EP3494764A1 - Carte de circuit imprimé et capteur - Google Patents

Carte de circuit imprimé et capteur

Info

Publication number
EP3494764A1
EP3494764A1 EP17739252.9A EP17739252A EP3494764A1 EP 3494764 A1 EP3494764 A1 EP 3494764A1 EP 17739252 A EP17739252 A EP 17739252A EP 3494764 A1 EP3494764 A1 EP 3494764A1
Authority
EP
European Patent Office
Prior art keywords
circuit board
printed circuit
substrate
board according
gradation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP17739252.9A
Other languages
German (de)
English (en)
Inventor
Erich Mattmann
Robert Peter
Waldemar Brinkis
Martin Maasz
Burkhard Dasbach
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schaeffler Technologies AG and Co KG
Original Assignee
Continental Automotive Technologies GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive Technologies GmbH filed Critical Continental Automotive Technologies GmbH
Publication of EP3494764A1 publication Critical patent/EP3494764A1/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
    • G01F23/0007—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm for discrete indicating and measuring
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
    • G01F23/30—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by floats
    • G01F23/32—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by floats using rotatable arms or other pivotable transmission elements
    • G01F23/36—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by floats using rotatable arms or other pivotable transmission elements using electrically actuated indicating means
    • G01F23/363—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by floats using rotatable arms or other pivotable transmission elements using electrically actuated indicating means using electromechanically actuated indicating means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C10/00—Adjustable resistors
    • H01C10/30—Adjustable resistors the contact sliding along resistive element
    • H01C10/32—Adjustable resistors the contact sliding along resistive element the contact moving in an arcuate path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0043—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units comprising a frame housing mating with two lids wherein the PCB is flat mounted on the frame housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C10/00—Adjustable resistors
    • H01C10/06—Adjustable resistors adjustable by short-circuiting different amounts of the resistive element
    • H01C10/08—Adjustable resistors adjustable by short-circuiting different amounts of the resistive element with intervening conducting structure between the resistive element and the short-circuiting means, e.g. taps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a circuit board and a sensor having such a circuit board.
  • Such sensors are known, which are used in a fuel tank of a motor vehicle for fuel level detection.
  • sensors are also known as MAPPS (MAgnetic Passive Position Sensor).
  • MAPPS Micrognetic Passive Position Sensor
  • Such a sensor includes a printed circuit board which is equipped on one side of a substrate with conductor tracks and a contact spring structure, wherein the contact spring structure is contacted depending on the fuel level of the tank by means of a magnet with the conductor tracks.
  • the interconnects and the contact spring structure are very fine and therefore protect against contamination and corrosion. For this reason, stocked with the conductor tracks and the contact spring structure side of the substrate is liquid ⁇ tight manner and hermetically sealed off. Therefore, such a sensor is independent of the fuel composition and thus equally suitable for all types of fuel. Also provides a sensor of a so-called closed system. Conventional open systems, however, without such a con ⁇ tact spring structure are protected by special alloys to corrosion in order to use them in an aggressive medium, such as gasoline or diesel. The alloys are matched to the fuels of the respective region and their share of sulfur, ethanol or methanol.
  • Such a sensor or MAPPS is known for example from the patent EP 0844459 Bl, which is hereby incorporated by reference in this application.
  • the circuit board is materially connected to a cover or a cover, for example by soldering.
  • soldering a flux is added as an adjuvant for cohesive connection, which allows a better wetting of the contact or connecting surface of the circuit board or the substrate of the circuit board with a solder.
  • the use of such an adjuvant may result in undesirable wetting of other surfaces of the circuit board side to be encapsulated than the said contact or connection surface, which undesired wetting may impair the contacting of the interconnects by contact spring structure.
  • An object of the present invention is therefore to prevent such impairments.
  • claims 13, 14 and 15 provide a sensor with such a circuit board, a fuel level measuring system with such a sensor and a vehicle with such a fuel level measurement system under protection.
  • Advantageous embodiments of the invention are the subject of the dependent claims.
  • a printed circuit board with formed on one side of a substrate tracks, wherein the substrate is integrally connected to a contact or connection surface with a cover for protecting the printed conductors or to protect the populated substrate side.
  • the cohesive connection can - as in the MAPPS - be designed so that it ensures a hermetic seal of the assembled substrate side, so that this page is absolutely free of contamination and corrosion.
  • the substrate has a gradation which, compared to an auxiliary material, promotes the cohesive connection Barrier forms to prevent wetting of the interconnects or the populated substrate side with the excipient.
  • Staging in the sense of this application is a variation of a substrate thickness, which can be increased and / or reduced by the variation.
  • the grading can thus be carried out substrate reinforcing and / or Sub ⁇ stratabschwankend.
  • Positive grading increases substrate thickness, whereas negative grading reduces substrate thickness.
  • An adjuvant in the sense of this application is one of the material ⁇ positive connection by means of a connecting material to be ⁇ a given substance, the better wetting of the contact or connection surface of the circuit board or the substrate of the printed circuit board to the connection material for the cohesive connection between the circuit board and Cover or allows a lid.
  • the connecting material it can thereby be a filler material, such as a solder, Sch Strukturzu ⁇ the filler metal or glue.
  • a cohesive connection can also be achieved without such an additional material in that the surfaces to be joined together merge.
  • at least one of the materials of the surfaces represents the connecting substance.
  • a flux is one such excipient.
  • a flux is an additive added during soldering in the context of this application, which effects a better wetting of a surface or contact surface of the substrate to be bonded with a solder as a bonding substance. It removes superficial oxides by chemical reaction. The same applies to oxides produced during a soldering operation by the sow ⁇ erstoff the air.
  • Such a solder joint is only one possibility for cohesive connection.
  • the cohesive connection between the substrate and the cover can also be achieved by gluing and / or welding.
  • a connecting substance may also be an adhesive and / or a welding filler material.
  • the gradation with respect to the substrate is disposed inwardly of the contact surface of the substrate. This prevents the previously described undesired wetting of other non-wetting surfaces of the assembled substrate side.
  • the grading is designed to reinforce the substrate, ie that the grading in the sense of a positive grading increases the substrate thickness or thickness.
  • the grading comprises the contact surface of the substrate. That is, the contact surface goes directly into the gradation. In other words, the grading follows directly on the contact surface. This allows a very space-saving design of the circuit board ⁇ . In principle, however, a spacing of the graduation to the contact surface or layer is also conceivable.
  • the graduation can be formed from one or more layers ⁇ . The same or different materials can be used for the layers.
  • the grading comprises a first layer, a second layer and a third layer, wherein the first and second layers form the contact layer and the third layer forms the barrier.
  • the grading can be metal-containing.
  • the grading is suitable for example for soldering with a metallic or at least metallized contact surface of the cover.
  • the stepping is formed from a silver-containing sintering paste.
  • the sintering paste can be any conceivable, preferably metal-containing, sintering paste which is suitable for producing such a grading.
  • Such a sintering paste which may be printed on an alumina ceramic substrate, compacts and solidifies into a solid material upon drying and sintering in a sintering furnace.
  • sintering or sintering is meant a solidification and compression of a sintering paste into a compact material as a result of a temperature treatment in a sintering furnace.
  • the gradation is formed circumferentially around the conductor tracks.
  • the gradation may be formed continuously encircling, so that - if necessary, such as in the MAPPS - a hermetic seal of the covered substrate side to be covered can be achieved.
  • the gradation can be formed along the edges of the substrate. This allows a very space-saving design of the circuit board.
  • the substrate may be formed from a sintered ceramic.
  • the substrate can be made of any conceivable material which is suitable for a printed circuit board, for example in connection with the MAPPS.
  • FIG. 1 shows a circuit board according to the prior art
  • Fig. 2 shows a modified circuit board according to the invention
  • Fig. 3 shows a possible step education
  • Fig. 4 is a schematic representation of an arrangement of a printed circuit board and a cover or a lid. Identical or equivalent features are denoted by the same reference numerals across all figures.
  • Fig. 1 illustrates a known in the art circuit board 10 of a MAPPS (MAgnetic Passive Position Sensor).
  • the printed circuit board 10 comprises a substrate 1, which is formed from an alumina sintered ceramic.
  • the substrate 1 is printed on one side with conductor tracks 2 which can be applied in the Template ⁇ nentik- or screen printing process.
  • the substrate 1 has along its edges a continuous circumferential contact surface 2 or layer, which surrounds the conductor tracks 2.
  • Both the conductor tracks 2 and the contact surface 2 or layer are formed from a metal-containing sintered paste. This is expediently the same material, such as a silver-containing sintering paste.
  • the thickness of these layers is suitably identical.
  • the contact surface 2 or layer is cohesively connectable to a corresponding metallic or at least metallized cover such that the printed substrate side can be hermetically sealed and consequently remains free from contamination and corrosion.
  • 2 illustrates a further developed printed circuit board 10, in which on the side of the substrate 1 to be covered both printed circuit traces 2 made of the metal-containing sintering paste and a resistance track 8 or layer-which is not shown as such in FIG. 1-are printed. Both the tracks 2 and the resistance track 8 can be applied in stencil printing or screen printing.
  • the conductor tracks 2 and the resistance track 8 are surrounded by the continuous peripheral contact surface 2 or layer, which is printed along the edges of the substrate 1 in order to ensure a hermetic seal with a correspondingly ver ⁇ bindable cover.
  • This contact surface 2 consists of the same sintering paste, which is also used for the tracks 2.
  • At this contact surface 2 further includes a gradation 3, which is arranged with respect to the substrate 1 inwardly opposite the contact surface 2 and the surface analogous to the contact 2 is formed continuously encircling so that it surrounds the tracks 2 and the resistance track 8.
  • the grading 3 acts as a barrier or dam against a flux with which the contact surface 2 is wetted to promote the cohesive connection between the contact surface 2 and a corresponding contact surface of the cover by means of a solder.
  • FIG. 3 illustrates the edge region 7 of the substrate 1 shown in FIG. 2 in a cross-sectional view.
  • the grading 3 in this case comprises the contact surface 2 or layer of the sintering paste, ie, the s the contact surface directly merges into the grading. In other words, the grading follows directly onto the contact surface, so that the substrate thickness increases or intensifies.
  • the thickness of the sintering paste changes as a result of an essentially positive step.
  • Flank jump from Y to Y '.
  • the width of the sintered paste corresponds to X and the width of the step corresponds to X '.
  • Y 0, 015mm
  • Y ' 0, 025mm
  • X 1, 2mm
  • X' 0.7mm.
  • the sintering paste including the contact surface portion and the gradation is formed in a single layer.
  • the sintering paste is printed by means of a corresponding template or by means of a corresponding screen on the ceramic substrate.
  • the template or the screen is formed correspondingly fine mesh, so that it or it allows such a stepped imprint on the substrate.
  • the sintering paste can also be applied in layers or in layers (see Fig. 4).
  • FIGS. 3 and FIG. 4 illustrate this a particularly simple and at the same time effective executing a sub ⁇ stratverellnden grading which has the shape of a substantially positive amplification stepped substrate having at least one step or edge.
  • a sub ⁇ stratverellnden grading which has the shape of a substantially positive amplification stepped substrate having at least one step or edge.
  • other gradations with both positive or substrate-enhancing as well as negative or substrate weakening sections are conceivable in order to prevent the aforementioned unwanted wetting of other not intended for wetting surfaces of the assembled substrate side.
  • this sintering paste comprises a first layer 2, a second layer 2 'or reinforcing layer and a third layer 3, wherein the first and second layers 2, 2' form the contact surface section on which the third layer 3 is printed in order to act as a barrier or dam to act.
  • the thickness of the first layer 2 corresponds to the layer thickness of the indicated conductor track 2, over which an indicated contact spring element 4 extends.
  • the stepped sintered paste ⁇ section 2, 2 ', 3 and the conductor 2 exist suitably from the same material, for example from the aforementioned silver-containing sintering paste.
  • Such a printed alumina sintered ceramic which is already sintered before the printing of the sintering pastes 2, 2 ', 3, finally passes through a sintering furnace, in which the sintering pastes 2, 2', 3 are dried and sintered.
  • the sintering pastes 2, 2 ', 3 compact and solidify to form a physically strong structure and enter into a cohesive connection with the aluminum oxide sintered ceramic.
  • Such a substrate or carrier material is suitable for a high-temperature or Sinterprozes s according to the so-called LTCC (Low Temperature Cofired Ceramics) or HTCC (High Temperature Cofired Ceramics) technology, i. for a treatment at about 950 ° C or at about 1500 ° C.
  • LTCC Low Temperature Cofired Ceramics
  • HTCC High Temperature Cofired Ceramics
  • An indicated cover 5 is connected by means of a solder 6 with the contact surface 2 'cohesively.
  • the lid 5 does not touch the barrier 3, even if it could.
  • the solder 6 is attached to the substrate edge and thus spaced to the barrier 3. In principle, however, the solder can also rest against the barrier.
  • a barrier according to FIG. 3 or FIG. 4 effectively prevents the wetting of the conductor track 2 and thus also the wetting of the contact spring element 4 by the flux. Thus, a bonding of the contact spring element 4 is omitted with the conductor 2 as a result of such wetting.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Fluid Mechanics (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

L'invention concerne une carte de circuit imprimé présentant des pistes conductrices (2) formées sur un côté d'un substrat (1), ce substrat (1) pouvant être assemblé par liaison de matière au niveau d'une surface de contact (2) avec un élément de recouvrement pour protéger les pistes conductrices (2). Le substrat comprend un palier (3) qui forme une barrière vis-à-vis d'un adjuvant destiné à favoriser l'assemblage par liaison de matière, de manière à empêcher que les pistes conductrices soient mouillées par l'adjuvant. L'invention concerne en outre un capteur comprenant une telle carte de circuit imprimé, pouvant être utilisé dans un système de mesure de niveau de carburant d'un véhicule.
EP17739252.9A 2016-08-02 2017-07-12 Carte de circuit imprimé et capteur Pending EP3494764A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016214277.1A DE102016214277A1 (de) 2016-08-02 2016-08-02 Leiterplatte und Sensor
PCT/EP2017/067490 WO2018024451A1 (fr) 2016-08-02 2017-07-12 Carte de circuit imprimé et capteur

Publications (1)

Publication Number Publication Date
EP3494764A1 true EP3494764A1 (fr) 2019-06-12

Family

ID=59325299

Family Applications (1)

Application Number Title Priority Date Filing Date
EP17739252.9A Pending EP3494764A1 (fr) 2016-08-02 2017-07-12 Carte de circuit imprimé et capteur

Country Status (6)

Country Link
US (1) US10791630B2 (fr)
EP (1) EP3494764A1 (fr)
KR (1) KR102163147B1 (fr)
CN (1) CN109644565B (fr)
DE (1) DE102016214277A1 (fr)
WO (1) WO2018024451A1 (fr)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5587882A (en) * 1995-08-30 1996-12-24 Hewlett-Packard Company Thermal interface for a heat sink and a plurality of integrated circuits mounted on a substrate
DE19648539C2 (de) 1996-11-25 2000-04-13 Mannesmann Vdo Ag Passiver magnetischer Positionssensor
US6828898B2 (en) * 2003-04-03 2004-12-07 Cts Corporation Fuel tank resistor card having improved corrosion resistance
US7388284B1 (en) * 2005-10-14 2008-06-17 Xilinx, Inc. Integrated circuit package and method of attaching a lid to a substrate of an integrated circuit
DE102007061316A1 (de) * 2007-12-19 2009-06-25 Continental Automotive Gmbh Tankgeberplatine
JP5277755B2 (ja) 2008-07-01 2013-08-28 オムロン株式会社 電子部品
JP2011066651A (ja) * 2009-09-17 2011-03-31 Kyocera Kinseki Corp 圧電デバイス
CN102185580A (zh) 2010-01-18 2011-09-14 精工爱普生株式会社 电子装置、基板的制造方法以及电子装置的制造方法
KR101167802B1 (ko) * 2010-12-27 2012-07-25 삼성전기주식회사 회로 기판 및 그 제조 방법
GB2520952A (en) * 2013-12-04 2015-06-10 Ibm Flip-chip electronic device with carrier having heat dissipation elements free of solder mask
JP6559236B2 (ja) * 2015-06-10 2019-08-14 三菱電機株式会社 半導体装置およびその製造方法
US9721859B2 (en) * 2015-09-01 2017-08-01 Texas Instruments Incorporated Semi-hermetic semiconductor package

Also Published As

Publication number Publication date
KR102163147B1 (ko) 2020-10-08
US10791630B2 (en) 2020-09-29
CN109644565A (zh) 2019-04-16
WO2018024451A1 (fr) 2018-02-08
DE102016214277A1 (de) 2018-02-08
KR20190023107A (ko) 2019-03-07
CN109644565B (zh) 2021-11-23
US20190200456A1 (en) 2019-06-27

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