EP2386117A4 - Procédés et applications de mosaïques d'imagerie non planes - Google Patents

Procédés et applications de mosaïques d'imagerie non planes Download PDF

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Publication number
EP2386117A4
EP2386117A4 EP10729657.6A EP10729657A EP2386117A4 EP 2386117 A4 EP2386117 A4 EP 2386117A4 EP 10729657 A EP10729657 A EP 10729657A EP 2386117 A4 EP2386117 A4 EP 2386117A4
Authority
EP
European Patent Office
Prior art keywords
applications
methods
planar imaging
imaging arrays
arrays
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP10729657.6A
Other languages
German (de)
English (en)
Other versions
EP2386117A2 (fr
Inventor
Bassel De Graff
Gilman Callsen
William J. Arora
Roozbeh Ghaffari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MC10 Inc
Original Assignee
MC10 Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/575,008 external-priority patent/US9289132B2/en
Priority claimed from US12/616,922 external-priority patent/US8389862B2/en
Priority claimed from US12/636,071 external-priority patent/US8886334B2/en
Application filed by MC10 Inc filed Critical MC10 Inc
Publication of EP2386117A2 publication Critical patent/EP2386117A2/fr
Publication of EP2386117A4 publication Critical patent/EP2386117A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/024—Manufacture or treatment of image sensors covered by group H10F39/12 of coatings or optical elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/10—Configurations of laterally-adjacent chips
EP10729657.6A 2009-01-12 2010-01-12 Procédés et applications de mosaïques d'imagerie non planes Withdrawn EP2386117A4 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US14414909P 2009-01-12 2009-01-12
US15690609P 2009-03-03 2009-03-03
US12/575,008 US9289132B2 (en) 2008-10-07 2009-10-07 Catheter balloon having stretchable integrated circuitry and sensor array
US12/616,922 US8389862B2 (en) 2008-10-07 2009-11-12 Extremely stretchable electronics
US12/636,071 US8886334B2 (en) 2008-10-07 2009-12-11 Systems, methods, and devices using stretchable or flexible electronics for medical applications
PCT/US2010/020742 WO2010081137A2 (fr) 2009-01-12 2010-01-12 Procédés et applications de mosaïques d'imagerie non planes

Publications (2)

Publication Number Publication Date
EP2386117A2 EP2386117A2 (fr) 2011-11-16
EP2386117A4 true EP2386117A4 (fr) 2017-12-27

Family

ID=42317209

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10729657.6A Withdrawn EP2386117A4 (fr) 2009-01-12 2010-01-12 Procédés et applications de mosaïques d'imagerie non planes

Country Status (3)

Country Link
EP (1) EP2386117A4 (fr)
JP (2) JP2012515436A (fr)
WO (1) WO2010081137A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12178580B2 (en) 2019-12-23 2024-12-31 Alimetry Limited Electrode patch and connection system

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US9123614B2 (en) 2008-10-07 2015-09-01 Mc10, Inc. Methods and applications of non-planar imaging arrays
US9545216B2 (en) 2011-08-05 2017-01-17 Mc10, Inc. Catheter balloon methods and apparatus employing sensing elements
US8389862B2 (en) 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
US8886334B2 (en) 2008-10-07 2014-11-11 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
US9119533B2 (en) 2008-10-07 2015-09-01 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US8097926B2 (en) 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
JP5646492B2 (ja) 2008-10-07 2014-12-24 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． 伸縮可能な集積回路およびセンサアレイを有する装置
WO2011041727A1 (fr) 2009-10-01 2011-04-07 Mc10, Inc. Boîtiers protecteurs avec des circuits électroniques intégrés
EP2681538B1 (fr) 2011-03-11 2019-03-06 Mc10, Inc. Dispositifs intégrés destinés à faciliter des dosages quantitatifs et la pose de diagnostics
US9687196B2 (en) * 2011-04-07 2017-06-27 Sanovas, Inc. Electrically conductive balloon catheter
KR102000302B1 (ko) 2011-05-27 2019-07-15 엠씨10, 인크 전자, 광학, 및/또는 기계 장치 및 시스템, 그리고 이를 제조하기 위한 방법
US9757050B2 (en) 2011-08-05 2017-09-12 Mc10, Inc. Catheter balloon employing force sensing elements
EP3470830A1 (fr) 2011-09-01 2019-04-17 MC10 Inc. Dispositif électronique pour détection d'une condition de tissu
JP6277130B2 (ja) 2011-10-05 2018-02-14 エムシーテン、インコーポレイテッド 医療用の装置およびそれの製造方法
US9226402B2 (en) 2012-06-11 2015-12-29 Mc10, Inc. Strain isolation structures for stretchable electronics
US9247637B2 (en) 2012-06-11 2016-01-26 Mc10, Inc. Strain relief structures for stretchable interconnects
KR20150031324A (ko) 2012-07-05 2015-03-23 엠씨10, 인크 유동 감지를 포함하는 카테터 장치
US9295842B2 (en) 2012-07-05 2016-03-29 Mc10, Inc. Catheter or guidewire device including flow sensing and use thereof
WO2014058473A1 (fr) 2012-10-09 2014-04-17 Mc10, Inc. Électronique conforme intégrée à un article vestimentaire
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
US9706647B2 (en) 2013-05-14 2017-07-11 Mc10, Inc. Conformal electronics including nested serpentine interconnects
JP2016527649A (ja) 2013-08-05 2016-09-08 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． 適合する電子機器を含む可撓性温度センサ
US10467926B2 (en) 2013-10-07 2019-11-05 Mc10, Inc. Conformal sensor systems for sensing and analysis
JP6711750B2 (ja) 2013-11-22 2020-06-17 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． 心臓活動の検知および分析のためのコンフォーマルセンサシステム
CA2935372C (fr) * 2014-01-06 2023-08-08 Mc10, Inc. Systemes et dispositifs electroniques conformes encapsules et procedes de fabrication et d'utilisation de ces derniers
US10485118B2 (en) 2014-03-04 2019-11-19 Mc10, Inc. Multi-part flexible encapsulation housing for electronic devices and methods of making the same
US9810623B2 (en) 2014-03-12 2017-11-07 Mc10, Inc. Quantification of a change in assay
US9591758B2 (en) * 2014-03-27 2017-03-07 Intel Corporation Flexible electronic system with wire bonds
US20160093600A1 (en) * 2014-09-25 2016-03-31 X-Celeprint Limited Compound micro-assembly strategies and devices
US9899330B2 (en) 2014-10-03 2018-02-20 Mc10, Inc. Flexible electronic circuits with embedded integrated circuit die
US10297572B2 (en) 2014-10-06 2019-05-21 Mc10, Inc. Discrete flexible interconnects for modules of integrated circuits
USD781270S1 (en) 2014-10-15 2017-03-14 Mc10, Inc. Electronic device having antenna
WO2016134306A1 (fr) 2015-02-20 2016-08-25 Mc10, Inc. Détection et configuration automatiques de dispositifs à porter sur soi sur la base d'un état, d'un emplacement et/ou d'une orientation sur le corps
WO2016140961A1 (fr) 2015-03-02 2016-09-09 Mc10, Inc. Capteur de transpiration
JP6484133B2 (ja) * 2015-07-09 2019-03-13 日東電工株式会社 配線回路基板の製造方法
JP6491556B2 (ja) * 2015-07-09 2019-03-27 日東電工株式会社 配線回路基板
US10653332B2 (en) 2015-07-17 2020-05-19 Mc10, Inc. Conductive stiffener, method of making a conductive stiffener, and conductive adhesive and encapsulation layers
US10709384B2 (en) 2015-08-19 2020-07-14 Mc10, Inc. Wearable heat flux devices and methods of use
US10300371B2 (en) 2015-10-01 2019-05-28 Mc10, Inc. Method and system for interacting with a virtual environment
CN108289630A (zh) 2015-10-05 2018-07-17 Mc10股份有限公司 用于神经调节和刺激的方法和系统
JP2017134276A (ja) * 2016-01-28 2017-08-03 オリンパス株式会社 撮像装置及びカプセル内視鏡
WO2017147053A1 (fr) 2016-02-22 2017-08-31 Mc10, Inc. Système, dispositif et procédé pour acquisition sur le corps de nœud de capteur et de concentrateur couplés d'informations de capteur
US10277386B2 (en) 2016-02-22 2019-04-30 Mc10, Inc. System, devices, and method for on-body data and power transmission
US10109784B2 (en) * 2016-03-01 2018-10-23 Qualcomm Incorporated Sensor device
CN109310340A (zh) 2016-04-19 2019-02-05 Mc10股份有限公司 用于测量汗液的方法和系统
JP6630639B2 (ja) 2016-07-11 2020-01-15 富士フイルム株式会社 内視鏡
US10447347B2 (en) 2016-08-12 2019-10-15 Mc10, Inc. Wireless charger and high speed data off-loader
WO2018131638A1 (fr) * 2017-01-15 2018-07-19 一般財団法人 総合研究奨励会 Réseau de photodétecteurs
CN106901702B (zh) * 2017-01-25 2020-01-03 巴龙 基于柔性力敏传感元件的定量脉搏波监测装置
US11798901B1 (en) 2018-10-31 2023-10-24 Avery Dennison Retail Information Services Llc Wafer-scale integration with alternative technology wafer processes that can be folded into three-dimensional packaging
CN111243966B (zh) * 2020-01-14 2021-11-05 联合微电子中心有限责任公司 一种柔性传感器制造工艺及柔性传感器
US11123011B1 (en) 2020-03-23 2021-09-21 Nix, Inc. Wearable systems, devices, and methods for measurement and analysis of body fluids
EP3893611A1 (fr) * 2020-04-07 2021-10-13 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO Dépôt contrôlé d'un matériau donneur sur une surface cible

Citations (4)

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JP2001156278A (ja) * 1999-11-26 2001-06-08 Fuji Film Microdevices Co Ltd 固体撮像装置
US20050030408A1 (en) * 2003-07-03 2005-02-10 Fuji Photo Film Co., Ltd. Solid-state image pickup device and optical instrument
WO2008030960A2 (fr) * 2006-09-06 2008-03-13 The Board Of Trustees Of The University Of Illinois Structures à déformation contrôlée dans des interconnexions de semi-conducteurs et des nanomembranes pour dispositifs électroniques étirables
US20080309807A1 (en) * 2007-06-15 2008-12-18 Sharp Kabushiki Kaisha Solid-state image pickup device and electronic apparatus including same

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JP2002190971A (ja) * 2000-12-21 2002-07-05 Olympus Optical Co Ltd 光学装置
WO2003021679A2 (fr) * 2001-09-03 2003-03-13 National Microelectronic Research Centre University College Cork - National University Of Ireland Cork Structure de circuit integre et son procede de fabrication
US7465678B2 (en) * 2003-03-28 2008-12-16 The Trustees Of Princeton University Deformable organic devices
KR101260981B1 (ko) * 2004-06-04 2013-05-10 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 인쇄가능한 반도체소자들의 제조 및 조립방법과 장치
TWI427802B (zh) * 2005-06-02 2014-02-21 美國伊利諾大學理事會 可印刷半導體結構及製造和組合之相關方法
JP2007266380A (ja) * 2006-03-29 2007-10-11 Matsushita Electric Ind Co Ltd 半導体撮像装置およびその製造方法
WO2007116344A1 (fr) * 2006-04-07 2007-10-18 Koninklijke Philips Electronics N.V. Dispositif de circuit integre a deformation elastique
MY149292A (en) * 2007-01-17 2013-08-30 Univ Illinois Optical systems fabricated by printing-based assembly
EP2255378B1 (fr) * 2008-03-05 2015-08-05 The Board of Trustees of the University of Illinois Dispositifs electroniques etirables et pliables

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
JP2001156278A (ja) * 1999-11-26 2001-06-08 Fuji Film Microdevices Co Ltd 固体撮像装置
US20050030408A1 (en) * 2003-07-03 2005-02-10 Fuji Photo Film Co., Ltd. Solid-state image pickup device and optical instrument
WO2008030960A2 (fr) * 2006-09-06 2008-03-13 The Board Of Trustees Of The University Of Illinois Structures à déformation contrôlée dans des interconnexions de semi-conducteurs et des nanomembranes pour dispositifs électroniques étirables
US20080309807A1 (en) * 2007-06-15 2008-12-18 Sharp Kabushiki Kaisha Solid-state image pickup device and electronic apparatus including same

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Title
See also references of WO2010081137A2 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12178580B2 (en) 2019-12-23 2024-12-31 Alimetry Limited Electrode patch and connection system
US12245862B2 (en) 2019-12-23 2025-03-11 Alimetry Limited Electrode patch and connection system

Also Published As

Publication number Publication date
JP2012515436A (ja) 2012-07-05
JP2016006880A (ja) 2016-01-14
WO2010081137A3 (fr) 2010-11-04
EP2386117A2 (fr) 2011-11-16
WO2010081137A2 (fr) 2010-07-15

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RIN1 Information on inventor provided before grant (corrected)

Inventor name: ARORA, WILLIAM, J.

Inventor name: DE GRAFF, BASSEL

Inventor name: GHAFFARI, ROOZBEH

Inventor name: CALLSEN, GILMAN

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