EP3536732A4 - Polyimidvorläuferzusammensetzung und polyimidfolie damit - Google Patents

Polyimidvorläuferzusammensetzung und polyimidfolie damit Download PDF

Info

Publication number
EP3536732A4
EP3536732A4 EP18856647.5A EP18856647A EP3536732A4 EP 3536732 A4 EP3536732 A4 EP 3536732A4 EP 18856647 A EP18856647 A EP 18856647A EP 3536732 A4 EP3536732 A4 EP 3536732A4
Authority
EP
European Patent Office
Prior art keywords
polyimide
same
precursor composition
polyimide film
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP18856647.5A
Other languages
English (en)
French (fr)
Other versions
EP3536732A1 (de
EP3536732B1 (de
Inventor
Cheolmin Yun
Kyungjun Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Chem Ltd
Original Assignee
LG Chem Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Chem Ltd filed Critical LG Chem Ltd
Publication of EP3536732A1 publication Critical patent/EP3536732A1/de
Publication of EP3536732A4 publication Critical patent/EP3536732A4/de
Application granted granted Critical
Publication of EP3536732B1 publication Critical patent/EP3536732B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/1028—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous
    • C08G73/1032—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the process itself, e.g. steps, continuous characterised by the solvent(s) used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/411—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by materials, geometry or structure of the substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/68—Organic materials, e.g. photoresists
    • H10P14/683—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
    • H10D86/423—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Nonlinear Science (AREA)
  • Materials Engineering (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
EP18856647.5A 2017-09-14 2018-07-09 Polyimidvorläuferzusammensetzung und polyimidfolie damit Active EP3536732B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020170117989A KR101840977B1 (ko) 2017-09-14 2017-09-14 폴리이미드 전구체 조성물 및 이를 이용한 폴리이미드 필름
PCT/KR2018/007733 WO2019054612A1 (ko) 2017-09-14 2018-07-09 폴리이미드 전구체 조성물 및 이를 이용한 폴리이미드 필름

Publications (3)

Publication Number Publication Date
EP3536732A1 EP3536732A1 (de) 2019-09-11
EP3536732A4 true EP3536732A4 (de) 2020-04-15
EP3536732B1 EP3536732B1 (de) 2024-11-06

Family

ID=61900699

Family Applications (1)

Application Number Title Priority Date Filing Date
EP18856647.5A Active EP3536732B1 (de) 2017-09-14 2018-07-09 Polyimidvorläuferzusammensetzung und polyimidfolie damit

Country Status (7)

Country Link
US (1) US11466124B2 (de)
EP (1) EP3536732B1 (de)
JP (1) JP6794610B2 (de)
KR (1) KR101840977B1 (de)
CN (1) CN110121520B (de)
TW (1) TWI677535B (de)
WO (1) WO2019054612A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101840977B1 (ko) 2017-09-14 2018-03-21 주식회사 엘지화학 폴리이미드 전구체 조성물 및 이를 이용한 폴리이미드 필름
KR102117151B1 (ko) 2017-09-29 2020-05-29 주식회사 엘지화학 폴리이미드 전구체 용액 및 이를 이용하여 제조된 폴리이미드 필름
US20210246268A1 (en) * 2018-04-23 2021-08-12 Shin-Etsu Chemical Co., Ltd. Silicon-containing compound
CN108641665B (zh) * 2018-05-14 2020-08-21 中国科学院化学研究所 一种聚酰亚胺胶黏剂及其制备方法
KR102268861B1 (ko) * 2018-08-20 2021-06-23 주식회사 엘지화학 폴리이미드 전구체 조성물 및 이를 이용하는 폴리이미드 필름
KR102264423B1 (ko) * 2018-08-20 2021-06-14 주식회사 엘지화학 폴리이미드 전구체 조성물, 그 제조 방법 및 이를 이용한 폴리이미드 필름
WO2020040495A1 (ko) * 2018-08-20 2020-02-27 주식회사 엘지화학 폴리이미드 전구체 조성물, 그 제조 방법 및 이를 이용한 폴리이미드 필름
CN110922753A (zh) * 2018-09-20 2020-03-27 住友化学株式会社 光学膜形成用组合物
KR102551047B1 (ko) 2019-02-01 2023-07-04 주식회사 엘지화학 폴리이미드 필름, 이를 이용한 플렉서블 기판 및 플렉서블 기판을 포함하는 플렉서블 디스플레이
JP2022025010A (ja) * 2020-07-13 2022-02-09 エスケー イノベーション カンパニー リミテッド テトラカルボン酸二無水物およびその製造方法
KR102788044B1 (ko) * 2020-07-13 2025-03-31 에스케이이노베이션 주식회사 폴리이미드 전구체, 폴리이미드 전구체 조성물, 폴리이미드 필름, 이의 제조방법 및 이의 용도
CN112382666B (zh) * 2020-11-05 2022-09-02 中国科学院上海微系统与信息技术研究所 一种柔性器件及其制备方法
CN116583553A (zh) * 2021-12-08 2023-08-11 株式会社Lg化学 基于聚酰亚胺的树脂膜、使用其的用于显示装置的基底和光学装置
WO2023106571A1 (ko) * 2021-12-08 2023-06-15 주식회사 엘지화학 폴리이미드계 수지 필름 및 이를 이용한 디스플레이 장치용 기판, 및 광학 장치
TW202344566A (zh) * 2022-02-14 2023-11-16 南韓商Ｓｋ新技術股份有限公司 聚醯亞胺前驅物組合物、及其製備方法與應用

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170096530A1 (en) * 2015-03-05 2017-04-06 Lg Chem, Ltd. Composition for the production of polyimide film for flexible board of photoelectronic device

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4395527A (en) * 1978-05-17 1983-07-26 M & T Chemicals Inc. Siloxane-containing polymers
FR2616153B1 (fr) 1987-06-05 1990-11-23 Rhone Poulenc Chimie Copolymeres thermostables sequences de structure (bloc imide-amide)-(bloc uree-siloxane)
JP2002012666A (ja) * 2000-06-29 2002-01-15 Shin Etsu Chem Co Ltd ポリイミドシリコーン樹脂、その製造方法およびその組成物
JP2003156863A (ja) * 2001-11-21 2003-05-30 Konica Corp 電子写真感光体の浸漬塗布方法及び電子写真感光体
JP3862267B2 (ja) 2002-03-29 2006-12-27 株式会社飾一 耐熱性繊維とシロキサンポリマーとからなる複合体
TW200400299A (en) 2002-03-29 2004-01-01 Du Pont Toray Co Ltd Compound material composed of heat-resistant fiber and siloxane polymer
JP2006342310A (ja) 2005-06-10 2006-12-21 Kaneka Corp 新規ポリイミド前駆体およびその利用
JP5370676B2 (ja) 2007-08-22 2013-12-18 デクセリアルズ株式会社 新規なアミド基含有シロキサンアミン化合物
WO2009025283A1 (ja) * 2007-08-22 2009-02-26 Sony Chemical & Information Device Corporation 新規なポリイミド樹脂及び感光性ポリイミド樹脂組成物
JP2009079165A (ja) 2007-09-27 2009-04-16 Du Pont Toray Co Ltd ポリイミドフィルム
JP2009007580A (ja) * 2008-08-12 2009-01-15 Hitachi Chem Co Ltd ポリアミドイミド樹脂及びそれを用いた接着剤組成物
JP5899605B2 (ja) 2010-01-12 2016-04-06 Jnc株式会社 熱硬化性組成物
JPWO2011122198A1 (ja) 2010-03-31 2013-07-08 Jsr株式会社 ポリイミド前駆体、該前駆体を含む樹脂組成物および樹脂組成物を用いた膜形成方法
KR101787652B1 (ko) 2011-05-13 2017-10-19 주식회사 엘지생활건강 세탁용 시트
KR101946092B1 (ko) * 2011-09-29 2019-02-08 제이에스알 가부시끼가이샤 수지 조성물 및 그것을 이용한 막 형성 방법
KR102213304B1 (ko) * 2012-12-21 2021-02-05 아사히 가세이 이-매터리얼즈 가부시키가이샤 폴리이미드 전구체 및 그것을 함유하는 수지 조성물
DE102014104223A1 (de) 2014-03-26 2015-10-01 Elantas Italia S.R.L. Neues Lösemittel für Polyamidimide und Polyimide
TWI551652B (zh) 2014-05-30 2016-10-01 Ｌｇ化學股份有限公司 聚醯亞胺系溶液和使用其製備的聚醯亞胺系膜及含聚醯亞胺系膜的顯示器基板與裝置
KR102388536B1 (ko) 2014-06-04 2022-04-20 우베 고산 가부시키가이샤 폴리이미드 막의 제조 방법
JP6254274B2 (ja) 2014-06-25 2017-12-27 旭化成株式会社 空隙を有するポリイミドフィルム及びその製造方法
KR101775204B1 (ko) * 2014-12-04 2017-09-19 주식회사 엘지화학 폴리이미드계 용액 및 이를 이용하여 제조된 폴리이미드계 필름
WO2016104309A1 (ja) 2014-12-24 2016-06-30 ユニチカ株式会社 多孔質ポリイミドフィルムおよびその製造方法
KR101748931B1 (ko) 2015-02-09 2017-06-19 주식회사 엘지화학 폴리이미드계 필름 형성용 조성물 및 이를 이용하여 제조된 폴리이미드계 필름
WO2016140559A1 (ko) * 2015-03-05 2016-09-09 주식회사 엘지화학 광전소자의 플렉시블 기판용 폴리이미드 필름용 조성물
JP2017052877A (ja) 2015-09-09 2017-03-16 富士ゼロックス株式会社 ポリイミド前駆体組成物、ポリイミド前駆体組成物の製造方法、及びポリイミド成形体の製造方法
KR102580455B1 (ko) 2015-12-31 2023-09-20 주식회사 동진쎄미켐 폴리이미드고분자 조성물, 이의 제조 방법 및 이를 이용한 폴리이미드 필름의 제조 방법
CN106674027B (zh) 2016-12-30 2018-10-16 江苏创拓新材料有限公司 二胺化合物、聚酰亚胺、光学薄膜及其制备方法
KR101840977B1 (ko) 2017-09-14 2018-03-21 주식회사 엘지화학 폴리이미드 전구체 조성물 및 이를 이용한 폴리이미드 필름
EP3704940A4 (de) 2017-10-30 2021-08-18 Nippon Soda Co., Ltd. Agrochemische emulgierbare konzentratzusammensetzung

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170096530A1 (en) * 2015-03-05 2017-04-06 Lg Chem, Ltd. Composition for the production of polyimide film for flexible board of photoelectronic device

Also Published As

Publication number Publication date
US11466124B2 (en) 2022-10-11
EP3536732A1 (de) 2019-09-11
US20190345288A1 (en) 2019-11-14
JP2020504198A (ja) 2020-02-06
KR101840977B1 (ko) 2018-03-21
WO2019054612A1 (ko) 2019-03-21
JP6794610B2 (ja) 2020-12-02
EP3536732B1 (de) 2024-11-06
TWI677535B (zh) 2019-11-21
TW201920484A (zh) 2019-06-01
CN110121520B (zh) 2021-10-08
CN110121520A (zh) 2019-08-13

Similar Documents

Publication Publication Date Title
EP3536732A4 (de) Polyimidvorläuferzusammensetzung und polyimidfolie damit
EP3536731A4 (de) Polyimidcopolymer und polyimidfolie damit
IL293377A (en) Hsd17b13 variants and uses thereof
IL282998A (en) Pyridazinone compounds and uses thereof
PL3523053T3 (pl) Urządzenie do powlekania i przynależny sposób eksploatacji
IL278122B1 (en) Pteridinone compounds and uses thereof
EP3643805A4 (de) Gleitelement und beschichtungsfilm
IL263273A (en) Anti-gitr antibodies and uses thereof
DK3638696T3 (da) Anvendelse af anti-cd70-antistof argx-110 til behandling af akut myeloid leukæmi
EP3431561A4 (de) Hochbeständige beschlagsverhindernde folie und beschichtungszusammensetzung
PL3672948T3 (pl) Związki pirydynoamino-pirydonu i pirymidynoamino-pirydonu
EP3395892A4 (de) Harzzusammensetzung und mehrschichtige struktur damit
EP3350818A4 (de) Dielektrischer geschichteter mehrkomponentenfilm und verwendungen davon
EP3589850C0 (de) Federbelastete mutterplatte
EP3486697A4 (de) Film und schichtkörper
EP3594285A4 (de) Zusammensetzung und beschichtungsfilm
EP3477689A4 (de) Wärmeverbindungsfolie und wärmeverbindungsfolie mit sägefolie
EP3689977A4 (de) Beschichtungszusammensetzung und beschichtungsfilm
EP3586112A4 (de) Thermoelektrische ablagerungsüberwachung
EP3612388A4 (de) Hartbeschichtungsfilm
EP3608350A4 (de) Polyimidfolie
EP3499087A4 (de) Planetengetriebevorrichtung
EP3689887A4 (de) Zusammensetzung und lichtemittierende vorrichtung damit
DK3672967T3 (da) Azaindolylpyridon- og diazaindolylpyridonforbindelser
EP3360007A4 (de) Elektrochrome zusammensetzung und elektrochrome vorrichtung damit

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20190607

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

A4 Supplementary search report drawn up and despatched

Effective date: 20200318

RIC1 Information provided on ipc code assigned before grant

Ipc: C08G 73/10 20060101AFI20200312BHEP

Ipc: H01L 21/02 20060101ALI20200312BHEP

Ipc: G02F 1/1333 20060101ALI20200312BHEP

Ipc: C08J 5/18 20060101ALI20200312BHEP

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

17Q First examination report despatched

Effective date: 20220719

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

INTG Intention to grant announced

Effective date: 20240704

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE PATENT HAS BEEN GRANTED

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602018076375

Country of ref document: DE

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

P01 Opt-out of the competence of the unified patent court (upc) registered

Free format text: CASE NUMBER: APP_60477/2024

Effective date: 20241109

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG9D

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20241106

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20241106

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20250306

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20250306

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20241106

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20241106

REG Reference to a national code

Ref country code: AT

Ref legal event code: MK05

Ref document number: 1739300

Country of ref document: AT

Kind code of ref document: T

Effective date: 20241106

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20241106

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20241106

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20250206

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20250207

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20241106

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20241106

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20241106

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20250206

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20241106

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20241106

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20250624

Year of fee payment: 8

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20241106

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20250624

Year of fee payment: 8

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20241106

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20241106

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20241106

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20241106

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602018076375

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20241106

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20250624

Year of fee payment: 8

26N No opposition filed

Effective date: 20250807

REG Reference to a national code

Ref country code: CH

Ref legal event code: H13

Free format text: ST27 STATUS EVENT CODE: U-0-0-H10-H13 (AS PROVIDED BY THE NATIONAL OFFICE)

Effective date: 20260224

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20250709

REG Reference to a national code

Ref country code: BE

Ref legal event code: MM

Effective date: 20250731

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20250731

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20250731