406A4 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2008/055126 WO2009108192A1 (fr) 2008-02-27 2008-02-27 Dissipateur thermique

Publications (2)

Publication Number Publication Date
EP2248406A1 EP2248406A1 (fr) 2010-11-10
EP2248406A4 true EP2248406A4 (fr) 2012-10-24

Family

ID=41016382

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08730843A Withdrawn EP2248406A4 (fr) 2008-02-27 2008-02-27 Dissipateur thermique

Country Status (4)

Country Link
US (1) US20110000649A1 (fr)
EP (1) EP2248406A4 (fr)
CN (1) CN101960938A (fr)
WO (1) WO2009108192A1 (fr)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100071880A1 (en) * 2008-09-22 2010-03-25 Chul-Ju Kim Evaporator for looped heat pipe system
TW201216827A (en) * 2010-10-11 2012-04-16 Hon Hai Prec Ind Co Ltd Disk drive bracket and disk drive assembly
US11454454B2 (en) 2012-03-12 2022-09-27 Cooler Master Co., Ltd. Flat heat pipe structure
TWI503072B (zh) * 2013-06-17 2015-10-01 Nat Univ Tainan 含有多孔性材料之微通道散熱座之通道最佳尺寸設計方法
CN104902728B (zh) * 2014-03-03 2019-02-05 联想(北京)有限公司 一种电子设备和散热件
US9532485B2 (en) * 2014-02-21 2016-12-27 Lenovo (Beijing) Co., Ltd. Heat dissipating device and electronic apparatus
CN104847476B (zh) * 2014-06-04 2017-07-11 北汽福田汽车股份有限公司 散热单元、散热器及发动机冷却系统
CN104075604A (zh) * 2014-07-17 2014-10-01 芜湖长启炉业有限公司 多u形热管同腔超导体
CN104266521A (zh) * 2014-10-24 2015-01-07 芜湖长启炉业有限公司 插入式超导散热拐
US20170156240A1 (en) * 2015-11-30 2017-06-01 Abb Technology Oy Cooled power electronic assembly
CN107044790A (zh) * 2016-02-05 2017-08-15 讯凯国际股份有限公司 立体传热装置
US10330392B2 (en) 2016-02-05 2019-06-25 Cooler Master Co., Ltd. Three-dimensional heat transfer device
US20180023895A1 (en) * 2016-07-22 2018-01-25 Trane International Inc. Enhanced Tubular Heat Exchanger
US10648745B2 (en) * 2016-09-21 2020-05-12 Thermal Corp. Azeotropic working fluids and thermal management systems utilizing the same
CN106255396B (zh) * 2016-10-18 2019-06-11 中车大连机车研究所有限公司 一种管片式微循环散热器及微循环换热系统
CN106332529B (zh) * 2016-10-18 2019-06-11 中车大连机车研究所有限公司 一种管带式微循环散热器及微循环换热系统
US20180106500A1 (en) * 2016-10-18 2018-04-19 Trane International Inc. Enhanced Tubular Heat Exchanger
CN106304805B (zh) * 2016-10-18 2019-06-11 中车大连机车研究所有限公司 一种板翅式微循环散热器及微循环换热系统
US20180192545A1 (en) * 2017-01-03 2018-07-05 Quanta Computer Inc. Heat dissipation apparatus
US11320211B2 (en) 2017-04-11 2022-05-03 Cooler Master Co., Ltd. Heat transfer device
US10597286B2 (en) 2017-08-01 2020-03-24 Analog Devices Global Monolithic phase change heat sink
US11131511B2 (en) 2018-05-29 2021-09-28 Cooler Master Co., Ltd. Heat dissipation plate and method for manufacturing the same
US20200068745A1 (en) * 2018-08-22 2020-02-27 Asia Vital Components Co., Ltd. Heat dissipation structure of electronic device
TWM575882U (zh) * 2018-11-22 2019-03-21 訊凱國際股份有限公司 外接式水冷裝置
US10760855B2 (en) * 2018-11-30 2020-09-01 Furukawa Electric Co., Ltd. Heat sink
US10677535B1 (en) * 2018-11-30 2020-06-09 Furukawa Electric Co., Ltd. Heat sink
US12331997B2 (en) 2018-12-21 2025-06-17 Cooler Master Co., Ltd. Heat dissipation device having irregular shape
US11913725B2 (en) 2018-12-21 2024-02-27 Cooler Master Co., Ltd. Heat dissipation device having irregular shape
CN109977578B (zh) * 2019-04-03 2020-02-14 北京卫星环境工程研究所 大型板式热沉的cfd结构优化方法
JP6813197B2 (ja) * 2019-04-26 2021-01-13 Ｎｅｃプラットフォームズ株式会社 放熱構造体
FI20195390A1 (en) 2019-05-10 2020-11-11 Teknologian Tutkimuskeskus Vtt Oy Electrical or optical component, coupler and heat transfer system
US11632853B2 (en) * 2021-03-15 2023-04-18 Heatscape.Com, Inc. Heatsink with perpendicular vapor chamber
TWM628143U (zh) * 2022-01-13 2022-06-11 華碩電腦股份有限公司 散熱裝置
TWI828112B (zh) * 2022-04-12 2024-01-01 邁萪科技股份有限公司 散熱模組及其製造方法
CN115711550A (zh) * 2022-11-01 2023-02-24 广州华钻电子科技有限公司 高温热管制备方法及高温热管
EP4677295A1 (fr) * 2023-03-08 2026-01-14 Conflux Technology Pty Ltd Dissipateur de chaleur

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5216580A (en) * 1992-01-14 1993-06-01 Sun Microsystems, Inc. Optimized integral heat pipe and electronic circuit module arrangement
US20050028965A1 (en) * 2003-08-07 2005-02-10 Ching-Chih Chen Combined structure of a thermal chamber and a thermal tower
US20050225943A1 (en) * 2004-04-07 2005-10-13 Delta Electronics, Inc. Heat dissipation module
US20060196640A1 (en) * 2004-12-01 2006-09-07 Convergence Technologies Limited Vapor chamber with boiling-enhanced multi-wick structure

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08340189A (ja) * 1995-04-14 1996-12-24 Nippondenso Co Ltd 沸騰冷却装置
TW556328B (en) * 2001-05-11 2003-10-01 Denso Corp Cooling device boiling and condensing refrigerant
US6626233B1 (en) * 2002-01-03 2003-09-30 Thermal Corp. Bi-level heat sink
US6714413B1 (en) * 2002-10-15 2004-03-30 Delphi Technologies, Inc. Compact thermosiphon with enhanced condenser for electronics cooling
US20050173098A1 (en) * 2003-06-10 2005-08-11 Connors Matthew J. Three dimensional vapor chamber
US7184269B2 (en) * 2004-12-09 2007-02-27 International Business Machines Company Cooling apparatus and method for an electronics module employing an integrated heat exchange assembly
US7193851B2 (en) * 2004-12-09 2007-03-20 Cray Inc. Assemblies for holding heat sinks and other structures in contact with electronic devices and other apparatuses
JP4714638B2 (ja) * 2006-05-25 2011-06-29 富士通株式会社 ヒートシンク

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5216580A (en) * 1992-01-14 1993-06-01 Sun Microsystems, Inc. Optimized integral heat pipe and electronic circuit module arrangement
US20050028965A1 (en) * 2003-08-07 2005-02-10 Ching-Chih Chen Combined structure of a thermal chamber and a thermal tower
US20050225943A1 (en) * 2004-04-07 2005-10-13 Delta Electronics, Inc. Heat dissipation module
US20060196640A1 (en) * 2004-12-01 2006-09-07 Convergence Technologies Limited Vapor chamber with boiling-enhanced multi-wick structure

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2009108192A1 *

Also Published As

Publication number Publication date
WO2009108192A1 (fr) 2009-09-03
EP2248406A1 (fr) 2010-11-10
US20110000649A1 (en) 2011-01-06
CN101960938A (zh) 2011-01-26

Similar Documents

Publication Publication Date Title
FIC20250022I1 (fi) Atetsolitsumabi
FIC20250007I1 (fi) Fidanakogeenielaparvoveekki
EP2248406A4 (fr) Dissipateur thermique
EP2412597A4 (fr) Dissipateur thermique
NL300922I2 (nl) dupilumab
FIC20170031I1 (fi) alirokumabi
EP2339264A4 (fr) Dispositif de réfrigération
BRPI0922878A2 (pt) ventilador
DK3421794T3 (da) Nedkølingsapparat
BRPI0914649A2 (pt) Piprazolo-quinazolinas
EP2264380A4 (fr) Dispositif de refrigeration
DE602008003972D1 (de) Sitzrücklehnungsmechanismus
EP2463903A4 (fr) Dissipateur thermique
DK2342454T3 (da) Vindkraftanlæg
EP2308156A4 (fr) Actionneur à pas
DE602008003970D1 (de) Strahlstromkalibriersystem
EP2257170A4 (fr) Tétrahydrofuropyridones
FI20085425A0 (fi) Sulfaattiesihydrolyysikeittomenetelmä
EP2384285A4 (fr) Couche de découplage de cisaillement de flanc
DK2235452T3 (da) Køleindretning
DE102008019532B8 (de) Ölvormischbrenner
FI20080325A0 (fi) Pihkaliuos
DE502008002554D1 (de) Falztaschenvorrichtung
CR10460S (es) Sink
CR10460U (es) Sink

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20100824

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA MK RS

DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20120921

RIC1 Information provided on ipc code assigned before grant

Ipc: H01L 23/467 20060101ALI20120917BHEP

Ipc: H01L 23/427 20060101AFI20120917BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20130420