EP3140853A4 - Lasermetallisierung durch direktschreibevorgang im impulsbetrieb - Google Patents

Lasermetallisierung durch direktschreibevorgang im impulsbetrieb Download PDF

Info

Publication number: EP3140853A4
Authority: EP; European Patent Office
Prior art keywords: pulsed; write laser; mode direct; laser metallization; metallization
Prior art date: 2014-04-10
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

EP15776752.6A

Other languages

English (en)

French (fr)

Other versions

EP3140853A1 (de

Inventor

Michael Zenou

Zvi Kotler

Jonathan ANKRI

Abraham ROTNEMER

Oleg ERMAK

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Orbotech Ltd

Original Assignee

Orbotech Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2014-04-10

Filing date

2015-04-05

Publication date

2018-01-17

2015-04-05 Application filed by Orbotech Ltd filed Critical Orbotech Ltd

2017-03-15 Publication of EP3140853A1 publication Critical patent/EP3140853A1/de

2018-01-17 Publication of EP3140853A4 publication Critical patent/EP3140853A4/de

Status Pending legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1492—Periodical treatments, e.g. pulse plating of through-holes

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing Of Printed Wiring (AREA)
Powder Metallurgy (AREA)
Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Thermal Transfer Or Thermal Recording In General (AREA)

EP15776752.6A 2014-04-10 2015-04-05 Lasermetallisierung durch direktschreibevorgang im impulsbetrieb Pending EP3140853A4 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US201461977766P	2014-04-10	2014-04-10
PCT/IB2015/052476 WO2015155662A1 (en)	2014-04-10	2015-04-05	Pulsed-mode direct-write laser metallization

Publications (2)

Publication Number	Publication Date
EP3140853A1 EP3140853A1 (de)	2017-03-15
EP3140853A4 true EP3140853A4 (de)	2018-01-17

Family

ID=54287371

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP15776752.6A Pending EP3140853A4 (de)	2014-04-10	2015-04-05	Lasermetallisierung durch direktschreibevorgang im impulsbetrieb

Country Status (7)

Country	Link
EP (1)	EP3140853A4 (de)
JP (1)	JP6635313B2 (de)
KR (1)	KR102345450B1 (de)
CN (1)	CN106133891B (de)
IL (1)	IL247946B (de)
TW (1)	TWI661752B (de)
WO (1)	WO2015155662A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US9925797B2 (en)	2014-08-07	2018-03-27	Orbotech Ltd.	Lift printing system
WO2016063270A1 (en)	2014-10-19	2016-04-28	Orbotech Ltd.	Llift printing of conductive traces onto a semiconductor substrate
US10633758B2 (en)	2015-01-19	2020-04-28	Orbotech Ltd.	Printing of three-dimensional metal structures with a sacrificial support
US10471538B2 (en)	2015-07-09	2019-11-12	Orbotech Ltd.	Control of lift ejection angle
WO2017085712A1 (en)	2015-11-22	2017-05-26	Orbotech Ltd	Control of surface properties of printed three-dimensional structures
TW201901887A (zh)	2017-05-24	2019-01-01	以色列商奧寶科技股份有限公司	於未事先圖樣化基板上電器互連電路元件
KR102040530B1 (ko) *	2018-04-25	2019-11-05	성균관대학교산학협력단	광소결을 이용해 재배선층을 형성하는 방법
ES2966467T3 (es) *	2018-05-08	2024-04-22	Seco Tools Ab	Un método para fabricar un cuerpo sinterizado
JP2021190594A (ja) *	2020-06-01	2021-12-13	旭化成株式会社	構造体、金属配線の製造方法、及び金属配線製造装置
CN112201571A (zh) *	2020-10-30	2021-01-08	英诺激光科技股份有限公司	在碳化硅基板上形成欧姆接触的方法及系统

Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US20070105395A1 (en) *	2005-11-04	2007-05-10	Edward Kinzel	Laser functionalization and patterning of thick-film inks
US7294449B1 (en) *	2003-12-31	2007-11-13	Kovio, Inc.	Radiation patternable functional materials, methods of their use, and structures formed therefrom
US20090274833A1 (en) *	2007-05-18	2009-11-05	Ishihara Chemical Co., Ltd.	Metallic ink
EP2957155A1 (de) *	2013-02-18	2015-12-23	Orbotech Ltd.	Zweistufige lasermetallisierung mit direktschreibvorgang

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JPS61290796A (ja) *	1985-06-19	1986-12-20	沖電気工業株式会社	厚膜混成集積回路基板の製造方法
JPS63209193A (ja) *	1987-02-25	1988-08-30	松下電器産業株式会社	導体パタ−ン形成方法
JPH11307914A (ja) *	1998-04-21	1999-11-05	Matsushita Electric Ind Co Ltd	厚膜配線基板のパターン形成方法
US6921626B2 (en) *	2003-03-27	2005-07-26	Kodak Polychrome Graphics Llc	Nanopastes as patterning compositions for electronic parts
US7682970B2 (en)	2003-07-16	2010-03-23	The Regents Of The University Of California	Maskless nanofabrication of electronic components
JP2006038999A (ja) *	2004-07-23	2006-02-09	Sumitomo Electric Ind Ltd	レーザ照射を用いた導電性回路形成方法と導電性回路
TWI324423B (en) *	2005-11-01	2010-05-01	Cymer Inc	Laser system
US10231344B2 (en)	2007-05-18	2019-03-12	Applied Nanotech Holdings, Inc.	Metallic ink
US20090120924A1 (en) *	2007-11-08	2009-05-14	Stephen Moffatt	Pulse train annealing method and apparatus
US8476552B2 (en) *	2008-03-31	2013-07-02	Electro Scientific Industries, Inc.	Laser systems and methods using triangular-shaped tailored laser pulses for selected target classes
JP2009290112A (ja) *	2008-05-30	2009-12-10	Fujifilm Corp	導電性無機膜とその製造方法、配線基板、半導体装置
US8422197B2 (en) *	2009-07-15	2013-04-16	Applied Nanotech Holdings, Inc.	Applying optical energy to nanoparticles to produce a specified nanostructure
KR101114256B1 (ko) *	2010-07-14	2012-03-05	한국과학기술원	패턴 제조 방법
TW201339279A (zh) *	2011-11-24	2013-10-01	Showa Denko Kk	導電圖型形成方法及藉由光照射或微波加熱的導電圖型形成用組成物

2015
- 2015-04-05 IL IL247946A patent/IL247946B/en unknown
- 2015-04-05 KR KR1020167026671A patent/KR102345450B1/ko active Active
- 2015-04-05 WO PCT/IB2015/052476 patent/WO2015155662A1/en not_active Ceased
- 2015-04-05 CN CN201580015581.9A patent/CN106133891B/zh active Active
- 2015-04-05 EP EP15776752.6A patent/EP3140853A4/de active Pending
- 2015-04-05 JP JP2016552929A patent/JP6635313B2/ja active Active
- 2015-04-09 TW TW104111474A patent/TWI661752B/zh active

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US7294449B1 (en) *	2003-12-31	2007-11-13	Kovio, Inc.	Radiation patternable functional materials, methods of their use, and structures formed therefrom
US20070105395A1 (en) *	2005-11-04	2007-05-10	Edward Kinzel	Laser functionalization and patterning of thick-film inks
US20090274833A1 (en) *	2007-05-18	2009-11-05	Ishihara Chemical Co., Ltd.	Metallic ink
EP2957155A1 (de) *	2013-02-18	2015-12-23	Orbotech Ltd.	Zweistufige lasermetallisierung mit direktschreibvorgang

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
No further relevant documents disclosed *
See also references of WO2015155662A1 *

Also Published As

Publication number	Publication date
KR102345450B1 (ko)	2021-12-29
CN106133891A (zh)	2016-11-16
IL247946A0 (en)	2016-11-30
EP3140853A1 (de)	2017-03-15
CN106133891B (zh)	2020-03-03
JP6635313B2 (ja)	2020-01-22
KR20160144985A (ko)	2016-12-19
WO2015155662A1 (en)	2015-10-15
TW201543978A (zh)	2015-11-16
IL247946B (en)	2022-08-01
JP2017513040A (ja)	2017-05-25
TWI661752B (zh)	2019-06-01

Legal Events

Date	Code	Title	Description
2016-12-21	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE
2017-02-10	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
2017-02-10	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE
2017-03-15	17P	Request for examination filed	Effective date: 20160929
2017-03-15	AK	Designated contracting states	Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
2017-03-15	AX	Request for extension of the european patent	Extension state: BA ME
2017-07-19	DAV	Request for validation of the european patent (deleted)
2017-07-19	DAX	Request for extension of the european patent (deleted)
2018-01-17	A4	Supplementary search report drawn up and despatched	Effective date: 20171219
2018-01-17	RIC1	Information provided on ipc code assigned before grant	Ipc: H01L 21/4763 20060101ALI20171213BHEP Ipc: H01L 21/477 20060101AFI20171213BHEP Ipc: H05K 3/02 20060101ALI20171213BHEP
2021-01-15	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: EXAMINATION IS IN PROGRESS
2021-02-17	17Q	First examination report despatched	Effective date: 20210119
2023-07-12	P01	Opt-out of the competence of the unified patent court (upc) registered	Effective date: 20230527

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