EP2445021A3 - Packung für eine Lichtemittierende Diode (LED) und Fabrikationsmethode - Google Patents

Packung für eine Lichtemittierende Diode (LED) und Fabrikationsmethode Download PDF

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Publication number
EP2445021A3
EP2445021A3 EP11185772A EP11185772A EP2445021A3 EP 2445021 A3 EP2445021 A3 EP 2445021A3 EP 11185772 A EP11185772 A EP 11185772A EP 11185772 A EP11185772 A EP 11185772A EP 2445021 A3 EP2445021 A3 EP 2445021A3
Authority
EP
European Patent Office
Prior art keywords
led
emitting diode
substrate
light emitting
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11185772A
Other languages
English (en)
French (fr)
Other versions
EP2445021A2 (de
Inventor
Wen-Huang Liu
Chung-Che Dan
Yuan-Hsiao Chang
Hung-Jen Kao
Chen-Fu Chu
Hao-Chun Cheng
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SemiLEDs Optoelectronics Co Ltd
Original Assignee
SemiLEDs Optoelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SemiLEDs Optoelectronics Co Ltd filed Critical SemiLEDs Optoelectronics Co Ltd
Publication of EP2445021A2 publication Critical patent/EP2445021A2/de
Publication of EP2445021A3 publication Critical patent/EP2445021A3/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Led Device Packages (AREA)
EP11185772A 2010-10-21 2011-10-19 Packung für eine Lichtemittierende Diode (LED) und Fabrikationsmethode Withdrawn EP2445021A3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/909,367 US20120097985A1 (en) 2010-10-21 2010-10-21 Light Emitting Diode (LED) Package And Method Of Fabrication

Publications (2)

Publication Number Publication Date
EP2445021A2 EP2445021A2 (de) 2012-04-25
EP2445021A3 true EP2445021A3 (de) 2013-02-13

Family

ID=44862596

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11185772A Withdrawn EP2445021A3 (de) 2010-10-21 2011-10-19 Packung für eine Lichtemittierende Diode (LED) und Fabrikationsmethode

Country Status (5)

Country Link
US (1) US20120097985A1 (de)
EP (1) EP2445021A3 (de)
JP (1) JP2012089848A (de)
CN (1) CN102456781A (de)
TW (1) TWI466331B (de)

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US9041019B2 (en) * 2012-10-25 2015-05-26 Flextronics Ap, Llc Method of and device for manufacturing LED assembly using liquid molding technologies
JP6197288B2 (ja) * 2012-12-27 2017-09-20 日亜化学工業株式会社 発光装置およびその製造方法
JP6098200B2 (ja) * 2013-02-05 2017-03-22 旭硝子株式会社 発光素子用基板および発光装置
US9748460B2 (en) 2013-02-28 2017-08-29 Flextronics Ap, Llc LED back end assembly and method of manufacturing
DE102013110320B3 (de) * 2013-09-19 2014-09-25 AEMtec GmbH, Berlin Sensorvorrichtung zur Überwachung eines Schmierstoffzustands sowie Verfahren zur Fertigung der Sensorvorrichtung
US9395067B2 (en) 2013-10-07 2016-07-19 Flextronics Ap, Llc Method of and apparatus for enhanced thermal isolation of low-profile LED lighting fixtures
JP2015165536A (ja) * 2014-03-03 2015-09-17 ウシオ電機株式会社 発光装置および発光モジュール
US10006615B2 (en) 2014-05-30 2018-06-26 Oelo, LLC Lighting system and method of use
US10123603B1 (en) 2015-03-27 2018-11-13 Multek Technologies Limited Diffuse fiber optic lighting for luggage
KR102634692B1 (ko) 2016-02-12 2024-02-08 삼성전자주식회사 반도체 발광 소자 패키지
TWI696300B (zh) 2016-03-15 2020-06-11 晶元光電股份有限公司 半導體裝置及其製造方法
DE102016116298A1 (de) 2016-09-01 2018-03-01 Osram Opto Semiconductors Gmbh Anordnung mit Träger und optoelektronischem Bauelement
JP6769248B2 (ja) * 2016-11-09 2020-10-14 日亜化学工業株式会社 発光装置
DE102017113020B4 (de) * 2017-06-13 2021-07-01 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Herstellung von Halbleiterbauelementen
TW201915818A (zh) * 2017-10-05 2019-04-16 香港商印芯科技股份有限公司 光學識別模組
US20190267525A1 (en) 2018-02-26 2019-08-29 Semicon Light Co., Ltd. Semiconductor Light Emitting Devices And Method Of Manufacturing The Same
JP6974724B2 (ja) 2018-03-08 2021-12-01 日亜化学工業株式会社 発光装置の製造方法
KR102613239B1 (ko) 2018-06-04 2023-12-14 삼성전자주식회사 백색 led 모듈 및 조명 장치
CN110299353B (zh) * 2019-07-24 2024-08-30 江苏欧密格光电科技股份有限公司 一种多波段的微型led发射贴片器件
CN111064073A (zh) * 2019-12-26 2020-04-24 常州纵慧芯光半导体科技有限公司 一种激光器及其制备方法及其应用
CN111769191B (zh) * 2020-07-31 2022-04-08 佛山紫熙慧众科技有限公司 一种紫外led芯片散热复合基板
JP7588547B2 (ja) * 2021-04-16 2024-11-22 スタンレー電気株式会社 半導体発光装置
CN116072791A (zh) * 2022-11-09 2023-05-05 华灿光电（浙江）有限公司 发光器件及其制备方法

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US20100025699A1 (en) * 2008-07-30 2010-02-04 Lustrous International Technology Ltd. Light emitting diode chip package
US20100051984A1 (en) * 2008-09-02 2010-03-04 Scott West Phosphor-Converted LED

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Patent Citations (7)

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Publication number Priority date Publication date Assignee Title
US20050224830A1 (en) * 2004-04-09 2005-10-13 Blonder Greg E Illumination devices comprising white light emitting diodes and diode arrays and method and apparatus for making them
US20080007939A1 (en) * 2006-07-10 2008-01-10 Samsung Electro-Mechanics Co., Ltd. Direct-type backlight unit having surface light source
US20080122123A1 (en) * 2006-11-27 2008-05-29 Siew It Pang Compact LED with a self-formed encapsulating dome
US20080231214A1 (en) * 2007-03-19 2008-09-25 Seoul Semiconductor Co., Ltd. Light emitting device having various color temperature
JP2009164242A (ja) * 2007-12-28 2009-07-23 Hitachi Ltd 光源モジュール、照明装置、及び液晶表示装置
US20100025699A1 (en) * 2008-07-30 2010-02-04 Lustrous International Technology Ltd. Light emitting diode chip package
US20100051984A1 (en) * 2008-09-02 2010-03-04 Scott West Phosphor-Converted LED

Also Published As

Publication number Publication date
TWI466331B (zh) 2014-12-21
EP2445021A2 (de) 2012-04-25
JP2012089848A (ja) 2012-05-10
CN102456781A (zh) 2012-05-16
TW201218435A (en) 2012-05-01
US20120097985A1 (en) 2012-04-26

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