EP2473438A1 - Procédé de réalisation d'un composant micro-mécanique protégé, composant micro-mécanique correspondant et protection pour composant micro-mécanique - Google Patents

Procédé de réalisation d'un composant micro-mécanique protégé, composant micro-mécanique correspondant et protection pour composant micro-mécanique

Info

Publication number
EP2473438A1
EP2473438A1 EP10739911A EP10739911A EP2473438A1 EP 2473438 A1 EP2473438 A1 EP 2473438A1 EP 10739911 A EP10739911 A EP 10739911A EP 10739911 A EP10739911 A EP 10739911A EP 2473438 A1 EP2473438 A1 EP 2473438A1
Authority
EP
European Patent Office
Prior art keywords
substrate
intermediate substrate
cap
perforations
mems
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP10739911A
Other languages
German (de)
English (en)
Inventor
Stefan Pinter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP2473438A1 publication Critical patent/EP2473438A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00333—Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/019—Bonding or gluing multiple substrate layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0118—Bonding a wafer on the substrate, i.e. where the cap consists of another wafer

Definitions

  • the present invention relates to a production method for a capped micromechanical component, a corresponding micromechanical component and cap for a micromechanical component.
  • ME S Micro Electro Mechanical Systems
  • the thin-film capping has developed, which dispenses with a cap wafer and instead forms a cavity or cavern between the micromechanical structures to be exposed and a silicon layer produced by a conventional deposition process as a cap layer ,
  • DE 10 2006 049 259 A1 discloses a method for producing a micromechanical component having a cap layer, wherein a cap layer is deposited on a filling layer and subsequently micropores are produced in the cap layer. Subsequently, the filling layer is removed by gas-phase etching with CIF 3 introduced through the micropores, the selectivity of the etching mixture and the composition of the filling layer being adjusted such that the selectivity with respect to the cap layer is high enough so as not to attack them. After removal of the filling layer, the micropores are sealed by depositing a sealing layer.
  • the production method according to the invention for a capped micromechanical component according to claim 1 and the corresponding micromechanical component according to claim 12 are characterized by low production costs.
  • optical windows or electrical feedthroughs and interconnects can be integrated.
  • the core of the present invention is that in an intermediate substrate, for example a plastic film and two optional adhesive layers, perforations are provided at the locations of the subsequent cavities, for example by punching.
  • the intermediate substrate is then applied to an unpunched cap substrate, e.g. another plastic film, laminated.
  • the material of both substrates, ie cap substrate and intermediate substrate can then be punched out in the composite.
  • the result is a resulting laminate with cavities and through holes.
  • the resulting laminate is finally laminated to the MEMS functional wafer.
  • Ais plastic films for the laminate or the cap substrate and intermediate substrate are, for example, biaxially oriented polyester film (boPET), such as ylar ® , eiinex®, Teonex®, with high dimensional stability even at elevated temperatures.
  • biPET biaxially oriented polyester film
  • metallic layers can be provided on or in the laminate. They are available in opaque and transparent versions in thicknesses of approx.
  • Adhesive layers or protective films can also be applied on one or both sides in the intermediate substrate or lobe substrate. In these adhesive layers or protective films in the intermediate substrate cavities can be miteinge Weggt easily. By already applied to appropriate films adhesive layers no additional process for the application of bonding layers is required. Easier handling is possible if additional protective films are provided. Since such layers are used in electronics for flexible printed circuit boards, they are also available in a solderable version with various coatings (paints, inks, photosensitive emulsions or copper layers for electrical conductors and vias).
  • the substrate film material is not limited to the above-mentioned substances. Of course, other, for example suitable for printed circuit boards materials can be used.
  • the invention offers the advantage that the cap substrate or the intermediate substrate can be realized with very small thicknesses. A simple, fast and inexpensive sawing or otherwise separating is also possible.
  • Wafer aterials is also easily possible.
  • FIGS. 1a-h are schematic cross-sectional views for explaining a manufacturing method for a capped micromechanical device according to a first embodiment of the present invention
  • FIGS. 2 a - e are schematic cross-sectional views for explaining a production method for a canned micromechanical component according to a second embodiment of the present invention. Description of exemplary embodiments
  • FIGS. 1a-h show schematic cross-sectional views for explaining a method of manufacturing a capped micromechanical device according to a first embodiment of the present invention.
  • reference numeral 1 denotes an intermediate substrate which comprises the following components: a plastic film KS, for example of Mylar®, Melinex ® or Teonex ®, a sputtered thereon metal layer 1 made of aluminum, an opening provided on the metal layer M1 first adhesive layer H1 from a Plastic adhesive, a provided under the plastic film KS second adhesive layer H2 of a plastic adhesive, a first protective film S1 on the first adhesive layer H1 and a second protective film S2 on the second adhesive layer H2.
  • Core component of the intermediate substrate 1 is the plastic film KS, the remaining layers are optional.
  • a micro-punching step is then carried out for producing perforations K at the positions at which cavities of the micromechanical component to be masked will later be located.
  • the front side protective film is removed S1 of the intermediate substrate 1, and a cap substrate KD first on this side from a further plastic film, for example, Mylar®, Melinex® or Teonex ®, or a wafer material on the exposed front side Adhesive layer H1 laminated.
  • a further plastic film for example, Mylar®, Melinex® or Teonex ®, or a wafer material on the exposed front side Adhesive layer H1 laminated.
  • Cap substrate KD optionally carries on the upper side also a protective film, which is designated by the reference symbol S3. As a result of this lamination, the cap substrate KD closes the perforations K on the front side VS of the intermediate substrate 1 'freed from the first protective foil SI.
  • passage openings D are subsequently provided in the intermediate substrate 1 'and the laminated cap substrate KD with the protective film S3, which lie laterally offset from the perforations K. These through-holes D should later make contact areas KP of the MEMS functional wafer 3 accessible (compare FIG. 1e).
  • the laminate consisting of the intermediate substrate 1 " which is freed from the second protective film S2, and from the cap ensubstrat KD with respect to the capped MEMS functional wafer 3 aligned with a plurality of components in such a way that the perforations K (of which only one is shown in FIG. 1) form respective cavities over corresponding functional areas FB of the MEMS functional wafer 3.
  • the through holes D are aligned such that they are arranged over corresponding contact regions KP of the MEMS functional wafer 3.
  • a base substrate SS made of glass which is optionally coated with a metal layer M2 of aluminum and an overlying adhesive layer H3 of plastic adhesive, to the back of the
  • Such functional areas FB can, for example, have structures of a micromirror. 1f, the base substrate SS, the MEMS functional wafer 3 and the intermediate substrate 1 "connected to the cap substrate KD are joined together under pressure and, if appropriate, at elevated temperature in order to join the composite shown in FIG Subsequently, the protective film S3 is removed from the top of the cap substrate KD by peeling.
  • the components are then singulated by means of S, wherein saw lines SL1, SL2 are schematically indicated in FIG. 1g.
  • the capped chip C shown in FIG. 1h is obtained, which in the present example is a micromirror chip.
  • FIGS. 2 a - e show schematic cross-sectional views for explaining a production method for a canned micromechanical component according to a second embodiment of the present invention.
  • the process state of the second embodiment shown in Figure 2a corresponds to the process state of the first embodiment shown in Figure 1c.
  • the intermediate substrate 2 of the second embodiment no metal layer on its front side VS ', but the adhesive layer H1' is applied to the plastic film KS '. Also applied to the plastic film KS 'is a back adhesive layer H2 "with overlying protective film S2".
  • the cap substrate KD ' which is laminated on the intermediate substrate 2, carries a front-side protective film S3 ".
  • the second embodiment differs from the first embodiment in that no through holes D are provided, but in the intermediate substrate 2 and in the cap substrate KD 'a rewiring device DK1, DK2 is provided which extends from the rear side of the adhesive layer HS "to the front side of the cap substrate KD '.
  • conductive adhesive LK is applied to the exposed areas of the contacts DK1, DK2 on the back side of the laminate of intermediate substrate 2' and cap substrate KD '. This can be done for example by screen printing.
  • FIG. 2c shows the alignment of the laminate of intermediate substrate 2 'with laminated cap substrate KD' to MEMS functional wafer 3 ', which has been freed from protective film S2' and has a functional region FB 'with a membrane region ME " FB 'contact areas KP1 and KP2 provided on the upper side of the MEMS function wafer 3'.
  • the arrangement is analogous to the above first exemplary embodiment such that the perforations K 'form respective cavities over the corresponding functional regions FB' with membrane regions ME 'of the MEMS functional wafer 3' and that the rewiring device DK1, DK2 over the corresponding contact regions KP1, KP2 of the MEMS Function Wafers 3 "are arranged.
  • saw lines SU 'and SL2' are provided in FIG. 2d, along which a sawing of the wafer for singulation into individual chips C takes place, as shown in FIG. 2e.
  • the materials are given only by way of example and can be replaced by other materials which have the required mechanical and / or optical properties.
  • the metal layer on the intermediate substrate was a sputtered aluminum layer
  • other, for example, optically active, coatings such as a filter coating, an anti-reflection coating, a polarization coating, etc. may be used .
  • plastic films such as Mylar®, Melinex® or Teonex® have been cited as examples of intermediate substrate and the cap substrate or glass for the socket substrate, other materials for these substrates are also useful.
  • the substrates KS, KD or SS can in principle all also consist of metal foils, glass, silicon or other suitable plastic.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)

Abstract

La présente invention concerne un procédé de réalisation d'un composant micro-mécanique protégé, un composant micro-mécanique correspondant et une protection destiné à un composant micro-mécanique. Le procédé comprend les étapes suivantes : formation d'un substrat intermédiaire (1, 1', 1"; 2, 2') comportant une pluralité de perforations (K; K'); laminage d'un substrat de protection (KD; KD') sur un côté avant (VS; VS') du substrat intermédiaire (1, 1 ', 1 "; 2, 2'), ledit substrat de protection refermant les perforations (K; K") sur le côté avant (VS; VS1); laminage d'une tranche fonctionnelle MEMS (3; 3') sur un côté arrière (RS; RS') du substrat intermédiaire (1, 1', 1"; 2, 2'), la tranche fonctionnelle MEMS (3; 3') étant orientée par rapport au substrat intermédiaire (1, 1', 1"; 2, 2') de sorte que les perforations (K; K') forment des cavités respectives sur des zones fonctionnelles (FB; FB') correspondantes de la tranche fonctionnelle MEMS (3; 3').
EP10739911A 2009-09-03 2010-08-02 Procédé de réalisation d'un composant micro-mécanique protégé, composant micro-mécanique correspondant et protection pour composant micro-mécanique Withdrawn EP2473438A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009029184A DE102009029184A1 (de) 2009-09-03 2009-09-03 Herstellungsverfahren für ein verkapptes mikromechanisches Bauelement, entsprechendes mikromechanisches Bauelement und Kappe für ein mikromechanisches Bauelement
PCT/EP2010/061185 WO2011026699A1 (fr) 2009-09-03 2010-08-02 Procédé de réalisation d'un composant micro-mécanique protégé, composant micro-mécanique correspondant et protection pour composant micro-mécanique

Publications (1)

Publication Number Publication Date
EP2473438A1 true EP2473438A1 (fr) 2012-07-11

Family

ID=43514140

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10739911A Withdrawn EP2473438A1 (fr) 2009-09-03 2010-08-02 Procédé de réalisation d'un composant micro-mécanique protégé, composant micro-mécanique correspondant et protection pour composant micro-mécanique

Country Status (6)

Country Link
US (1) US20120235252A1 (fr)
EP (1) EP2473438A1 (fr)
KR (1) KR20120068850A (fr)
CN (1) CN102482074A (fr)
DE (1) DE102009029184A1 (fr)
WO (1) WO2011026699A1 (fr)

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EP2359590A4 (fr) 2008-12-15 2014-09-17 Ericsson Telefon Ab L M Procédé et appareil pour éviter la détérioration de qualité d'un contenu multimédia transmis
DE102009045541B4 (de) 2009-10-09 2019-03-14 Robert Bosch Gmbh Verfahren zur Herstellung einer mikromechanischen Vorrichtung
ITTO20130247A1 (it) * 2013-03-26 2014-09-27 St Microelectronics Srl Metodo di incapsulamento di un dispositivo trasduttore mems e dispositivo trasduttore mems incapsulato
US9120298B2 (en) * 2013-09-16 2015-09-01 Fluxergy, Llc Method of continuously manufacturing microfluidic chips with BoPET film for a microfluidic device and microfluidic chips with BoPET film
WO2016057963A1 (fr) * 2014-10-09 2016-04-14 Carnegie Mellon University Embrayage électrostatique
US10355624B2 (en) 2014-10-09 2019-07-16 Carnegie Mellon University Electrostatic clutch
DE102015216461A1 (de) * 2015-08-28 2017-03-02 Robert Bosch Gmbh Mikroelektronische Bauelementanordnung, System mit einer mikroelektronischen Bauelementanordnung und entsprechendes Herstellungsverfahren für eine mikroelektronische Bauelementanordnung
DE102017218155A1 (de) * 2017-10-11 2019-04-11 Robert Bosch Gmbh Mikromechanische Vorrichtung mit überdeckendem Bondrahmen
DE102019201236B4 (de) * 2019-01-31 2021-05-20 Robert Bosch Gmbh Verfahren zum Herstellen einer MEMS-Struktur und entsprechende MEMS-Struktur
WO2022192280A1 (fr) 2021-03-09 2022-09-15 Shifamed Holdings, Llc Actionneurs à mémoire de forme pour systèmes de dérivation réglables et systèmes et procédés associés
DE102024105343A1 (de) * 2024-02-26 2025-08-28 OQmented GmbH Verfahren zur herstellung eines deckelelements, deckelelement, verfahren zur herstellung einer mems-vorrichtung und mems-vorrichtung

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EP1961696A1 (fr) * 2005-11-16 2008-08-27 Kyocera Corporation Plaque de fermeture de composant electronique, plaque de fermeture de composant electronique en plusieurs pieces, dispositif electronique utilisant ladite plaque et procede de fabrication de dispositif electronique

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JP2003516630A (ja) * 1999-12-08 2003-05-13 アナログ デバイセス インコーポレーテッド 超小型回路ダイをウェハから分離する方法
US7049528B2 (en) * 2002-02-06 2006-05-23 Ibiden Co., Ltd. Semiconductor chip mounting wiring board, manufacturing method for same, and semiconductor module
JP4746847B2 (ja) * 2004-04-27 2011-08-10 三洋電機株式会社 半導体装置の製造方法
JP4552783B2 (ja) * 2005-07-06 2010-09-29 株式会社デンソー 半導体センサ
DE102006049259A1 (de) 2006-10-19 2008-04-30 Robert Bosch Gmbh Verfahren zur Herstellung eines mikromechanischen Bauelementes mit einer Dünnschicht-Verkappung
DE102007022509B4 (de) 2007-05-14 2015-10-22 Robert Bosch Gmbh Mikromechanisches Bauteil mit Dünnschichtverkappung und Herstellungsverfahrung
TW200919593A (en) * 2007-10-18 2009-05-01 Asia Pacific Microsystems Inc Elements and modules with micro caps and wafer level packaging method thereof
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EP1961696A1 (fr) * 2005-11-16 2008-08-27 Kyocera Corporation Plaque de fermeture de composant electronique, plaque de fermeture de composant electronique en plusieurs pieces, dispositif electronique utilisant ladite plaque et procede de fabrication de dispositif electronique

Also Published As

Publication number Publication date
US20120235252A1 (en) 2012-09-20
DE102009029184A1 (de) 2011-03-10
KR20120068850A (ko) 2012-06-27
CN102482074A (zh) 2012-05-30
WO2011026699A1 (fr) 2011-03-10

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