EP3304644A4 - Hochfrequenzmodul und leiterplatte - Google Patents

Hochfrequenzmodul und leiterplatte Download PDF

Info

Publication number
EP3304644A4
EP3304644A4 EP16799413.6A EP16799413A EP3304644A4 EP 3304644 A4 EP3304644 A4 EP 3304644A4 EP 16799413 A EP16799413 A EP 16799413A EP 3304644 A4 EP3304644 A4 EP 3304644A4
Authority
EP
European Patent Office
Prior art keywords
circuit board
radio frequency
frequency module
module
radio
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP16799413.6A
Other languages
English (en)
French (fr)
Other versions
EP3304644A1 (de
Inventor
Tauno VÄHÄ-HEIKKILÄ
Mervi Hirvonen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of EP3304644A1 publication Critical patent/EP3304644A1/de
Publication of EP3304644A4 publication Critical patent/EP3304644A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/48—Earthing means; Earth screens; Counterpoises
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0723—Shielding provided by an inner layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1006—Non-printed filter
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Transceivers (AREA)
EP16799413.6A 2015-05-25 2016-05-24 Hochfrequenzmodul und leiterplatte Withdrawn EP3304644A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20155386A FI127701B (en) 2015-05-25 2015-05-25 Radio frequency module and circuit board
PCT/FI2016/050351 WO2016189199A1 (en) 2015-05-25 2016-05-24 Radio frequency module and circuit board

Publications (2)

Publication Number Publication Date
EP3304644A1 EP3304644A1 (de) 2018-04-11
EP3304644A4 true EP3304644A4 (de) 2019-01-02

Family

ID=57392924

Family Applications (1)

Application Number Title Priority Date Filing Date
EP16799413.6A Withdrawn EP3304644A4 (de) 2015-05-25 2016-05-24 Hochfrequenzmodul und leiterplatte

Country Status (3)

Country Link
EP (1) EP3304644A4 (de)
FI (1) FI127701B (de)
WO (1) WO2016189199A1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9825597B2 (en) 2015-12-30 2017-11-21 Skyworks Solutions, Inc. Impedance transformation circuit for amplifier
US10062670B2 (en) 2016-04-18 2018-08-28 Skyworks Solutions, Inc. Radio frequency system-in-package with stacked clocking crystal
KR102629723B1 (ko) 2016-04-19 2024-01-30 스카이워크스 솔루션즈, 인코포레이티드 무선 주파수 모듈의 선택적 차폐
US10297913B2 (en) 2016-05-04 2019-05-21 Skyworks Solutions, Inc. Shielded radio frequency component with integrated antenna
TWI907080B (zh) 2016-12-29 2025-12-01 美商天工方案公司 封裝模組、無線通信裝置及射頻信號傳輸方法
US10515924B2 (en) 2017-03-10 2019-12-24 Skyworks Solutions, Inc. Radio frequency modules
FR3092467B1 (fr) * 2019-01-31 2021-07-16 Thales Sa Procédé de fabrication d’une carte micromodules haute densité
FI20205799A1 (en) 2020-08-14 2022-02-15 Teknologian Tutkimuskeskus Vtt Oy COVER AND MODULE FOR WEARABLE SMALL RF DEVICE AND WEARABLE RF DEVICE

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080036668A1 (en) * 2006-08-09 2008-02-14 White George E Systems and Methods for Integrated Antennae Structures in Multilayer Organic-Based Printed Circuit Devices
US20080158063A1 (en) * 2006-12-29 2008-07-03 Xiang Yin Zeng Package level integration of antenna and rf front-end module
US20140028518A1 (en) * 2012-07-26 2014-01-30 Shawn Xavier Arnold Antenna Structures and Shield Layers on Packaged Wireless Circuits

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0317305D0 (en) * 2003-07-24 2003-08-27 Koninkl Philips Electronics Nv Improvements in or relating to planar antennas
US7030815B2 (en) * 2004-09-08 2006-04-18 Motorola, Inc. Integrated patch antenna and electronics assembly and method for fabricating
JP2007116217A (ja) * 2005-10-18 2007-05-10 Hitachi Ltd ミリ波レーダ装置およびそれを用いたミリ波レーダシステム
US9680232B2 (en) * 2012-05-07 2017-06-13 Qualcomm Incorporated Graded-ground design in a millimeter-wave radio module

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080036668A1 (en) * 2006-08-09 2008-02-14 White George E Systems and Methods for Integrated Antennae Structures in Multilayer Organic-Based Printed Circuit Devices
US20080158063A1 (en) * 2006-12-29 2008-07-03 Xiang Yin Zeng Package level integration of antenna and rf front-end module
US20140028518A1 (en) * 2012-07-26 2014-01-30 Shawn Xavier Arnold Antenna Structures and Shield Layers on Packaged Wireless Circuits

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
KIM SANGKIL ET AL: "Inkjet-printed antennas, sensors and circuits on paper substrate", IET MICROWAVES, ANTENNAS & PROPAGATION, THE INSTITUTION OF ENGINEERING AND TECHNOLOGY, UNITED KINGDOM, vol. 7, no. 10, 16 July 2013 (2013-07-16), pages 858 - 868, XP006045826, ISSN: 1751-8725, DOI: 10.1049/IET-MAP.2012.0685 *
See also references of WO2016189199A1 *
SUYASH JAIN SWRA367A ET AL: "Application Note AN098 Layout Review Techniques for Low Power RF Designs", 2 August 2012 (2012-08-02), http://www.ti.com/, XP055625187, Retrieved from the Internet <URL:http://www.ti.com/lit/an/swra367a/swra367a.pdf> [retrieved on 20190923] *

Also Published As

Publication number Publication date
WO2016189199A1 (en) 2016-12-01
FI127701B (en) 2018-12-31
FI20155386A7 (fi) 2016-11-26
EP3304644A1 (de) 2018-04-11

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A4 Supplementary search report drawn up and despatched

Effective date: 20181130

RIC1 Information provided on ipc code assigned before grant

Ipc: H05K 1/16 20060101ALN20181126BHEP

Ipc: H01Q 1/22 20060101AFI20181126BHEP

Ipc: H05K 1/02 20060101ALI20181126BHEP

Ipc: H04B 1/38 20150101ALI20181126BHEP

Ipc: H05K 1/18 20060101ALN20181126BHEP

Ipc: H05K 3/36 20060101ALN20181126BHEP

Ipc: H05K 3/34 20060101ALN20181126BHEP

Ipc: H05K 1/14 20060101ALN20181126BHEP

17Q First examination report despatched

Effective date: 20191007

STAA Information on the status of an ep patent application or granted ep patent

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18D Application deemed to be withdrawn

Effective date: 20200603