EP2985367A4 - Electroplating apparatus for preventing excessive plating of edge - Google Patents

Electroplating apparatus for preventing excessive plating of edge

Info

Publication number
EP2985367A4
EP2985367A4 EP13881849.7A EP13881849A EP2985367A4 EP 2985367 A4 EP2985367 A4 EP 2985367A4 EP 13881849 A EP13881849 A EP 13881849A EP 2985367 A4 EP2985367 A4 EP 2985367A4
Authority
EP
European Patent Office
Prior art keywords
edge
preventing excessive
electroplating apparatus
excessive plating
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP13881849.7A
Other languages
German (de)
French (fr)
Other versions
EP2985367A1 (en
Inventor
Young Ha Kim
Hwon Woo Jeong
Yong Sik Kang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Posco Holdings Inc
Original Assignee
Posco Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Posco Co Ltd filed Critical Posco Co Ltd
Publication of EP2985367A1 publication Critical patent/EP2985367A1/en
Publication of EP2985367A4 publication Critical patent/EP2985367A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008Current shielding devices
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06Suspending or supporting devices for articles to be coated
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10Electrodes, e.g. composition, counter electrode

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
EP13881849.7A 2013-04-10 2013-12-12 Electroplating apparatus for preventing excessive plating of edge Withdrawn EP2985367A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20130038912A KR101495419B1 (en) 2013-04-10 2013-04-10 Electro-plating apparatus utilizing edge mask to prevent the edge overcoating
PCT/KR2013/011554 WO2014168314A1 (en) 2013-04-10 2013-12-12 Electroplating apparatus for preventing excessive plating of edge

Publications (2)

Publication Number Publication Date
EP2985367A1 EP2985367A1 (en) 2016-02-17
EP2985367A4 true EP2985367A4 (en) 2016-12-28

Family

ID=51689696

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13881849.7A Withdrawn EP2985367A4 (en) 2013-04-10 2013-12-12 Electroplating apparatus for preventing excessive plating of edge

Country Status (6)

Country Link
US (1) US20160076166A1 (en)
EP (1) EP2985367A4 (en)
JP (1) JP6089125B2 (en)
KR (1) KR101495419B1 (en)
CN (1) CN105189830B (en)
WO (1) WO2014168314A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101633617B1 (en) * 2014-12-12 2016-06-28 주식회사 포스코 Electric plating apparatus with horizontal cell and edge mask for using the same
KR101666461B1 (en) 2014-12-24 2016-10-14 주식회사 포스코 Electro-plating apparatus for preventing edge area of plate from being overcoated
KR101674793B1 (en) * 2015-03-02 2016-11-10 주식회사 포스코 Centering apparatus using fluid flow and Electroplating plant having the same
DE102016111649A1 (en) * 2016-06-24 2017-12-28 Thyssenkrupp Ag Apparatus and method for the electrolytic coating of a metal strip
JP6839992B2 (en) * 2017-02-03 2021-03-10 Dowaメタルテック株式会社 Plating method and its equipment
KR102065220B1 (en) 2017-12-22 2020-01-10 주식회사 포스코 Electroplating apparatus with edge mask
CN109234776B (en) * 2018-09-17 2020-04-10 芜湖海成科技有限公司 Portable conductive tool
KR102022920B1 (en) * 2019-06-25 2019-09-19 주식회사 태성 Roll-to-roll Horizontal Continuous Plating Equipment
EP4389940A1 (en) * 2022-12-21 2024-06-26 John Cockerill SA Device for electrodeposition against dendritic substances
KR102674486B1 (en) * 2024-03-14 2024-06-11 주식회사 티티엠기술연구소 Edge mask to prevent overplating for vertical fusible electric nickel plating baths

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6217736B1 (en) * 1997-04-25 2001-04-17 Atotech Deutschland Gmbh Method and apparatus for electrolytically treating a board-shaped substrate comprising shielding edge regions of the substrate during electrolytic treatment
JP2004315922A (en) * 2003-04-18 2004-11-11 Nippon Steel Corp Edge mask equipment for continuous electroplating equipment
CN202509143U (en) * 2012-02-01 2012-10-31 湖南中精伦金属材料有限公司 Electronickelling edge shield device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08239796A (en) * 1995-03-01 1996-09-17 Nippon Steel Corp Edge mask device for electroplating and electroplating method
FR2750438B1 (en) * 1996-06-27 1998-08-07 Usinor Sacilor METHOD AND INSTALLATION FOR ELECTROLYTIC COATING WITH A METAL LAYER OF THE SURFACE OF A CYLINDER FOR CONTINUOUS CASTING OF THIN METAL STRIPS
JP4177902B2 (en) * 1998-04-23 2008-11-05 アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング Apparatus for electrolytically treating a plate-shaped workpiece and method for electrically shielding the edge range of the workpiece during electrolytic treatment
KR20010059601A (en) * 1999-12-30 2001-07-06 이구택 a method for electro-plating with good coating layer
JP3508725B2 (en) * 2001-02-07 2004-03-22 Jfeスチール株式会社 Steel strip electroplating apparatus and method of manufacturing electroplated steel strip
US20060037865A1 (en) * 2004-08-19 2006-02-23 Rucker Michael H Methods and apparatus for fabricating gas turbine engines
JP4977046B2 (en) 2008-01-21 2012-07-18 Jx日鉱日石金属株式会社 Edge overcoat prevention device and electroplating material manufacturing method using the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6217736B1 (en) * 1997-04-25 2001-04-17 Atotech Deutschland Gmbh Method and apparatus for electrolytically treating a board-shaped substrate comprising shielding edge regions of the substrate during electrolytic treatment
JP2004315922A (en) * 2003-04-18 2004-11-11 Nippon Steel Corp Edge mask equipment for continuous electroplating equipment
CN202509143U (en) * 2012-02-01 2012-10-31 湖南中精伦金属材料有限公司 Electronickelling edge shield device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2014168314A1 *

Also Published As

Publication number Publication date
KR101495419B1 (en) 2015-02-24
JP2016513752A (en) 2016-05-16
CN105189830A (en) 2015-12-23
KR20140122768A (en) 2014-10-21
WO2014168314A1 (en) 2014-10-16
JP6089125B2 (en) 2017-03-01
CN105189830B (en) 2018-03-06
EP2985367A1 (en) 2016-02-17
US20160076166A1 (en) 2016-03-17

Similar Documents

Publication Publication Date Title
SG2014003156A (en) Adjustable current shield for electroplating processes
EP2985367A4 (en) Electroplating apparatus for preventing excessive plating of edge
SG10201500801YA (en) Electroplating methods for semiconductor substrates
AU362192S (en) Bath
TWD174558S (en) Bath
SI3253906T1 (en) Electrolyte for electroplating
SG11201610462WA (en) Resin plating method
SG11201700896XA (en) Copper-nickel alloy electroplating bath
SG10201504959UA (en) Plating method
EP3212823A4 (en) Plating bath solutions
SG10201404675XA (en) Deposition apparatus
ES2753375T5 (en) Polymer blend for metal plating
GB2518776B (en) Electroplating of articles
EP3194640A4 (en) Additives for electrodeposition
PL2796593T3 (en) Internal airfoil component electroplating
GB201514501D0 (en) Electroless plating method
SG11201509066UA (en) Deposition apparatus
TWM489874U (en) Electroplating fixture
SG10201407143TA (en) Plating rack
TWI561687B (en) An electroplating method
GB201414431D0 (en) Improved electrodeposition
GB201312355D0 (en) Plating apparatus
GB201306710D0 (en) Electroplating rack
TWM489872U (en) Electroplating fixture
GB201302523D0 (en) Bath

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20151106

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20161125

RIC1 Information provided on ipc code assigned before grant

Ipc: C25D 17/00 20060101AFI20161118BHEP

17Q First examination report despatched

Effective date: 20180605

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20200825