EP3050002A1 - Étiquette rfid et procédé de fabrication d'une étiquette rfid - Google Patents

Étiquette rfid et procédé de fabrication d'une étiquette rfid

Info

Publication number
EP3050002A1
EP3050002A1 EP14766496.5A EP14766496A EP3050002A1 EP 3050002 A1 EP3050002 A1 EP 3050002A1 EP 14766496 A EP14766496 A EP 14766496A EP 3050002 A1 EP3050002 A1 EP 3050002A1
Authority
EP
European Patent Office
Prior art keywords
carrier component
microchip
antenna
rfid transponder
tab portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP14766496.5A
Other languages
German (de)
English (en)
Inventor
Uwe Augst
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Muehlbauer GmbH and Co KG
Original Assignee
Muehlbauer GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Muehlbauer GmbH and Co KG filed Critical Muehlbauer GmbH and Co KG
Publication of EP3050002A1 publication Critical patent/EP3050002A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic

Definitions

  • an RFID transponder is described.
  • an RFID transponder is described with a carrier component, which is formed at least in sections from an insulating material.
  • the RFID transponder also has at least one microchip, and at least one antenna having at its ends contact points formed on a surface of the carrier component. Furthermore, a method for producing such an RFID transponder is described.
  • transponders are used, for example, for value or security documents or the like, and usually have a monolayer or multilayer body.
  • value and security documents In order to meet rising security requirements, transponders (inlays) are increasingly used in value and security documents (debit, credit cards, passports, identity cards, access control cards, etc.).
  • value and security documents are often produced centrally, with the exception of personalization data, and then provided with personalization locally, for example at registration offices, at authorities or in companies that are authorized to issue such value and security documents.
  • personalization the individual holder of the value and security document will receive individually identifying textual, numerical and / or pictorial data (for example the name and address of the holder, date of birth, place of birth, photograph of the holder, biometric data of the holder, etc.) in the Value and security document entered.
  • the antenna allows non-contact data access, ie a contactless, automated writing and / or reading of (personalization) data in / from the microchip of the transponder.
  • Transponder inlays are used as production-processable units. Such transponder inlays have a substrate layer for arranging a transponder unit comprising the transponder antenna and the microchip, which is located on a contact surface of the transponder antenna Substrate layer is located.
  • the microchip can be integrated, for example, in a chip module.
  • transponder inlays for example in value and security documents, places special demands on the transponder inlays.
  • Such transponder inlays should affect the previous weight and format of the value and security documents as little as possible.
  • the handling of the value and security documents in the course of their period of validity results in mechanical stresses for the transponder inlays or for the antennas arranged on the substrate layer of the transponder inlays and the microchip / chip module and their electrical / mechanical connection.
  • Such an RFID transponder is known for example from EP 1 291 818 AI.
  • This document describes a transponder in which two spiral antennas are printed on a plate on insulating material.
  • an electronic circuit for example a chip of a transponder, is first connected to terminals within one of the spiral antennas.
  • the plate is folded along a line of symmetry, the antennas being superimposed on each other and their outer terminals and inner terminals overlapping each other.
  • the connections are formed without conductors bridging the turns of the spiral antennas.
  • the antennas are connected in series. Since the printed spirals face each other, an insulating layer is interposed between them.
  • the terminals of the spiral antennas overlapping each other after folding are connected together by a pin.
  • RFID transponders In general, known RFID transponders have microchips that are contacted on one side and that require comparatively complicated designs of antennas. For example, especially when using coil / spiral radio-frequency antennas (RF antennas), bridging structures are necessary in order to electrically connect the microchip to both ends of the antenna without plated-through holes.
  • multilayer antennas can be used in RFID transponders. Such multilayer antennas are usually sandwiched and comprise, for example, an electrically conductive ground plane, an electrically conductive radiating surface arranged parallel to the ground plane and an interposed between the ground plane and the radiating surface Dielectric. The development and manufacture of such multilayer antennas, however, is generally expensive and thus economically disadvantageous for use in RFID transponders.
  • WO 2010/046 127 A1 discloses a method and a device for producing multilayer electronic data carriers with at least one transponder coil for contactless data and / or energy transfer and such a data carrier.
  • the method comprises applying two coil parts of the transponder coil on a surface of a carrier layer. By folding the carrier layer and joining the folded parts, the two coil parts are contacted with each other.
  • DE 10 2008 062 211 A1 discloses a method for producing a semiconductor component, in which an electronic component is applied to a flexible carrier substrate.
  • a reference point is determined on the carrier substrate, from which starting at least one further structure is arranged on and / or on the carrier substrate.
  • the antenna module for producing a transponder and a transponder.
  • the antenna module has an antenna conductor arrangement arranged on a substrate surface of a substrate with an antenna conductor for contacting with a chip.
  • a first antenna part of the antenna conductor is formed with a first Anschiussende on a first partial surface of the substrate surface.
  • the antenna conductor extends to form a second antenna part with a second connection end on a second partial surface of the substrate surface.
  • antenna connection contacts are arranged on the respective subareas that they can be brought by pivoting the sub-surfaces against each other in a cover layer for producing an electrically conductive connection of the antenna connection contacts.
  • the aim is to provide an RFID transponder of the type described above and a method for its production, which can be easily and quickly produced in various configurations and at the same time enables reliable data transmission.
  • an RFID transponder of the type described at the beginning of the microchip has first and second terminals with respect to a center plane of the microchip opposite surfaces of the microchip, which are each electrically connected to one of the contact points of the antenna.
  • the microchip may be substantially flat and / or cuboid, i. For example, it may have two opposite large side surfaces and four small side surfaces, each smaller than the large side surfaces.
  • the terminals are preferably located on the large side surfaces of the microchip.
  • the contact surfaces formed on the microchip are formed on opposite side surfaces. This has the advantage that the contact can be made over a large area, which keeps the contact resistance low.
  • the carrier component here is an insulating structure. On a surface of this structure, the antenna is in the form of a conductor track.
  • the carrier component is folded and the contact points are positioned on the surface of the carrier component such that the microchip is in contact with the (opposite) surfaces, in particular in the region of the connections.
  • the folded shape of the carrier component thus allows the microchip to be fixed between two portions of the same surface of the carrier component. Because of this double-sided contacting of the microchip, the terminals and the contact points can each be configured over a larger area than in the RFID transponders known from the prior art. As a result, both simple fastening mechanisms and low electrical contact resistance between the antenna and the microchip are realized.
  • the surface dimensions of the terminals are preferably equal to the surface dimensions of the contact points.
  • the carrier component may alternatively comprise a part of the antenna as well as one of the contact points, and a further carrier component may comprise a further part of the antenna as well as the second of the contact points.
  • the carrier component and the further carrier component with their antenna parts and the contact points are joined together facing each other.
  • the carrier component and the further carrier component are preferably formed separately.
  • the carrier component has a base portion and a tab portion.
  • the contact points are provided in pairs; in each case a first contact point on the base portion and a second contact point on the tab portion.
  • the first contact point is connected to a first surface of the microchip and the second contact point is connected to a second surface of the microchip opposite the first surface of the microchip.
  • the connection between the contact points and the respective terminals of the microchip are each electrically conductive.
  • the carrier component may also have a plurality of tab sections.
  • further tabs can be designed as subsections of the tab section.
  • Each of the tab sections or tabs is in these variants in an edge region of the carrier component. This simplifies the production.
  • the tab portion may be formed in a corner / in a corner region of the carrier component. During production, only the corner area is then folded / folded over. The tab portion then has a triangular shape.
  • the tab portion / tab may alternatively be left without connection to a peripheral edge of the carrier component, i. in the interior of the carrier component, be formed.
  • the tab is formed in this case, for example, by two or more cuts or perforations in the carrier component.
  • the embodiment of the carrier component with three unequal length cuts has the advantage that the tab portion can be folded obliquely, ie at an acute angle with respect to one of the sections on the base portion, so efficiently an intended for transmission in the UHF range antenna can be formed.
  • the cuts may for example be provided in a straight line. Alternatively, however, any other form of separation between base portion and tab portion is conceivable.
  • the antenna at least in sections, has an imaginary arrangement extending between the tab section and the base section. crossing axle crosses.
  • the antenna / conductor track is flexible in the sections crossing the connection axis.
  • the configuration of the RFID transponder with double-sided contactable microchip allows the RFID transponder to be fully functional even with partial overlap between the terminals and the contact points.
  • the carrier component has a tab-shaped insulation section in its edge region.
  • the tab-shaped insulation portion is intended to prevent a via between portions of the antenna.
  • the use of complex bridge structures can advantageously be dispensed with.
  • the tab-shaped insulation portion is formed as part of the tab portion.
  • the insulation portion may be formed like the other tab portions or tabs. It is dimensioned such that it covers a part of the antenna in a folded state on the surface of the carrier component or, depending on the arrangement, on the tab portion, thereby being electrically insulated from the environment.
  • the carrier component may have a slot.
  • the tab portion and the slot are then shaped such that the tab portion is partially engaged with the slot, with a portion of the tab portion protruding through the slot and having one of the contact points provided thereon.
  • the tab portion can be folded onto a rear side of the carrier component opposite the surface of the carrier component such that the tab portion protrudes through the slot from the rear side to the surface. The contact points are thus facing each other.
  • Another device for isolating the antenna is dispensable in this case, since the (partially insulating) carrier component takes over the insulation function.
  • the antenna may be a radio frequency (RF) or ultra high frequency (UHF) antenna.
  • the RF antenna is preferably coil-shaped or spiral-shaped, whereas the UHF antenna preferably has the shape of a dipole antenna.
  • both coil or spiralför- have mile sections as well as dipole-shaped sections.
  • the microchip may be fixed to the carrier component between the contact points by means of self-contacting and / or self-adhesive structures. Alternatively, the microchip may be fixed between the pads by clinching the carrier component. In a further alternative embodiment, the chip is connected to the contact points by means of an electrically conductive adhesive. The bonding can be done over a large area. These connections allow a high tolerance with regard to the placement of the microchip on the contact surfaces. As described above, the RFID transponder can be fully functional even with only partial overlap between the microchip and the pads.
  • a carrier component and an antenna are provided.
  • the carrier component is at least partially formed of an insulating material and the antenna has at its ends contact points which are formed on a surface of the carrier component.
  • a microchip having first and second terminals at opposite surfaces of the microchip with respect to a center plane of the microchip is positioned on a first pad. The first and second terminals of the microchip are electrically connected to one of the contact pads, respectively.
  • the method for producing an RFID transponder may include folding the carrier component along an imaginary connection axis which extends between a base portion and a second contact point strap portion of the carrier component, wherein the antenna crosses the imaginary connection axis and is thus folded.
  • the folding of the carrier component is generally easy and fast. Production costs can therefore be kept low.
  • a slot is produced in the carrier component.
  • the tab section is preferably folded over in the direction of a rear side of the carrier component opposite the surface of the carrier component, and a part of the tab section having a contact point is inserted through the slot.
  • the tab portion may be in one of a circumference of the carrier component
  • spaced inside area of the carrier component are generated based on at least two sections. Following this, it is in one embodiment of the Method is provided, that the ikrochip is positioned on the first contact point, after which the tab portion is folded onto the surface of the carrier component.
  • an electrically conductive adhesive to be applied to the contact points provided for connecting the microchip, and the adhesive to be cured after the microchip has been connected.
  • the RFID transponder receives a signal via the antenna and transmits it via the contact points and the first and second connections to the microchip.
  • the signal is processed and generates a signal to be remitted, which is then transmitted via the first and second terminals and via the contact points to the antenna, from where it is finally remitted.
  • FIG. 1 shows a first embodiment of an RFID transponder
  • FIG. 5 shows a method for the production of the RFID transponder of Fig. 1
  • Fig. 6 shows a method for the production of the RFID transponder of Fig. 2
  • Fig. 7 shows a method for the production of the RFID transponder of Fig. 3
  • FIG. 8 shows a method for the production of the RFID transponder from FIG. 4.
  • An RFID transponder 10 shown in FIG. 1 comprises a carrier component 12 (also referred to as substrate or substrate layer) which is formed from an insulating material, in the present example polyvinyl chloride (PVC).
  • a carrier component 12 also referred to as substrate or substrate layer
  • PVC polyvinyl chloride
  • the carrier component 12 can also comprise one or more of the following materials: paper, polyethylene (PE), polyethylene terephthalate (PET) or glycol modified polyethylene terephthalate (PETG), polyethylene naphthalate (PEN), acrylonitrile-butadiene-styrene copolymer (ABS), polyvinyl butyral (PVB ), Polymethylmethacrylate (PMMA), polyimide (PI), polyvinylalcohol (PVA), polystyrene (PS), polyvinylphenol (PVP), polypropylene (PP), polycarbonate (PC) or their derivatives.
  • PE polyethylene
  • PET polyethylene terephthalate
  • PET glycol modified polyethylene terephthalate
  • PEN polyethylene naphthalate
  • ABS acrylonitrile-butadiene-styrene copolymer
  • PVB polyvinyl butyral
  • PMMA Polymethylmethacrylate
  • PMMA Polyimide
  • PVA polyviny
  • the RFID transponder 10 has a microchip 14 and an antenna 16, each having a first and second contact point 18, 20 at its two ends.
  • the antenna 16 is substantially spiral-shaped and extends along a circumference of the carrier component 12.
  • the contact points 18, 20 overlap each other in the representation shown in Fig. 1, so that only the one contact pad 20 is shown.
  • the pads 18, 20 are located on a surface 22 of the carrier component 12.
  • the microchip 14, which is designed here as an electronic component, has first and second terminals (not shown) at its opposite to a center plane surfaces. The first and second terminals are each electrically connected to one of the contact points 18, 20 of the antenna 16.
  • the carrier component 12 is folded and the pads 18, 20 are positioned on the surface 22 of the carrier component 12 such that the microchip 14 is contacted on its opposite surfaces.
  • the carrier component 12 has a base portion 24 and a tab portion 26, and the pads 18, 20 are provided in pairs with the first pad 18 on the base portion and the second pad 20 on the tab portion 26, respectively.
  • the first pad is 18 is connected to the first terminals on a first surface of the microchip 14, and the second pad 20 is connected to the second terminals on a second surface of the microchip 14 opposite the first surface of the microchip 14.
  • Between the tab portion 26 and the base portion 24 extends an imaginary connection axis 28, which crosses the antenna 16.
  • the carrier component 12 in its edge region on a tab-shaped insulation portion 30, which is intended to prevent vias between portions of the antenna 16.
  • the tab-shaped insulation portion 30 is formed as part of the tab portion 26.
  • the tab portion 26 is located at a corner of the substantially rectangular support component 12.
  • the tab portion 26, ie the corner of the support component 12, is folded onto the base portion 24 so that the microchip sandwiched between the contact pads 18, 20 of the antenna is fixed.
  • the contact parts 20 is shown by means of a along a circumference of the contact point 20 extending broken line.
  • the contact point 20 completely covers the contact point 18. Therefore, the contact point 18 in Fig. 1 is not visible.
  • the contact point 20 only partially covers the contact point 18.
  • the exact shape of the pads 18, 20 is adapted to the shape of the microchip 14. In the present case, both the microchip 14 and the two contact points 18, 20 are rectangular, in particular square, although any other shapes are conceivable for this purpose.
  • the microchip 14 is connected via the first and second terminals to the contact points by means of an electrically conductive adhesive 232.
  • This adhesive 232 is located on both sides of the microchip 14 between the respective terminals (not shown) and the associated contact point 18, 20.
  • the antenna 16 extends along the surface of the base portion 24 of the carrier component 12 initially substantially parallel to the imaginary connection axis 28 and then parallel to an outer edge of the carrier component 12.
  • the antenna 16 thus has substantially the shape of a rectangular spiral, ie their distance from the edge / periphery of the carrier component 12 increases starting from the contact point 18 with increasing distance along of the antenna path.
  • a first end portion 32 of the antenna 16 adjoins the contact point 20 and is located on the tab portion 26 of the carrier component 12.
  • the antenna 16 is due to their Form preferably for the transmission and reception of high-frequency radio waves (so-called shortwave) determines and is therefore referred to as an RF antenna.
  • the contact point of the antenna may be formed of the metal of the antenna.
  • the contact of the microchip 14 may be made of a copper (Cu), silver (Ag), and / or other metal-containing metal strip having a thickness of about 10 microns to about 100 microns.
  • An RFID transponder 50 shown in FIG. 2 differs from the RFID transponder 10 shown in FIG. 1 in that instead of the antenna 16 it comprises an antenna 52 and that no insulation section is formed on its strap section 53.
  • the RFID transponder 50 shown in FIG. 2 has all the features of the RFID transponder 10 shown in FIG. 1.
  • the antenna 52 is provided for receiving and transmitting an ultra-high frequency radio signal (UHF signal, UHF antenna). It has two substantially elongate sections 54, 56, which are connected to each other via a connecting portion 58.
  • the elongate portions 54, 56 extend along two mutually perpendicular edges 55, 57 of the base portion 24 of the carrier component 12 and are exposed at their ends 60, 62 opposite the connecting portion 58, i.e., at the ends 60, 62. not electrically contacted.
  • the connecting section 58 has a first part 68 provided on the base section 24 with the first contact point 18 and a second part 70 provided on the tab section 53 with the second contact point 20.
  • the first part 68 is connected to the second part 70 via an electrically conductive connection point 64.
  • the second part 70 of the connecting portion 58 has, adjacent to the elongated portion 54, an end portion 66 corresponding to the end portion 32. In contrast to that
  • End portion 32 however, the end portion 66 is not isolated by the insulating portion 30 opposite to the provided on the base portion 24 first portion 68 of the connecting portion of the antenna 52, but electrically connected thereto.
  • the first part of the connecting portion 58 comprises a loop portion 72, which is substantially C-shaped and partially orbits the first contact portion 18.
  • the loop portion 72 is connected to an intermediate portion 74, wherein the intermediate portion 74 is adapted to the contact point 18 with the elongated portion 56 to connect.
  • the loop part 72 is electrically conductively coupled to the end section 66 on the basis of the connection point 64.
  • An RFID transponder 100 shown in FIG. 3 differs from the RFID transponder 10 shown in FIG. 1 in that it has a tab section 104 without an isolation section 30.
  • the RFID transponder 100 shown in FIG. 3 has all the features of the RFID transponder 10 shown in FIG. 1.
  • the carrier component 12 also has a slot 102.
  • the tab portion 104 and the slot 102 are formed such that a portion 106 of the tab portion 104 is engaged with the slot 102.
  • the contact point 20 is provided at the part 106.
  • the portion 106 of the tab portion 104 extends through the slot 102 and rests on the surface 22 of the carrier component 12, so that the contact points 18, 20 overlap each other as in the case of RFID transponders 10 and 50 and with the microchip 14 on both sides of the first and second terminals are connected.
  • the contact points are facing each other.
  • the slot 102 extends substantially parallel to the imaginary connection axis 28 and is arranged such that no through-contact occurs in the region of the end portion 32 of the antenna 16.
  • both the slot 102 (apart from the second end portion 34) and the pad 18 are located closer to a center 108 of the carrier component 12 than the antenna 16
  • the slot 102 and the pad 18 are within the helical antenna, ie they are encircled by the antenna 16.
  • the contact point 20 is superimposed here, the contact point 18.
  • a through-connection is thus avoided here by the tab portion 104 is folded on one of the surface 22 of the carrier component 12 opposite back of the carrier component 12, so that the
  • Tab portion 104 protrudes through the slot 102 from the back to the surface 22 therethrough.
  • An RFID transponder 150 shown in FIG. 4 differs from the RFID transponder 50 shown in FIG. 2 in that its antenna 160 has elongate sections 162, 164 which are aligned parallel to one another, and the transponder 150 has a tab section 152 which in the interior of the carrier component 12 is formed and is not connected to the edge (the periphery) of the carrier component 12.
  • the RFID transponder 150 shown in FIG. 4 has all the features of the RFID transponder 50 shown in FIG. 2.
  • the tab section 152 is formed by three rectilinear sections 154, 156, 158 arranged substantially perpendicular to one another. As with the RFID transponders 10, 50 and 100 here is the tab section
  • the cuts 154, 156, 158 are of unequal length such that the imaginary connection axis 28 between the base portion 153 and the tab portion 152 extends at an acute angle 159 to the cut / edge of the cut 154. Because the tab portion 152 is out of the base portion
  • the shapes of tab portion 152 and base portion 153 are complementary to each other.
  • This embodiment has the advantage that the antenna 160 can be made much more flexible in terms of their shape.
  • the antenna 160 shown is a UHF antenna.
  • the embodiment of the RFID transponder 150 with a strap section 152 formed in the interior of the carrier component 12 can also be used for HF antennas, as are provided in the RFID transponders 10 and 50.
  • the terminals of the microchip are connected to the contact points of the antennas via splices by an electrically conductive adhesive 232.
  • the connection and fixation may alternatively be made by means of self-contacting and / or self-adhering structures or by clinching the carrier component 12.
  • the support component 12 has a substantially rectangular shape in all (four) embodiments shown herein and is formed of a non-conductive material, such as a plastic. Alternatively, however, it is also conceivable that the carrier component 12 is partially conductive. In this case, however, it is provided that the respective antenna 16, 52, 160 at least in sections, preferably completely, does not come into contact with the conductive portion.
  • FIG. 5 shows the individual steps of a method for producing the RFID transponder 10 from FIG. 1.
  • the carrier component 12 having the features described above is provided. Subsequently, the carrier component 12 perforated in a step 210 along the perforation lines 212, 214 and 216, so that the insulation portion 30 is formed. Along the perforation lines 212 and 214, it is also conceivable that the carrier component 12 is cut. Thereafter, at 220, the isolation portion 30 is folded onto the surface 22 of the carrier component 12, thereby covering a portion of the antenna and thereby electrically isolating it. Alternatively, however, the section of the antenna can also be covered by means of a separately formed insulation layer.
  • an electrically conductive adhesive 232 is applied to the contact surfaces 18, 20.
  • the adhesive 232 may be anisotropic conductive paste, for example.
  • This step is eliminated in microchips with self-contacting and adherent structures, such as the NCS.
  • the microchip 14 is positioned on the adhesive 232 at the pad 18, whereby it is electrically connected to the contact pad 18 at its first terminals in an electrically conductive manner.
  • the tab portion 26 is folded in a step 240 along the imaginary connection axis 28 and folded onto the base portion 24, wherein the contact point 20 is folded onto the contact point 18.
  • the imaginary connection axis runs between the base portion and the second contact point 20 having tab portion 26 of the carrier component 12 and the antenna 16, which crosses the imaginary connection axis 28 is folded.
  • the adhesive 232 is cured in a final step 250.
  • the curing can be done locally in the area of the adhesive 232 or over a large area. Suitable means for this purpose are well known to the person skilled in the art. The result is thus the RFID transponder 10 shown in FIG. 1.
  • FIG. 6 shows the individual steps of a method for the production of the RFID transponder 50 from FIG. 2.
  • a first step 300 first the carrier component 12 and the antenna 52, each with the features described above, are provided. Subsequently, in a next step 310, the electrically conductive adhesive 232 is applied to the contact surfaces 18, 20.
  • This step is eliminated in microchips with self-contacting and adherent structures.
  • the contacting can be done by "piercing.” In this process, tips formed on one surface penetrate into an opposite surface, and advantageously a low electrical resistance can be produced with little effort Under the product name NanoPierce Connection System (NCS) known connection system can be used for this purpose.
  • NCS NanoPierce Connection System
  • the adhesive 232 is applied to the joint 64.
  • the microchip 14 is positioned on the adhesive 232 at the pad 18, whereby it is electrically connected to the contact point 18 at its first terminals in an electrically conductive manner.
  • the tab portion 53 is folded in a step 340 along the imaginary connection axis 28 and folded onto the base portion 24, wherein the contact point 20 is folded onto the contact point 18.
  • the imaginary connection axis 28 extends between the base portion 24 and the second contact point 20 having tab portion 53 of the carrier component 12.
  • the antenna 52 which crosses the imaginary connection axis 28 is folded with.
  • the adhesive 232 is cured in a last step 350.
  • connection can be produced by means of other connection methods, for example by clinching the carrier component 12.
  • FIG. 7 shows the individual steps of a method for producing the RFID transponder 100 from FIG. 3.
  • first the carrier component 12 and the antenna 16 with the features described above are provided. Thereafter, slot 102 is generated at 410.
  • the tab portion 104 is folded in the direction of a rear side of the carrier component 12 opposite the surface of the carrier component 12, and the portion 106 of the tab portion is inserted through the slot 102. Thus, the corner of the carrier component 12 projects through the slot 102.
  • the portion 106 of the tab portion 104 is again folded on the carving 102 so that the pad 20 is aligned parallel to the pad 18, after which in a step 440 electrically conductive adhesive 232 is applied to the contact surfaces 18, 20.
  • step 450 the microchip is positioned on the adhesive 232 at the pad 18, thereby electrically connecting to the pad 18 at each of its first terminals of the microchip.
  • step 460 the part 106 of the tab portion 104 is in turn folded back so that the contact point 20 is folded onto the contact point 18.
  • the adhesive 232 is cured in a last step 460. The curing can be done locally in the area 352 or over a large area. The result is thus the RFID transponder 100 shown in FIG. 3.
  • FIG. 8 shows the individual steps of a method for producing the RFID transponder 150 from FIG. 4.
  • a first step 500 first the carrier component 12 and the antenna 160, each with the features already described, are provided.
  • the tab portion 152 is created in an interior region (i.e., interior) of the carrier component 12 spaced from a circumference of the carrier component 12.
  • the three sections (alternatively perforations) 154, 156 and 158 are generated. This can be done for example by laser cutting.
  • the electrically conductive adhesive 232 is applied to the contact surfaces 18, 20. This step is eliminated in microchips with self-contacting and adherent structures, such as the NCS.
  • the adhesive 232 is applied to the joint 64.
  • a different adhesive than the adhesive 232 applied to the contact surfaces may also be applied to the joint 64.
  • the microchip 14 is positioned on the adhesive 232 at the pad 18, whereby it is electrically connected to the pad 18 at its first terminals.
  • the tab portion 152 is folded in a step 540 along the imaginary connection axis 28 and folded onto the base portion 153 (that is, the surface of the carrier component 12), wherein the pad 20 is folded onto the contact point 18.
  • connection axis 28 runs between the base section 153 and the tab section 152 of the carrier component 12 having the second contact point 20, and the antenna 160, which crosses the imaginary connecting axis, is folded in.
  • adhesive 232 is cured in a final step 550.
  • the curing can be done locally in both areas 352, 354 of the adhesive 232 or over a large area. The result is thus the RFID transponder 150 shown in FIG. 4.
  • the connection can be produced by means of other connection methods, for example clinching.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Details Of Aerials (AREA)

Abstract

L'invention concerne une étiquette RFID (Radio Frequency Identification) comprenant un élément support (12) qui est formé au moins par endroits d'un matériau isolant, au moins une puce (14), et au moins une antenne (16) qui présente des zones de contact (20) à ses extrémités. Les zones de contact (20) sont formées sur une surface (22) de l'élément support (12). La puce (14) de l'étiquette RFID présente une première et une seconde borne sur ses surfaces opposées par référence à un plan central de la puce (14). Ces bornes sont chacune reliées électriquement à une zone de contact (20) respective de l'antenne (16).
EP14766496.5A 2013-09-23 2014-09-17 Étiquette rfid et procédé de fabrication d'une étiquette rfid Withdrawn EP3050002A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE201310015790 DE102013015790A1 (de) 2013-09-23 2013-09-23 RFID Transponder und Verfahren zum Herstellen eines RFID Transponders
PCT/EP2014/069771 WO2015040046A1 (fr) 2013-09-23 2014-09-17 Étiquette rfid et procédé de fabrication d'une étiquette rfid

Publications (1)

Publication Number Publication Date
EP3050002A1 true EP3050002A1 (fr) 2016-08-03

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Application Number Title Priority Date Filing Date
EP14766496.5A Withdrawn EP3050002A1 (fr) 2013-09-23 2014-09-17 Étiquette rfid et procédé de fabrication d'une étiquette rfid

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EP (1) EP3050002A1 (fr)
DE (1) DE102013015790A1 (fr)
WO (1) WO2015040046A1 (fr)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1291818A1 (fr) 2001-08-15 2003-03-12 Datamars SA Transpondeur
JP4290620B2 (ja) * 2004-08-31 2009-07-08 富士通株式会社 Ｒｆｉｄタグ、ｒｆｉｄタグ用アンテナ、ｒｆｉｄタグ用アンテナシートおよびｒｆｉｄタグの製造方法
DE102008047013A1 (de) * 2008-09-11 2010-03-25 Smartrac Ip B.V. Antennenmodul zur Herstellung eines Transponders sowie Transponder
DE102008053096A1 (de) * 2008-10-24 2010-04-29 Giesecke & Devrient Gmbh Verfahren und Vorrichtung zur Herstellung von Datenträgern und Datenträgerhalbzeugen, sowie Datenträger und Datenträgerhalbzeug
DE102008062211A1 (de) * 2008-12-13 2010-06-17 Mühlbauer Ag Verfahren zum Herstellen eines Halbleiterbauteils und Halbleiterbauteil

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
None *
See also references of WO2015040046A1 *

Also Published As

Publication number Publication date
DE102013015790A1 (de) 2015-03-26
WO2015040046A1 (fr) 2015-03-26

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