EP2711088A4 - Filmbeschichtungsdüse, beschichtungsvorrichtung und beschichtungsverfahren - Google Patents

Filmbeschichtungsdüse, beschichtungsvorrichtung und beschichtungsverfahren

Info

Publication number
EP2711088A4
EP2711088A4 EP12786423.9A EP12786423A EP2711088A4 EP 2711088 A4 EP2711088 A4 EP 2711088A4 EP 12786423 A EP12786423 A EP 12786423A EP 2711088 A4 EP2711088 A4 EP 2711088A4
Authority
EP
European Patent Office
Prior art keywords
coating
coating method
filing nozzle
filing
coating device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP12786423.9A
Other languages
English (en)
French (fr)
Other versions
EP2711088A1 (de
EP2711088B1 (de
Inventor
Kazumasa Ikushima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Musashi Engineering Inc
Original Assignee
Musashi Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Musashi Engineering Inc filed Critical Musashi Engineering Inc
Publication of EP2711088A1 publication Critical patent/EP2711088A1/de
Publication of EP2711088A4 publication Critical patent/EP2711088A4/de
Application granted granted Critical
Publication of EP2711088B1 publication Critical patent/EP2711088B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0254Coating heads with slot-shaped outlet
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/14Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openings; with strainers in or outside the outlet opening
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00Means for manipulating or holding work, e.g. for separate articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/26Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
EP12786423.9A 2011-05-16 2012-04-27 Filmbeschichtungsdüse, beschichtungsvorrichtung und beschichtungsverfahren Active EP2711088B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011109047A JP5702223B2 (ja) 2011-05-16 2011-05-16 膜状塗布ノズル、塗布装置および塗布方法
PCT/JP2012/061335 WO2012157434A1 (ja) 2011-05-16 2012-04-27 膜状塗布ノズル、塗布装置および塗布方法

Publications (3)

Publication Number Publication Date
EP2711088A1 EP2711088A1 (de) 2014-03-26
EP2711088A4 true EP2711088A4 (de) 2015-02-25
EP2711088B1 EP2711088B1 (de) 2020-01-15

Family

ID=47176769

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12786423.9A Active EP2711088B1 (de) 2011-05-16 2012-04-27 Filmbeschichtungsdüse, beschichtungsvorrichtung und beschichtungsverfahren

Country Status (7)

Country Link
EP (1) EP2711088B1 (de)
JP (1) JP5702223B2 (de)
KR (1) KR102006009B1 (de)
CN (1) CN103596700B (de)
ES (1) ES2774224T3 (de)
TW (1) TWI533935B (de)
WO (1) WO2012157434A1 (de)

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* Cited by examiner, † Cited by third party
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JP5702223B2 (ja) * 2011-05-16 2015-04-15 武蔵エンジニアリング株式会社 膜状塗布ノズル、塗布装置および塗布方法
JP6121203B2 (ja) * 2013-03-13 2017-04-26 東レエンジニアリング株式会社 塗布器、パターン塗布装置およびパターン塗布方法
JP6142268B2 (ja) * 2013-05-28 2017-06-07 兵神装備株式会社 吐出幅可変装置、及び吐出装置
JP6068271B2 (ja) 2013-06-10 2017-01-25 東レ株式会社 塗布器、及び塗布装置
KR102218589B1 (ko) * 2013-06-20 2021-02-23 삼성디스플레이 주식회사 수지 도포 장치, 그 방법 및 이를 이용한 수지층 형성방법
JP2015013272A (ja) 2013-07-08 2015-01-22 トヨタ自動車株式会社 塗布装置及び塗布方法
WO2015030168A1 (ja) 2013-08-30 2015-03-05 武蔵エンジニアリング株式会社 板状積層体の製造方法および装置
DE102014212940A1 (de) * 2014-07-03 2016-01-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Modul, System und Verfahren zum Auftragen eines viskosen Mediums auf eine Oberfläche und Verfahren zum Herstellen des Moduls
JP2016111302A (ja) * 2014-12-10 2016-06-20 株式会社Screenホールディングス 基板処理装置
JP6385864B2 (ja) * 2015-03-18 2018-09-05 株式会社東芝 ノズルおよび液体供給装置
JP6877877B2 (ja) * 2016-01-26 2021-05-26 ノードソン コーポレーションNordson Corporation ノズル
CN107398365B (zh) * 2017-08-02 2019-03-12 东南大学 一种洒水车喷头
CN108097538A (zh) * 2018-02-01 2018-06-01 安徽东旭康图太阳能科技有限公司 光伏组件的打胶系统及打胶方法
JP6554580B1 (ja) * 2018-05-22 2019-07-31 日東電工株式会社 塗工膜形成方法
KR102116534B1 (ko) 2018-06-25 2020-05-28 주식회사 에이치에스하이테크 기판 세정용 노즐 및 그 제조 방법
CN109433695B (zh) * 2018-10-23 2019-08-23 广东顺德蓝导电器科技有限公司 高温高压蒸汽清洁机
IT201800009720A1 (it) * 2018-10-23 2020-04-23 Isopan Spa Dispositivo di erogazione di un liquido
IT201800020614A1 (it) * 2018-12-20 2020-06-20 Isopan S P A Dispositivo per l'erogazione di un liquido
CN109721254B (zh) * 2019-02-21 2021-01-01 深圳市华星光电技术有限公司 喷嘴以及涂布装置
KR102904747B1 (ko) 2019-04-27 2025-12-24 무사시 엔지니어링 가부시키가이샤 적층면재의 제조 방법 및 장치
CN109967309A (zh) * 2019-05-08 2019-07-05 绍兴索顿电子科技有限公司 一种专用高分子疏水材料的上料设备
JP7213142B2 (ja) * 2019-05-24 2023-01-26 花王株式会社 発熱体の製造方法
JP7377641B2 (ja) * 2019-07-31 2023-11-10 タツモ株式会社 塗布ノズル及び塗布装置
JP7557723B2 (ja) * 2020-05-26 2024-09-30 パナソニックIpマネジメント株式会社 スリットダイ及びそれを備えた塗工装置
EP4194104A4 (de) 2020-08-04 2024-05-29 Kabushiki Kaisha Toshiba Anwendungsvorrichtung und anwendungsverfahren
JP6847566B1 (ja) 2020-10-01 2021-03-24 中外炉工業株式会社 塗布装置及び塗布方法
CN112873585B (zh) * 2021-01-12 2023-01-20 上海新昇半导体科技有限公司 晶棒带锯机喷嘴
EP4053538A1 (de) 2021-03-01 2022-09-07 Single Technologies AB Flüssigkeitshandhabungsmittel zur durchführung von assays
CN217140968U (zh) * 2022-03-14 2022-08-09 宁德时代新能源科技股份有限公司 涂布模头和电池极片的涂布装置
CN114985211B (zh) * 2022-08-01 2022-10-25 潍坊市昌威交通工程有限公司 一种组合式高压热熔喷涂头
TWI909230B (zh) * 2022-10-25 2025-12-21 日商兵神裝備股份有限公司 噴嘴和液體供給系統
CN115716027A (zh) * 2022-11-30 2023-02-28 安徽环速自动化科技有限公司 一种用于直线导轨加工的润滑油均匀涂覆装置
KR102893037B1 (ko) * 2022-12-23 2025-11-27 주식회사 엘지에너지솔루션 스페이서 심, 슬롯 다이 코터 및 이를 이용한 코팅 방법
JP2024135145A (ja) * 2023-03-22 2024-10-04 兵神装備株式会社 吐出装置、塗布システム、及び塗布方法
CN116550548A (zh) * 2023-05-19 2023-08-08 苏州迪泰奇自动化科技有限公司 多支路宽幅出胶嘴
GB2632872A (en) * 2023-08-25 2025-02-26 Airbus Operations Ltd Applicator
WO2026005580A1 (ko) * 2024-06-27 2026-01-02 엘지전자 주식회사 도포 장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0578469A2 (de) * 1992-07-08 1994-01-12 Nordson Corporation Verbesserungen an und hinsichtlich des Aufbringens von Beschichtungen
JPH11290746A (ja) * 1998-04-07 1999-10-26 Musashi Eng Co Ltd 流体の吐出路構造
US20080102268A1 (en) * 2005-01-28 2008-05-01 Koichiro Higasa Adhesive for Production of Ic Card, Process for Producing Ic Card, and Ic Card
US20110061589A1 (en) * 2009-09-17 2011-03-17 Nhk Spring Co., Ltd. Liquid application apparatus

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JPS59109273A (ja) * 1982-12-15 1984-06-23 Matsushita Electric Ind Co Ltd 回転塗布装置用ノズル
JPH0598625A (ja) * 1991-04-08 1993-04-20 Tatsumi Kogyo Kk オイルフエンス形槽
JP3277214B2 (ja) * 1992-02-05 2002-04-22 株式会社スギノマシン 急拡大型液中ジェット噴射用ノズル
JPH08224503A (ja) 1995-02-21 1996-09-03 Alloy Koki Kk 塗装方法および装置
JPH09206649A (ja) * 1996-01-31 1997-08-12 Sony Corp 接着剤塗布装置
JP2002052731A (ja) * 2000-08-09 2002-02-19 Mimaki Engineering Co Ltd インクジェットプロッタ
JP2002370057A (ja) 2001-06-13 2002-12-24 Matsushita Electric Ind Co Ltd エクストルージョン型ノズルおよび塗布装置
JP2006084975A (ja) * 2004-09-17 2006-03-30 Fujitsu Display Technologies Corp 液晶表示装置の製造方法及び液晶滴下装置
JP4037861B2 (ja) 2004-11-11 2008-01-23 武蔵エンジニアリング株式会社 流体の吐出路構造
JP4509763B2 (ja) * 2004-12-15 2010-07-21 エムケー精工株式会社 気液混合流噴射装置
US9302301B2 (en) * 2006-12-19 2016-04-05 Spraying Systems Co. Automated tank cleaning and monitoring device
CN101623684A (zh) * 2008-07-07 2010-01-13 中信国安盟固利新能源科技有限公司 用于锂离子电池极片的涂膜方法和涂膜设备
JP5702223B2 (ja) * 2011-05-16 2015-04-15 武蔵エンジニアリング株式会社 膜状塗布ノズル、塗布装置および塗布方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0578469A2 (de) * 1992-07-08 1994-01-12 Nordson Corporation Verbesserungen an und hinsichtlich des Aufbringens von Beschichtungen
JPH11290746A (ja) * 1998-04-07 1999-10-26 Musashi Eng Co Ltd 流体の吐出路構造
US20080102268A1 (en) * 2005-01-28 2008-05-01 Koichiro Higasa Adhesive for Production of Ic Card, Process for Producing Ic Card, and Ic Card
US20110061589A1 (en) * 2009-09-17 2011-03-17 Nhk Spring Co., Ltd. Liquid application apparatus

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2012157434A1 *

Also Published As

Publication number Publication date
CN103596700A (zh) 2014-02-19
KR102006009B1 (ko) 2019-07-31
WO2012157434A1 (ja) 2012-11-22
TW201302314A (zh) 2013-01-16
EP2711088A1 (de) 2014-03-26
CN103596700B (zh) 2016-12-28
TWI533935B (zh) 2016-05-21
JP5702223B2 (ja) 2015-04-15
EP2711088B1 (de) 2020-01-15
JP2012239930A (ja) 2012-12-10
KR20140024921A (ko) 2014-03-03
ES2774224T3 (es) 2020-07-17

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