EP3616237A4 - Cmp-maschine mit erhöhtem durchsatz und verbesserter prozessflexibilität - Google Patents

Cmp-maschine mit erhöhtem durchsatz und verbesserter prozessflexibilität Download PDF

Info

Publication number
EP3616237A4
EP3616237A4 EP18791930.3A EP18791930A EP3616237A4 EP 3616237 A4 EP3616237 A4 EP 3616237A4 EP 18791930 A EP18791930 A EP 18791930A EP 3616237 A4 EP3616237 A4 EP 3616237A4
Authority
EP
European Patent Office
Prior art keywords
improved process
increased throughput
process flexibility
cmp machine
cmp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP18791930.3A
Other languages
English (en)
French (fr)
Other versions
EP3616237A1 (de
Inventor
Daniel Ray TROJAN
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASM America Inc
Original Assignee
AXUS Tech LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AXUS Tech LLC filed Critical AXUS Tech LLC
Publication of EP3616237A1 publication Critical patent/EP3616237A1/de
Publication of EP3616237A4 publication Critical patent/EP3616237A4/de
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/033—Other grinding machines or devices for grinding a surface for cleaning purposes, e.g. for descaling or for grinding off flaws in the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
EP18791930.3A 2017-04-26 2018-04-06 Cmp-maschine mit erhöhtem durchsatz und verbesserter prozessflexibilität Pending EP3616237A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201762602538P 2017-04-26 2017-04-26
PCT/US2018/026590 WO2018200165A1 (en) 2017-04-26 2018-04-06 Cmp machine with improved throughput and process flexibility

Publications (2)

Publication Number Publication Date
EP3616237A1 EP3616237A1 (de) 2020-03-04
EP3616237A4 true EP3616237A4 (de) 2020-12-16

Family

ID=63915835

Family Applications (1)

Application Number Title Priority Date Filing Date
EP18791930.3A Pending EP3616237A4 (de) 2017-04-26 2018-04-06 Cmp-maschine mit erhöhtem durchsatz und verbesserter prozessflexibilität

Country Status (6)

Country Link
US (2) US20180311784A1 (de)
EP (1) EP3616237A4 (de)
JP (3) JP7094983B2 (de)
KR (2) KR20240110657A (de)
CN (2) CN120480807A (de)
WO (1) WO2018200165A1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240110657A (ko) * 2017-04-26 2024-07-15 액서스 테크놀로지, 엘엘씨 향상된 처리량과 공정 유연성을 가진 cmp 기계
WO2020167485A1 (en) * 2019-02-14 2020-08-20 Axus Technology, Llc Substrate carrier head and processing system
US12217979B2 (en) 2019-07-01 2025-02-04 Axus Technology, Llc Temperature controlled substrate carrier and polishing components
CN114206551A (zh) 2019-08-02 2022-03-18 崇硕科技公司 用于工件抛光期间晶片滑移检测的原位调整的方法和设备
KR102428927B1 (ko) * 2020-01-22 2022-08-04 주식회사 씨티에스 웨이퍼 세정 장치용 웨이퍼 회전 유닛 및 이를 포함하는 씨엠피 장치
US20210323117A1 (en) 2020-04-16 2021-10-21 Applied Materials, Inc. High throughput polishing modules and modular polishing systems
US11705354B2 (en) 2020-07-10 2023-07-18 Applied Materials, Inc. Substrate handling systems
US12198944B2 (en) 2020-11-11 2025-01-14 Applied Materials, Inc. Substrate handling in a modular polishing system with single substrate cleaning chambers
US12224186B2 (en) 2023-04-03 2025-02-11 Applied Materials, Inc. Apparatus and method of brush cleaning using periodic chemical treatments
WO2025192933A1 (ko) * 2024-03-14 2025-09-18 정인권 기판 연마 장치의 연마 헤드 공압 제어 시스템
WO2026049750A1 (en) * 2024-08-30 2026-03-05 Applied Materials, Inc. In-situ monitoring system with substrate held by carrier in chemical mechanical polishing

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5562524A (en) * 1994-05-04 1996-10-08 Gill, Jr.; Gerald L. Polishing apparatus
US6189680B1 (en) * 1999-07-27 2001-02-20 Fujikoshi Kikai Kogyo Kabushiki Kaisha Rotary conveyor
US20060234508A1 (en) * 2002-05-17 2006-10-19 Mitsuhiko Shirakashi Substrate processing apparatus and substrate processing method
US20070141954A1 (en) * 2005-12-16 2007-06-21 Applied Materials, Inc. Paired pivot arm
US20080038993A1 (en) * 2006-08-08 2008-02-14 Jeong In-Kwon Apparatus and method for polishing semiconductor wafers

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JPS61152357A (ja) * 1984-12-24 1986-07-11 Hitachi Ltd 加工装置
JPH06196456A (ja) * 1992-12-24 1994-07-15 Fujitsu Ltd ウエハ研磨装置及びウエハ研磨方法
US6354926B1 (en) * 1997-03-12 2002-03-12 Lam Research Corporation Parallel alignment method and apparatus for chemical mechanical polishing
JP2000061821A (ja) * 1998-08-19 2000-02-29 Speedfam-Ipec Co Ltd ポリッシング装置における外気連通機構
JP3797822B2 (ja) * 1999-06-30 2006-07-19 株式会社荏原製作所 ポリッシング装置
JP4485643B2 (ja) * 1999-08-30 2010-06-23 三菱マテリアル株式会社 研磨装置及び被研磨材の研磨方法
US6602121B1 (en) * 1999-10-28 2003-08-05 Strasbaugh Pad support apparatus for chemical mechanical planarization
JP4257017B2 (ja) * 2000-05-02 2009-04-22 不二越機械工業株式会社 ウェーハの研磨装置
JP2001326201A (ja) * 2000-05-16 2001-11-22 Ebara Corp ポリッシング装置
US6923711B2 (en) * 2000-10-17 2005-08-02 Speedfam-Ipec Corporation Multizone carrier with process monitoring system for chemical-mechanical planarization tool
US6439981B1 (en) * 2000-12-28 2002-08-27 Lsi Logic Corporation Arrangement and method for polishing a surface of a semiconductor wafer
US6561881B2 (en) * 2001-03-15 2003-05-13 Oriol Inc. System and method for chemical mechanical polishing using multiple small polishing pads
KR100488376B1 (ko) * 2001-04-27 2005-05-11 가부시키가이샤 고베 세이코쇼 기판 처리 방법 및 기판 처리 설비
US6817923B2 (en) * 2001-05-24 2004-11-16 Applied Materials, Inc. Chemical mechanical processing system with mobile load cup
US6575818B2 (en) * 2001-06-27 2003-06-10 Oriol Inc. Apparatus and method for polishing multiple semiconductor wafers in parallel
JP2005131772A (ja) * 2003-10-31 2005-05-26 Ebara Corp ポリッシング装置
CN101023429B (zh) * 2004-07-02 2010-09-01 斯特拉斯鲍公司 用于处理晶片的方法和系统
CN102124545B (zh) * 2008-08-14 2013-11-06 应用材料公司 具有可移动的浆液分配器的化学机械抛光机及方法
US20120021671A1 (en) * 2010-07-26 2012-01-26 Applied Materials, Inc. Real-time monitoring of retaining ring thickness and lifetime
KR20240110657A (ko) * 2017-04-26 2024-07-15 액서스 테크놀로지, 엘엘씨 향상된 처리량과 공정 유연성을 가진 cmp 기계

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5562524A (en) * 1994-05-04 1996-10-08 Gill, Jr.; Gerald L. Polishing apparatus
US6189680B1 (en) * 1999-07-27 2001-02-20 Fujikoshi Kikai Kogyo Kabushiki Kaisha Rotary conveyor
US20060234508A1 (en) * 2002-05-17 2006-10-19 Mitsuhiko Shirakashi Substrate processing apparatus and substrate processing method
US20070141954A1 (en) * 2005-12-16 2007-06-21 Applied Materials, Inc. Paired pivot arm
US20080038993A1 (en) * 2006-08-08 2008-02-14 Jeong In-Kwon Apparatus and method for polishing semiconductor wafers

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2018200165A1 *

Also Published As

Publication number Publication date
JP2022141653A (ja) 2022-09-29
JP2020518475A (ja) 2020-06-25
JP2024026436A (ja) 2024-02-28
WO2018200165A1 (en) 2018-11-01
US20220088744A1 (en) 2022-03-24
KR20200002928A (ko) 2020-01-08
JP7094983B2 (ja) 2022-07-04
KR102680584B1 (ko) 2024-07-03
CN120480807A (zh) 2025-08-15
EP3616237A1 (de) 2020-03-04
KR20240110657A (ko) 2024-07-15
US20180311784A1 (en) 2018-11-01
JP7408726B2 (ja) 2024-01-05
CN110709980A (zh) 2020-01-17

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