EP2289100A2 - Procédé de fabrication d'un module électronique - Google Patents

Procédé de fabrication d'un module électronique

Info

Publication number
EP2289100A2
EP2289100A2 EP09765709A EP09765709A EP2289100A2 EP 2289100 A2 EP2289100 A2 EP 2289100A2 EP 09765709 A EP09765709 A EP 09765709A EP 09765709 A EP09765709 A EP 09765709A EP 2289100 A2 EP2289100 A2 EP 2289100A2
Authority
EP
European Patent Office
Prior art keywords
electronic component
layer
conductive
electronic
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP09765709A
Other languages
German (de)
English (en)
Inventor
Ulrich Schaaf
Andreas Kugler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP2289100A2 publication Critical patent/EP2289100A2/fr
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H05K1/186—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/041—Connecting or disconnecting interconnections to or from leadframes, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H10W70/614—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together the multiple chips being integrally enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7438—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support with parts of the auxiliary support remaining in the finished device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Definitions

  • the invention relates to a method for producing an electronic assembly comprising at least one electronic component and a conductor track structure, with which the at least one electronic component is contacted.
  • Electronic components used to manufacture the electronic package include integrated circuits (IC), for example. These are, for example, in order to encapsulate and increase the land use on the electronic circuit substrate, accommodated in a substrate. As a result, a protection of the electronic components is possible. From US Pat. No. 6,512,182 it is known, for example, to mill receptacles in a printed circuit board substrate into which the electronic components are inserted. After inserting the electronic components, the recordings are filled, then smoothed and overlaminated. By embedding the electronic components, a smooth surface of the electronic assembly can be achieved.
  • IC integrated circuits
  • a disadvantage of this module is that first recordings are milled into the printed circuit board substrate, in which the electronic components are used. An exact positioning of the electronic components is difficult in this way possible.
  • a method for producing an electrical circuit comprising electrical components which are mechanically interconnected by a potting compound is known from DE-A 10 2005 003 125.
  • On at least one side of the potting compound at least one layer of conductor tracks is provided, which electrically connects the components to one another.
  • the components are applied to a carrier film and then encapsulated with a potting compound. Subsequently, the carrier film is removed and on the side on which the components were connected to the carrier film, one or more layers of conductor tracks are applied, which electrically connect the components to one another. In order to ensure a functional interconnection of the However, it must be ensured that the carrier film must be removed without residue.
  • An inventive method for producing an electronic assembly comprising at least one electronic component and a conductor track structure, with which the at least one electronic component is contacted, comprises the following steps:
  • Components with which the printed conductor structure is equipped are, for example, integrated circuits (IC), batteries, solar modules or other electronic components known to the person skilled in the art, which are usually used for the production of electronic assemblies.
  • IC integrated circuits
  • batteries batteries
  • solar modules or other electronic components known to the person skilled in the art, which are usually used for the production of electronic assemblies.
  • a film deformable assemblies can be made for example of a thermoplastic material.
  • the thermoplastic film is, for example, the further film laminated onto the conductive film or a deformable, for example thermoplastic film is used as carrier film, which is connected to the conductive film.
  • the further foil which is laminated onto the conductive foil populated with the at least one electronic component is likewise a conductive foil which is equipped with at least one electronic component.
  • the lamination is preferably carried out in such a way that the electronic components of the two films face each other, so that the conductive films are located on the outside of the layer composite. In this way, the land use can be significantly increased.
  • the layer which is introduced between the two conductive films is a plastic layer.
  • a plastic for example, a thermoplastic is used. However, it is also possible to use any other plastic.
  • the layer which is introduced between the two conductive films is preferably used to fix the components and to ensure the contact.
  • plastic coating can be applied before or after the structuring of the film to form the conductor track structure.
  • the application of the plastic coating prior to structuring of the conductive film has the advantage that a continuous base is maintained by the plastic layer, on which the metal layer is patterned. This can not be done by, for example, careless handling moving or kinking of individual tracks.
  • the conductive foil is not provided with a plastic layer, it is necessary to leave the conductive foil on a support, the structured foil then being handled so carefully that no displacement or kinking of the individual tracks of the structure occurs ,
  • the plastic layer it is also possible, for example, for the plastic layer to be applied to the foil on which the at least one electronic component is positioned only after the conductive foil has been loaded on the side. Furthermore, it is also possible that after loading the conductive foil, a further plastic layer is applied to the foil. In this case, the plastic coating that has been applied before the placement of the conductive foil may be arranged on the side on which the foil has been fitted with the electronic components or on the side of the foil facing away from the components.
  • vias may be introduced for a connection of the conductor track structures structured from the conductive foils.
  • the introduction of the plated-through holes can take place, for example, in that holes are formed and these are then metallized.
  • the plated-through holes it is also possible for the plated-through holes to be produced, for example, by a deep drawing process in which the upper layer of the conductive foil is pressed through the dielectric via a mandrel until it contacts the lower conductive foil.
  • an insulating layer is applied to at least one of the outwardly facing sides of the electronic assembly.
  • the insulating layer is usually made of a dielectric material.
  • Particularly preferred as an insulating layer are plastics.
  • the insulation layer is made of a thermoplastic material.
  • thermoplastics or thermosetting plastics it is alternatively also possible to use, for example, elastomers or ductile silicones for the dielectric and optionally the at least one insulating layer.
  • elastomers or stretchable silicones in conjunction with suitably designed interconnect structures, electronic circuits can be produced which are flexible in all spatial directions.
  • electronic assemblies can also be stretched, for example.
  • a forming force must generally be used for stretching or recalculation and, if appropriate, the electronic assembly should be heated.
  • At least two electronic assemblies are connected together to form a composite layer. Due to the layer composite, more than just two layers of the printed circuit board equipped with electronic components can also be used. structures are interconnected. The individual layers can be electrically contacted by plated-through holes.
  • an electrically conductive foil to be equipped on its upper side and on its lower side with at least one electronic component. In this case, further films are laminated both at the top and at the bottom of the electrically conductive film.
  • a dielectric is introduced in each case between two films.
  • the dielectric is, for example, a plastic or a silicone.
  • the electronic component In order to achieve an improved encapsulation of the electronic component, it is preferable to additionally enclose the electronic component with a molding compound.
  • a molding compound By enclosing the component with a molding compound, for example, an additional stabilization of the electronic component and the contact can be achieved, so that this does not break, for example, in a bending of the electronic assembly.
  • the electronic assembly is formed into a molding in a final step.
  • the forming can be done for example by deep drawing or other forming processes. Forming is possible in particular when a deformable material is used as the dielectric. In order to avoid that electronic components with which the film is loaded, are damaged in the forming process, it is on the one hand possible to design the assembly that no electronic components are applied to bending points or kinks of the molded part. Alternatively, it is also possible, for example, to use flexible electronic components that can be bent, for example.
  • the inventive method by the use of flexible electronics completely flexible and deformable circuits can be produced by the inventive method.
  • the electronic component which is formed into a molded part in a concluding step, can also be used, for example, as a housing part.
  • the housing parts can be connected, for example, by gluing or embossing with the actual housing and contacted if necessary.
  • FIGS. 1 to 7 show steps of a method for producing an electronic assembly
  • FIG. 8 shows an electronic assembly produced according to the invention.
  • an electrically conductive film 1 is structured to form a conductor track structure.
  • the structuring takes place here only on an electrically conductive layer 3 of the electrically conductive film 1.
  • the electrically conductive layer 3 is applied to an electrically non-conductive layer 5.
  • the electrically non-conductive layer 5 serves as a carrier layer and is not structured.
  • the electrically non-conductive layer 5 is, for example, a plastic layer.
  • As an electrically conductive layer 3 are particularly suitable special metals, for example copper or silver. Also suitable are gold, palladium or laminates, for example NiPdAu.
  • the electrically non-conductive layer 5 may be applied to the electrically conductive layer 3, for example, by lamination or doctoring. The application of the electrically non-conductive layer 5 can take place either after the structuring of the electrically conductive layer 3 or before the structuring of the electrically conductive layer 3.
  • an electrically conductive film 1 which has only one electrically conductive layer 3.
  • the electrically conductive film 1 is equipped with electronic components 9.
  • the loading of the electrically conductive foil 1 takes place, for example, in flip-chip technology.
  • 9 contact points 11 (bumps) are attached to the electronic components.
  • the contact points 11 are pressed through the electrically non-conductive layer so that they contact the conductor track structure 7, which has been structured from the electrically conductive layer 3.
  • the electrically non-conductive layer 5 can serve here simultaneously as a connection medium.
  • connection of the contact points 11 with the conductor track structure 7 takes place, for example, by a temperature and pressure process, for example so-called heatsealing. Also suitable is an NCA process (non-conductive adhesive). Alternatively, it is also possible, for example, to contact the electronic components 9 by a soldering process to the printed conductor structure 7. In this case, for example, acids contained in the electrically non-conductive layer 5 can serve as a flux for the soldering process. As a material for the electrically non-conductive layer 5 is suitable in this case, for example, an epoxy resin.
  • the electrically conductive film 1 consists only of the electrically conductive layer 3 and no electrically non-conductive layer 5 is provided, it is possible to solder the electronic components 9 first with contact points 11 on the wiring pattern 7 and then the electronic component 9 with an adhesive to underfill. Alternatively, so-called ICA bonding (isotropic conductive adhesive) is possible.
  • a second carrier strip 13 can optionally also be produced, for example.
  • the second carrier strip 13 likewise comprises a conductive film 1 with an electrically conductive layer 3, from which a printed conductor structure 7 has been patterned, and an electrically non-conductive layer 5.
  • the electrically non-conductive layer 5 is at least one other structure in another structure applied an electronic component 9, which is provided with a contact point 11.
  • the contact point 11 is pressed through the electrically non-conductive layer 5 and contacts the electronic component 9 with the conductor track structure 7.
  • the first carrier strip 12 and second carrier strip 13 produced in this way can later be connected to form a layer composite.
  • the placement and structure of the conductor tracks of the first carrier strip 12 and of the second carrier strip 13 usually differs.
  • An additional stabilization of the electronic components 9 can be achieved, for example, by enclosing them, as shown in FIG. 4, by a molding compound 15.
  • enclosing the electronic components 9 with the molding compound 15 is only necessary if the electronic components 9 are very sensitive or, for example, even if the carrier strip is to be bent, without the electronic components being bent.
  • the molding compound 15 serves as additional mechanical stabilization.
  • the second carrier strip 13 connected to the first carrier strip 12 is shown in FIG.
  • the first carrier strip 12 and the second carrier strip 13 are connected to one another such that the electrically conductive layer 3 of the two carrier strips 12, 13 lies on the outer side in each case.
  • the electrically non-conductive layer 5 of the first carrier strip 12 and of the second carrier strip 13 forms a dielectric, by which it is avoided that the electrically conductive layers 3, which form the conductor track structure 7, are contacted with one another at undesired positions.
  • the connection of the carrier strips 12, 13 takes place by means of a conventional laminating method known to the person skilled in the art.
  • a dielectric is suitable in this case, for example, a plastic film.
  • the two carrier strips 12, 13 laminated together with the intervening plastic film.
  • the second carrier strip 13 As an alternative to laminating the second carrier strip 13 onto the first carrier strip 12, it is also possible, for example, to laminate a dielectric onto the first carrier strip 12 and to provide only one conductive layer. Furthermore, it is also possible to apply a dielectric to the outside of the electrically conductive layer 3 and to laminate a further electrically conductive layer. In this case, for example, at least one electronic element 9 can also be arranged on the upper side and the lower side of the electrically conductive layer 3. In this case, it is furthermore preferred for the electrically conductive layer 3 to be provided with an electrically nonconductive layer on the second side after structuring to form the conductor track structure 7.
  • the strip conductor structures 7, which have been patterned from the electrically conductive layers 3, can be connected to one another by plated-through holes 17.
  • the through contacts 17 can be produced, for example, by introducing bores into the circuit carrier and then metallizing the bores.
  • the electrically conductive layer 3 of one of the two carrier strips 12, 13 is pressed over a mandrel through the dielectric which is formed by the electrically non-conductive layer 5 until it is the second electrically conductive layer 3 contacted.
  • an insulating layer 19 is preferably applied to the outside.
  • the insulation layer 19 for example, a plastic film can be applied to the layer composite of the first carrier strip 12 and the second carrier strip 13. Alternatively, it is also possible to apply a plastic layer by any other method on the composite layer.
  • the insulation layer 19 which is applied to the outside of the composite layer, can be optionally structured, for example, to be able to attach connectors or cables. This makes it possible to contact the electronic module.
  • this can be embossed in any shape.
  • a flexible film-like circuit This is shown in FIG.
  • electronic components 9 are applied to an electrically conductive foil which has been patterned into a conductor track structure 7, which are enclosed by the molding compound 15 in order to protect it from damage.
  • a dielectric 21 is applied to the layer in order to achieve a uniform layer thickness and a further encapsulation of the electronic components 9.
  • a material for the dielectric 21 a material is selected which is flexible and allows deformation of the layer composite.
  • Such a flexible film-like circuit can be used for example in garments.
  • Such apparel-integrated electronics are useful, for example, in skis or mountaineering equipment, for example, to locate a wearer of such garment that may have been spilled by an avalanche.
  • the electronics can be used, for example, as theft protection. It is also possible, for example, to store product information on a corresponding circuit.
  • circuit is not used as a flexible film-like circuit, it is also possible, for example, to transform the layer composite into a molded part. This is done for example by embossing the layer composite, as shown in Figure 7. As a result, for example, a housing with integrated electronics can be generated.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

L'invention concerne un procédé de fabrication d'un module électronique comportant au moins un composant électronique (9) et une structure de pistes conductrices (7) qui assurent le contact du ou des composants électroniques (9). Selon ce procédé, un film conducteur (1) est structuré pour former la structure de pistes conductrices (7) dans une première étape, puis, dans une deuxième étape, la structure de pistes conductrices (7) est dotée du ou des composants électroniques (9) et, dans une étape finale, un autre film est stratifié sur la face du film conducteur (1) portant le ou les composants électroniques (9).
EP09765709A 2008-06-19 2009-05-25 Procédé de fabrication d'un module électronique Ceased EP2289100A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008002532A DE102008002532A1 (de) 2008-06-19 2008-06-19 Verfahren zur Herstellung einer elektronischen Baugruppe
PCT/EP2009/056286 WO2009153129A2 (fr) 2008-06-19 2009-05-25 Procédé de fabrication d'un module électronique

Publications (1)

Publication Number Publication Date
EP2289100A2 true EP2289100A2 (fr) 2011-03-02

Family

ID=40905909

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09765709A Ceased EP2289100A2 (fr) 2008-06-19 2009-05-25 Procédé de fabrication d'un module électronique

Country Status (6)

Country Link
US (1) US8505198B2 (fr)
EP (1) EP2289100A2 (fr)
JP (1) JP2011524645A (fr)
CN (1) CN102124560B (fr)
DE (1) DE102008002532A1 (fr)
WO (1) WO2009153129A2 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010014579A1 (de) * 2010-04-09 2011-10-13 Würth Elektronik Rot am See GmbH & Co. KG Verfahren zum Herstellen einer elektronischen Baugruppe
DE102010030528A1 (de) * 2010-06-25 2011-12-29 Robert Bosch Gmbh Eingekapseltes Steuerungsmodul für ein Kraftfahrzeug
US10820437B2 (en) * 2016-09-28 2020-10-27 Intel Corporation Flexible packaging for a wearable electronic device
DE102017203381A1 (de) * 2017-03-02 2018-04-05 Robert Bosch Gmbh Mikroelektronische Bauelementanordnung und entsprechendes Herstellungsverfahren
US20230102508A1 (en) * 2020-01-24 2023-03-30 Jyri Kaija Functional Housing Structure for an Electronic Device
DE102021108701A1 (de) 2021-04-08 2022-10-13 Innome Gmbh Sensorbauteil und Verfahren zur Herstellung desselben

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030137045A1 (en) * 2002-01-23 2003-07-24 Matsushita Electric Industrial Co., Ltd. Circuit component built-in module and method of manufacturing the same
US20050006142A1 (en) * 2003-07-09 2005-01-13 Matsushita Electric Industrial Co., Ltd. Circuit board with in-built electronic component and method for manufacturing the same
US20050218491A1 (en) * 2004-03-31 2005-10-06 Alps Electric Co., Ltd. Circuit component module and method of manufacturing the same
US20070099449A1 (en) * 2005-10-31 2007-05-03 Daigo Suzuki Printed circuit board, electronic device, and manufacturing method for printed circuit board

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2816028B2 (ja) * 1991-02-18 1998-10-27 株式会社東芝 半導体装置の製造方法
US5686172A (en) * 1994-11-30 1997-11-11 Mitsubishi Gas Chemical Company, Inc. Metal-foil-clad composite ceramic board and process for the production thereof
JP3359910B2 (ja) * 1998-01-22 2002-12-24 フラウンホーファー−ゲゼルシャフト・ツール・フェルデルング・デル・アンゲヴァンテン・フォルシュング・アインゲトラーゲネル・フェライン マイクロシステム及びマイクロシステムを製造する方法
DE19830540A1 (de) * 1998-07-08 2000-01-13 Siemens Ag Elektronischer Schaltungsträger
JP2000151057A (ja) * 1998-11-09 2000-05-30 Hitachi Ltd 電子部品実装構造体およびその製造方法並びに無線ｉｃカードおよびその製造方法
US6512182B2 (en) 2001-03-12 2003-01-28 Ngk Spark Plug Co., Ltd. Wiring circuit board and method for producing same
JP2005045228A (ja) * 2003-07-09 2005-02-17 Matsushita Electric Ind Co Ltd 光学情報記録媒体とその製造方法
US6928726B2 (en) * 2003-07-24 2005-08-16 Motorola, Inc. Circuit board with embedded components and method of manufacture
TW200539246A (en) 2004-05-26 2005-12-01 Matsushita Electric Industrial Co Ltd Semiconductor device and method for manufacturing the same
DE102005003125A1 (de) 2005-01-21 2006-07-27 Robert Bosch Gmbh Elektrische Schaltung und Verfahren zur Herstellung einer elektrischen Schaltung
DE102006055576A1 (de) * 2006-11-21 2008-05-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Herstellen eines dehnbaren Schaltungsträgers und dehnbarer Schaltungsträger

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030137045A1 (en) * 2002-01-23 2003-07-24 Matsushita Electric Industrial Co., Ltd. Circuit component built-in module and method of manufacturing the same
US20050006142A1 (en) * 2003-07-09 2005-01-13 Matsushita Electric Industrial Co., Ltd. Circuit board with in-built electronic component and method for manufacturing the same
US20050218491A1 (en) * 2004-03-31 2005-10-06 Alps Electric Co., Ltd. Circuit component module and method of manufacturing the same
US20070099449A1 (en) * 2005-10-31 2007-05-03 Daigo Suzuki Printed circuit board, electronic device, and manufacturing method for printed circuit board

Also Published As

Publication number Publication date
WO2009153129A3 (fr) 2010-03-04
WO2009153129A2 (fr) 2009-12-23
JP2011524645A (ja) 2011-09-01
DE102008002532A1 (de) 2009-12-24
US20110138620A1 (en) 2011-06-16
US8505198B2 (en) 2013-08-13
CN102124560B (zh) 2014-05-07
CN102124560A (zh) 2011-07-13

Similar Documents

Publication Publication Date Title
EP2260683B1 (fr) Procédé de fabrication d'un module électronique
DE102011006489B4 (de) Leiterplatte mit eingebautem Halbleiterchip und Verfahren zur Herstellung derselben
DE112004001727B4 (de) Verfahren zur Herstellung eines elektronischen Moduls
DE102009001461A1 (de) Verfahren zur Herstellung einer elektronischen Baugruppe
DE4422216A1 (de) Mehrlagige metallische Leiterplatte und gegossener Baustein
EP1842407A1 (fr) Module de commande
DE102006056363B4 (de) Halbleitermodul mit mindestens zwei Substraten und Verfahren zur Herstellung eines Halbleitermoduls mit zwei Substraten
DE102008043774A1 (de) AVT-Technik mit Transfermolding
EP2289100A2 (fr) Procédé de fabrication d'un module électronique
DE102014107299A1 (de) Chipkartenmodul, Chipkarte, und Verfahren zum Herstellen eines Chipkartenmoduls
EP2852970B1 (fr) Procédé de fabrication d'un module électronique
WO2004003991A2 (fr) Composant electronique encapsule dans un boitier
EP2819492B1 (fr) Composant MID, procédé de fabrication
EP3222125B1 (fr) Module de commande de transmission pour une utilisation dans un milieu contaminant et procédé de fabrication d'un tel module de commande de transmission
WO2009037145A2 (fr) Procédé de production d'un bloc de composants électroniques et bloc de composants électroniques correspondants
DE19800928B4 (de) Gehäuse, insbesondere stapelbares Gehäuse, zur Aufnahme von Bauelementen und Verfahren zu dessen Herstellung
DE19701163A1 (de) Elektrische Schaltung insbesondere für eine Chipkarte
EP2340693B1 (fr) Procédé de fabrication d'un circuit électrique
WO2019001810A1 (fr) Module électronique et procédé de fabrication d'un module électronique
DE10210841B4 (de) Modul und Verfahren zur Herstellung von elektrischen Schaltungen und Modulen
DE10225431A1 (de) Verfahren zur Anschlußkontaktierung von elektronischen Bauelementen auf einem isolierenden Substrat und nach dem Verfahren hergestelltes Bauelement-Modul
WO2008119586A1 (fr) Procédé de fabrication d'un module électronique et module électronique
DE10133959B4 (de) Elektronisches Bauteil mit Halbleiterchip
WO2018210671A1 (fr) Procédé de fabrication d'un composant électronique et composant électronique
DE102007037841A1 (de) Trägermodul und Verfahren zur Herstellung eines Trägermoduls

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20110119

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA RS

DAX Request for extension of the european patent (deleted)
17Q First examination report despatched

Effective date: 20170313

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: ROBERT BOSCH GMBH

REG Reference to a national code

Ref country code: DE

Ref legal event code: R003

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN REFUSED

18R Application refused

Effective date: 20201115