EP3765651A1 - Dispositif pour le revêtement d'une pluralité de substrats - Google Patents

Dispositif pour le revêtement d'une pluralité de substrats

Info

Publication number
EP3765651A1
EP3765651A1 EP19711579.3A EP19711579A EP3765651A1 EP 3765651 A1 EP3765651 A1 EP 3765651A1 EP 19711579 A EP19711579 A EP 19711579A EP 3765651 A1 EP3765651 A1 EP 3765651A1
Authority
EP
European Patent Office
Prior art keywords
shutter
substrates
coating
shk
holding device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP19711579.3A
Other languages
German (de)
English (en)
Inventor
Rüdiger SCHERSCHLICHT
Stefan RADÜNZ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rodenstock GmbH
Original Assignee
Rodenstock GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rodenstock GmbH filed Critical Rodenstock GmbH
Publication of EP3765651A1 publication Critical patent/EP3765651A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C23C14/044—Coating on selected surface areas, e.g. using masks using masks using masks to redistribute rather than totally prevent coating, e.g. producing thickness gradient
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates

Definitions

  • the shutter SH 1 , SH 2 , SH 3 ... SHK and the holding device H can be rotated by a common drive.
  • a common drive makes it possible to provide a synchronous movement of the shutter and holding device H with a few mechanical means.
  • positioning elements SHP, HP are arranged on the shutter SHi, SH 2 , SH 3 ... SHK and the holding device H. To facilitate the corresponding positioning elements have a similar filling.
  • the shutter SH1, SH2, SH3... SHK provide at least partial coverage relative to a substrate, so that at least for the partially covered parts the direct line between the Substrate and coating source is interrupted.
  • FIG. 5 shows a triangular tip on the left side of the shutter SH1. If this is (at least temporarily) over a substrate, then less material will be deposited on the more shaded area. As a result, coating progressions can be generated.
  • SH K and holding element H ie to prevent lateral evaporation of the covered substrates
  • various ways are feasible.
  • One possibility would be to provide the segments of the shutter SHi, SH2, SH3 ... SH K with deflector covers and / or additionally to provide insert elements of the individual substrates likewise with side deflector covers. That is to say, substrates can be held in an insert element, for example a insert ring, which has a collar-shaped protuberance projecting laterally at least in sections. This (partial) collar-shaped protuberance can then constitute a physical barrier for lateral vapor deposition.
  • stepper motors can be used.
  • position switches can be provided.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

L'invention concerne un dispositif pour le revêtement d'une pluralité de substrats, la pluralité de substrats (S1, S2, S3,...SN) étant disposés sur un dispositif de support (H), le dispositif comprenant une source de revêtement (Q1, Q2,...QM), le dispositif de support (H) supportant la pluralité de substrats (S1, S2, S3,...SN) de telle façon qu'ils peuvent être revêtus en ligne directe à partir de la source de revêtement (Q1, Q2,...QM), un obturateur (SH1, SH2, SH3...SHK) réglable permettant de sélectionner quels substrats de la pluralité de substrats (S1, S2, S3,...SN) peuvent être revêtus, l'obturateur (SH1, SH2, SH3...SHK) interrompant la ligne directe entre le substrat et la source de revêtement, le nombre de substrats (S1, S2, S3,...SN) sélectionnés pouvant être changé par l'obturateur (SH1, SH2, SH3...SHK).
EP19711579.3A 2018-03-16 2019-03-15 Dispositif pour le revêtement d'une pluralité de substrats Withdrawn EP3765651A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018204033.8A DE102018204033A1 (de) 2018-03-16 2018-03-16 Vorrichtung zur Beschichtung einer Vielzahl von Substraten
PCT/EP2019/056525 WO2019175372A1 (fr) 2018-03-16 2019-03-15 Dispositif pour le revêtement d'une pluralité de substrats

Publications (1)

Publication Number Publication Date
EP3765651A1 true EP3765651A1 (fr) 2021-01-20

Family

ID=65812319

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19711579.3A Withdrawn EP3765651A1 (fr) 2018-03-16 2019-03-15 Dispositif pour le revêtement d'une pluralité de substrats

Country Status (4)

Country Link
EP (1) EP3765651A1 (fr)
JP (1) JP2021516286A (fr)
DE (1) DE102018204033A1 (fr)
WO (1) WO2019175372A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4050121A4 (fr) 2019-10-21 2024-04-17 Jiangsu Favored Nanotechnology Co., Ltd. Procédé de revêtement et couche de film correspondante, et appareil de revêtement et application correspondante
CN110699662B (zh) * 2019-10-21 2022-05-27 江苏菲沃泰纳米科技股份有限公司 镀膜方法及其膜层
DE102022003486B4 (de) * 2022-09-21 2025-08-28 Rodenstock Gmbh Abschattungsvorrichtung

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0633225A (ja) * 1992-07-21 1994-02-08 Murata Mfg Co Ltd 真空蒸着装置
JPH06336672A (ja) * 1993-05-31 1994-12-06 Mitsubishi Electric Corp 蒸着装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4022939A (en) * 1975-12-18 1977-05-10 Western Electric Company, Inc. Synchronous shielding in vacuum deposition system
CH650028A5 (de) * 1980-09-26 1985-06-28 Balzers Hochvakuum Anordnung zum gleichfoermigen beschichten von rotationsflaechen durch bedampfen im hochvakuum.
US6733640B2 (en) * 2002-01-14 2004-05-11 Seagate Technology Llc Shutter assembly having optimized shutter opening shape for thin film uniformity
CN1243279C (zh) * 2002-07-30 2006-02-22 佳能电子株式会社 滤光片制造方法、有该滤光片的光通量光阑装置和照相机

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0633225A (ja) * 1992-07-21 1994-02-08 Murata Mfg Co Ltd 真空蒸着装置
JPH06336672A (ja) * 1993-05-31 1994-12-06 Mitsubishi Electric Corp 蒸着装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2019175372A1 *

Also Published As

Publication number Publication date
DE102018204033A1 (de) 2019-09-19
WO2019175372A1 (fr) 2019-09-19
JP2021516286A (ja) 2021-07-01

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