EP2855738A4 - Additifs pour la fabrication d'électrodépôts de cuivre ayant une faible teneur en oxygène - Google Patents
Additifs pour la fabrication d'électrodépôts de cuivre ayant une faible teneur en oxygèneInfo
- Publication number
- EP2855738A4 EP2855738A4 EP13793817.1A EP13793817A EP2855738A4 EP 2855738 A4 EP2855738 A4 EP 2855738A4 EP 13793817 A EP13793817 A EP 13793817A EP 2855738 A4 EP2855738 A4 EP 2855738A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- electrodepers
- additives
- copper
- manufacture
- oxygen content
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/04—Removal of gases or vapours ; Gas or pressure control
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
- C25D3/40—Electroplating: Baths therefor from solutions of copper from cyanide baths, e.g. with Cu+
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/480,887 US9243339B2 (en) | 2012-05-25 | 2012-05-25 | Additives for producing copper electrodeposits having low oxygen content |
| PCT/US2013/036546 WO2013176796A1 (fr) | 2012-05-25 | 2013-04-15 | Additifs pour la fabrication d'électrodépôts de cuivre ayant une faible teneur en oxygène |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP2855738A1 EP2855738A1 (fr) | 2015-04-08 |
| EP2855738A4 true EP2855738A4 (fr) | 2016-01-27 |
| EP2855738B1 EP2855738B1 (fr) | 2022-07-06 |
Family
ID=49620743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP13793817.1A Active EP2855738B1 (fr) | 2012-05-25 | 2013-04-15 | Additifs pour la fabrication d'électrodépôts de cuivre ayant une faible teneur en oxygène |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9243339B2 (fr) |
| EP (1) | EP2855738B1 (fr) |
| JP (1) | JP6030229B2 (fr) |
| CN (1) | CN104428452B (fr) |
| TW (1) | TWI481745B (fr) |
| WO (1) | WO2013176796A1 (fr) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2591574Y2 (ja) | 1993-12-27 | 1999-03-03 | ジューキ株式会社 | オーバーロックミシンの安全装置 |
| US20170067173A1 (en) * | 2015-09-09 | 2017-03-09 | Rohm And Haas Electronic Materials Llc | Acid copper electroplating bath and method for electroplating low internal stress and good ductility copper deposits |
| US20170145577A1 (en) * | 2015-11-19 | 2017-05-25 | Rohm And Haas Electronic Materials Llc | Method of electroplating low internal stress copper deposits on thin film substrates to inhibit warping |
| CN107326407B (zh) * | 2017-07-25 | 2018-11-16 | 上海新阳半导体材料股份有限公司 | 整平剂、含其的金属电镀组合物及制备方法、应用 |
| PT3483307T (pt) | 2017-11-09 | 2020-07-03 | Atotech Deutschland Gmbh | Composições de revestimento para deposição de cobre eletrolítico, a sua utilização e um método para depósito electrolítico de uma camada de cobre ou liga de cobre na pelo menos uma superfície de um substrato |
| WO2020006761A1 (fr) * | 2018-07-06 | 2020-01-09 | 力汉科技有限公司 | Électrolyte, procédé de préparation d'un cuivre monocristallin par électrodéposition à l'aide d'un électrolyte, et dispositif d'électrodéposition |
| EP3933073B1 (fr) * | 2020-06-29 | 2023-11-29 | Atotech Deutschland GmbH & Co. KG | Bain d'électrodéposition de cuivre |
| US20230063860A1 (en) * | 2021-08-24 | 2023-03-02 | ACS ENTERPRISES, LLC d/b/a AMERICAN CHEMICAL | Copper treatment additive |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1000204B (de) * | 1954-03-13 | 1957-01-03 | Dehydag Gmbh | Verfahren zur Herstellung galvanischer Kupferueberzuege |
| GB1142292A (en) * | 1965-12-28 | 1969-02-05 | Mikhail Mikhailovich Esipenko | Improved method and apparatus for the manufacture of articles having multilayer wallsand channels, e.g. waveguides |
| US3616330A (en) * | 1970-01-08 | 1971-10-26 | North American Rockwell | Process for electroforming low oxygen copper |
| US20070062818A1 (en) * | 2005-09-20 | 2007-03-22 | Alchimer | Electroplating composition intended for coating a surface of a substrate with a metal |
Family Cites Families (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE534101A (fr) * | 1954-03-13 | |||
| GB790870A (en) | 1954-09-10 | 1958-02-19 | Horizons Titanium Corp | Improvements in the electrolytic deposition of refractory metals |
| DE1152863B (de) * | 1957-03-16 | 1963-08-14 | Riedel & Co | Saure Baeder zur Herstellung von einebnenden Kupferueberzuegen |
| FR1573438A (fr) | 1967-07-03 | 1969-07-04 | ||
| US3730853A (en) | 1971-06-18 | 1973-05-01 | Schloetter M | Electroplating bath for depositing tin-lead alloy plates |
| US3770598A (en) | 1972-01-21 | 1973-11-06 | Oxy Metal Finishing Corp | Electrodeposition of copper from acid baths |
| DE2204326C3 (de) | 1972-01-26 | 1981-07-09 | Schering Ag Berlin Und Bergkamen, 1000 Berlin | Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und duktilen Kupferüberzügen |
| US4036710A (en) | 1974-11-21 | 1977-07-19 | M & T Chemicals Inc. | Electrodeposition of copper |
| US4009087A (en) | 1974-11-21 | 1977-02-22 | M&T Chemicals Inc. | Electrodeposition of copper |
| JPS5167234A (ja) * | 1974-12-09 | 1976-06-10 | Hitachi Ltd | Pirorinsandometsukizeikahimakuboshiho |
| US4036711A (en) * | 1975-12-18 | 1977-07-19 | M & T Chemicals Inc. | Electrodeposition of copper |
| US4374709A (en) | 1980-05-01 | 1983-02-22 | Occidental Chemical Corporation | Process for plating polymeric substrates |
| US4376685A (en) * | 1981-06-24 | 1983-03-15 | M&T Chemicals Inc. | Acid copper electroplating baths containing brightening and leveling additives |
| US4425197A (en) * | 1981-08-19 | 1984-01-10 | Inoue-Japax Research Incorporated | Method of and apparatus for electrodepositing a metal on a conductive surface |
| US4686017A (en) * | 1981-11-05 | 1987-08-11 | Union Oil Co. Of California | Electrolytic bath and methods of use |
| US4469564A (en) | 1982-08-11 | 1984-09-04 | At&T Bell Laboratories | Copper electroplating process |
| AU559896B2 (en) | 1983-06-10 | 1987-03-26 | Omi International Corp. | Electrolytic copper depositing processes |
| US4555315A (en) | 1984-05-29 | 1985-11-26 | Omi International Corporation | High speed copper electroplating process and bath therefor |
| US4673469A (en) | 1984-06-08 | 1987-06-16 | Mcgean-Rohco, Inc. | Method of plating plastics |
| US4673472A (en) | 1986-02-28 | 1987-06-16 | Technic Inc. | Method and electroplating solution for deposition of palladium or alloys thereof |
| US5181770A (en) * | 1989-04-19 | 1993-01-26 | Olin Corporation | Surface topography optimization through control of chloride concentration in electroformed copper foil |
| JPH0328389A (ja) * | 1989-06-23 | 1991-02-06 | Meiko Denshi Kogyo Kk | 銅張積層板用銅箔層、その製造方法およびそれに用いるめっき浴 |
| US5024733A (en) | 1989-08-29 | 1991-06-18 | At&T Bell Laboratories | Palladium alloy electroplating process |
| US5167791A (en) * | 1991-12-20 | 1992-12-01 | Xerox Corporation | Process for electrolytic deposition of iron |
| JPH09104996A (ja) * | 1995-10-04 | 1997-04-22 | Takayuki Tamura | 酸性光沢Ｓｎ−Ｎｉ合金めっき液 |
| JPH1110794A (ja) * | 1997-06-27 | 1999-01-19 | Nippon Denkai Kk | 銅張積層板用銅箔およびそれを用いた銅張積層板 |
| US6444110B2 (en) | 1999-05-17 | 2002-09-03 | Shipley Company, L.L.C. | Electrolytic copper plating method |
| DE19937843C1 (de) | 1999-08-13 | 2001-02-08 | Bolta Werke Gmbh | Verfahren zur Herstellung einer selbsttragenden Kupferfolie |
| US6605204B1 (en) | 1999-10-14 | 2003-08-12 | Atofina Chemicals, Inc. | Electroplating of copper from alkanesulfonate electrolytes |
| DE60142831D1 (de) | 2000-05-22 | 2010-09-30 | Nippon Mining Co | Verfahren zur herstellung von metall mit höherem reinheitsgrad |
| JP3919474B2 (ja) * | 2000-06-30 | 2007-05-23 | 株式会社荏原製作所 | めっき方法及びめっき装置 |
| EP1167582B1 (fr) | 2000-07-01 | 2005-09-14 | Shipley Company LLC | Compositions d'un alliage de metal et méthode de déposition associée |
| US6679983B2 (en) | 2000-10-13 | 2004-01-20 | Shipley Company, L.L.C. | Method of electrodepositing copper |
| EP1341951B1 (fr) | 2000-10-19 | 2004-05-19 | ATOTECH Deutschland GmbH | Bain de cuivre et procede de depot d'un revetement de cuivre mat |
| TWI400365B (zh) | 2004-11-12 | 2013-07-01 | 安頌股份有限公司 | 微電子裝置上的銅電沈積 |
| JP4065004B2 (ja) * | 2005-03-31 | 2008-03-19 | 三井金属鉱業株式会社 | 電解銅箔、その電解銅箔を用いて得られた表面処理電解銅箔、その表面処理電解銅箔を用いた銅張積層板及びプリント配線板 |
| EP1741804B1 (fr) * | 2005-07-08 | 2016-04-27 | Rohm and Haas Electronic Materials, L.L.C. | Verfahren zur elektrolytischen Kupferplattierung |
| WO2008049019A2 (fr) | 2006-10-17 | 2008-04-24 | Enthone Inc. | Cuivrage permettant de remplir des caractéristiques lors de la fabrication de dispositifs microélectroniques |
| JP4827952B2 (ja) | 2008-07-07 | 2011-11-30 | 古河電気工業株式会社 | 電解銅箔および銅張積層板 |
| WO2010115756A1 (fr) * | 2009-04-07 | 2010-10-14 | Basf Se | Composition pour le plaquage de métaux comportant un agent suppresseur de remplissage des fissures submicroniques éliminant les vides |
| SG174264A1 (en) * | 2009-04-07 | 2011-10-28 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
| WO2011036076A2 (fr) * | 2009-09-28 | 2011-03-31 | Basf Se | Composition de cuivrage électrolytique |
| EP2576696B1 (fr) * | 2010-06-01 | 2017-10-04 | Basf Se | Composition pour électrodéposition métallique comprenant un agent nivelant |
-
2012
- 2012-05-25 US US13/480,887 patent/US9243339B2/en not_active Expired - Fee Related
-
2013
- 2013-04-15 WO PCT/US2013/036546 patent/WO2013176796A1/fr not_active Ceased
- 2013-04-15 JP JP2015514018A patent/JP6030229B2/ja not_active Expired - Fee Related
- 2013-04-15 CN CN201380027336.0A patent/CN104428452B/zh not_active Expired - Fee Related
- 2013-04-15 EP EP13793817.1A patent/EP2855738B1/fr active Active
- 2013-04-26 TW TW102114950A patent/TWI481745B/zh not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1000204B (de) * | 1954-03-13 | 1957-01-03 | Dehydag Gmbh | Verfahren zur Herstellung galvanischer Kupferueberzuege |
| GB1142292A (en) * | 1965-12-28 | 1969-02-05 | Mikhail Mikhailovich Esipenko | Improved method and apparatus for the manufacture of articles having multilayer wallsand channels, e.g. waveguides |
| US3616330A (en) * | 1970-01-08 | 1971-10-26 | North American Rockwell | Process for electroforming low oxygen copper |
| US20070062818A1 (en) * | 2005-09-20 | 2007-03-22 | Alchimer | Electroplating composition intended for coating a surface of a substrate with a metal |
Non-Patent Citations (1)
| Title |
|---|
| See also references of WO2013176796A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| US9243339B2 (en) | 2016-01-26 |
| WO2013176796A1 (fr) | 2013-11-28 |
| TW201406999A (zh) | 2014-02-16 |
| CN104428452B (zh) | 2017-05-17 |
| CN104428452A (zh) | 2015-03-18 |
| EP2855738A1 (fr) | 2015-04-08 |
| TWI481745B (zh) | 2015-04-21 |
| JP2015521237A (ja) | 2015-07-27 |
| JP6030229B2 (ja) | 2016-11-24 |
| EP2855738B1 (fr) | 2022-07-06 |
| US20130313119A1 (en) | 2013-11-28 |
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