EP2552006A4 - Dispositif de conversion de puissance - Google Patents

Dispositif de conversion de puissance Download PDF

Info

Publication number
EP2552006A4
EP2552006A4 EP10848449.4A EP10848449A EP2552006A4 EP 2552006 A4 EP2552006 A4 EP 2552006A4 EP 10848449 A EP10848449 A EP 10848449A EP 2552006 A4 EP2552006 A4 EP 2552006A4
Authority
EP
European Patent Office
Prior art keywords
power conversion
conversion device
power
conversion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP10848449.4A
Other languages
German (de)
English (en)
Other versions
EP2552006A1 (fr
EP2552006B1 (fr
Inventor
Shinichi Fujino
Yusuke Takagi
Takuma Hakuto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Astemo Ltd
Original Assignee
Hitachi Automotive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Automotive Systems Ltd filed Critical Hitachi Automotive Systems Ltd
Publication of EP2552006A1 publication Critical patent/EP2552006A1/fr
Publication of EP2552006A4 publication Critical patent/EP2552006A4/fr
Application granted granted Critical
Publication of EP2552006B1 publication Critical patent/EP2552006B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/51—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used
    • H03K17/56—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices
    • H03K17/687—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices the devices being field-effect transistors
    • H03K17/689—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices the devices being field-effect transistors with galvanic isolation between the control circuit and the output circuit
    • H03K17/691—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices the devices being field-effect transistors with galvanic isolation between the control circuit and the output circuit using transformer coupling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07552—Controlling the environment, e.g. atmosphere composition or temperature changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/527—Multiple bond wires having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Inverter Devices (AREA)
EP10848449.4A 2010-03-23 2010-08-19 Dispositif de conversion de puissance Active EP2552006B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010066272A JP5312386B2 (ja) 2010-03-23 2010-03-23 電力変換装置
PCT/JP2010/064009 WO2011118057A1 (fr) 2010-03-23 2010-08-19 Dispositif de conversion de puissance

Publications (3)

Publication Number Publication Date
EP2552006A1 EP2552006A1 (fr) 2013-01-30
EP2552006A4 true EP2552006A4 (fr) 2017-06-21
EP2552006B1 EP2552006B1 (fr) 2018-05-23

Family

ID=44672644

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10848449.4A Active EP2552006B1 (fr) 2010-03-23 2010-08-19 Dispositif de conversion de puissance

Country Status (5)

Country Link
US (1) US9270195B2 (fr)
EP (1) EP2552006B1 (fr)
JP (1) JP5312386B2 (fr)
CN (1) CN102754327B (fr)
WO (1) WO2011118057A1 (fr)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5733421B2 (ja) 2011-11-28 2015-06-10 日産自動車株式会社 電力変換装置
JP5876970B2 (ja) * 2012-06-19 2016-03-02 アーベーベー・テクノロジー・アーゲー 複数のパワートランジスタを搭載するための基板、およびパワー半導体モジュール
JP6128766B2 (ja) * 2012-07-04 2017-05-17 矢崎総業株式会社 電子部品実装基板
US20140077611A1 (en) * 2012-09-14 2014-03-20 Henry Todd Young Capacitor bank, laminated bus, and power supply apparatus
FR3011713B1 (fr) * 2013-10-09 2017-06-23 Valeo Systemes De Controle Moteur Module electrique, systeme electrique comportant un tel module electrique, procedes de fabrication correspondants
US10131042B2 (en) 2013-10-21 2018-11-20 Milwaukee Electric Tool Corporation Adapter for power tool devices
JP5840669B2 (ja) * 2013-12-17 2016-01-06 株式会社デンソー 電力変換装置
DE102014201631B4 (de) 2014-01-30 2022-02-03 Robert Bosch Gmbh Anordnung zum Kontaktieren elektrischer Komponenten
US10270357B2 (en) * 2014-12-22 2019-04-23 Mitsubishi Electric Corporation Printed wiring board, circuit board, and control unit
EP3217774B1 (fr) * 2016-03-08 2018-06-13 ABB Schweiz AG Module semi-conducteur
JP6672908B2 (ja) * 2016-03-10 2020-03-25 富士電機株式会社 半導体装置及び半導体装置の製造方法
DE102019204889A1 (de) * 2019-04-05 2020-10-08 Robert Bosch Gmbh Elektronische Schaltungseinheit
DE102019112936A1 (de) * 2019-05-16 2020-11-19 Danfoss Silicon Power Gmbh Halbleitermodul
JP7491043B2 (ja) * 2020-05-13 2024-05-28 富士電機株式会社 半導体モジュール
DE102024105617A1 (de) 2024-02-28 2025-08-28 Semikron Danfoss GmbH Leistungselektronische Schalteinrichtung
CN119210099B (zh) * 2024-11-28 2025-04-25 杰华特半导体科技(湖州)有限公司 一种三相半桥电路拓扑功率模块

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998004029A1 (fr) * 1996-07-22 1998-01-29 Hydro-Quebec Module de conversion de puissance a faible inductance d'interconnexion parasite, destine a convertir une tension cc en une tension ca, et procede associe
JP2000102253A (ja) * 1998-09-25 2000-04-07 Hitachi Ltd 電力変換装置
US20030002311A1 (en) * 2001-07-02 2003-01-02 Kazuhisa Mori Power converter
US20090219696A1 (en) * 2006-03-30 2009-09-03 Mitsubishi Electric Corporation Power conversion device and fabricating method for the same
EP2159131A2 (fr) * 2008-09-02 2010-03-03 Hitachi Ltd. Dispositif de contrôle pour système de direction assistée électrique
EP2346153A1 (fr) * 2008-10-31 2011-07-20 Hitachi Automotive Systems, Ltd. Module de puissance, dispositif de conversion de puissance et vehicule electrique

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4115882B2 (ja) * 2003-05-14 2008-07-09 株式会社ルネサステクノロジ 半導体装置
JP2007082359A (ja) * 2005-09-16 2007-03-29 Hitachi Ltd インバータ装置および制御装置
JP4452953B2 (ja) * 2007-08-09 2010-04-21 日立オートモティブシステムズ株式会社 電力変換装置
JP4657329B2 (ja) * 2008-07-29 2011-03-23 日立オートモティブシステムズ株式会社 電力変換装置および電動車両
JP5212340B2 (ja) 2009-11-13 2013-06-19 株式会社ニコン アブソリュートエンコーダ

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998004029A1 (fr) * 1996-07-22 1998-01-29 Hydro-Quebec Module de conversion de puissance a faible inductance d'interconnexion parasite, destine a convertir une tension cc en une tension ca, et procede associe
JP2000102253A (ja) * 1998-09-25 2000-04-07 Hitachi Ltd 電力変換装置
US20030002311A1 (en) * 2001-07-02 2003-01-02 Kazuhisa Mori Power converter
US20090219696A1 (en) * 2006-03-30 2009-09-03 Mitsubishi Electric Corporation Power conversion device and fabricating method for the same
EP2159131A2 (fr) * 2008-09-02 2010-03-03 Hitachi Ltd. Dispositif de contrôle pour système de direction assistée électrique
EP2346153A1 (fr) * 2008-10-31 2011-07-20 Hitachi Automotive Systems, Ltd. Module de puissance, dispositif de conversion de puissance et vehicule electrique

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2011118057A1 *

Also Published As

Publication number Publication date
CN102754327A (zh) 2012-10-24
WO2011118057A1 (fr) 2011-09-29
EP2552006A1 (fr) 2013-01-30
US9270195B2 (en) 2016-02-23
JP5312386B2 (ja) 2013-10-09
US20120320645A1 (en) 2012-12-20
EP2552006B1 (fr) 2018-05-23
CN102754327B (zh) 2014-12-10
JP2011200074A (ja) 2011-10-06

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