EP3551957A1 - Échangeur de chaleur et procédé d'utilisation de celui-ci - Google Patents

Échangeur de chaleur et procédé d'utilisation de celui-ci

Info

Publication number
EP3551957A1
EP3551957A1 EP17811925.1A EP17811925A EP3551957A1 EP 3551957 A1 EP3551957 A1 EP 3551957A1 EP 17811925 A EP17811925 A EP 17811925A EP 3551957 A1 EP3551957 A1 EP 3551957A1
Authority
EP
European Patent Office
Prior art keywords
heat
heat exchanger
heat transfer
conducting
exchanger according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP17811925.1A
Other languages
German (de)
English (en)
Other versions
EP3551957B1 (fr
Inventor
Marcel Fink
Olaf Andersen
Marcus Rohne
Lena Schnabel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Original Assignee
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV filed Critical Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Publication of EP3551957A1 publication Critical patent/EP3551957A1/fr
Application granted granted Critical
Publication of EP3551957B1 publication Critical patent/EP3551957B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/122—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and being formed of wires
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/12—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes expanded or perforated metal plate

Definitions

  • the invention relates to a heat exchanger with at least one heat transfer surface which is connected to at least one heat conduction structure. Furthermore, the invention relates to a method for vaporizing a liquid in which heat is supplied to a liquid. Closing ⁇ Lich, the invention relates to a process for transfer of heat between a first heat transfer medium and a second heat transfer medium by means of a heat exchanger.
  • Devices and methods of the type mentioned can be used in many ways, for example for the cooling of process equipment or machinery or as
  • lamellar heat exchangers are known. These contain a lamella package, whereby individual lamellae are made of a sheet metal of a metal or an alloy.
  • the disk pack may contain, for example, aluminum or copper. In the disk pack holes are provided through which pipes are routed.
  • a first heat transfer medium for example water or a thermal oil, flows through the pipelines.
  • a second heat transfer medium for example ambient air, flows through the
  • Disc pack In this case, heat may be transferred either from the first heat ⁇ carrier medium to the second heat transfer medium or vice versa.
  • the disk pack is thermally connected to the pipes and causes the surface available for heat exchange is increased.
  • these known fin heat exchangers have the disadvantage that the fins production due to have a certain minimum distance from each other and the thus available for heat exchange surface is limited. This limits the same time Powerful ⁇ ness of the heat exchanger, ie per unit time
  • the invention is therefore based on the object to provide a heat exchanger with improved performance.
  • a heat exchanger with at least one heat transfer surface is proposed.
  • the heat ⁇ tragungs simulation can to-heat or removed, for example by electric heating resistors, Peltier elements or waste heat recovery.
  • the heat transfer surface may be a wall or pipe ⁇ contain a portion of a tube wall which defines an interior space of a pipe from the surrounding the tube exterior.
  • a heat carrier can circulate in the tube, to which sensible and / or latent heat is supplied or to which sensible and / or latent heat is taken.
  • the heat transfer surface may be part of a container wall, the container containing a latent heat storage.
  • the cross section of the pipe may be polygonal or round.
  • the cross-sectional area can be the same width as height
  • a heat exchanger having a plurality of such tubes may also be referred to as a plate heat exchanger.
  • the heat transfer surface may be a metal or a
  • the heat transfer surface may in some embodiments of the
  • Invention contain aluminum or / and copper and / or stainless steel or consist thereof.
  • the heat transfer surface at least on one side with a heat conduction structure.
  • the heat conduction structure is thermally coupled to the heat transfer surface, so that the area available for heat exchange is increased compared to the pure heat transfer surface.
  • the heat-conducting structure contains at least two heat-conducting gratings , which are connected to one another in a material-locking manner.
  • the thermal conductivity ⁇ grid can be this, soldered or welded together or sintered.
  • the planteleitgitter allow in the
  • the heat-conducting gratings Unlike lamellae due to the existing openings in the grid an efficient flow with a heat transfer medium. Furthermore, due to their openings, the heat-conducting gratings have internal surfaces which contribute to increasing the total surface area available for heat exchange. Due to the coherent connection of adjacent heat-conducting gratings
  • At least one heat-conducting grid may be selected from a perforated material layer and / or an expanded metal grid and / or a braid.
  • the perforated material layer can be selected from a perforated material layer and / or an expanded metal grid and / or a braid.
  • the material layer can be flat or curved or wavy, so as to create spaces between adjacent ones
  • An expanded metal grid or a mesh or a knitted fabric can have an anisotropic thermal conductivity in the two spatial directions of the plane defined by the flat structure of the expanded metal lattice, so that the thermal conductivity orthogonal to the heat transfer surface can be greater than in a direction parallel to the heat transfer surface.
  • the number or area density of existing in the braid or fabric threads in a spatial direction be greater than in a spatial direction orthogonal thereto.
  • the individual heat conducting gratings may have a material thickness of less than about 200 ym or less than about 150 ym or less than about 60 ym.
  • the individual nickel-silicon
  • the heat conduction gratings may have a material thickness of about 50 ym.
  • the heat conduction structure may be disposed on the heat transfer surface such that the heat conduction gratings communicate with the pipe
  • the projected area of the saut ⁇ structure is maximum, if this is arranged approximately 90 ° to the heat transfer surface ⁇ and the flow of the heat transfer medium. As a result, flow losses can be minimized and the heat transfer performance can be maximized.
  • the heat conduction structure can be made by sintering the heat conduction gratings.
  • a stack of may be heated to a predetermined temperature ⁇ structure.
  • this temperature may be selected below the melting temperature and above half the melting temperature of the material used for the heat-conducting gratings. This comes it for welding theticianleitgitter or for the formation of Sinterotrolsen at individual points of contact. This can increase the mechanical stability even thinner heat-conducting grid so far that the heat exchanger can be made mechanically robust.
  • the thermal conduction structure may have a height of about 1 mm to about 10 mm, or about 1 mm to about 5 mm, or about 1 mm to about 3 mm
  • the heat conduction structure can be partially or completely immersed in the liquid sump.
  • the thermal conduction structure may have a height of from about 15 mm to about 40 mm or from about 20 mm to about 30 mm. The height extends from the surface of the pipe wall starting
  • Such banksleit Jardin can be flowed through by a gaseous heat transfer medium and thereby used as a heat exchanger between two heat transfer media and
  • the thermal conductivity structure may be between about 50 and about 2500, or between about 100 and about 1000, or between about 150 and about 500, or between about 200 and about 300 heat conductors
  • the soupleitgitter can after cutting and optional reshaping, for example, by structural rolls, superimposed and connected to each other by sintering, gluing or soldering.
  • sintering allows a simple production process of the heat conduction structure according to the invention. After sintering, the heat-conducting structure has a comparatively high mechanical stability and, at the same time, a high porosity, which permits efficient flow through one, in particular
  • the heat conduction structure in the individual levels of the heat conduction can efficiently conduct heat, whereas in the direction of the normal vector of sautgitter due to the only point-like connection of the individual michleitgitter each other is given a reduced thermal conductivity.
  • the composite of a plurality of crableitgittern heat conduction structure can be subsequently tailored to the desired size and positively or materially joined to the heat transfer area ⁇ a heat exchanger.
  • a plurality of heat conducting structures can be attached to a heat transfer surface.
  • the thermal conductivity structure may have a porosity of from about 70% to about 90%, or from about 80% to about 85%. According to the invention, it has been recognized that even when a plurality of heat conducting gratings are placed on top of each other, the open area, which forms the
  • the mesh size of the individual meshes of a heat-conducting grid may be between about 1.5 mm and about 3.5 mm. In some embodiments of the invention, the width of a mesh may be greater than its height. In some embodiments of the invention, the width of a mesh may be between about 2.2 mm to about 3.5 mm. In these embodiments of the invention, the height of a mesh may be between about 1.5 mm and about 2.5 mm. In some embodiments of the invention, the land width of the heat conducting grid, i. the remaining material thickness between adjacent meshes, between about 180 ym and about 50 ym or between about
  • the land width may be between about 120 ym and about 90 ym.
  • the relatively large mesh size permits the efficient through-flow of a heat transfer medium ⁇ or in the case of an evaporator, the efficient transfer of a gaseous medium, whereas the
  • Normal vector of the plane defined by the skilletleitgitter be more than a factor of 7 or more than a factor of 8 or more than a factor 10 less than in a direction normal to the vector orthogonal direction.
  • the heat exchanger may further include a sorbent disposed on and / or in the heat conduction structure.
  • the sorbent can be applied, for example, by plasma coating, dip coating or spray coating. This makes it possible to use the heat exchanger according to the invention as a sorber in a thermal compressor of a sorption heat pump.
  • the heat exchanger can also be used as a condenser and / or evaporator of a heat pump.
  • the thermal conduction structure may be pleated.
  • the heat conducting structure may be integrally connected to the tube, for example by soldering.
  • soldering for this purpose, in some embodiments of the invention, a solder paste can be used which is applied to the joint and subsequently heated.
  • this relates to a method for vaporizing a liquid, in which the heat-conducting structure of a heat exchanger is at least partially immersed in a sump and via at least one tube of the heat exchanger, a heat transfer medium with increased
  • the heat conduction structure of the heat exchanger is derived from a heat energy source Transfer heat to a liquid, whereby the liquid is evaporated ⁇ speed.
  • the liquid can be supplied via a sump.
  • the heat exchanger can immerse completely or partially in the sump.
  • the liquid may also pass through the heat exchanger
  • the liquid to be evaporated may also condense on the heat exchanger before being stored there.
  • nucleate boiling in the liquid may be produced.
  • nucleate boiling the formation of gas phases by heating within the liquid is called.
  • Bubble germ sites and a relation to the saturation temperature of the fluid to be evaporated increased wall ⁇ temperatures necessary. It is known that especially at the corners and edges of a heating surface germination sites for the
  • the heat exchanger according to the invention thus has a good thermal conductivity due to the continuous within the thermal conductivity ⁇ lattice structure of the material. Due to the meshes within the cherriesleit ⁇ lattice, which are each bounded by webs with edges, the heat exchanger according to the invention but also many nucleation points for blistering and thus improved compared to known lamella heat exchangers
  • this relates to a method for heat transfer between a first heat transfer medium to a second heat transfer medium by means of a heat exchanger.
  • a heat transfer medium flows inside a pipe and is through the pipe wall from
  • the first heat transfer medium may be a liquid, for example a heating water, a cooling water or a thermal oil.
  • the second heat transfer medium may be gaseous, for example ambient air or an exhaust gas flow. In this case, the gaseous second heat transfer medium flows through the heat-conducting structure according to the invention. Because the porosity, ie the
  • Figure 1 shows an embodiment of an inventive
  • Figure 2 shows an embodiment of a cakeleit ⁇ structure in the view.
  • FIG. 3 shows a heat conduction structure in cross section.
  • FIG. 4 shows a cross section through a
  • Heat exchanger in a first embodiment.
  • Figure 5 shows a cross section through a
  • Figure 6 shows a cross section through a
  • Figure 7 shows the application of a heat exchanger according to the invention as an evaporator.
  • FIG. 1 shows an embodiment of a dressingleitgitters according to the present invention.
  • the heat-conducting grid according to FIG. 1 consists of an expanded metal which can be obtained by inserting slots into a metal foil or sheet and subsequent pulling apart. This results in stitches 25, which by webs 23rd
  • the metal foil or sheet may contain or consist of copper or aluminum.
  • Maschen 25 have a greater width a and a lower height b.
  • the width a may be between about 2.5 and about 3 mm, whereas the height b is between about 1.5 mm and about 2.5 mm.
  • the webs 23 may in some embodiments of the
  • Invention be between about 90 ym and about 100 ym wide.
  • the material thickness of the expanded metal mesh may be between about 40 ym and about 60 ym in some embodiments of the invention.
  • Expanded metal mesh 20 defines a continuous metallic structure so that heat can be efficiently conducted within the plane defined by the expanded metal. If the mesh 25 of the banksleitgitters 20 of an example gaseous heat transfer medium
  • a leitgitter 20 can also by
  • FIG. 2 shows a heat-conducting structure 2, which is composed of a multiplicity of heat-conducting lattices 20. For this purpose, about 50 to about 400 of the rectifier shown in Figure 1 are cut and superimposed.
  • the joining of the can be done for example by soldering.
  • a solder paste which contains solder and flux, punctiform or planar are applied to the heat ⁇ guiding grid 20.
  • at least one heat-conducting grid may be oxidized before soldering and the contact points may be ground. The can avoid that the heat conduction structure during soldering by capillary action absorbs the solder.
  • the individual cherriesleitgitter 20 can be sintered by a stack of a plurality of nickel-silicon 20 in
  • Inert gas atmosphere for example, a noble gas
  • the heat conduction structure 2 has a much higher
  • the semifinished product of the thermal conduction structure shown in Figure 2 can be cut below and applied to the tube wall of at least one tube or other heat transfer ⁇ surface of a heat exchanger, as will be explained with reference to Figures 4 to. 6
  • Figure 3 shows the cross section through a thermal conduction structure according to figure 2. Shown is a section of eleven heat ⁇ guide grids 20, which are arranged above one another.
  • Sinterphose 24 can also be a
  • FIG. 4 shows a cross section through a heat exchanger 1 according to the present invention.
  • the heat exchanger 1 contains at least one tube 10, which has a tube wall 100.
  • the pipe wall 100 separates an inner space 105 from an outer space surrounding the pipe 10.
  • the cross section of the tube 10 may be polygonal or round. In some embodiments of the invention, the tube 10 may have a
  • the heat exchanger 1 in the interior 105 of the tube 10 circulates a first heat transfer medium 6.
  • the thermal transfer medium ⁇ 6 may in some embodiments of the
  • the Invention be cooling or heating water or a thermal oil.
  • the heat transfer medium 6 may be in other embodiments, the working fluid of a heat pump or a refrigerator, such as ammonia, water or a hydrocarbon. In this case, the first heat transfer medium 6 may condense or evaporate in the tube 10.
  • the heat is the interior 105 of the tube 10 via the pipe wall 100 added or removed.
  • the heat conduction structure 2 according to the present invention is available.
  • the heat-conducting structure 2 has a multiplicity of heat-conducting lattices 20. For reasons of clarity, only a single heat-conducting grid 20 is shown in FIG.
  • the nickelleitgitter 20 has elongated stitches 25, as described with reference to FIG.
  • the heat conduction structure 2 is provided with a plurality of
  • the mesh 25 can be traversed by a second heat transfer medium 5.
  • the second heat transfer medium 5 flows into the drawing plane or out of the plane of the drawing and thus approximately
  • the flow direction of the two heat transfer media may of course also run in the same direction or in opposite directions.
  • the invention does not teach the use of a cross- flow heat ⁇ transferor as a solution principle. Due to the comparatively large surface portion of the mesh 25 on the total surface of the heat-conducting grid 20 of about 80% to about 90% sets the
  • the second heat transfer medium 5 may be gaseous and, for example, ambient air
  • the height of the heat conducting structure 2 between the joint 110 and the upper end may be between about 150 mm to about
  • FIG. 5 shows a second embodiment of a
  • Heat exchanger according to the present invention.
  • the same components of the invention are provided with the same reference numerals, so that the following description is limited to the essential differences.
  • the heat-conducting structure 2 is oriented so that the larger width of the mesh 25 runs approximately parallel to the tube 10.
  • the joints 110 may have a larger area than in the first embodiment explained with reference to FIG. This can improve the connection of the heat-conducting structure 2 to the wall 100 of the tubes 10.
  • FIG. 6 shows the heat exchangers according to FIG. 4 and FIG. 5 in a cutting direction orthogonal to these figures.
  • the first heat transfer medium 6 flows into the plane of the drawing or out of the plane of the drawing.
  • the flow direction of the second heat transfer medium 5 extends within the plane of the drawing.
  • FIG. 6 shows that the individual heat-conducting louvers 20 of the heat-conducting structure 2 are substantially perpendicular to the heat-transferring surface 100. Because of
  • a thermal conduction structure 2 may include between about 50 and about 400 heat conducting gratings 20.
  • a plurality of heat conducting structures 2 can be arranged on a tube 10, so that a heat exchanger 1 according to the present invention can contain many thousands of heat conducting gratings 20.
  • the second heat transfer medium 5 flows ⁇ approximately along the normal vector of the saut Camill 2.
  • the heat transfer medium 5 thus does not flow along the individual surface elements, but through them.
  • the direction of flow may also be in the plane of the heat transfer grids. Due to the high proportion of mesh 25 on the total area, this can nevertheless take place with a sufficiently low pressure loss. At the same time, the area available for heat transfer is increased, so that the heat exchanger according to the invention has better performance.
  • FIG. 7 shows the application of a heat exchanger according to the invention as an evaporator.
  • a heat exchanger 1 ⁇ dipped completely or partially into a sump 7 which is filled with a liquid to be evaporated 70th
  • the liquid 70 is evaporated and leaves the sump as steam 75.
  • the evaporator can
  • the circulating in the pipe 10 heat transfer medium leads to the evaporation necessary heat.
  • the heat ⁇ carrier medium can be heated by a heat source, not shown, or in the case of a refrigeration system to transport the dissipated heat.
  • the height of the rectifit Quilt 2 between the joint on the tube 10 and the upper end may in some embodiments of
  • Invention may be between about 10 mm and about 100 mm, or between about 10 mm and about 50 mm, or between about 10 mm and about 30 mm.
  • high heat transfer coefficients occur within the heat conduction structure 2, which are caused by the dynamics of bubble formation, bubble growth and bubble breakage.
  • Bubble nucleation sites and increased wall temperatures relative to the saturation temperature of the fluid to be vaporized are necessary for the formation of bubble formation on a partial surface of the heat-conducting structure. Especially at corners and edges of a heating surface germination sites for
  • the heat-conducting structure 2 of the invention has an improved evaporation performance, as at the edges of the webs 23 a plurality of
  • Evolved steam can then leave the heat conduction structure 2 through the mesh 25.
  • the sintering necks 24 formed between individual heat conducting gratings during the heat treatment of the heat conducting structure also form additional nucleating sites for the formation of bubbles.
  • heat exchanger according to the invention can thus be significantly increased compared to known heat exchangers

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

La présente invention concerne un échangeur de chaleur (1) comprenant au moins un tube (10) qui présente une paroi (100) et une structure thermoconductrice (2) qui est reliée à la paroi à la paroi du tube, la structure thermoconductrice (2) contenant au moins deux grilles thermoconductrices qui sont reliées entre elles par liaison de matière. L'invention concerne en outre un procédé d'utilisation d'un tel échangeur de chaleur.
EP17811925.1A 2016-12-07 2017-12-06 Échangeur de chaleur et procédé d'utilisation de celui-ci Active EP3551957B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016224338.1A DE102016224338A1 (de) 2016-12-07 2016-12-07 Wärmeübertrager und Verfahren zu dessen Verwendung
PCT/EP2017/081648 WO2018104375A1 (fr) 2016-12-07 2017-12-06 Échangeur de chaleur et procédé d'utilisation de celui-ci

Publications (2)

Publication Number Publication Date
EP3551957A1 true EP3551957A1 (fr) 2019-10-16
EP3551957B1 EP3551957B1 (fr) 2024-02-14

Family

ID=60654957

Family Applications (1)

Application Number Title Priority Date Filing Date
EP17811925.1A Active EP3551957B1 (fr) 2016-12-07 2017-12-06 Échangeur de chaleur et procédé d'utilisation de celui-ci

Country Status (3)

Country Link
EP (1) EP3551957B1 (fr)
DE (1) DE102016224338A1 (fr)
WO (1) WO2018104375A1 (fr)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1451009A1 (de) * 1963-07-10 1969-03-13 Siemens Elektrogeraete Gmbh Waermeaustauscher
FR2085171B1 (fr) * 1969-12-23 1974-02-01 Radial Ste Nle
DE2714617C2 (de) * 1977-04-01 1982-08-26 Spiro Research B.V., Helmond Wärmeaustauscher mit auf einem Trägerrohr angeordneter Drahtwendel
US5305824A (en) * 1993-09-27 1994-04-26 Gasseling John B Oil filter cooler
EP0693666B1 (fr) * 1994-07-22 1999-06-30 Mitsubishi Denki Kabushiki Kaisha Echangeur de chaleur pour un appareil de conditionnement d'air
DE29721686U1 (de) * 1996-11-27 1998-01-22 Joh. Vaillant Gmbh U. Co, 42859 Remscheid Wärmetauscher
DE19961284A1 (de) * 1999-12-18 2001-07-12 Bosch Gmbh Robert Wärmeübertrager für Gasheizgeräte, insbesondere Brennwertgeräte
US7981199B2 (en) * 2005-12-19 2011-07-19 Behr Gmbh & Co. Kg Sorber heat exchanger wall and sorber heat exchanger
RU2311600C1 (ru) * 2006-06-20 2007-11-27 Владимир Сергеевич Попов Трубчатый теплообменник (варианты)
DE102009018197A1 (de) * 2008-04-24 2009-11-26 Scheller, Gudrun Charlotte Flächengebilde
FR2993967B1 (fr) * 2012-07-24 2014-08-29 Valeo Systemes Thermiques Ailette destinee a perturber l'ecoulement d'un fluide, echangeur de chaleur comprenant une telle ailette et procede de fabrication d'une telle ailette
DE102014223250A1 (de) * 2014-11-14 2016-05-19 Vaillant Gmbh Verdampfer-Wärmetauscher

Also Published As

Publication number Publication date
EP3551957B1 (fr) 2024-02-14
WO2018104375A1 (fr) 2018-06-14
DE102016224338A1 (de) 2018-06-07

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