EP2484478A3 - Procédé de réalisation d'un passage dans un substrat - Google Patents

Procédé de réalisation d'un passage dans un substrat Download PDF

Info

Publication number
EP2484478A3
EP2484478A3 EP20110401675 EP11401675A EP2484478A3 EP 2484478 A3 EP2484478 A3 EP 2484478A3 EP 20110401675 EP20110401675 EP 20110401675 EP 11401675 A EP11401675 A EP 11401675A EP 2484478 A3 EP2484478 A3 EP 2484478A3
Authority
EP
European Patent Office
Prior art keywords
line
starting point
substrate
cutting line
creating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP20110401675
Other languages
German (de)
English (en)
Other versions
EP2484478A2 (fr
EP2484478B1 (fr
Inventor
Florian Roick
Christian Kohlmeier
Stefan Bönigk
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LPKF Laser and Electronics AG
Original Assignee
LPKF Laser and Electronics AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LPKF Laser and Electronics AG filed Critical LPKF Laser and Electronics AG
Publication of EP2484478A2 publication Critical patent/EP2484478A2/fr
Publication of EP2484478A3 publication Critical patent/EP2484478A3/fr
Application granted granted Critical
Publication of EP2484478B1 publication Critical patent/EP2484478B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/18—Sheet panels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B23K2103/04—Steel or steel alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic materials
    • B23K2103/42—Plastics other than composite materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y10T83/0524—Plural cutting steps

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
EP11401675.1A 2011-02-07 2011-12-20 Procédé de réalisation d'un passage dans un substrat Active EP2484478B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE201110000529 DE102011000529B3 (de) 2011-02-07 2011-02-07 Verfahren zum Einbringen einer Durchbrechung in ein Substrat

Publications (3)

Publication Number Publication Date
EP2484478A2 EP2484478A2 (fr) 2012-08-08
EP2484478A3 true EP2484478A3 (fr) 2014-08-20
EP2484478B1 EP2484478B1 (fr) 2015-10-07

Family

ID=45832813

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11401675.1A Active EP2484478B1 (fr) 2011-02-07 2011-12-20 Procédé de réalisation d'un passage dans un substrat

Country Status (6)

Country Link
US (1) US20120198977A1 (fr)
EP (1) EP2484478B1 (fr)
JP (1) JP5486027B2 (fr)
CN (1) CN102626832B (fr)
DE (1) DE102011000529B3 (fr)
TW (1) TWI464030B (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106793534A (zh) * 2015-11-20 2017-05-31 富泰华工业（深圳）有限公司 电路板钢网印刷方法
JP2024133832A (ja) * 2023-03-20 2024-10-03 株式会社ディスコ 板状物の加工方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02169194A (ja) * 1988-12-23 1990-06-29 Shin Meiwa Ind Co Ltd 穴あけ切断方法
JPH07132385A (ja) * 1993-11-10 1995-05-23 Fanuc Ltd レーザ加工装置
JP2005021897A (ja) * 2003-06-30 2005-01-27 Sumitomo Heavy Ind Ltd ビーム切断方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59144588A (ja) * 1983-02-07 1984-08-18 Amada Co Ltd レ−ザ加工による積層金型の製作方法
JP3372339B2 (ja) * 1994-02-25 2003-02-04 ファナック株式会社 レーザ加工装置
US5856649A (en) * 1994-02-25 1999-01-05 Fanuc Ltd. Laser beam machine
JPH08271873A (ja) * 1995-04-04 1996-10-18 Casio Comput Co Ltd セル集合体の分離方法
JPH091369A (ja) * 1995-04-14 1997-01-07 Hitachi Cable Ltd 基板の割断方法及びその割断装置
US6128546A (en) * 1996-09-30 2000-10-03 Cincinnati Incorporated Method and apparatus for a cutting system for avoiding pre-cut features
JPH10146671A (ja) * 1996-11-14 1998-06-02 Kawasaki Steel Corp 金属板の耳屑切断方法
JPH10249563A (ja) * 1997-03-06 1998-09-22 Komatsu Ltd 熱切断加工方法
JP3500049B2 (ja) * 1997-09-22 2004-02-23 株式会社日平トヤマ レーザ加工機
DE10335312A1 (de) * 2003-08-01 2005-02-24 Asys Automatisierungssysteme Gmbh Erstellen von Testmustern zur Nachkontrolle
JP2008516442A (ja) * 2004-10-05 2008-05-15 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 基板のレーザダイシングに対する方法
TW200815885A (en) * 2006-09-29 2008-04-01 Chunghwa Picture Tubes Ltd Active device array substrate and cutting method thereof
CN201040335Y (zh) * 2007-06-06 2008-03-26 张洪军 激光模板切割机
US9346130B2 (en) * 2008-12-17 2016-05-24 Electro Scientific Industries, Inc. Method for laser processing glass with a chamfered edge

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02169194A (ja) * 1988-12-23 1990-06-29 Shin Meiwa Ind Co Ltd 穴あけ切断方法
JPH07132385A (ja) * 1993-11-10 1995-05-23 Fanuc Ltd レーザ加工装置
JP2005021897A (ja) * 2003-06-30 2005-01-27 Sumitomo Heavy Ind Ltd ビーム切断方法

Also Published As

Publication number Publication date
JP5486027B2 (ja) 2014-05-07
JP2012161843A (ja) 2012-08-30
EP2484478A2 (fr) 2012-08-08
CN102626832A (zh) 2012-08-08
CN102626832B (zh) 2015-07-22
EP2484478B1 (fr) 2015-10-07
US20120198977A1 (en) 2012-08-09
TWI464030B (zh) 2014-12-11
DE102011000529B3 (de) 2012-04-05
TW201240760A (en) 2012-10-16

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