EP3178622B1 - Procédé de fabrication d'une plaque en matériau dérivé du bois présentant une émission réduit de composés organiques volatiles (cov) - Google Patents

Procédé de fabrication d'une plaque en matériau dérivé du bois présentant une émission réduit de composés organiques volatiles (cov) Download PDF

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Publication number
EP3178622B1
EP3178622B1 EP15198210.5A EP15198210A EP3178622B1 EP 3178622 B1 EP3178622 B1 EP 3178622B1 EP 15198210 A EP15198210 A EP 15198210A EP 3178622 B1 EP3178622 B1 EP 3178622B1
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EP
European Patent Office
Prior art keywords
wood
heat
treated
wood chips
chips
Prior art date
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Active
Application number
EP15198210.5A
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German (de)
English (en)
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EP3178622A1 (fr
Inventor
Norbert Dr. Kalwa
Jens Siems
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Swiss Krono Tec AG
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Swiss Krono Tec AG
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Priority to PT15198210T priority Critical patent/PT3178622T/pt
Application filed by Swiss Krono Tec AG filed Critical Swiss Krono Tec AG
Priority to ES15198210.5T priority patent/ES2687495T3/es
Priority to PL15198210T priority patent/PL3178622T3/pl
Priority to EP15198210.5A priority patent/EP3178622B1/fr
Priority to US15/778,882 priority patent/US10399245B2/en
Priority to PCT/EP2016/076568 priority patent/WO2017097506A1/fr
Priority to EP16794249.9A priority patent/EP3386699A1/fr
Priority to RU2018124570A priority patent/RU2689571C1/ru
Priority to CA3007578A priority patent/CA3007578A1/fr
Priority to JP2018548275A priority patent/JP6622423B2/ja
Publication of EP3178622A1 publication Critical patent/EP3178622A1/fr
Application granted granted Critical
Publication of EP3178622B1 publication Critical patent/EP3178622B1/fr
Priority to RU2019112232A priority patent/RU2766678C2/ru
Priority to US16/506,441 priority patent/US11148317B2/en
Priority to JP2019210187A priority patent/JP6832411B2/ja
Active legal-status Critical Current
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N1/00—Pretreatment of moulding material
    • B27N1/003—Pretreatment of moulding material for reducing formaldehyde gas emission
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27K—PROCESSES, APPARATUS OR SELECTION OF SUBSTANCES FOR IMPREGNATING, STAINING, DYEING, BLEACHING OF WOOD OR SIMILAR MATERIALS, OR TREATING OF WOOD OR SIMILAR MATERIALS WITH PERMEANT LIQUIDS, NOT OTHERWISE PROVIDED FOR; CHEMICAL OR PHYSICAL TREATMENT OF CORK, CANE, REED, STRAW OR SIMILAR MATERIALS
    • B27K5/00—Treating of wood not provided for in groups B27K1/00, B27K3/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27K—PROCESSES, APPARATUS OR SELECTION OF SUBSTANCES FOR IMPREGNATING, STAINING, DYEING, BLEACHING OF WOOD OR SIMILAR MATERIALS, OR TREATING OF WOOD OR SIMILAR MATERIALS WITH PERMEANT LIQUIDS, NOT OTHERWISE PROVIDED FOR; CHEMICAL OR PHYSICAL TREATMENT OF CORK, CANE, REED, STRAW OR SIMILAR MATERIALS
    • B27K5/00—Treating of wood not provided for in groups B27K1/00, B27K3/00
    • B27K5/001—Heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27K—PROCESSES, APPARATUS OR SELECTION OF SUBSTANCES FOR IMPREGNATING, STAINING, DYEING, BLEACHING OF WOOD OR SIMILAR MATERIALS, OR TREATING OF WOOD OR SIMILAR MATERIALS WITH PERMEANT LIQUIDS, NOT OTHERWISE PROVIDED FOR; CHEMICAL OR PHYSICAL TREATMENT OF CORK, CANE, REED, STRAW OR SIMILAR MATERIALS
    • B27K5/00—Treating of wood not provided for in groups B27K1/00, B27K3/00
    • B27K5/0085—Thermal treatments, i.e. involving chemical modification of wood at temperatures well over 100°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N1/00—Pretreatment of moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/02—Manufacture of substantially flat articles, e.g. boards, from particles or fibres from particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/08—Moulding or pressing
    • B27N3/18—Auxiliary operations, e.g. preheating, humidifying, cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/08—Moulding or pressing
    • B27N3/18—Auxiliary operations, e.g. preheating, humidifying, cutting-off
    • B27N3/183—Forming the mat-edges, e.g. by cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27K—PROCESSES, APPARATUS OR SELECTION OF SUBSTANCES FOR IMPREGNATING, STAINING, DYEING, BLEACHING OF WOOD OR SIMILAR MATERIALS, OR TREATING OF WOOD OR SIMILAR MATERIALS WITH PERMEANT LIQUIDS, NOT OTHERWISE PROVIDED FOR; CHEMICAL OR PHYSICAL TREATMENT OF CORK, CANE, REED, STRAW OR SIMILAR MATERIALS
    • B27K2240/00—Purpose of the treatment
    • B27K2240/10—Extraction of components naturally occurring in wood, cork, straw, cane or reed

Definitions

  • the present invention relates to a process for the production of wood-based panels, in particular chipboard or fiberboard.
  • Wood-based panels such as chipboard or wood fiber boards, which in the present case are always medium or high density wood fiber boards (MDF / HDF) are understood to be the basis of many everyday objects, such as furniture or coverings for wall, floor or ceiling.
  • MDF / HDF medium or high density wood fiber boards
  • VOCs volatile organic compounds
  • chipboard and wood fiber boards are used uncoated on a larger scale (eg as tongue and groove panels, interior fittings, etc.).
  • the use of lightweight and super light wood fiber boards is often done without coating.
  • AgBB scheme by assuming emissions of a space loading of 1 m 2 / m 3 and a defined air change (0.5 / h).
  • air exchange of 0.5 / h is often well below in modern low-energy houses. This, in combination, can lead to higher room concentrations of wood constituents.
  • Volatile organic compounds also called VOCs, include volatile organic compounds that are light in weight evaporate or already present at lower temperatures, such as room temperature as a gas.
  • the volatile organic compounds VOC are either already present in the wood material and are released during workup from this or they are formed according to the current state of knowledge by the degradation of unsaturated fatty acids, which in turn are decomposition products of wood.
  • Typical conversion products that occur during processing are, for example, higher aldehydes or organic acids.
  • Organic acids are produced in particular as cleavage products of the wood constituents cellulose, hemicelluloses and lignin, alkanoic acids such as acetic acid, propionic acid, hexanoic acid or aromatic acids preferably being formed.
  • Aldehydes will be formed during the hydrolytic workup from the basic building blocks of cellulose or hemicellulose.
  • the aldehyde furfural is formed from mono- and disaccharides of cellulose or hemicellulose, while aromatic aldehydes can be liberated during the partial hydrolytic exclusion of lignin.
  • Other released aldehydes include i.a. the higher aldehydes hexanal, pentanal or octanal.
  • DE102004010796 A1 discloses a method of reducing the delivery of medium density fiberboard VOCs. Accordingly, there is still a very large demand for low-emission wood-based panels as well as the simplest and safest production methods.
  • the present method enables the production of wood-based panels, such as chipboard and fiberboard using heat-treated wood chips, which are introduced into a known manufacturing process in addition to untreated, non-heat-treated wood chips.
  • a wood-based panel produced by the method according to the invention in particular in the form of a chipboard or a fiberboard with a typical density of 400 to 1200 kg / m 3 comprising wood chips or wood fibers produced from heat-treated wood chips has a reduced emission of volatile organic compounds, especially higher aldehydes and of organic acids.
  • the presently applied heat treatment of the wood chips is preferably carried out in a saturated steam atmosphere, in particular under an elevated pressure, preferably above 5 bar.
  • the present heat treatment can be understood both as torrefaction known per se and, at least with regard to the pressure conditions, as a modification of the torrefaction known per se.
  • Torrefaction is a thermal treatment process in which the material to be torrefied is typically heated at atmospheric pressure in an oxygen-free gas atmosphere.
  • the treatment of biomass without air access leads to a pyrolytic decomposition and drying.
  • the process is carried out at relatively low temperatures of 250 to 300 ° C for pyrolysis.
  • the aim is, as in the case of coking, to increase the mass and volume-related energy density and thus the calorific value of the raw material, to increase transportability or to reduce the expense of subsequent biomass milling.
  • the step of heat treating the woodchips may be provided in various ways in the present process.
  • the step of heat treatment of the woodchips into the manufacturing process of the wood-based panels, such as chipboard and fiberboard, i. the heat treatment step is integrated into the overall process or process line and takes place online.
  • the step of heat treatment of the wood chips can be carried out separately from the production process of the wood-based panels, such as chipboard and wood fiber boards. Accordingly, the heat treatment step in this embodiment of the present method is outside the overall process or process line.
  • the woodchips are thereby discharged from the manufacturing process and introduced into the heat treatment apparatus (e.g., heat treatment reactor). Subsequently, the heat-treated woodchips may possibly be introduced again into the conventional manufacturing process after an intermediate storage. This allows a high flexibility in the manufacturing process.
  • the woodchips used herein may have a length between 10 to 100 mm, preferably 20 to 90 mm, particularly preferably 30 to 80 mm; a width between 5 to 70 mm, preferably 10 to 50 mm, particularly preferably 15 to 20 mm; and a thickness between 1 and 30 mm, preferably between 2 and 25 mm, particularly preferably between 3 and 20 mm.
  • the wood chips are heat treated at temperatures between 200 ° C and 280 ° C, more preferably between 220 ° C and 260 ° C.
  • the heat treatment process of the wood chips may be between 1 and 5 hours, preferably between 2 and 3 hours, with the duration of the process varying depending on the amount and type of starting material used.
  • the process of heat treatment is preferably completed at a mass loss of the woodchips of 10 to 30%, preferably 15 to 20%.
  • the wood chips are heat-treated by heating in a low-oxygen or oxygen-free atmosphere, in particular in a saturated steam atmosphere. This can be done under atmospheric pressure.
  • the heat treatment process preferably proceeds at temperatures between 160 ° C and 220 ° C and pressures of 6 bar to 16 bar.
  • woodchips are heat treated at a moisture content of 20-50% by weight, i. no previous drying of the wood chips takes place here, but the wood chips are fed to the heat treatment device after further machining without further pretreatment.
  • the presently used heat treatment reactor can be present as a batch plant or as a continuously operated plant.
  • the pyrolysis gases released during the heat treatment process essentially from hemicelluloses and other low molecular weight compounds are used to generate process energy.
  • the amount of gas mixture formed as gaseous fuel is sufficient to operate the process energetically self-sufficient.
  • the heat-treated woodchips are preferably cooled to room temperature and, if appropriate, temporarily stored or returned to the production process directly, if necessary after moistening.
  • the heat-treated woodchips are cooled and watered in a water bath, wherein at least one wetting agent is added to the water.
  • the wetting agent e.g. a conventional surfactant facilitates the wetting of the resulting hydrophobic surface of the woodchips with water by the heat treatment.
  • the amount of wetting agent is in the water bath, in which the wood chips are transferred at 0.1 to 1.0% by weight. Watering positively influences the subsequent cutting or defibering process. The wetting of the chips or fibers with binders containing water as a solvent is thereby improved.
  • the moisture of the heat-treated wood chips is adjusted to 5 to 20%, preferably 10 to 15%.
  • the moisture content of the untreated, non-heat treated wood chips is adjusted accordingly.
  • the woodchips are in this step e.g. washed and cooked.
  • the water treatment is desirable so that the wood chips can be chipped or shredded.
  • without water in the machining or defibration would be very unwanted dust.
  • the wood chips produced in the cutting process are divided into fine and coarse chip material, wherein the larger wood chips are preferably used in the middle layer of the chipboard and the smaller wood chips are preferably used in the cover layers. It is preferred if the wood chips used in the middle layer were produced from heat-treated wood chips, since these typically have a dark color. When using the dark colored chips in the middle layer, the plate optics is thus not affected. In addition, since the middle layer is typically about 2/3 of a particle board, the effect on emission reduction is not adversely affected.
  • the wood fibers produced by the defibration process have a length between 1.5 mm and 20 mm and a thickness between 0.05 mm and 1 mm.
  • the wood chips after the machining process or the wood fibers after the defibration process are brought into contact with at least one binder suitable for crosslinking the wood chips or fibers, the contacting of the wood chips and wood fibers with the binder in each case in different ways can be done.
  • the wood fibers can be contacted with the at least one binder in step d) in a blow-line process in which the binder is injected into the stream of wood fibers. It is possible that the binders described below for wood fiber crosslinking in the blow-line are fed to a wood fiber-steam mixture.
  • wood chips are preferably contacted with the binder in a mixing device.
  • the amount of binder added depends on the type of binder and the type of wood-based panel.
  • the amount of binder to be applied to the wood fibers is from 3 to 20% by weight, preferably from 5 to 15% by weight, more preferably from 8 to 12% by weight. If, on the other hand, polyurethane-containing binders, such as PMDI, are used for wood fiber boards, the necessary amount of binder is reduced to 1 to 10% by weight, preferably 2 to 8% by weight, particularly preferably 4 to 6% by weight.
  • Binders based on formaldehyde are preferably used in the case of wood chip boards, wherein binder amounts of between 5 and 8% by weight, preferably between 6 and 7% by weight, and for the cover layer between 6 and 10% by weight, preferably between 8 and 9% by weight, are used for the middle layer become.
  • binder amounts of between 5 and 8% by weight, preferably between 6 and 7% by weight, and for the cover layer between 6 and 10% by weight, preferably between 8 and 9% by weight, are used for the middle layer become.
  • a polyurethane-based binder such as PMDI
  • the amount of binder in the middle layer is between 2 and 5% by weight, preferably 3% by weight, and in the top layer between 4 and 8% by weight, preferably 5% by weight.
  • a polymer adhesive is preferably used as a binder, which is selected from the group consisting of formaldehyde adhesives, polyurethane adhesives, epoxy adhesives, polyester adhesives, wherein mainly formaldehyde adhesives are used.
  • formaldehyde adhesive in particular, a phenol-formaldehyde resin adhesive (PF), a cresol / resorcinol-formaldehyde resin adhesive, urea-formaldehyde resin adhesive (UF), and / or melamine-formaldehyde resin adhesive (MF) can be used.
  • PF phenol-formaldehyde resin adhesive
  • UF cresol / resorcinol-formaldehyde resin adhesive
  • UF urea-formaldehyde resin adhesive
  • MF melamine-formaldehyde resin adhesive
  • Polyurethane adhesives based on aromatic polyisocyanates in particular polydiphenylmethane diisocyanate (PMDI), tolylene diisocyanate (TDI) and / or diphenylmethane diisocyanate (MDI), with PMDI being particularly preferred, are available to a lesser extent as an alternative to the formaldehyde adhesive.
  • PMDI polydiphenylmethane diisocyanate
  • TDI tolylene diisocyanate
  • MDI diphenylmethane diisocyanate
  • the flame retardant may typically be added to the wood fiber-binder mixture in an amount of between 1 and 20% by weight, preferably between 5 and 15% by weight, more preferably 10% by weight.
  • Typical flame retardants are selected from the group comprising phosphates, borates, in particular ammonium polyphosphate, tris (tri-bromneopentyl) phosphate, zinc borate or boric acid complexes of polyhydric alcohols.
  • the wood chips or wood fibers are dried to a degree of moisture of 1 to 10%, preferably 3 to 5%.
  • the drying process is preferably carried out in a one-step process, e.g. in a drum dryer, whereas wood fibers can be dried in a two-stage process.
  • the dried wood chips or wood fibers are then sorted according to their size or sighted and preferably stored, for example, in silos or bunkers.
  • the screening of the chips or fibers after the drying process is typically associated with a post-cleaning.
  • the fibers are placed in an air stream and freed either largely by vortex formation, sharp deflections, impact vision, Steigluftsichtung or a combination of several effects of heavy particles such as glue lumps.
  • the fibers are again separated by cyclone from the air flow and fed to further use. In the case of sighting of wood chips, these are subdivided into coarser chips for the middle class and finer chips for the outer layers.
  • the gluing of the wood fibers can be done before drying.
  • the gluing of the wood chamfers can also be done after drying.
  • the gluing is done after the screening, wherein the gluing is done by mixing chips and glue.
  • the glued wood chips or wood fibers are sprinkled on a conveyor belt to form a chip cake or fiber cake.
  • the scattering station typically used in the case of wood fibers consists of a dosing bunker, a mat diffusion and a mat smoothing.
  • wood shavings it is customary to work with wind scattering, in which case firstly a first covering layer, followed by the middle layer and finally a second covering layer, is spread.
  • the chip cake or fiber cake is then first pre-pressed and then pressed hot at temperatures between 100 ° C and 250 ° C, preferably 130 ° C and 220 ° C, especially at 200 ° C.
  • the chip cake or the fiber cake is first weighed after spreading and measured the moisture.
  • the chip or fiber cake then passes into the pre-press.
  • the cake is reduced in thickness during the cold pre-compaction, so that the subsequent hot presses can be charged more efficiently and the risk of damage to the cake is reduced.
  • the pre-compaction in the run is usually worked with tape pre-pressing, according to the principle of the conveyor belt (rarely with Plattenbandvorpressen, according to the principle of the tank chain, or with Walzenbandvorpressen, according to the principle of pyramid stone transport with round timbers).
  • the trimming of the compacted cake or mat follows.
  • side strips are separated from the mat, so that the corresponding desired plate width can be produced.
  • the side strips are in front of the spreader in the Process returned.
  • Other measuring devices for density control or metal detection may follow.
  • a Mattenbesprühung to improve the surface qualities or acceleration of the Mattwart bienrmung can follow.
  • the hot pressing which can be clocked or continuously performed.
  • continuous hot pressing is preferred.
  • continuous presses are used, which work with a press belt or press plates, via which the pressure and the temperature are transmitted.
  • the tape is supported either by a roll carpet, a rod carpet or an oil pad against the mostly with thermal oil (more rarely with steam) heated heating plates.
  • This press system enables the production of plate thicknesses between 1.5 mm and 60 mm.
  • On calender presses only thin chipboard or fibreboard can be produced. The pressing takes place here with press rolls and an outer belt on a heated calender roll.
  • the pressed plates are assembled. This is usually followed by a series of quality control measurements, in particular thickness control.
  • the use of heat-treated woodchips for the production of particle boards and fiberboard has a number of advantages.
  • the wood chips and wood fibers produced from the heat-treated wood chips are particularly easy to dry, which is due in particular to the low hydrophilicity of the heat-treated wood.
  • This is also advantageous for the use of the wood fiberboards produced, since the wood chips or wood fibers produced from the heat-treated wood chips have a lower equilibrium moisture content at defined temperatures and humidities than the non-heat-treated wood.
  • Another positive aspect of the use of heat-treated woodchips as starting material is that a homogenization of the starting raw material wood is achieved.
  • the present method enables the production of a particle board and FFC board with reduced emission of volatile organic compounds (VOCs), each comprising wood chips or wood fibers made from heat-treated woodchips.
  • the present chipboard may consist entirely of wood shavings made from heat-treated wood chips or may consist of a mixture of wood shavings made from untreated (i.e., not heat-treated) wood chips and heat-treated wood chips.
  • the present wood fiber board may be wholly made of wood fibers made of heat-treated wood chips, or may consist of a mixture of wood fibers made from untreated (i.e., not heat-treated) wood chips and wood fibers made from heat-treated wood chips.
  • the chipboard or fiberboard in each case has in particular a reduced emission of aldehydes released during the wood pulping, in particular pentanal, hexanal or octanal, and / or of organic acids, in particular acetic acid.
  • the present wood-based panel in the form of a chipboard or wood fiber board may have a bulk density between 400 and 1200 kg / m 3 , preferably between 500 and 1000 kg / m 3 , particularly preferably between 600 and 800 kg / m 3 .
  • the thickness of the present wood-based panel as chipboard or wood fiber board may be between 3 and 20 mm, preferably between 5 and 15 mm, in particular, a thickness of 10 mm is preferred.
  • the chipboard consists of 60 to 90% by weight, preferably 70 to 80% by weight of wood chips and 5 to 20% by weight, preferably 10 to 15% by weight of binders.
  • the present wood fiber board consists of a fiber mixture comprising 60 to 90% by weight, preferably 70 to 80% by weight of wood fibers and 5 to 20% by weight, preferably 10 to 15% by weight of binders.
  • binders preferably 10 to 15% by weight
  • both the present wood chip board and the present wood fiber board may consist of a mixture of wood shavings / wood fibers produced from non-heat treated wood chips and wood shavings / wood fibers made of heat treated wood chips.
  • the mixture used in the chipboard and in the wood fiberboard may be between 10 and 50% by weight, preferably between 20 and 30% by weight, of chips / fibers produced from non-heat treated woodchips and between 50 and 90% by weight, preferably between 70 and 80% by weight. comprise chips / fibers produced from heat-treated wood chips.
  • the chips obtained from the heat-treated woodchips are preferably used in the middle layer.
  • Both the present chipboard and the present fiberboard can be used as a low-emission wood chip or wood fiber board for furniture and floor, wall or ceiling coverings.
  • wood chips and wood fibers produced from heat-treated woodchips can be used to reduce the emission of volatile organic compounds (VOCs) from wood chipboard or wood fiber board.
  • VOCs volatile organic compounds
  • the wood chips and wood fibers produced from heat-treated woodchips are used to reduce aldehydes and / or organic acids released during wood pulping.
  • the wood chips / wood fibers produced from heat-treated woodchips are presently preferably used for reducing the emission of organic acids, in particular for reducing the emission of acetic acid and hexanoic acid.
  • Organic acids are produced in particular as cleavage products of the wood constituents cellulose, hemicelluloses and lignin, alkanoic acids such as acetic acid, propionic acid, hexanoic acid or aromatic acids preferably being formed.
  • wood shavings / wood fibers made from heat treated woodchips to reduce the emission of aldehydes.
  • the wood fibers are used to reduce aldehydes released during the aqueous wood pulping process.
  • the wood chips or wood fibers produced from heat-treated wood chips are used to reduce the emission of C1-C10 aldehydes, more preferably pentanal, hexanal or octanal.
  • FIG. 1 shown first embodiment of the method according to the invention describes the individual process steps, starting with the provision of the wood output product to the finished wood fiber board.
  • step 1 suitable wood starting material for producing the woodchips is first provided.
  • wood source material all conifers, hardwoods or mixtures thereof are suitable.
  • the roundwood is debarked and shredded in wood chippers or drum chippers (step 2), whereby the size of the wood chippings can be controlled accordingly.
  • step 3 At least part of the optionally pre-dried wood chips from the usual manufacturing process is discharged and introduced into a heat treatment reactor (step 3).
  • the heat treatment of the discharged wood chips takes place in a temperature range between 220 ° and 260 ° C.
  • the resulting pyrolysis gases are used to generate the energy required for the process plant.
  • the heat-treated woodchips After completion of the heat treatment, which takes in the present case about 2 hours, the heat-treated woodchips be reintroduced into the process and are optionally together with the non-heat treated woodchips in a washing and cooking step 4 back to a humidity of 10-20% brought.
  • step 5 the wood fibers are subjected to the pulping process in a refiner (step 5), whereby a suitable wetting agent is supplied to the wood fibers in the course of the pulping process.
  • the wood fibers can be mixed immediately after the fiber pulping with a liquid binder and optionally a flame retardant (step 6).
  • the contacting of the wood fibers with the liquid binder can be carried out in this process stage, for example in a blow-line process.
  • the gluing step 6 is followed by a drying process of the glued wood fibers (step 7), wherein this drying process can take place in two stages I, II.
  • the dryer is designed as a 2-stage dryer, with the main drying being carried out in stage 1 by means of hot gases (air or superheated steam) and final drying in stage 2, here also the use of hot air or superheated steam is possible.
  • the mixture is separated in / after each stage by means of separation cyclone and capsule plants.
  • the dried wood fibers are sorted according to their size (step 8).
  • step 9 the formed fiber cake first fed to a pre-press (step 10) and finally pressed in the hot press (step 11) to a large-sized wood fiber board.
  • the wood fiber board obtained is assembled in a suitable manner.
  • FIG. 2 shown second embodiment differs from the in FIG. 1 in the first embodiment in that the step of heat treatment of the woodchips (step 3) is integrated into the manufacturing process of the wood fiber boards, ie, the heat treatment step is incorporated into the overall process line and takes place online. Removal of wood chips from the process line for heat treatment is thus eliminated. This is particularly advantageous if the wood fiber board is made entirely from wood fibers obtained from heat-treated wood chips.
  • Wood chips are kept undried (humidity: approx. 50%, format: approx. 5 x 5 cm, thickness: approx. 1 cm) in a continuous heat treatment device at 220 ° C under saturated steam for approx. 2 h.
  • the device consists of a conveyor through which the wood chips are transported slowly by means of a screw conveyor.
  • the chips are cooled in the wood chips laundry and then led to the normal defibration.
  • 0.1% of a commercially available surfactant was in the water of the wood chips washing. This was added to improve the wetting of the hydrophobic chips.
  • the water of the laundry showed a significantly lower color and the load of organic ingredients was reduced by about 90%.
  • the wood chips resulting after defibration were glued in the blowline with a commercially available urea-formaldehyde glue and dried. Subsequently, the fibers were scattered and processed into MDF having a density of 650 kg / m 3 and a thickness of 10 mm.
  • the resulting MDF is then tested for VOC emission according to the AgBB scheme along with a blank sample (from non-heat treated wood chips). For reasons of time, the 3-day value was determined.
  • Chamber parameters temperature 23C ° C; Humidity 50% + - 5%; Air change 0.5 / h + - 0.1 / h; Load 1m 2 / m 3 ; Chamber volume 225 m 3 parameter Blank sample ⁇ g / m 3 Test plate ⁇ g / m 3 acetic acid 188 9 hexanoic 91 nn hexanal 51 4 pentanal 43 9 octanal 33 5
  • the emissions of the quantitatively most important parameters from the test plate are at a significantly lower level.
  • the production of particleboard is generally known.
  • the heat treated wood chips analogous to Example 1 are fed to a chipper. After cutting, the wood chips are dried to a residual moisture content of approx. 2% in a drum dryer. After drying, the wood chips are sorted and separated into coarser chips for the middle layer and finer chips for the top layer.
  • the chips After gluing with urea-formaldehyde glue, the chips are scattered to multilayer chip cake, wherein the chips used in the middle layer of heat-treated wood chips was recovered, and pressed at temperatures of about 200 ° C to (not according to the invention) chipboard.

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  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Dry Formation Of Fiberboard And The Like (AREA)

Claims (9)

  1. Procédé servant à fabriquer des panneaux en matériau dérivé du bois, en particulier des panneaux de particules de bois et des panneaux en aggloméré, avec une émission réduite en composés organiques volatiles (COV), lequel procédé comprend les étapes consistant à :
    a) produire des copeaux de bois à partir de bois adaptés ;
    b) traiter thermiquement au moins une partie des copeaux de bois par chauffage sous une atmosphère pauvre en oxygène ou sans oxygène, à une température entre 150 °C et 300 °C pendant une durée allant de 1 h à 5 h ;
    c) broyer les copeaux de bois non traités thermiquement et au moins une partie des copeaux de bois traités thermiquement par déchiquetage afin d'obtenir des copeaux de bois ou par pulpage pour obtenir des fibres de bois ;
    d) encoller les copeaux de bois ou les fibres de bois avec au moins un liant, dans lequel les copeaux de bois ou les fibres de bois sont produits à partir des copeaux de bois traités thermiquement et non traités thermiquement selon l'étape c) ;
    e) appliquer les copeaux de bois encollés sur une bande transporteuse en réalisant un gâteau de copeaux multicouche ou les fibres de bois encollées sur une bande transporteuse en réalisant un gâteau de fibres monocouche ; et
    f) comprimer le gâteau de copeaux ou le gâteau de fibres en un panneau en matériau dérivé du bois.
  2. Procédé selon la revendication 1, caractérisé en ce que l'étape du traitement thermique des copeaux de bois est intégrée dans le processus de production du panneau en matériau dérivé du bois.
  3. Procédé selon la revendication 1, caractérisé en ce que l'étape du traitement thermique des copeaux de bois est effectuée séparément du processus de production du panneau en matériau dérivé du bois.
  4. Procédé selon l'une quelconque des revendications précédentes, caractérisé en ce que les copeaux de bois sont traités thermiquement à des températures entre 200 °C et 280 °C, en particulier de manière préférée entre 220 °C et 260 °C.
  5. Procédé selon l'une quelconque des revendications précédentes, caractérisé en ce que les copeaux de bois sont traités thermiquement pendant une durée entre 2 h et 3 h.
  6. Procédé selon l'une quelconque des revendications précédentes, caractérisé en ce que les copeaux de bois sont traités thermiquement sous une atmosphère de vapeur saturée par chauffage.
  7. Procédé selon l'une quelconque des revendications précédentes, caractérisé en ce qu'au moins une partie des copeaux de bois est traitée thermiquement à une humidité de 20 - 50 % en poids.
  8. Procédé selon l'une quelconque des revendications précédentes, caractérisé en ce que les copeaux de bois traités thermiquement sont refroidis dans un bain d'eau, dans lequel au moins un agent mouillant est ajouté à l'eau.
  9. Procédé selon l'une quelconque des revendications précédentes, caractérisé en ce que l'humidité des copeaux de bois traités thermiquement est réglée à une valeur de 5 à 20 %, de manière préférée de 10 à 15 %.
EP15198210.5A 2015-12-07 2015-12-07 Procédé de fabrication d'une plaque en matériau dérivé du bois présentant une émission réduit de composés organiques volatiles (cov) Active EP3178622B1 (fr)

Priority Applications (13)

Application Number Priority Date Filing Date Title
ES15198210.5T ES2687495T3 (es) 2015-12-07 2015-12-07 Procedimiento para la fabricación de un tablero de material derivado de la madera con emisión reducida de compuestos orgánicos volátiles (VOC)
PL15198210T PL3178622T3 (pl) 2015-12-07 2015-12-07 Sposób wytwarzania płyty drewnopochodnej o obniżonej emisji lotnych związków organicznych (voc)
EP15198210.5A EP3178622B1 (fr) 2015-12-07 2015-12-07 Procédé de fabrication d'une plaque en matériau dérivé du bois présentant une émission réduit de composés organiques volatiles (cov)
PT15198210T PT3178622T (pt) 2015-12-07 2015-12-07 Processo para a produção de uma placa de derivados da madeira com emissão reduzida de compostos orgânicos voláteis (voc)
RU2018124570A RU2689571C1 (ru) 2015-12-07 2016-11-03 Способ изготовления плит на основе древесного материала с уменьшенным выделением летучих органических соединений
EP16794249.9A EP3386699A1 (fr) 2015-12-07 2016-11-03 Panneau en matériau dérivé du bois présentant une émission réduite de composés organiques volatiles (cov) et procédé de fabrication de celui-ci
US15/778,882 US10399245B2 (en) 2015-12-07 2016-11-03 Wood material board with reduced emission of volatile organic compounds (VOCs) and method for the production thereof
CA3007578A CA3007578A1 (fr) 2015-12-07 2016-11-03 Panneau en materiau derive du bois presentant une emission reduite de composes organiques volatiles (cov) et procede de fabrication de celui-ci
JP2018548275A JP6622423B2 (ja) 2015-12-07 2016-11-03 揮発性有機化合物（ｖｏｃ）の放出が抑制された木質材料ボード、および当該木質材料ボードの製造方法
PCT/EP2016/076568 WO2017097506A1 (fr) 2015-12-07 2016-11-03 Panneau en matériau dérivé du bois présentant une émission réduite de composés organiques volatiles (cov) et procédé de fabrication de celui-ci
RU2019112232A RU2766678C2 (ru) 2015-12-07 2019-04-23 Плита на основе древесного материала с уменьшенным выделением летучих органических соединений (voc) и ее применение
US16/506,441 US11148317B2 (en) 2015-12-07 2019-07-09 Wood material board with reduced emission of volatile organic compounds (VOCs) and method for the production thereof
JP2019210187A JP6832411B2 (ja) 2015-12-07 2019-11-21 揮発性有機化合物（ｖｏｃ）の放出が抑制された木質材料ボード、および当該木質材料ボードの製造方法

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EP16794249.9A Ceased EP3386699A1 (fr) 2015-12-07 2016-11-03 Panneau en matériau dérivé du bois présentant une émission réduite de composés organiques volatiles (cov) et procédé de fabrication de celui-ci

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US11148317B2 (en) 2021-10-19
PT3178622T (pt) 2018-10-30
EP3178622A1 (fr) 2017-06-14
JP2020023195A (ja) 2020-02-13
US10399245B2 (en) 2019-09-03
RU2019112232A (ru) 2019-07-15
US20180345529A1 (en) 2018-12-06
RU2689571C1 (ru) 2019-05-28
JP2018536568A (ja) 2018-12-13
JP6622423B2 (ja) 2019-12-18
US20190329445A1 (en) 2019-10-31
CA3007578A1 (fr) 2017-06-15
WO2017097506A1 (fr) 2017-06-15
ES2687495T8 (es) 2019-09-18
PL3178622T3 (pl) 2018-12-31
EP3386699A1 (fr) 2018-10-17
JP6832411B2 (ja) 2021-02-24
ES2687495T3 (es) 2018-10-25
RU2766678C2 (ru) 2022-03-15
RU2019112232A3 (fr) 2021-11-18

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