EP2653574A4 - Alliage de cuivre et procédé de fabrication de celui-ci - Google Patents

Alliage de cuivre et procédé de fabrication de celui-ci

Info

Publication number
EP2653574A4
EP2653574A4 EP11848127.4A EP11848127A EP2653574A4 EP 2653574 A4 EP2653574 A4 EP 2653574A4 EP 11848127 A EP11848127 A EP 11848127A EP 2653574 A4 EP2653574 A4 EP 2653574A4
Authority
EP
European Patent Office
Prior art keywords
manufacturing
same
copper alloy
alloy
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP11848127.4A
Other languages
German (de)
English (en)
Other versions
EP2653574B1 (fr
EP2653574A1 (fr
Inventor
Kiyohito Ishida
Ryosuke Kainuma
Ikuo Ohnuma
Toshihiro Omori
Takashi Miyamoto
Hiroki Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Seisen Co Ltd
Tohoku Techno Arch Co Ltd
Original Assignee
Nippon Seisen Co Ltd
Tohoku Techno Arch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Seisen Co Ltd, Tohoku Techno Arch Co Ltd filed Critical Nippon Seisen Co Ltd
Publication of EP2653574A1 publication Critical patent/EP2653574A1/fr
Publication of EP2653574A4 publication Critical patent/EP2653574A4/fr
Application granted granted Critical
Publication of EP2653574B1 publication Critical patent/EP2653574B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/01—Alloys based on copper with aluminium as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/05—Alloys based on copper with manganese as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
EP11848127.4A 2010-12-13 2011-12-13 Alliage de cuivre et procédé de fabrication de celui-ci Active EP2653574B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010276607 2010-12-13
PCT/JP2011/078786 WO2012081573A1 (fr) 2010-12-13 2011-12-13 Alliage de cuivre et procédé de fabrication de celui-ci

Publications (3)

Publication Number Publication Date
EP2653574A1 EP2653574A1 (fr) 2013-10-23
EP2653574A4 true EP2653574A4 (fr) 2014-09-10
EP2653574B1 EP2653574B1 (fr) 2017-05-31

Family

ID=46244672

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11848127.4A Active EP2653574B1 (fr) 2010-12-13 2011-12-13 Alliage de cuivre et procédé de fabrication de celui-ci

Country Status (6)

Country Link
US (1) US20130333812A1 (fr)
EP (1) EP2653574B1 (fr)
JP (1) JP5743165B2 (fr)
KR (1) KR101576715B1 (fr)
CN (1) CN103328665B (fr)
WO (1) WO2012081573A1 (fr)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9476474B2 (en) * 2010-12-13 2016-10-25 Nippon Seisen Co., Ltd. Copper alloy wire and copper alloy spring
JP5916964B2 (ja) * 2014-03-25 2016-05-11 古河電気工業株式会社 銅合金板材、コネクタ、および銅合金板材の製造方法
CN104532055A (zh) * 2014-11-21 2015-04-22 华南理工大学 一种高镍含量的变形铝白铜合金材料及其制备方法
CN104711451B (zh) * 2015-01-30 2017-04-12 湖南科技大学 一种抗高温氧化耐热铜镍基合金
JP5925936B1 (ja) * 2015-04-22 2016-05-25 日本碍子株式会社 銅合金
EP3085799B1 (fr) * 2015-04-22 2018-01-17 NGK Insulators, Ltd. Alliage de cuivre et son procédé de fabrication
CN105088008A (zh) * 2015-07-26 2015-11-25 邢桂生 一种微合金化铜合金框架带材及其制备方法
CN105088009A (zh) * 2015-07-26 2015-11-25 邢桂生 一种铜合金框架带材及其制备方法
CN105316523A (zh) * 2015-12-02 2016-02-10 苏州龙腾万里化工科技有限公司 一种磨削机调节器用耐用电阻合金
DE102016006824B4 (de) 2016-06-03 2025-04-10 Wieland-Werke Ag Kupferlegierung und deren Verwendungen
JP6362809B1 (ja) * 2016-12-02 2018-07-25 古河電気工業株式会社 銅合金線材
CN114959230B (zh) * 2017-02-04 2024-08-16 美题隆公司 铜镍锡合金带材或板材及其制备方法
JP6869119B2 (ja) * 2017-06-14 2021-05-12 Ｄｏｗａメタルテック株式会社 Ｃｕ−Ｎｉ−Ａｌ系銅合金板材および製造方法並びに導電ばね部材
CN109429497B (zh) * 2017-06-22 2021-07-09 日本精线株式会社 弹簧用铜合金极细线及其制造方法
CN107653384A (zh) * 2017-08-31 2018-02-02 宋宏婷 一种原位生成铝化镍增强铜基复合材料的制备方法
JP7202121B2 (ja) * 2018-09-27 2023-01-11 Ｄｏｗａメタルテック株式会社 Ｃｕ－Ｎｉ－Ａｌ系銅合金板材およびその製造方法並びに導電ばね部材
JP7181768B2 (ja) * 2018-11-13 2022-12-01 Ｄｏｗａメタルテック株式会社 高ヤング率Ｃｕ－Ｎｉ－Ａｌ系銅合金板材およびその製造方法並びに導電ばね部材
CN110551917B (zh) * 2019-09-29 2021-07-09 广东和润新材料股份有限公司 一种高导电耐腐蚀铜带及其制备方法
JP7534883B2 (ja) * 2020-07-29 2024-08-15 Ｄｏｗａメタルテック株式会社 Ｃｕ－Ｎｉ－Ａｌ系銅合金板材、その製造方法および導電ばね部材
EP4190929A4 (fr) * 2020-07-29 2025-07-30 Dowa Metaltech Co Ltd Matériau de plaque d'alliage de cuivre à base de cu-ni-al, son procédé de fabrication, et élément ressort électroconducteur
CN115094266B (zh) * 2022-07-05 2023-06-27 中南大学 一种高强导电弹性铜合金及其制备方法
CN116815009A (zh) * 2023-05-08 2023-09-29 大连理工大学 一种多组元复杂共格析出强化Cu-Ni-Al-Cr-Ti耐高温铜合金及其制备方法
JP7610667B1 (ja) 2023-09-11 2025-01-08 日本精線株式会社 銅合金
CN117568656B (zh) * 2023-10-25 2026-01-20 宁波金田铜业(集团)股份有限公司 一种铜合金带材及其制备方法与应用
CN117535553B (zh) * 2023-11-14 2025-09-26 安徽工程大学 一种抗高温氧化、耐高温软化高强Cu合金及其制备方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2051127A (en) * 1979-04-30 1981-01-14 Delta Enfield Metals Precipitation hardening copper alloys
JPH02179839A (ja) * 1988-12-29 1990-07-12 Kobe Steel Ltd 耐衝撃特性及び熱間加工性に優れた高強度銅合金
JPH03126829A (ja) * 1989-10-06 1991-05-30 Sumitomo Metal Mining Co Ltd 工具用非発火性銅合金
JPH03173730A (ja) * 1989-12-01 1991-07-29 Sumitomo Metal Mining Co Ltd 工具用非発火性銅合金
JPH0499140A (ja) * 1990-08-03 1992-03-31 Hitachi Ltd プラスチック成形用金型材料
DE4226692A1 (de) * 1991-08-13 1993-03-04 Mitsubishi Materials Corp Ausscheidungshaertbare legierungen auf kupferbasis mit hoher festigkeit bei erhoehten temperaturen
JPH07268512A (ja) * 1994-03-30 1995-10-17 Mitsubishi Materials Corp 熱伝導度、高温硬さおよび耐酸化性に優れた耐熱銅合金およびこの耐熱銅合金からなる焼成型
JP2010007174A (ja) * 2008-05-29 2010-01-14 Nippon Mining & Metals Co Ltd 電子材料用Ｃｕ−Ｎｉ−Ｓｉ系合金板又は条

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2851353A (en) * 1953-07-15 1958-09-09 Ibm Copper-base alloys
US4378332A (en) * 1981-06-15 1983-03-29 Ford Motor Company Aluminum hardened copper alloy
US4692192A (en) * 1984-10-30 1987-09-08 Ngk Insulators, Ltd. Electroconductive spring material
JPH0238653B2 (ja) * 1986-01-27 1990-08-31 Kobe Steel Ltd Purasuchitsukukanagatayodogokinoyobisonoseizohoho
JPS63210247A (ja) * 1987-02-27 1988-08-31 Sumitomo Metal Mining Co Ltd 高強度銅合金
JPS63266033A (ja) * 1987-04-23 1988-11-02 Mitsubishi Electric Corp 銅合金
JP3383615B2 (ja) 1999-08-05 2003-03-04 日鉱金属株式会社 電子材料用銅合金及びその製造方法
JP3465108B2 (ja) 2000-05-25 2003-11-10 株式会社神戸製鋼所 電気・電子部品用銅合金
JP4728704B2 (ja) 2005-06-01 2011-07-20 古河電気工業株式会社 電気電子機器用銅合金
WO2006093140A1 (fr) * 2005-02-28 2006-09-08 The Furukawa Electric Co., Ltd. Alliage de cuivre
JP4501818B2 (ja) 2005-09-02 2010-07-14 日立電線株式会社 銅合金材およびその製造方法
JP4408275B2 (ja) * 2005-09-29 2010-02-03 日鉱金属株式会社 強度と曲げ加工性に優れたＣｕ−Ｎｉ−Ｓｉ系合金
JP2007126739A (ja) 2005-11-07 2007-05-24 Nikko Kinzoku Kk 電子材料用銅合金
JP2008266787A (ja) 2007-03-28 2008-11-06 Furukawa Electric Co Ltd:The 銅合金材およびその製造方法
JP4440313B2 (ja) 2008-03-31 2010-03-24 日鉱金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ−Ｃｒ系合金
JP5261122B2 (ja) 2008-10-03 2013-08-14 Ｄｏｗａメタルテック株式会社 銅合金板材およびその製造方法
US9476474B2 (en) * 2010-12-13 2016-10-25 Nippon Seisen Co., Ltd. Copper alloy wire and copper alloy spring

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2051127A (en) * 1979-04-30 1981-01-14 Delta Enfield Metals Precipitation hardening copper alloys
JPH02179839A (ja) * 1988-12-29 1990-07-12 Kobe Steel Ltd 耐衝撃特性及び熱間加工性に優れた高強度銅合金
JPH03126829A (ja) * 1989-10-06 1991-05-30 Sumitomo Metal Mining Co Ltd 工具用非発火性銅合金
JPH03173730A (ja) * 1989-12-01 1991-07-29 Sumitomo Metal Mining Co Ltd 工具用非発火性銅合金
JPH0499140A (ja) * 1990-08-03 1992-03-31 Hitachi Ltd プラスチック成形用金型材料
DE4226692A1 (de) * 1991-08-13 1993-03-04 Mitsubishi Materials Corp Ausscheidungshaertbare legierungen auf kupferbasis mit hoher festigkeit bei erhoehten temperaturen
JPH07268512A (ja) * 1994-03-30 1995-10-17 Mitsubishi Materials Corp 熱伝導度、高温硬さおよび耐酸化性に優れた耐熱銅合金およびこの耐熱銅合金からなる焼成型
JP2010007174A (ja) * 2008-05-29 2010-01-14 Nippon Mining & Metals Co Ltd 電子材料用Ｃｕ−Ｎｉ−Ｓｉ系合金板又は条

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
"Mechanical Properties of Intermetallic Compounds Formed Between Tin (Solder) and Copper or Nickel - Hardness as a function of temperature for Cu6Sn5, Cu3Sn, and Ni3Sn4", 23 July 2014 (2014-07-23), pages 1 - 2, XP002727695, Retrieved from the Internet <URL:http://www.msed.nist.gov/mechanical_properties/solder_mechanicalprop.html> [retrieved on 20140723] *
GRYZIECKI JANUSZ ET AL: "The role of microadditions in the kinetic change of precipitation during the aging process of nickel-aluminium bronze", ARCHIVES OF METALLURGY,, vol. 48, no. 3, 31 December 2003 (2003-12-31), pages 245 - 259, XP009179304 *
See also references of WO2012081573A1 *
ZHU ZHI-YUAN ET AL: "Solid solution and aging of Cu-Ni-Al-Si alloy", JINSHU RECHULI - HEAT TREATMENT OF METALS, ZHONGGUO JIXIE GONGCHENG XUEHUI, RECHULI XUEHUI, BEIJING, CN, vol. 32, no. 4, 31 December 2007 (2007-12-31), pages 83 - 85, XP009179303, ISSN: 0254-6051 *

Also Published As

Publication number Publication date
WO2012081573A1 (fr) 2012-06-21
CN103328665A (zh) 2013-09-25
KR101576715B1 (ko) 2015-12-10
CN103328665B (zh) 2016-04-13
EP2653574B1 (fr) 2017-05-31
US20130333812A1 (en) 2013-12-19
EP2653574A1 (fr) 2013-10-23
JP5743165B2 (ja) 2015-07-01
JPWO2012081573A1 (ja) 2014-05-22
KR20130089661A (ko) 2013-08-12

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