EP3294780A4 - Compositions de résines liquides durcissables par un rayonnement hybride uv/vis pour une fabrication additive - Google Patents

Compositions de résines liquides durcissables par un rayonnement hybride uv/vis pour une fabrication additive Download PDF

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Publication number
EP3294780A4
EP3294780A4 EP16808207.1A EP16808207A EP3294780A4 EP 3294780 A4 EP3294780 A4 EP 3294780A4 EP 16808207 A EP16808207 A EP 16808207A EP 3294780 A4 EP3294780 A4 EP 3294780A4
Authority
EP
European Patent Office
Prior art keywords
hybrid
liquid
curable resin
resin compositions
radiation curable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP16808207.1A
Other languages
German (de)
English (en)
Other versions
EP3294780A1 (fr
Inventor
Tai Yeon Lee
Luke KWISNEK
Johan Jansen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stratasys Inc
Original Assignee
DSM IP Assets BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DSM IP Assets BV filed Critical DSM IP Assets BV
Publication of EP3294780A1 publication Critical patent/EP3294780A1/fr
Publication of EP3294780A4 publication Critical patent/EP3294780A4/fr
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00—Materials specially adapted for additive manufacturing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F16/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical
    • C08F16/12—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical by an ether radical
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16—Cyclic ethers having four or more ring atoms
    • C08G65/18—Oxetanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L29/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical; Compositions of hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Compositions of derivatives of such polymers
    • C08L29/10—Homopolymers or copolymers of unsaturated ethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0037—Production of three-dimensional images
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Epoxy Resins (AREA)
  • Polyethers (AREA)
  • Polymerisation Methods In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
EP16808207.1A 2015-06-08 2016-06-08 Compositions de résines liquides durcissables par un rayonnement hybride uv/vis pour une fabrication additive Pending EP3294780A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562172489P 2015-06-08 2015-06-08
PCT/US2016/036483 WO2016200972A1 (fr) 2015-06-08 2016-06-08 Compositions de résines liquides durcissables par un rayonnement hybride uv/vis pour une fabrication additive

Publications (2)

Publication Number Publication Date
EP3294780A1 EP3294780A1 (fr) 2018-03-21
EP3294780A4 true EP3294780A4 (fr) 2018-11-21

Family

ID=57504188

Family Applications (1)

Application Number Title Priority Date Filing Date
EP16808207.1A Pending EP3294780A4 (fr) 2015-06-08 2016-06-08 Compositions de résines liquides durcissables par un rayonnement hybride uv/vis pour une fabrication additive

Country Status (5)

Country Link
EP (1) EP3294780A4 (fr)
JP (4) JP2018517034A (fr)
KR (1) KR102698770B1 (fr)
CN (1) CN107636025B (fr)
WO (1) WO2016200972A1 (fr)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6798071B2 (ja) * 2016-03-14 2020-12-09 ディーエスエム アイピー アセッツ ビー．ブイ．Ｄｓｍ Ｉｐ Ａｓｓｅｔｓ Ｂ．Ｖ． 改善された靭性および耐高温性を有する付加造形用放射線硬化性組成物
CN107629705A (zh) * 2017-10-17 2018-01-26 烟台信友新材料股份有限公司 一种高活性低收缩单组份光热双固胶及其制备方法
JP7145362B2 (ja) * 2017-10-26 2022-10-03 エア・ウォーター・パフォーマンスケミカル株式会社 アントラセン系光ラジカル重合増感剤およびナフタレン系光ラジカル重合増感助剤を含む光ラジカル重合性組成物
EP3628697A1 (fr) 2018-09-27 2020-04-01 Université de Haute Alsace Photopolyaddition éther-amine cyclique ultrarapide et ses utilisations
CN111902258B (zh) * 2019-01-04 2022-07-15 卡本有限公司 具有哑光饰面的增材制造的产品
CN109880434B (zh) * 2019-02-25 2022-04-19 中钞印制技术研究院有限公司 一种可固化组合物及其用途
US20200373279A1 (en) * 2019-05-24 2020-11-26 Applied Materials, Inc. Color Conversion Layers for Light-Emitting Devices
KR20220056207A (ko) * 2019-08-30 2022-05-04 코베스트로 (네덜란드) 비.브이. 적층식 제조용 하이브리드 UV/vis 방사선 경화성 액체 수지 조성물
EP4097163A1 (fr) 2020-01-27 2022-12-07 Hitachi Energy Switzerland AG Époxy photodurcissable pour composants électriques
JP2022139586A (ja) * 2021-03-12 2022-09-26 株式会社松風 色調選択性に優れた歯科用光硬化性組成物
JP7684040B2 (ja) * 2020-03-16 2025-05-27 株式会社松風 歯科用光硬化性組成物用のアリールヨードニウム塩を含む光重合開始剤
EP3881818B1 (fr) * 2020-03-16 2024-03-06 Kabushiki Kaisha Shofu Compositions dentaires photodurcissables comprenant un initiateur de photopolymérisation comprenant un sel d'aryliodonium
EP4150404A4 (fr) * 2020-05-14 2024-05-29 3M Innovative Properties Company Photo-initiateurs fluorés et couches de (co)polymères fluorés fabriquées au moyen de ces derniers
KR20230041786A (ko) 2020-07-24 2023-03-24 어플라이드 머티어리얼스, 인코포레이티드 Uv-led 경화를 위한 티올계 가교제들을 갖는 양자점 배합물들
US11646397B2 (en) 2020-08-28 2023-05-09 Applied Materials, Inc. Chelating agents for quantum dot precursor materials in color conversion layers for micro-LEDs
EP4049841B1 (fr) 2021-02-26 2026-03-18 Cubicure GmbH Composition de résine hybride
EP4369098A1 (fr) 2022-11-14 2024-05-15 Cubicure GmbH Composition de résine
EP4711849A1 (fr) * 2024-09-17 2026-03-18 Arkema France Additifs pour empêcher la formation de bulles pendant l'impression 3d
GB2701404A (en) * 2024-10-09 2026-04-29 Henkel Ag & Co Kgaa A curable epoxy composition

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2137576A1 (fr) * 2007-04-13 2009-12-30 Huntsman Advanced Materials Americas LLC Photoinitiateur double, composition photodurcissable, utilisation de ceux-ci et procédé de production d'un article tridimensionnel
EP2502728A1 (fr) * 2011-03-23 2012-09-26 DSM IP Assets B.V. Articles tridimensionnels légers et résistants pouvant être produits par des procédés de fabrication additive
WO2014109303A1 (fr) * 2013-01-11 2014-07-17 川崎化成工業株式会社 Composé anthracène et son utilisation comme sensibilisateur de photopolymérisation
US20150099127A1 (en) * 2012-03-09 2015-04-09 Cheil Industries Inc. Adhesive composition for polarizer and polarizer using same

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2830927A1 (de) 1978-07-14 1980-01-31 Basf Ag Acylphosphinoxidverbindungen und ihre verwendung
US4575330A (en) 1984-08-08 1986-03-11 Uvp, Inc. Apparatus for production of three-dimensional objects by stereolithography
DE3443221A1 (de) 1984-11-27 1986-06-05 ESPE Fabrik pharmazeutischer Präparate GmbH, 8031 Seefeld Bisacylphosphinoxide, ihre herstellung und verwendung
JP2590215B2 (ja) * 1988-07-15 1997-03-12 旭電化工業株式会社 光学的造形用樹脂組成物
US5434196A (en) 1988-02-19 1995-07-18 Asahi Denka Kogyo K.K. Resin composition for optical molding
US5047568A (en) 1988-11-18 1991-09-10 International Business Machines Corporation Sulfonium salts and use and preparation thereof
ZA941879B (en) 1993-03-18 1994-09-19 Ciba Geigy Curing compositions containing bisacylphosphine oxide photoinitiators
US5380923A (en) 1993-04-29 1995-01-10 Minnesota Mining And Manufacturing Company Polymeric sulfonium salts and method of preparation thereof
US5418112A (en) 1993-11-10 1995-05-23 W. R. Grace & Co.-Conn. Photosensitive compositions useful in three-dimensional part-building and having improved photospeed
JP3379827B2 (ja) * 1994-07-05 2003-02-24 旭電化工業株式会社 光学的立体造形用樹脂組成物及びこれを用いた光学的立体造形法
US5665792A (en) 1995-06-07 1997-09-09 E. I. Du Pont De Nemours And Company Stabilizers for use with photoacid precursor formulations
SE520727C2 (sv) 1996-03-04 2003-08-19 Ciba Sc Holding Ag Alkylfenylbisacylfosfinoxid och fotoinitiatorblandningar
SG53043A1 (en) 1996-08-28 1998-09-28 Ciba Geigy Ag Molecular complex compounds as photoinitiators
FR2762001B1 (fr) 1997-04-11 1999-07-02 Rhodia Chimie Sa Amorceurs non toxiques, resines a groupements organofonctionnels reticulables comprenant les amorceurs, et leur utilisation pour la preparation de polymeres stables et non toxiques
JP4204113B2 (ja) * 1997-12-04 2009-01-07 株式会社Ａｄｅｋａ 新規な芳香族スルホニウム化合物、これからなる光酸発生剤およびこれを含む光重合性組成物、光造形用樹脂組成物ならびに光学的立体造形法
JP3913350B2 (ja) * 1998-01-13 2007-05-09 ナブテスコ株式会社 光学的造形用樹脂組成物
US6100007A (en) * 1998-04-06 2000-08-08 Ciba Specialty Chemicals Corp. Liquid radiation-curable composition especially for producing cured articles by stereolithography having high heat deflection temperatures
US6287748B1 (en) * 1998-07-10 2001-09-11 Dsm N.V. Solid imaging compositions for preparing polyethylene-like articles
SE9904080D0 (sv) 1998-12-03 1999-11-11 Ciba Sc Holding Ag Fotoinitiatorberedning
DE60006210T2 (de) 1999-12-08 2004-07-15 Ciba Specialty Chemicals Holding Inc. Neues Photoinitiatorsystem aus Phosphinoxidverbindungen und wenig gefärbte härtbare Zusammensetzungen
SG98433A1 (en) * 1999-12-21 2003-09-19 Ciba Sc Holding Ag Iodonium salts as latent acid donors
US6610759B1 (en) * 2000-03-06 2003-08-26 Curators Of The University Of Missouri Cationically polymerizable adhesive composition containing an acidic component and methods and materials employing same
PL207529B1 (pl) * 2002-04-19 2010-12-31 Ciba Sc Holding Ag Sposób wytwarzania powlekanego podłoża
EP1557413B1 (fr) 2002-09-25 2012-08-01 Adeka Corporation Nouveau compose de sel de sulfonium aromatique, generateur photo-acide le comprenant et composition photopolymerisable le contenant, composition de resine pour la mise en forme tridimensionnelle optique et procede correspondant
JP2004204228A (ja) * 2002-12-13 2004-07-22 Daicel Chem Ind Ltd 硬化性エポキシ樹脂組成物および硬化物
DE60332768D1 (de) 2002-12-23 2010-07-08 Stx Aprilis Inc Fluorarylsulfonium fotosäure erzeugende verbindungen
EP1477511A1 (fr) * 2003-05-15 2004-11-17 DSM IP Assets B.V. Compositions à base de polyène et de polythiol durcissables sous irradiation
US7230122B2 (en) 2003-11-04 2007-06-12 National Starch And Chemical Investment Holding Corporation Sulfonium salt photinitiators and use thereof
US7678528B2 (en) 2005-11-16 2010-03-16 Az Electronic Materials Usa Corp. Photoactive compounds
US7696260B2 (en) * 2006-03-30 2010-04-13 Dsm Ip Assets B.V. Cationic compositions and methods of making and using the same
EP2019975B1 (fr) * 2006-05-01 2017-08-16 DSM IP Assets B.V. Composition de resine durcissable par rayonnement et procede d'imagerie tridimensionnelle rapide utilisant celle-ci
JP5168860B2 (ja) * 2006-09-14 2013-03-27 株式会社スリーボンド 光重合性組成物
US20080103226A1 (en) * 2006-10-31 2008-05-01 Dsm Ip Assets B.V. Photo-curable resin composition
GB0622284D0 (en) * 2006-11-09 2006-12-20 Xennia Technology Ltd Inkjet printing
CN101658068A (zh) * 2006-11-14 2010-02-24 皇家飞利浦电子股份有限公司 用于led照明器具的外部微控制器、具有内部控制器的led照明器具以及led照明系统
CN101925594B (zh) 2007-11-28 2013-11-20 住友精化株式会社 光致酸发生剂及光反应性组合物
JP5208573B2 (ja) 2008-05-06 2013-06-12 サンアプロ株式会社 スルホニウム塩、光酸発生剤、光硬化性組成物及びこの硬化体
JP5721630B2 (ja) 2008-10-20 2015-05-20 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ スルホニウム誘導体および潜在酸としてのその使用
US8617787B2 (en) 2009-02-20 2013-12-31 San-Apro, Ltd. Sulfonium salt, photo-acid generator, and photosensitive resin composition
WO2010104603A2 (fr) * 2009-03-13 2010-09-16 Dsm Ip Assets B.V Composition de résine durcissable par rayonnement et procédé d'imagerie tridimensionnelle rapide l'utilisant
KR101833078B1 (ko) * 2009-12-17 2018-02-27 디에스엠 아이피 어셋츠 비.브이. 적층식 제작을 위한 발광 다이오드 경화성 액체 수지 조성물
CA2838255C (fr) * 2011-06-28 2019-08-20 Global Filtration Systems Methode de formation d'objets tridimensionnels au moyen de la solidification lineaire
JP6414411B2 (ja) * 2013-08-09 2018-10-31 ディーエスエム アイピー アセッツ ビー．ブイ．Ｄｓｍ Ｉｐ Ａｓｓｅｔｓ Ｂ．Ｖ． 積層造形用の低粘度液状放射線硬化型歯科アライナー成形型用樹脂組成物
EP3971235B1 (fr) * 2013-11-05 2025-01-01 Stratasys, Inc. Compositions stabilisées de résine durcissables par rayonnement liquide de matrice chargée pour fabrication additive
JP6807531B2 (ja) * 2016-12-20 2021-01-06 岡本化学工業株式会社 光学的立体造形用組成物及びこれを用いた立体造形物の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2137576A1 (fr) * 2007-04-13 2009-12-30 Huntsman Advanced Materials Americas LLC Photoinitiateur double, composition photodurcissable, utilisation de ceux-ci et procédé de production d'un article tridimensionnel
EP2502728A1 (fr) * 2011-03-23 2012-09-26 DSM IP Assets B.V. Articles tridimensionnels légers et résistants pouvant être produits par des procédés de fabrication additive
US20150099127A1 (en) * 2012-03-09 2015-04-09 Cheil Industries Inc. Adhesive composition for polarizer and polarizer using same
WO2014109303A1 (fr) * 2013-01-11 2014-07-17 川崎化成工業株式会社 Composé anthracène et son utilisation comme sensibilisateur de photopolymérisation

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CN107636025A (zh) 2018-01-26
JP2020090679A (ja) 2020-06-11
JP7652850B2 (ja) 2025-03-27
WO2016200972A1 (fr) 2016-12-15
KR20180016505A (ko) 2018-02-14
EP3294780A1 (fr) 2018-03-21
JP2018517034A (ja) 2018-06-28
JP2022070865A (ja) 2022-05-13
CN107636025B (zh) 2021-02-02
KR102698770B1 (ko) 2024-08-23

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