EP3483944A4 - Boîtier de dispositif électroluminescent et appareil d'éclairage le comprenant - Google Patents

Boîtier de dispositif électroluminescent et appareil d'éclairage le comprenant Download PDF

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Publication number
EP3483944A4
EP3483944A4 EP17892069.0A EP17892069A EP3483944A4 EP 3483944 A4 EP3483944 A4 EP 3483944A4 EP 17892069 A EP17892069 A EP 17892069A EP 3483944 A4 EP3483944 A4 EP 3483944A4
Authority
EP
European Patent Office
Prior art keywords
light emitting
same
emitting device
lighting apparatus
device housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP17892069.0A
Other languages
German (de)
English (en)
Other versions
EP3483944B1 (fr
EP3483944A1 (fr
Inventor
Ki Seok Kim
Won Jung Kim
June O Song
Chang Man Lim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Lekin Semiconductor Co Ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of EP3483944A4 publication Critical patent/EP3483944A4/fr
Publication of EP3483944A1 publication Critical patent/EP3483944A1/fr
Application granted granted Critical
Publication of EP3483944B1 publication Critical patent/EP3483944B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/814—Bodies having reflecting means, e.g. semiconductor Bragg reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/831—Electrodes characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/882—Scattering means

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
EP17892069.0A 2017-09-15 2017-09-29 Boîtier de dispositif électroluminescent et appareil d'éclairage le comprenant Active EP3483944B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020170119047A KR102401826B1 (ko) 2017-09-15 2017-09-15 발광소자 패키지 및 이를 포함하는 조명장치
PCT/KR2017/011089 WO2019054547A1 (fr) 2017-09-15 2017-09-29 Boîtier de dispositif électroluminescent et appareil d'éclairage le comprenant

Publications (3)

Publication Number Publication Date
EP3483944A4 true EP3483944A4 (fr) 2019-05-15
EP3483944A1 EP3483944A1 (fr) 2019-05-15
EP3483944B1 EP3483944B1 (fr) 2023-07-19

Family

ID=64308444

Family Applications (1)

Application Number Title Priority Date Filing Date
EP17892069.0A Active EP3483944B1 (fr) 2017-09-15 2017-09-29 Boîtier de dispositif électroluminescent et appareil d'éclairage le comprenant

Country Status (6)

Country Link
US (1) US10297725B2 (fr)
EP (1) EP3483944B1 (fr)
JP (1) JP2021500735A (fr)
KR (1) KR102401826B1 (fr)
CN (1) CN109964323B (fr)
WO (1) WO2019054547A1 (fr)

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TWI790249B (zh) * 2017-07-13 2023-01-21 大陸商蘇州樂琻半導體有限公司 發光裝置及發光裝置封裝
KR102392013B1 (ko) * 2017-09-15 2022-04-28 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지
KR102379733B1 (ko) * 2017-09-15 2022-03-28 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지
JP6870592B2 (ja) * 2017-11-24 2021-05-12 豊田合成株式会社 発光装置
KR102530755B1 (ko) * 2017-12-07 2023-05-10 삼성전자주식회사 광 반사 패턴 및 파장 변환 층을 갖는 발광 소자
JP7053249B2 (ja) * 2017-12-22 2022-04-12 スタンレー電気株式会社 半導体発光装置
DE102019104268A1 (de) * 2018-02-20 2019-08-22 Epistar Corporation Lichtemittierende Vorrichtung und Herstellungsverfahren dafür
US10862015B2 (en) * 2018-03-08 2020-12-08 Samsung Electronics., Ltd. Semiconductor light emitting device package
KR102595821B1 (ko) * 2018-05-02 2023-10-30 서울바이오시스 주식회사 발광 소자 패키지
US20190355876A1 (en) * 2018-05-18 2019-11-21 Dominant Opto Technologies Sdn Bhd Light emitting diode (led) package
DE102018125138A1 (de) * 2018-10-11 2020-04-16 Osram Opto Semiconductors Gmbh Strahlungsemittierendes bauteil und verfahren zur herstellung eines strahlungsemittierenden bauteils
JP7152666B2 (ja) * 2019-03-08 2022-10-13 日亜化学工業株式会社 発光装置及びその製造方法
KR102898914B1 (ko) 2019-09-20 2025-12-12 엘지이노텍 주식회사 조명 모듈, 조명 장치 및 램프
CN112582518B (zh) * 2019-09-30 2025-11-14 惠州市聚飞光电有限公司 高可靠性led支架、制作方法、led及发光装置
US11437429B2 (en) 2019-09-30 2022-09-06 Nichia Corporation Light emitting device
EP3813129A1 (fr) * 2019-10-21 2021-04-28 Lumileds Holding B.V. Module à del et son procédé de fabrication
CN110718622B (zh) * 2019-10-24 2020-12-08 朝阳微电子科技股份有限公司 一种发光二极管器件及其制造方法
DE102020107409B4 (de) * 2020-03-18 2023-11-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Gehäuse für ein optoelektronisches halbleiterbauelement und optoelektronisches halbleiterbauelement
KR20220026684A (ko) * 2020-08-26 2022-03-07 엘지이노텍 주식회사 조명 장치 및 이를 포함하는 램프
CN111900184A (zh) * 2020-09-02 2020-11-06 深圳市华星光电半导体显示技术有限公司 显示装置及其制备方法
US11894496B2 (en) 2021-02-18 2024-02-06 Creeled, Inc. Solid-state light emitting device with improved color emission
DE102021113047A1 (de) 2021-05-19 2022-11-24 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Anzeigeelement und verfahren
JP7389363B2 (ja) * 2021-05-26 2023-11-30 日亜化学工業株式会社 発光装置
CN113936545B (zh) * 2021-10-15 2024-01-16 业成科技（成都）有限公司 背光模组及其制造方法
KR20230071628A (ko) 2021-11-16 2023-05-23 삼성전자주식회사 LED(Light Emitting Diode) 패키지
JP3250506U (ja) * 2022-03-31 2025-03-11 シェンツェン ジュフェイ オプトエレクトロニクス カンパニー リミテッド Ｌｅｄデバイス
CN116053386B (zh) * 2023-02-04 2025-09-09 深圳市卓越华予电路有限公司 发光芯片封装结构和封装方法

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EP2535954A1 (fr) * 2010-02-09 2012-12-19 Nichia Corporation Dispositif électroluminescent et procédé de fabrication de dispositif électroluminescent
US20130307000A1 (en) * 2011-01-27 2013-11-21 Dai Nippon Printing Co., Ltd. Resin-attached lead frame, method for manufacturing the same, and lead frame
US20150236203A1 (en) * 2014-02-17 2015-08-20 Lumens Co., Ltd Light emitting device package, backlight unit, lighting device and its manufacturing method
KR20150144971A (ko) * 2014-06-18 2015-12-29 엘지이노텍 주식회사 발광 소자 패키지

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EP2535954A1 (fr) * 2010-02-09 2012-12-19 Nichia Corporation Dispositif électroluminescent et procédé de fabrication de dispositif électroluminescent
US20130307000A1 (en) * 2011-01-27 2013-11-21 Dai Nippon Printing Co., Ltd. Resin-attached lead frame, method for manufacturing the same, and lead frame
US20150236203A1 (en) * 2014-02-17 2015-08-20 Lumens Co., Ltd Light emitting device package, backlight unit, lighting device and its manufacturing method
KR20150144971A (ko) * 2014-06-18 2015-12-29 엘지이노텍 주식회사 발광 소자 패키지
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Title
See also references of WO2019054547A1 *

Also Published As

Publication number Publication date
WO2019054547A1 (fr) 2019-03-21
JP2021500735A (ja) 2021-01-07
US20190088824A1 (en) 2019-03-21
EP3483944B1 (fr) 2023-07-19
KR20190031094A (ko) 2019-03-25
US10297725B2 (en) 2019-05-21
KR102401826B1 (ko) 2022-05-25
CN109964323A (zh) 2019-07-02
CN109964323B (zh) 2023-08-04
EP3483944A1 (fr) 2019-05-15

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