EP2907367A1 - Carte de circuits imprimés permettant le montage d'éléments lumineux à fenêtre active variable - Google Patents

Carte de circuits imprimés permettant le montage d'éléments lumineux à fenêtre active variable

Info

Publication number
EP2907367A1
EP2907367A1 EP13774421.5A EP13774421A EP2907367A1 EP 2907367 A1 EP2907367 A1 EP 2907367A1 EP 13774421 A EP13774421 A EP 13774421A EP 2907367 A1 EP2907367 A1 EP 2907367A1
Authority
EP
European Patent Office
Prior art keywords
printed circuit
circuit board
groups
connection
circuit boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP13774421.5A
Other languages
German (de)
English (en)
Inventor
Kenneth Martin
David GAJDOS
Steffen Block
Christian Daniel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zumtobel Lighting GmbH Austria
Original Assignee
Zumtobel Lighting GmbH Austria
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zumtobel Lighting GmbH Austria filed Critical Zumtobel Lighting GmbH Austria
Publication of EP2907367A1 publication Critical patent/EP2907367A1/fr
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0295—Programmable, customizable or modifiable circuits adapted for choosing between different types or different locations of mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional [2D] array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09254—Branched layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09318—Core having one signal plane and one power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09954—More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/173—Adding connections between adjacent pads or conductors, e.g. for modifying or repairing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections

Definitions

  • the present invention relates to a printed circuit board for equipping with luminous bodies according to the preamble of claim 1.
  • the luminous bodies are in particular LEDs, the printed circuit board having so-called equipping areas
  • circuit boards which have a plurality of channels which can be controlled separately from one another, wherein a plurality of connection possibilities, so-called footprints, are provided for LEDs on one channel.
  • the circuit board on a plurality of component areas, wherein in each assembly area a
  • the present invention is therefore based on the object to provide a novel solution, which provides greater flexibility in the operation of
  • LED modules allows. In particular, it should be possible to operate the module with different currents, but in principle the current provided to the individual LEDs should be able to move in the appropriate range.
  • the object is achieved by a printed circuit board for equipping with luminous bodies according to claim 1.
  • Connecting elements via which the groups or a part thereof can be optionally connected in parallel or serially with each other.
  • a printed circuit board for equipping with luminous bodies, in particular LEDs, the printed circuit board having component areas with connection possibilities for the luminous bodies, and in each case a plurality of the component areas being connected in series to one another by interconnects.
  • the printed circuit board has more
  • Connection options for electrical connection elements in particular for 0- Ohm resistances, via which at least a part of the groups can be optionally connected in parallel or in series with each other.
  • Amperage is required. Depending on the type of available converter so a corresponding interconnection of the groups can be made with each other to ensure optimal operation of the LEDs.
  • the placement areas are evenly distributed or arranged like a matrix on the circuit board.
  • a plurality of printed circuit boards according to the invention are connected to one another in order to form a planar arrangement for emitting light. It can be provided in particular that printed circuit boards of different sizes are available. Despite everything, it is then preferably provided in this case that the spacing of the mounting areas on the printed circuit boards is independent of the respective size of the printed circuit board. That is, the various printed circuit boards differ apart from their size in particular also in terms of the number of LEDs arranged thereon. If printed circuit boards are connected in series with one another and accordingly operated with the same current, this has the consequence that, with smaller circuit boards, a somewhat higher current is present at the associated LEDs and they accordingly shine brighter. However, this effect can be used to advantage, within the area
  • Arrangement for emitting light certain free spaces to form which can be used for arranging non-luminous elements, such as converters or the like, despite all over the entire area across a substantially homogeneous or uniform light output is achieved.
  • the circuit board according to the invention allows a very diverse and flexible use by the end user.
  • Figure 1 shows a first embodiment of a circuit board according to the invention
  • Figure 2 is an enlarged view of the connection of the LEDs or the
  • Figure 4 shows a second embodiment of a circuit board according to the invention
  • Figures 5a and 5b representations for alternative connection of the LED groups in the circuit board of Figure 4;
  • FIG. 7 shows a first possibility for combining printed circuit boards
  • FIG. 1 initially shows a first variant of a printed circuit board 10 designed according to the invention.
  • the illustrated printed circuit board 10 is intended to be populated with a total of 64 LEDs and accordingly has a large number of footprints or component areas 20 arranged in an 8 ⁇ 8 matrix distributed on a flat, in particular an approximately square shaped support element 1 1 are arranged in the form of a circuit board.
  • the arrangement of the component areas 20 is such that the distance d between two adjacent component areas 20 is basically the same in both the vertical direction and in the horizontal direction.
  • the component areas 20 are connected to one another via strip conductors 21. At the edge regions further positive and negative terminals 15 and 16 are formed for the power supply of the lyre plate 10.
  • terminals 15, 16 allow the connection of the printed circuit board 10 with a power supply unit, not shown, in particular a converter, which is adapted to supply the printed circuit board 10 with a constant current. Furthermore, with help These terminals 15 and 16, a plurality of circuit boards 10 are interconnected with each other to - as explained later in more detail - to form a planar arrangement for emitting light. According to a particularly preferred embodiment of the invention, it is provided that these connections 15 and 16 are designed such that they
  • connection of different contact types In particular, at least the connection should be possible with two different types of contact.
  • connection type During the final assembly of the printed circuit board equipped with the LEDs, it is then possible, depending on the presence, to resort to the corresponding connection type.
  • connections 15 and 16 in such a way that optionally so-called AVX insulation displacement contacts or so-called Molex connectors can be connected, which are very common in this field.
  • AVX insulation displacement contacts or so-called Molex connectors can be connected, which are very common in this field.
  • Molex connectors can be connected, which are very common in this field.
  • other contact types would be conceivable.
  • the assembly areas 20 allow, as already mentioned, the respective one
  • pulse-width modulated - are operated, since this is a highly efficient LED operation is possible. This in turn means that for the
  • the component areas 20 or, as shown in FIGS. 2, 3a and 3b, the LEDs 25 arranged on the component areas 20 are connected in series to one another via printed conductors 211 and 21 2 .
  • a Group of LEDs 25, however, is not arranged along a single line or column of the LED matrix but instead connected to one another via the conductor tracks 211 or 21 2 such that an arrangement results in two adjacent rows or columns, the LEDs 251 and 25, respectively 25 2 offset from each other.
  • two groups are shown in FIG. 2, wherein the first group 251 is connected to one another via the strip conductors 211 shown as a solid line while the second group 25 2 is connected via the strip conductors 21 2 shown by dashed lines. It can be seen that both LED groups 251 and 25 2 are arranged in a comb-like manner to one another in a comb-like manner.
  • FIG. 2 shows completely only the two uppermost LED rows of the printed circuit board, wherein in the embodiment of FIG.
  • the following LED groups can optionally be connected in series or in parallel with the previous groups.
  • the first LED 25 3 or 25 4 of the next group is shown on the underside, in which case it is then possible to connect these LEDs 25 3 or 25 4 either to the first or input-side LED of the upper group (represented by the connections a), which results in a parallel connection of the LED groups, or to connect to the output or the last LED of the previous group (represented by the connections b), which results in a serial connection of the groups with each other ,
  • Placement areas 20 is achieved by means of connection possibilities 22, which are likewise arranged on the printed circuit board 10 and are designed for the connection of so-called 0-ohm resistors.
  • 22 0-ohm resistors are positioned at these connection possibilities in order to connect the conductor tracks 21 together.
  • the connection of the LED groups shown in FIG. If, on the other hand, a serial shading of the groups is desired, the 0-ohm resistances are set in such a way that the arrangement shown in FIG. 3b results.
  • the current is split only between the two main groups. That is, the current flowing through a single LED now equals half of the current provided by the converter.
  • the converter now has to provide 32 times a single LED voltage. That is, in the constellation according to FIG. 3 a, a supply device with a low-voltage supply in the range of 18 to 24 V can be used, whereas, in contrast to FIG. 3
  • connection options for bridges or 0-ohm resistors also a separation and thus independent control of both LED group types can be selected. This would be particularly useful, for example, if by separate control both types of LEDs the light output of the module in terms of their color or
  • FIG. 4 A second embodiment of an LED board according to the invention is shown in Figures 4, 5a and 5b, wherein the same elements with the same
  • this second variant essentially corresponds to the exemplary embodiment of FIGS. 1 to 3, whereby, however, the total of 36 mounting regions 20 are now arranged in a 6 ⁇ 6 matrix.
  • the groups now each consisting of 6 LEDs 25 can be connected in series or in parallel, in which case the arrangement resulting in FIGS. 5a (parallel interconnection) or 5b (serial interconnection) results.
  • the LED current then corresponds to one sixth of the current provided by the converter, the voltage of the converter should correspond to 6 times the LED operating voltage, ie approximately 18V at 3V LED voltage.
  • the LED current again corresponds to half of the current provided by the converter, whereas the supply voltage of the converter should correspond to 18 times the LED voltage.
  • FIGS. 6a to 6c merely show some conceivable variants by way of example, whereby of course the isolated use of a single module 10 would also be conceivable.
  • FIG. 7 A first embodiment of this is shown in FIG. 7, in which five 8 ⁇ 8 modules 10i are combined with four 6 ⁇ 6 modules 10 2 in order to form an approximately circular light output region.
  • the use of different sizes of printed circuit boards in this case allows a better or more flexible adaptation of the entire arrangement to the desired area to be illuminated.
  • the advantage here is also that the distance between the individual LEDs in both types of printed circuit boards 10i and 10 2 is the same size.
  • FIGS. 8a and 8b Another possibility to combine printed circuit boards of different sizes is shown in FIGS. 8a and 8b.
  • Embodiments the arrangement of, for example, a converter 50 for powering the printed circuit boards 10i and 10 2 is shown in each case.
  • the converter 50 itself does not emit light, but due to the smaller and therefore brighter glowing printed circuit boards 10 2 arranged immediately adjacent thereto, this is compensated, so that finally over the entire surface a homogeneous light output is achieved, provided that a corresponding optical system, which ensures a homogenization of the light output is used.
  • the solution described above has the advantage that the units for power supply in the same plane as the circuit boards can be arranged and, accordingly, the realization of large-area luminous arrangement is made possible with an extremely low height.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Led Devices (AREA)

Abstract

L'invention concerne une carte de circuits imprimés (10) permettant le montage d'éléments lumineux, notamment de DEL (25), et présentant des zones de montage (20) avec moyens de connexion pour les éléments lumineux, plusieurs de ces zones de montage (20) étant reliées les unes aux autres en série par l'intermédiaire de pistes conductrices (21) pour former un groupe. En outre, des moyens de connexion (22) supplémentaires pour des éléments de liaison électriques, notamment pour des résistances de 0 ohm, sont prévus, au moins une partie des groupes pouvant être sélectivement reliés les uns aux autres en parallèle ou en série par l'intermédiaire desdits moyens de connexion.
EP13774421.5A 2012-10-12 2013-10-09 Carte de circuits imprimés permettant le montage d'éléments lumineux à fenêtre active variable Ceased EP2907367A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE202012103898.6U DE202012103898U1 (de) 2012-10-12 2012-10-12 Leiterplatte zum Bestücken mit Leuchtkörpern mit variablem Arbeitsfenster
PCT/EP2013/071038 WO2014056977A1 (fr) 2012-10-12 2013-10-09 Carte de circuits imprimés permettant le montage d'éléments lumineux à fenêtre active variable

Publications (1)

Publication Number Publication Date
EP2907367A1 true EP2907367A1 (fr) 2015-08-19

Family

ID=49326672

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13774421.5A Ceased EP2907367A1 (fr) 2012-10-12 2013-10-09 Carte de circuits imprimés permettant le montage d'éléments lumineux à fenêtre active variable

Country Status (5)

Country Link
US (1) US20150285474A1 (fr)
EP (1) EP2907367A1 (fr)
CN (1) CN104704927B (fr)
DE (1) DE202012103898U1 (fr)
WO (1) WO2014056977A1 (fr)

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RU2017106895A (ru) * 2014-08-07 2018-09-07 Филипс Лайтинг Холдинг Б.В. Расположение светодиодных элементов в соединении со ступенчатым драйвером
US9791112B2 (en) * 2014-12-24 2017-10-17 Bridgelux, Inc. Serial and parallel LED configurations for linear lighting modules
US9763333B2 (en) 2015-03-09 2017-09-12 Cooper Technologies Company Shared resistor pad bypass
EP3324713A1 (fr) * 2016-11-22 2018-05-23 OSRAM GmbH Procédé de production de structures de support pour dispositifs d'éclairage et dispositif correspondant
CN108240564A (zh) * 2016-12-27 2018-07-03 天津职业技术师范大学 一种光照度均匀的led灯板
DE102019217344A1 (de) * 2019-11-11 2021-05-12 Osram Gmbh Beleuchtungsmodule mit einem schaltungsträger und lichtquellen
KR20240029101A (ko) 2021-07-21 2024-03-05 루미레즈 엘엘씨 나중에 구성가능한 led 모듈 및 차량 헤드라이트
CN114234137B (zh) * 2021-12-08 2023-06-09 厦门普为光电科技有限公司 高光效照明装置
CN116518318A (zh) * 2023-03-29 2023-08-01 厦门普为光电科技有限公司 具高光效布线结构的照明装置

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DE202010008479U1 (de) * 2010-09-08 2011-12-09 Zumtobel Lighting Gmbh Leiterplatte zum Bestücken mit Leuchtkörpern
US20110316422A1 (en) * 2010-01-04 2011-12-29 Michael Tischler Failure mitigation in arrays of light-emitting devices

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DE4200879A1 (de) * 1992-01-15 1993-07-29 Kemo Klaus Kernchen Leiterplatte zum bestuecken mit leuchtkoerpern
EP0967590A1 (fr) * 1998-06-25 1999-12-29 Hewlett-Packard Company Dispositif d'affichage optique utilisant des diodes électroluminescentes et sa méthode de commande
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US20110316422A1 (en) * 2010-01-04 2011-12-29 Michael Tischler Failure mitigation in arrays of light-emitting devices
DE202010008479U1 (de) * 2010-09-08 2011-12-09 Zumtobel Lighting Gmbh Leiterplatte zum Bestücken mit Leuchtkörpern

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Also Published As

Publication number Publication date
DE202012103898U1 (de) 2014-01-15
US20150285474A1 (en) 2015-10-08
WO2014056977A1 (fr) 2014-04-17
CN104704927A (zh) 2015-06-10
CN104704927B (zh) 2018-02-09

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