EP2896720A4 - Basismittel für stromlose plattierung - Google Patents

Basismittel für stromlose plattierung

Info

Publication number
EP2896720A4
EP2896720A4 EP13837102.6A EP13837102A EP2896720A4 EP 2896720 A4 EP2896720 A4 EP 2896720A4 EP 13837102 A EP13837102 A EP 13837102A EP 2896720 A4 EP2896720 A4 EP 2896720A4
Authority
EP
European Patent Office
Prior art keywords
basic agent
autocatalytic deposition
autocatalytic
deposition
basic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP13837102.6A
Other languages
English (en)
French (fr)
Other versions
EP2896720A1 (de
EP2896720B1 (de
Inventor
Daigo Saito
Keisuke Kojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Chemical Corp
Original Assignee
Nissan Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Chemical Corp filed Critical Nissan Chemical Corp
Publication of EP2896720A1 publication Critical patent/EP2896720A1/de
Publication of EP2896720A4 publication Critical patent/EP2896720A4/de
Application granted granted Critical
Publication of EP2896720B1 publication Critical patent/EP2896720B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1646Characteristics of the product obtained
    • C23C18/165Multilayered product
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/1851Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1875Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
    • C23C18/1879Use of metal, e.g. activation, sensitisation with noble metals
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/1851Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1875Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
    • C23C18/1882Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/206Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/2066Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28Sensitising or activating
    • C23C18/30Activating or accelerating or sensitising with palladium or other noble metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Catalysts (AREA)
  • Powder Metallurgy (AREA)
EP13837102.6A 2012-09-13 2013-09-12 Basismittel für stromlose plattierung Active EP2896720B1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2012201584 2012-09-13
JP2013003605 2013-01-11
JP2013053574 2013-03-15
PCT/JP2013/074714 WO2014042215A1 (ja) 2012-09-13 2013-09-12 無電解めっき下地剤

Publications (3)

Publication Number Publication Date
EP2896720A1 EP2896720A1 (de) 2015-07-22
EP2896720A4 true EP2896720A4 (de) 2016-06-22
EP2896720B1 EP2896720B1 (de) 2017-11-22

Family

ID=50278324

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13837102.6A Active EP2896720B1 (de) 2012-09-13 2013-09-12 Basismittel für stromlose plattierung

Country Status (7)

Country Link
US (1) US20160010215A1 (de)
EP (1) EP2896720B1 (de)
JP (1) JP6354950B2 (de)
KR (2) KR102157192B1 (de)
CN (1) CN104641017B (de)
TW (1) TWI627194B (de)
WO (1) WO2014042215A1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6352059B2 (ja) * 2014-06-05 2018-07-04 奥野製薬工業株式会社 無電解めっき下地層形成用組成物
JP6631806B2 (ja) * 2014-07-30 2020-01-15 日産化学株式会社 ハイパーブランチポリマー、金属微粒子及び樹脂プライマーを含む無電解めっき下地剤
JP6649631B2 (ja) * 2014-09-05 2020-02-19 日産化学株式会社 光硬化性無電解めっき下地剤
WO2016035897A1 (ja) * 2014-09-05 2016-03-10 日産化学工業株式会社 感光性無電解めっき下地剤
CH710579A1 (fr) * 2014-12-23 2016-06-30 Metalor Tech Int Sa Procédé de placage autocatalytique d'un métal précieux.
JP6471392B2 (ja) * 2015-02-12 2019-02-20 上村工業株式会社 無電解めっき用前処理剤、並びに前記無電解めっき用前処理剤を用いたプリント配線基板の前処理方法およびその製造方法
WO2016158949A1 (ja) * 2015-03-31 2016-10-06 日産化学工業株式会社 感光性無電解めっき下地剤
KR102878303B1 (ko) * 2016-02-19 2025-10-29 닛산 가가쿠 가부시키가이샤 고분지 고분자 및 금속 미립자를 포함하는 무전해 도금 하지제
WO2017154919A1 (ja) * 2016-03-09 2017-09-14 日産化学工業株式会社 高分岐高分子及び金属微粒子を含む無電解めっき下地剤
WO2017154913A1 (ja) * 2016-03-09 2017-09-14 日産化学工業株式会社 感光性無電解めっき下地剤
JP6607811B2 (ja) * 2016-03-11 2019-11-20 マクセルホールディングス株式会社 メッキ部品の製造方法、メッキ部品、触媒活性妨害剤及び無電解メッキ用複合材料
WO2019022151A1 (ja) * 2017-07-25 2019-01-31 日産化学株式会社 金属微粒子複合体の製造方法
EP3670698B1 (de) * 2018-12-17 2021-08-11 ATOTECH Deutschland GmbH Wässrige alkalische vorbehandlungslösung zur verwendung vor der ablagerung einer palladiumaktivierungsschicht, verfahren und verwendung davon
KR102886315B1 (ko) * 2018-12-21 2025-11-14 닛산 가가쿠 가부시키가이샤 고분자 및 금속미립자를 포함하는 무전해도금하지제
CN113508192B (zh) * 2019-03-05 2024-07-05 麦克赛尔株式会社 化学镀抑制组合物和镀覆部件的制造方法
TWI888485B (zh) * 2020-02-19 2025-07-01 日商日產化學股份有限公司 包含高分子及金屬微粒之無電解鍍敷基底劑

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1491656A1 (de) * 2003-06-24 2004-12-29 Rohm and Haas Electronic Materials, L.L.C. Katalysator und Methode zur stromlosen Abscheidung
US20080248211A1 (en) * 2007-03-13 2008-10-09 Basf Corporation Coating compositions containing silane, methods for producing a coating composition and a coated substrate

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006052101A (ja) * 2004-08-10 2006-02-23 Mitsuboshi Belting Ltd セラミックス基材表面への金属皮膜形成方法及び金属化処理セラミックス基材
JP2008007849A (ja) * 2006-06-01 2008-01-17 Nippon Paint Co Ltd 無電解めっき用プライマー組成物及び無電解めっき方法
CN101506246B (zh) * 2006-09-01 2011-06-22 日产化学工业株式会社 超支化聚合物及其制造方法
WO2010021386A1 (ja) * 2008-08-22 2010-02-25 日産化学工業株式会社 アンモニウム基を有する分岐高分子化合物からなる金属微粒子分散剤
WO2012141215A1 (ja) * 2011-04-12 2012-10-18 日産化学工業株式会社 ハイパーブランチポリマー及び金属微粒子を含む無電解めっき下地剤

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1491656A1 (de) * 2003-06-24 2004-12-29 Rohm and Haas Electronic Materials, L.L.C. Katalysator und Methode zur stromlosen Abscheidung
US20080248211A1 (en) * 2007-03-13 2008-10-09 Basf Corporation Coating compositions containing silane, methods for producing a coating composition and a coated substrate

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2014042215A1 *

Also Published As

Publication number Publication date
US20160010215A1 (en) 2016-01-14
TWI627194B (zh) 2018-06-21
KR20200015818A (ko) 2020-02-12
EP2896720A1 (de) 2015-07-22
KR20150054851A (ko) 2015-05-20
EP2896720B1 (de) 2017-11-22
CN104641017B (zh) 2018-06-15
JPWO2014042215A1 (ja) 2016-08-18
KR102157192B1 (ko) 2020-09-18
TW201418299A (zh) 2014-05-16
JP6354950B2 (ja) 2018-07-11
CN104641017A (zh) 2015-05-20
WO2014042215A1 (ja) 2014-03-20

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