EP2641391A4 - Kameramodul und herstellungsverfahren dafür - Google Patents

Kameramodul und herstellungsverfahren dafür

Info

Publication number
EP2641391A4
EP2641391A4 EP11842321.9A EP11842321A EP2641391A4 EP 2641391 A4 EP2641391 A4 EP 2641391A4 EP 11842321 A EP11842321 A EP 11842321A EP 2641391 A4 EP2641391 A4 EP 2641391A4
Authority
EP
European Patent Office
Prior art keywords
manufacturing same
apparatus module
shooting apparatus
shooting
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP11842321.9A
Other languages
English (en)
French (fr)
Other versions
EP2641391B1 (de
EP2641391A2 (de
Inventor
Kiho Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020100115144A external-priority patent/KR101834953B1/ko
Priority claimed from KR1020100116417A external-priority patent/KR101220334B1/ko
Priority claimed from KR1020100123653A external-priority patent/KR101221511B1/ko
Priority claimed from KR1020100127054A external-priority patent/KR101159167B1/ko
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of EP2641391A2 publication Critical patent/EP2641391A2/de
Publication of EP2641391A4 publication Critical patent/EP2641391A4/de
Application granted granted Critical
Publication of EP2641391B1 publication Critical patent/EP2641391B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/51Housings
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00Details of cameras or camera bodies; Accessories therefor
    • G03B17/02Bodies
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/54Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128Assembling formed circuit to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Studio Devices (AREA)
  • Lens Barrels (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
EP11842321.9A 2010-11-18 2011-11-10 Kameramodul und herstellungsverfahren dafür Active EP2641391B1 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
KR1020100115144A KR101834953B1 (ko) 2010-11-18 2010-11-18 카메라 모듈
KR1020100116417A KR101220334B1 (ko) 2010-11-22 2010-11-22 카메라 모듈
KR1020100123653A KR101221511B1 (ko) 2010-12-06 2010-12-06 카메라 모듈
KR1020100127054A KR101159167B1 (ko) 2010-12-13 2010-12-13 카메라 모듈과 그 제조방법
PCT/KR2011/008538 WO2012067377A2 (en) 2010-11-18 2011-11-10 Camera module and method for manufacturing the same

Publications (3)

Publication Number Publication Date
EP2641391A2 EP2641391A2 (de) 2013-09-25
EP2641391A4 true EP2641391A4 (de) 2015-06-17
EP2641391B1 EP2641391B1 (de) 2017-10-18

Family

ID=46084478

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11842321.9A Active EP2641391B1 (de) 2010-11-18 2011-11-10 Kameramodul und herstellungsverfahren dafür

Country Status (4)

Country Link
US (1) US9392147B2 (de)
EP (1) EP2641391B1 (de)
CN (1) CN103222257B (de)
WO (1) WO2012067377A2 (de)

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US9197796B2 (en) * 2011-11-23 2015-11-24 Lg Innotek Co., Ltd. Camera module
KR101917221B1 (ko) * 2012-06-29 2018-11-13 엘지이노텍 주식회사 카메라 모듈
EP3029520B1 (de) * 2013-07-29 2019-11-13 LG Innotek Co., Ltd. Kameramodul
US9640709B2 (en) * 2013-09-10 2017-05-02 Heptagon Micro Optics Pte. Ltd. Compact opto-electronic modules and fabrication methods for such modules
KR102244153B1 (ko) * 2013-09-13 2021-04-23 엘지이노텍 주식회사 카메라 모듈
US10194062B2 (en) * 2013-10-16 2019-01-29 Samsung Electro-Mechanics Co., Ltd. Camera module, method for aligning optical axis of camera module and portable electronic device including camera module
US9313389B2 (en) 2013-11-08 2016-04-12 Htc Corporation Camera assembly and electronic device
JP6413754B2 (ja) * 2014-03-10 2018-10-31 株式会社デンソー 撮像装置および撮像装置を備えた車載装置
DE102014212034A1 (de) * 2014-06-24 2015-12-24 Robert Bosch Gmbh Verfahren zum Herstellen eines Imager-Moduls und ein entsprechendes Imagermodul
KR102293357B1 (ko) 2015-01-12 2021-08-25 엘지이노텍 주식회사 카메라 모듈
WO2017003140A1 (ko) * 2015-06-29 2017-01-05 엘지이노텍 주식회사 듀얼 카메라 모듈 및 광학기기
US10684444B2 (en) 2015-08-17 2020-06-16 Lg Innotek Co., Ltd. Camera module
KR102406627B1 (ko) * 2015-10-21 2022-06-08 엘지이노텍 주식회사 카메라 모듈
TWI580990B (zh) * 2015-12-27 2017-05-01 昇佳電子股份有限公司 感測裝置及感測裝置製作方法
US10298820B2 (en) 2016-08-10 2019-05-21 Apple Inc. Camera module with embedded components
CN107786784B (zh) * 2016-08-29 2020-06-30 光宝电子(广州)有限公司 镜头组件及其制作方法
TWI775851B (zh) * 2017-05-17 2022-09-01 台灣東電化股份有限公司 驅動機構
RU176122U1 (ru) * 2017-05-31 2018-01-09 Акционерное общество "Государственный Рязанский приборный завод" Модуль видеокамеры
CN110035202A (zh) * 2018-01-12 2019-07-19 深圳富泰宏精密工业有限公司 壳体组件、电子组件模组及具有电子组件模组的电子装置
US10277786B1 (en) 2018-02-23 2019-04-30 Veoneer Us, Inc. Camera module assembly for a motor vehicle
KR102492626B1 (ko) 2018-03-20 2023-01-27 엘지이노텍 주식회사 카메라 모듈 및 이를 포함하는 광학 기기
KR102620548B1 (ko) 2018-07-09 2024-01-03 삼성전자주식회사 신호 배선을 둘러싸는 복수의 그라운드 배선들이 배치된 연성 회로기판을 포함하는 전자 장치
CN113784506B (zh) * 2020-06-10 2023-08-18 三赢科技(深圳)有限公司 镜头模组及电子装置
CN212696066U (zh) * 2020-07-01 2021-03-12 广州立景创新科技有限公司 摄像模块及电子装置
CN115917422A (zh) * 2020-07-17 2023-04-04 麦斯卓微电子(南京)有限公司 Mems组件工艺流程
CN112004014B (zh) * 2020-08-31 2022-01-14 维沃移动通信有限公司 电子设备及其摄像头模组
DE102020211194A1 (de) * 2020-09-07 2022-03-10 Robert Bosch Gesellschaft mit beschränkter Haftung Gehäuseanordnung und Verfahren zum Herstellen einer Gehäuseanordnung
KR102897964B1 (ko) 2021-06-08 2025-12-09 삼성전자주식회사 카메라 모듈 및 그것을 포함하는 전자 장치
CN115811640B (zh) * 2021-09-10 2024-07-09 宁波舜宇光电信息有限公司 用于摄像模组的线路板及相应的摄像模组
CN115811642B (zh) * 2021-09-10 2024-10-18 宁波舜宇光电信息有限公司 摄像模组

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060082658A1 (en) * 2004-10-18 2006-04-20 Samsung Electronics Co.; Ltd Device for image stabilization of camera module
US20080278621A1 (en) * 2007-05-10 2008-11-13 Samsung Electro-Mechanics Co., Ltd. Camera module
US20090128681A1 (en) * 2007-11-21 2009-05-21 Min Soo Kim Camera Module
EP2234465A1 (de) * 2009-03-26 2010-09-29 Samsung Electronics Co., Ltd. Struktur zur Befestigung eines Kameramoduls auf einem Biolaufwerk

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JP3607160B2 (ja) 2000-04-07 2005-01-05 三菱電機株式会社 撮像装置
WO2004095832A1 (ja) * 2003-04-22 2004-11-04 Konica Minolta Opto, Inc. 撮像装置及びこの撮像装置を搭載した携帯端末装置
KR100568223B1 (ko) * 2003-06-18 2006-04-07 삼성전자주식회사 고체 촬상용 반도체 장치
JP3839019B2 (ja) 2003-12-24 2006-11-01 三菱電機株式会社 撮像装置
JP4349232B2 (ja) * 2004-07-30 2009-10-21 ソニー株式会社 半導体モジュール及びmos型固体撮像装置
JP2006245246A (ja) 2005-03-02 2006-09-14 Sharp Corp 固体撮像装置
JP4555732B2 (ja) * 2005-05-24 2010-10-06 オリンパスイメージング株式会社 撮像装置
KR100721167B1 (ko) * 2005-08-24 2007-05-23 삼성전기주식회사 이미지 센서 모듈과 그 제조 방법 및 이를 이용한 카메라모듈
CN100531310C (zh) * 2006-01-14 2009-08-19 鸿富锦精密工业(深圳)有限公司 数码相机模组
US7539412B2 (en) * 2006-05-17 2009-05-26 Terrasem Co. Ltd. Camera module with first and second image sensor chips, holders and lens
TWI321944B (en) * 2006-08-25 2010-03-11 Primax Electronics Ltd Camera module and assembling method thereof
KR20080085444A (ko) 2007-03-20 2008-09-24 엘지이노텍 주식회사 카메라모듈
CN100561280C (zh) * 2007-05-30 2009-11-18 鸿富锦精密工业(深圳)有限公司 相机模组及其制造方法
KR101449001B1 (ko) 2007-10-10 2014-10-08 엘지이노텍 주식회사 카메라모듈
KR101449004B1 (ko) * 2007-11-21 2014-10-08 엘지이노텍 주식회사 카메라 모듈
JP2009128736A (ja) 2007-11-27 2009-06-11 Seiko Instruments Inc 駆動モジュールおよびそれを備える電子機器
KR100957384B1 (ko) 2008-09-22 2010-05-11 엘지이노텍 주식회사 카메라 모듈
CN102187273B (zh) * 2008-10-14 2014-03-26 日本电产三协株式会社 带抖动修正功能的光学单元、光学设备及带抖动修正功能的光学单元的制造方法
US20120170125A1 (en) * 2010-12-29 2012-07-05 Samsung Electro-Mechanics Co., Ltd. Lens module, lens wafer module, and method of manufacturing lens module
KR101184812B1 (ko) * 2011-03-02 2012-09-20 삼성전기주식회사 손떨림 보정용 서스펜션 와이어 및 이를 포함하는 영상 촬상 장치
US8717487B2 (en) * 2012-08-10 2014-05-06 Digitaloptics Corporation Camera module with compact sponge absorbing design

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060082658A1 (en) * 2004-10-18 2006-04-20 Samsung Electronics Co.; Ltd Device for image stabilization of camera module
US20080278621A1 (en) * 2007-05-10 2008-11-13 Samsung Electro-Mechanics Co., Ltd. Camera module
US20090128681A1 (en) * 2007-11-21 2009-05-21 Min Soo Kim Camera Module
EP2234465A1 (de) * 2009-03-26 2010-09-29 Samsung Electronics Co., Ltd. Struktur zur Befestigung eines Kameramoduls auf einem Biolaufwerk

Also Published As

Publication number Publication date
WO2012067377A2 (en) 2012-05-24
US9392147B2 (en) 2016-07-12
EP2641391B1 (de) 2017-10-18
CN103222257A (zh) 2013-07-24
US20130242183A1 (en) 2013-09-19
WO2012067377A3 (en) 2012-09-20
EP2641391A2 (de) 2013-09-25
CN103222257B (zh) 2017-04-05

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