EP2385545A3 - Verfahren und Vorrichtung zum Ultraschallbonden - Google Patents
Verfahren und Vorrichtung zum Ultraschallbonden Download PDFInfo
- Publication number
- EP2385545A3 EP2385545A3 EP11176310A EP11176310A EP2385545A3 EP 2385545 A3 EP2385545 A3 EP 2385545A3 EP 11176310 A EP11176310 A EP 11176310A EP 11176310 A EP11176310 A EP 11176310A EP 2385545 A3 EP2385545 A3 EP 2385545A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- bonding
- ultrasonic
- during
- relates
- detected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
- B23K20/005—Capillary welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00
- B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00 relating to investigating the properties, e.g. the weldability, of materials
- B23K31/125—Weld quality monitoring
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Quality & Reliability (AREA)
- Wire Bonding (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007054626A DE102007054626A1 (de) | 2007-11-12 | 2007-11-12 | Verfahren und Vorrichtung zum Ultraschallbonden |
| EP08850453.5A EP2218097B1 (de) | 2007-11-12 | 2008-11-07 | Verfahren und vorrichtung zum ultraschallbonden |
Related Parent Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP08850453.5A Division-Into EP2218097B1 (de) | 2007-11-12 | 2008-11-07 | Verfahren und vorrichtung zum ultraschallbonden |
| EP08850453.5A Division EP2218097B1 (de) | 2007-11-12 | 2008-11-07 | Verfahren und vorrichtung zum ultraschallbonden |
| EP08850453.5 Division | 2008-11-07 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP2385545A2 EP2385545A2 (de) | 2011-11-09 |
| EP2385545A3 true EP2385545A3 (de) | 2012-05-02 |
| EP2385545B1 EP2385545B1 (de) | 2016-03-02 |
Family
ID=40328775
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP08850453.5A Active EP2218097B1 (de) | 2007-11-12 | 2008-11-07 | Verfahren und vorrichtung zum ultraschallbonden |
| EP11176310.8A Active EP2385545B1 (de) | 2007-11-12 | 2008-11-07 | Verfahren und Vorrichtung zum Ultraschallbonden |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP08850453.5A Active EP2218097B1 (de) | 2007-11-12 | 2008-11-07 | Verfahren und vorrichtung zum ultraschallbonden |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8783545B2 (de) |
| EP (2) | EP2218097B1 (de) |
| JP (2) | JP5583588B2 (de) |
| KR (1) | KR20100087214A (de) |
| CN (2) | CN101911272B (de) |
| DE (1) | DE102007054626A1 (de) |
| MY (1) | MY155362A (de) |
| WO (1) | WO2009062887A1 (de) |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102007054626A1 (de) * | 2007-11-12 | 2009-05-14 | Hesse & Knipps Gmbh | Verfahren und Vorrichtung zum Ultraschallbonden |
| US20100163601A1 (en) * | 2008-12-31 | 2010-07-01 | General Electric Company | Friction weld vibration quality monitoring system |
| US8702882B2 (en) * | 2009-11-09 | 2014-04-22 | GM Global Technology Operations LLC | Method and system for online quality monitoring and control of a vibration welding process |
| US20120074206A1 (en) * | 2010-09-27 | 2012-03-29 | Kulicke And Soffa Industries, Inc. | Methods of forming wire bonds for wire loops and conductive bumps |
| US9604305B2 (en) * | 2011-10-26 | 2017-03-28 | GM Global Technology Operations LLC | Quality status display for a vibration welding process |
| US8757469B2 (en) * | 2011-10-26 | 2014-06-24 | GM Global Technology Operations LLC | Binary classification of items of interest in a repeatable process |
| JP5974472B2 (ja) * | 2011-12-15 | 2016-08-23 | 日産自動車株式会社 | ワイヤボンディング装置およびワイヤボンディング方法 |
| CN103077906B (zh) * | 2013-02-01 | 2017-02-08 | 上海华虹宏力半导体制造有限公司 | 硅片共晶键合检测方法 |
| TWI522257B (zh) * | 2014-07-09 | 2016-02-21 | 原相科技股份有限公司 | 車用安全系統及其運作方法 |
| DE102014116474A1 (de) | 2014-11-11 | 2016-05-12 | Herrmann Ultraschalltechnik Gmbh & Co. Kg | Ultraschallbearbeitungssystem mit Piezokraftsensor |
| DE102015120165A1 (de) * | 2015-11-20 | 2017-05-24 | Kromberg & Schubert Gmbh | Vorrichtung und ein Verfahren zur Überwachung eines Ultraschallschweißprozesses |
| CN105499109B (zh) * | 2015-12-23 | 2017-08-01 | 中国科学院声学研究所东海研究站 | 超声阻垢除垢控制系统 |
| DE102017101736A1 (de) | 2017-01-30 | 2018-08-02 | F&K Delvotec Bondtechnik Gmbh | Verfahren zur Herstellung von Drahtbondverbindungen und Anordnung zur Durchführung des Verfahrens |
| KR102242248B1 (ko) * | 2017-05-02 | 2021-04-20 | 주식회사 엘지화학 | 이차전지의 용접 검사장치 및 검사방법 |
| DE102019109263B4 (de) * | 2019-04-09 | 2021-11-18 | Lisa Dräxlmaier GmbH | Verfahren, eine Messvorrichtung und eine Ultraschallschweißanlage zum zerstörungsfreien Prüfen einer Qualität einer Ultraschallschweißung |
| DE102019109262B4 (de) * | 2019-04-09 | 2025-11-20 | Lisa Dräxlmaier GmbH | VORRICHTUNG UND VERFAHREN ZUM BESTIMMEN EINES ZUSTANDS EINES ULTRASCHALLSCHWEIßPROZESSES |
| DE102019109264C5 (de) * | 2019-04-09 | 2025-07-31 | Lisa Dräxlmaier GmbH | VERFAHREN UND VORRICHTUNG ZUR ÜBERWACHUNG EINER QUALITÄT EINER ULTRASCHALLSCHWEIßUNG |
| JP2021018849A (ja) * | 2019-07-17 | 2021-02-15 | オムロン株式会社 | 予測装置、データ生成装置、予測装置の制御方法、データ生成装置の制御方法、情報処理プログラム、および記録媒体 |
| GB2595710B (en) * | 2020-06-04 | 2022-06-08 | Advance Technical Systems Ltd | Operation analysis |
| EP3960309A1 (de) * | 2020-08-31 | 2022-03-02 | Siemens Aktiengesellschaft | Resonanzverfahren für ein schwingungssystem, einen umrichter, eine anregungseinheit und das schwingungssystem |
| CN113029933B (zh) * | 2021-02-26 | 2021-11-16 | 广东利元亨智能装备股份有限公司 | 焊接质量检测系统及超声波焊接设备、焊接质量检测方法 |
| CN113023484B (zh) * | 2021-03-03 | 2022-10-04 | 福建泳力泰针织机械有限公司 | 一种改良式大圆机送纱机构 |
| US11501116B1 (en) * | 2021-07-19 | 2022-11-15 | Sas Institute Inc. | Quality prediction using process data |
| CN114510468A (zh) * | 2022-01-26 | 2022-05-17 | 高德软件有限公司 | 数据处理方法及计算机程序产品 |
| CN116738141A (zh) * | 2022-12-29 | 2023-09-12 | 上海骄成超声波技术股份有限公司 | 基于双通道特征的焊接状态的识别方法、装置和电子设备 |
| DE102023204150A1 (de) | 2023-05-04 | 2024-11-07 | Robert Bosch Gesellschaft mit beschränkter Haftung | Verfahren und Vorrichtung zur Qualitätskontrolle einer Wirebond-Verbindung |
| CN117491403B (zh) * | 2023-11-03 | 2024-08-09 | 北京霍里思特科技有限公司 | 用于测定煤灰分值的方法、灰分仪和存储介质 |
| CN117600926A (zh) * | 2023-12-06 | 2024-02-27 | 无锡市科尼格电梯配件有限公司 | 基于声波辅助的电梯导轨表面精整工艺 |
| CN119682220B (zh) * | 2024-12-13 | 2025-08-26 | 广州多优家居用品有限公司 | 一种可调节的超声波缝合机的智能控制方法、设备及系统 |
| CN119536192B (zh) * | 2025-01-22 | 2025-10-24 | 深圳中宝新材科技有限公司 | 基于聚类分析模型的智能键合铜丝的功率控制方法及系统 |
| CN120471242B (zh) * | 2025-07-17 | 2025-10-10 | 深圳市宇斯特电子有限公司 | 一种陶瓷线路板的制备工艺优化方法及装置 |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3458921A (en) * | 1965-07-19 | 1969-08-05 | Western Electric Co | Short pulse vibratory bonding |
| DE3429776A1 (de) * | 1984-08-13 | 1986-02-13 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur qualitaetskontrolle beim ultraschallschweissen sowie zugehoerige vorrichtung |
| EP0247291A2 (de) * | 1986-05-30 | 1987-12-02 | Crestek, Inc. | Kontrollgerät zur Überwachung der Güte von mittels Ultraschall hergestellten unlösbaren Verbindungen an Drähten und Verfahren |
| EP0275877A2 (de) * | 1987-01-21 | 1988-07-27 | Siemens Aktiengesellschaft | Überwachung von Bondparametern während des Bondvorganges |
| US4998664A (en) * | 1989-12-22 | 1991-03-12 | Hughes Aircraft Company | Bond signature analyzer |
| WO1999019107A1 (de) * | 1997-10-13 | 1999-04-22 | Hesse & Knipps Gmbh | Verfahren zur qualitätskontrolle |
| WO2002070185A1 (de) * | 2001-03-02 | 2002-09-12 | Robert Bosch Gmbh | Verfahren zum prüfen von durch ultraschall-drahtbonden hergestellten verbindungen |
| WO2006032316A1 (de) * | 2004-09-17 | 2006-03-30 | Hesse & Knipps Gmbh | Ultraschalltransducer mit einem in der lagerung angeordneten sensor |
| EP1897648A1 (de) * | 2006-09-05 | 2008-03-12 | Technische Universität Berlin | Verfahren und Vorrichtung zur Regelung der Herstellung von Drahtbondverbindungen |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3852999A (en) * | 1969-12-29 | 1974-12-10 | Uthe Technology | Impedance measuring network |
| US3794236A (en) * | 1973-05-07 | 1974-02-26 | Raytheon Co | Monitoring and control means for evaluating the performance of vibratory-type devices |
| FR2302172A1 (fr) * | 1975-02-27 | 1976-09-24 | Podselver Michel | Perfectionnements aux appareils de soudage avec pression |
| US4606490A (en) | 1982-08-24 | 1986-08-19 | Asm Assembly Automation Limited | Apparatus and method for automatic evaluation of a bond created by an ultrasonic transducer |
| US4599899A (en) * | 1985-02-14 | 1986-07-15 | Caterpillar Tractor Co. | Apparatus and method for controlling a sonic device |
| US4606409A (en) * | 1985-06-10 | 1986-08-19 | Baker Oil Tools, Inc. | Fluid pressure actuated firing mechanism for a well perforating gun |
| JPH0777229B2 (ja) * | 1988-10-28 | 1995-08-16 | 株式会社新川 | 超音波ワイヤボンディング装置 |
| GB8826488D0 (en) | 1988-11-11 | 1988-12-14 | Emhart Deutschland | Quality control for wire bonding |
| JP2708222B2 (ja) * | 1989-03-31 | 1998-02-04 | 株式会社東芝 | ボンディング装置 |
| EP0540189B1 (de) | 1991-10-30 | 1997-01-15 | F & K Delvotec Bondtechnik GmbH | Steuerungssystem |
| JP2705423B2 (ja) * | 1992-01-24 | 1998-01-28 | 株式会社日立製作所 | 超音波接合装置及び品質モニタリング方法 |
| US5213249A (en) * | 1992-05-29 | 1993-05-25 | International Business Machines Corporation | Ultrasonic adhesion/dehesion monitoring apparatus with power feedback measuring means |
| FR2696166B1 (fr) * | 1992-09-28 | 1994-11-18 | Escher Wyss Ag | Cylindre de guidage d'une bande. |
| JPH07105413B2 (ja) * | 1993-07-30 | 1995-11-13 | 株式会社東芝 | ワイヤボンディング装置 |
| CN1144278C (zh) * | 1998-09-01 | 2004-03-31 | 松下电器产业株式会社 | 压点焊接的判定装置与方法及半导体部件制造装置与方法 |
| US20040076984A1 (en) | 2000-12-07 | 2004-04-22 | Roland Eils | Expert system for classification and prediction of generic diseases, and for association of molecular genetic parameters with clinical parameters |
| KR20030066344A (ko) * | 2002-02-01 | 2003-08-09 | 에섹 트레이딩 에스에이 | 와이어본더로 접합시에 최적의 접합 파라미터들을결정하기 위한 방법 |
| JP3791424B2 (ja) * | 2002-02-15 | 2006-06-28 | 松下電器産業株式会社 | 超音波ボンディング装置及び超音波ボンディング方法 |
| JP4102596B2 (ja) * | 2002-05-17 | 2008-06-18 | 矢崎総業株式会社 | 超音波溶着装置 |
| JP2004047944A (ja) * | 2002-05-22 | 2004-02-12 | Nec Corp | 接合装置および接合の良否判別方法を有する接合方法 |
| JP4434623B2 (ja) * | 2003-05-12 | 2010-03-17 | パナソニック株式会社 | ボンディング装置およびボンディング方法 |
| DE102004022509A1 (de) * | 2004-01-07 | 2005-08-25 | Stapla Ultraschall-Technik Gmbh | Verfahren zum Abquetschen und Abdichten eines Rohres |
| DE102006043605B3 (de) * | 2006-09-16 | 2008-03-27 | Stapla Ultraschalltechnik Gmbh | Verfahren zur Qualitätsüberwachung beim Ultraschallschweißen |
| DE102007054626A1 (de) * | 2007-11-12 | 2009-05-14 | Hesse & Knipps Gmbh | Verfahren und Vorrichtung zum Ultraschallbonden |
-
2007
- 2007-11-12 DE DE102007054626A patent/DE102007054626A1/de not_active Withdrawn
-
2008
- 2008-11-07 CN CN2008801223279A patent/CN101911272B/zh active Active
- 2008-11-07 MY MYPI2010002157A patent/MY155362A/en unknown
- 2008-11-07 CN CN201210028536.5A patent/CN102543792B/zh active Active
- 2008-11-07 EP EP08850453.5A patent/EP2218097B1/de active Active
- 2008-11-07 WO PCT/EP2008/065101 patent/WO2009062887A1/de not_active Ceased
- 2008-11-07 EP EP11176310.8A patent/EP2385545B1/de active Active
- 2008-11-07 KR KR1020107012784A patent/KR20100087214A/ko not_active Withdrawn
- 2008-11-07 JP JP2010533543A patent/JP5583588B2/ja active Active
-
2010
- 2010-05-12 US US12/778,883 patent/US8783545B2/en active Active
-
2013
- 2013-05-17 JP JP2013105142A patent/JP5583821B2/ja active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3458921A (en) * | 1965-07-19 | 1969-08-05 | Western Electric Co | Short pulse vibratory bonding |
| DE3429776A1 (de) * | 1984-08-13 | 1986-02-13 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur qualitaetskontrolle beim ultraschallschweissen sowie zugehoerige vorrichtung |
| EP0247291A2 (de) * | 1986-05-30 | 1987-12-02 | Crestek, Inc. | Kontrollgerät zur Überwachung der Güte von mittels Ultraschall hergestellten unlösbaren Verbindungen an Drähten und Verfahren |
| EP0275877A2 (de) * | 1987-01-21 | 1988-07-27 | Siemens Aktiengesellschaft | Überwachung von Bondparametern während des Bondvorganges |
| US4998664A (en) * | 1989-12-22 | 1991-03-12 | Hughes Aircraft Company | Bond signature analyzer |
| WO1999019107A1 (de) * | 1997-10-13 | 1999-04-22 | Hesse & Knipps Gmbh | Verfahren zur qualitätskontrolle |
| WO2002070185A1 (de) * | 2001-03-02 | 2002-09-12 | Robert Bosch Gmbh | Verfahren zum prüfen von durch ultraschall-drahtbonden hergestellten verbindungen |
| WO2006032316A1 (de) * | 2004-09-17 | 2006-03-30 | Hesse & Knipps Gmbh | Ultraschalltransducer mit einem in der lagerung angeordneten sensor |
| EP1897648A1 (de) * | 2006-09-05 | 2008-03-12 | Technische Universität Berlin | Verfahren und Vorrichtung zur Regelung der Herstellung von Drahtbondverbindungen |
Non-Patent Citations (4)
| Title |
|---|
| BROKELMANN M ET AL: "Bond process monitoring via self-sensing piezoelectric transducers", FREQUENCY CONTROL SYMPOSIUM AND EXPOSITION, 2004. PROCEEDINGS OF THE 2 004 IEEE INTERNATIONAL MONTREAL, CANADA 23-27 AUG. 2004, PISCATAWAY, NJ, USA,IEEE, 23 August 2004 (2004-08-23), pages 125 - 129, XP010784600, ISBN: 978-0-7803-8414-9 * |
| BROKELMANN M ET AL: "Model based development of an integrated sensor-actuator system for online quality monitoring in ultrasonic wire bonding", AD / AEROSPACE DIVISION, AMERICAN SOCIETY OF MECHANICAL ENGINEERS; 2005 ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, IMECE 2005, AMERICAN SOCIETY OF MECHANICAL ENGINEERS / AEROSPACE DIVISION, US; ORLANDO, FL, USA, vol. 70AD, 1 January 2005 (2005-01-01), pages 219 - 226, XP008149932, ISSN: 0733-4230 * |
| DONG ZHANG ET AL: "Monitoring wire bonding via time-frequency analysis of horn vibration", IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, IEEE, PISCATAWAY, NY, US, vol. 26, no. 3, 1 July 2003 (2003-07-01), pages 216 - 220, XP011105046, ISSN: 1521-334X, DOI: 10.1109/TEPM.2003.820800 * |
| WANG QIWEN ET AL: "Neural network model for the wire bonding process", COMPUTERS AND OPERATIONS RESEARCH, OXFORD, GB, vol. 20, no. 8, 1 October 1993 (1993-10-01), pages 879 - 888, XP008149894, ISSN: 0305-0548, [retrieved on 20030520], DOI: 10.1016/0305-0548(93)90108-U * |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2218097B1 (de) | 2016-02-24 |
| JP5583588B2 (ja) | 2014-09-03 |
| MY155362A (en) | 2015-10-15 |
| JP2011503890A (ja) | 2011-01-27 |
| EP2218097A1 (de) | 2010-08-18 |
| US20100280646A1 (en) | 2010-11-04 |
| DE102007054626A1 (de) | 2009-05-14 |
| KR20100087214A (ko) | 2010-08-03 |
| EP2385545A2 (de) | 2011-11-09 |
| EP2385545B1 (de) | 2016-03-02 |
| JP5583821B2 (ja) | 2014-09-03 |
| CN101911272A (zh) | 2010-12-08 |
| WO2009062887A1 (de) | 2009-05-22 |
| CN102543792B (zh) | 2014-11-05 |
| US8783545B2 (en) | 2014-07-22 |
| JP2013153236A (ja) | 2013-08-08 |
| CN101911272B (zh) | 2013-01-02 |
| CN102543792A (zh) | 2012-07-04 |
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