EP2896720A4 - Basismittel für stromlose plattierung - Google Patents
Basismittel für stromlose plattierungInfo
- Publication number
- EP2896720A4 EP2896720A4 EP13837102.6A EP13837102A EP2896720A4 EP 2896720 A4 EP2896720 A4 EP 2896720A4 EP 13837102 A EP13837102 A EP 13837102A EP 2896720 A4 EP2896720 A4 EP 2896720A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- basic agent
- autocatalytic deposition
- autocatalytic
- deposition
- basic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
- C23C18/1879—Use of metal, e.g. activation, sensitisation with noble metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
- C23C18/1882—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/206—Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
- Catalysts (AREA)
- Powder Metallurgy (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012201584 | 2012-09-13 | ||
| JP2013003605 | 2013-01-11 | ||
| JP2013053574 | 2013-03-15 | ||
| PCT/JP2013/074714 WO2014042215A1 (ja) | 2012-09-13 | 2013-09-12 | 無電解めっき下地剤 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP2896720A1 EP2896720A1 (de) | 2015-07-22 |
| EP2896720A4 true EP2896720A4 (de) | 2016-06-22 |
| EP2896720B1 EP2896720B1 (de) | 2017-11-22 |
Family
ID=50278324
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP13837102.6A Active EP2896720B1 (de) | 2012-09-13 | 2013-09-12 | Basismittel für stromlose plattierung |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20160010215A1 (de) |
| EP (1) | EP2896720B1 (de) |
| JP (1) | JP6354950B2 (de) |
| KR (2) | KR102157192B1 (de) |
| CN (1) | CN104641017B (de) |
| TW (1) | TWI627194B (de) |
| WO (1) | WO2014042215A1 (de) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6352059B2 (ja) * | 2014-06-05 | 2018-07-04 | 奥野製薬工業株式会社 | 無電解めっき下地層形成用組成物 |
| JP6631806B2 (ja) * | 2014-07-30 | 2020-01-15 | 日産化学株式会社 | ハイパーブランチポリマー、金属微粒子及び樹脂プライマーを含む無電解めっき下地剤 |
| JP6649631B2 (ja) * | 2014-09-05 | 2020-02-19 | 日産化学株式会社 | 光硬化性無電解めっき下地剤 |
| WO2016035897A1 (ja) * | 2014-09-05 | 2016-03-10 | 日産化学工業株式会社 | 感光性無電解めっき下地剤 |
| CH710579A1 (fr) * | 2014-12-23 | 2016-06-30 | Metalor Tech Int Sa | Procédé de placage autocatalytique d'un métal précieux. |
| JP6471392B2 (ja) * | 2015-02-12 | 2019-02-20 | 上村工業株式会社 | 無電解めっき用前処理剤、並びに前記無電解めっき用前処理剤を用いたプリント配線基板の前処理方法およびその製造方法 |
| WO2016158949A1 (ja) * | 2015-03-31 | 2016-10-06 | 日産化学工業株式会社 | 感光性無電解めっき下地剤 |
| KR102878303B1 (ko) * | 2016-02-19 | 2025-10-29 | 닛산 가가쿠 가부시키가이샤 | 고분지 고분자 및 금속 미립자를 포함하는 무전해 도금 하지제 |
| WO2017154919A1 (ja) * | 2016-03-09 | 2017-09-14 | 日産化学工業株式会社 | 高分岐高分子及び金属微粒子を含む無電解めっき下地剤 |
| WO2017154913A1 (ja) * | 2016-03-09 | 2017-09-14 | 日産化学工業株式会社 | 感光性無電解めっき下地剤 |
| JP6607811B2 (ja) * | 2016-03-11 | 2019-11-20 | マクセルホールディングス株式会社 | メッキ部品の製造方法、メッキ部品、触媒活性妨害剤及び無電解メッキ用複合材料 |
| WO2019022151A1 (ja) * | 2017-07-25 | 2019-01-31 | 日産化学株式会社 | 金属微粒子複合体の製造方法 |
| EP3670698B1 (de) * | 2018-12-17 | 2021-08-11 | ATOTECH Deutschland GmbH | Wässrige alkalische vorbehandlungslösung zur verwendung vor der ablagerung einer palladiumaktivierungsschicht, verfahren und verwendung davon |
| KR102886315B1 (ko) * | 2018-12-21 | 2025-11-14 | 닛산 가가쿠 가부시키가이샤 | 고분자 및 금속미립자를 포함하는 무전해도금하지제 |
| CN113508192B (zh) * | 2019-03-05 | 2024-07-05 | 麦克赛尔株式会社 | 化学镀抑制组合物和镀覆部件的制造方法 |
| TWI888485B (zh) * | 2020-02-19 | 2025-07-01 | 日商日產化學股份有限公司 | 包含高分子及金屬微粒之無電解鍍敷基底劑 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1491656A1 (de) * | 2003-06-24 | 2004-12-29 | Rohm and Haas Electronic Materials, L.L.C. | Katalysator und Methode zur stromlosen Abscheidung |
| US20080248211A1 (en) * | 2007-03-13 | 2008-10-09 | Basf Corporation | Coating compositions containing silane, methods for producing a coating composition and a coated substrate |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006052101A (ja) * | 2004-08-10 | 2006-02-23 | Mitsuboshi Belting Ltd | セラミックス基材表面への金属皮膜形成方法及び金属化処理セラミックス基材 |
| JP2008007849A (ja) * | 2006-06-01 | 2008-01-17 | Nippon Paint Co Ltd | 無電解めっき用プライマー組成物及び無電解めっき方法 |
| CN101506246B (zh) * | 2006-09-01 | 2011-06-22 | 日产化学工业株式会社 | 超支化聚合物及其制造方法 |
| WO2010021386A1 (ja) * | 2008-08-22 | 2010-02-25 | 日産化学工業株式会社 | アンモニウム基を有する分岐高分子化合物からなる金属微粒子分散剤 |
| WO2012141215A1 (ja) * | 2011-04-12 | 2012-10-18 | 日産化学工業株式会社 | ハイパーブランチポリマー及び金属微粒子を含む無電解めっき下地剤 |
-
2013
- 2013-09-12 KR KR1020207003144A patent/KR102157192B1/ko active Active
- 2013-09-12 US US14/428,189 patent/US20160010215A1/en not_active Abandoned
- 2013-09-12 WO PCT/JP2013/074714 patent/WO2014042215A1/ja not_active Ceased
- 2013-09-12 EP EP13837102.6A patent/EP2896720B1/de active Active
- 2013-09-12 CN CN201380047242.XA patent/CN104641017B/zh active Active
- 2013-09-12 JP JP2014535588A patent/JP6354950B2/ja active Active
- 2013-09-12 KR KR1020157007380A patent/KR20150054851A/ko not_active Ceased
- 2013-09-13 TW TW102133177A patent/TWI627194B/zh active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1491656A1 (de) * | 2003-06-24 | 2004-12-29 | Rohm and Haas Electronic Materials, L.L.C. | Katalysator und Methode zur stromlosen Abscheidung |
| US20080248211A1 (en) * | 2007-03-13 | 2008-10-09 | Basf Corporation | Coating compositions containing silane, methods for producing a coating composition and a coated substrate |
Non-Patent Citations (1)
| Title |
|---|
| See also references of WO2014042215A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| US20160010215A1 (en) | 2016-01-14 |
| TWI627194B (zh) | 2018-06-21 |
| KR20200015818A (ko) | 2020-02-12 |
| EP2896720A1 (de) | 2015-07-22 |
| KR20150054851A (ko) | 2015-05-20 |
| EP2896720B1 (de) | 2017-11-22 |
| CN104641017B (zh) | 2018-06-15 |
| JPWO2014042215A1 (ja) | 2016-08-18 |
| KR102157192B1 (ko) | 2020-09-18 |
| TW201418299A (zh) | 2014-05-16 |
| JP6354950B2 (ja) | 2018-07-11 |
| CN104641017A (zh) | 2015-05-20 |
| WO2014042215A1 (ja) | 2014-03-20 |
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