EP3836219A4 - Anzeigevorrichtung - Google Patents

Anzeigevorrichtung Download PDF

Info

Publication number
EP3836219A4
EP3836219A4 EP19847700.2A EP19847700A EP3836219A4 EP 3836219 A4 EP3836219 A4 EP 3836219A4 EP 19847700 A EP19847700 A EP 19847700A EP 3836219 A4 EP3836219 A4 EP 3836219A4
Authority
EP
European Patent Office
Prior art keywords
display device
display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP19847700.2A
Other languages
English (en)
French (fr)
Other versions
EP3836219B1 (de
EP3836219A1 (de
Inventor
Byoung Yong Kim
Bong Hyun You
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Display Co Ltd
Original Assignee
Samsung Display Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Display Co Ltd filed Critical Samsung Display Co Ltd
Publication of EP3836219A1 publication Critical patent/EP3836219A1/de
Publication of EP3836219A4 publication Critical patent/EP3836219A4/de
Application granted granted Critical
Publication of EP3836219B1 publication Critical patent/EP3836219B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/88—Dummy elements, i.e. elements having non-functional features
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)
EP19847700.2A 2018-08-09 2019-03-18 Anzeigevorrichtung Active EP3836219B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020180093249A KR102603403B1 (ko) 2018-08-09 2018-08-09 표시 장치
PCT/KR2019/003077 WO2020032340A1 (ko) 2018-08-09 2019-03-18 표시 장치

Publications (3)

Publication Number Publication Date
EP3836219A1 EP3836219A1 (de) 2021-06-16
EP3836219A4 true EP3836219A4 (de) 2022-05-04
EP3836219B1 EP3836219B1 (de) 2025-09-03

Family

ID=69414948

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19847700.2A Active EP3836219B1 (de) 2018-08-09 2019-03-18 Anzeigevorrichtung

Country Status (6)

Country Link
US (1) US11925077B2 (de)
EP (1) EP3836219B1 (de)
JP (1) JP7349493B2 (de)
KR (1) KR102603403B1 (de)
CN (1) CN112655095B (de)
WO (1) WO2020032340A1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102769361B1 (ko) * 2019-04-01 2025-02-17 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
KR102756713B1 (ko) 2019-07-17 2025-01-21 삼성디스플레이 주식회사 표시 장치
KR102925153B1 (ko) * 2020-02-25 2026-02-09 삼성디스플레이 주식회사 표시 장치
KR102936702B1 (ko) * 2020-07-01 2026-03-11 삼성디스플레이 주식회사 표시장치
CN111985547A (zh) 2020-08-11 2020-11-24 华侨大学 一种基于注意力引导生成学习的跨分辨率车辆再辨识方法
CN111951669A (zh) * 2020-08-11 2020-11-17 武汉华星光电技术有限公司 一种显示面板及显示装置
KR20220065949A (ko) 2020-11-13 2022-05-23 삼성디스플레이 주식회사 표시 장치
KR102936711B1 (ko) 2021-02-26 2026-03-11 삼성디스플레이 주식회사 전자 장치
KR20220143212A (ko) 2021-04-15 2022-10-25 삼성디스플레이 주식회사 표시 장치
CN113437048B (zh) * 2021-06-28 2023-04-07 武汉华星光电半导体显示技术有限公司 显示装置
CN116830028B (zh) * 2022-01-20 2025-09-16 京东方科技集团股份有限公司 驱动ic及显示装置
CN114488632B (zh) * 2022-01-27 2023-06-20 武汉天马微电子有限公司 一种显示面板、显示装置及其检测方法
KR20230123091A (ko) * 2022-02-15 2023-08-23 삼성디스플레이 주식회사 발광 표시 장치
US12402290B2 (en) * 2022-03-16 2025-08-26 Samsung Display Co., Ltd. Display device and method of manufacturing the same
US12520430B2 (en) * 2022-05-18 2026-01-06 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Display module and mobile terminal
CN219592702U (zh) * 2023-02-14 2023-08-25 隆达电子股份有限公司 发光模块及其电性模块

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050111961A (ko) * 2004-05-24 2005-11-29 앰코 테크놀로지 코리아 주식회사 내장형 카메라 모듈 및 그에 사용되는 회로 기판
KR101324554B1 (ko) * 2006-12-21 2013-11-01 엘지디스플레이 주식회사 액정표시장치모듈
US20170357122A1 (en) * 2016-06-08 2017-12-14 Samsung Display Co., Ltd. Display apparatus and method of manufacturing the same
US20180110122A1 (en) * 2016-10-13 2018-04-19 Samsung Display Co., Ltd. Display device
US20180182839A1 (en) * 2016-12-28 2018-06-28 Lg Display Co., Ltd. Flexible display device and method for manufacturing the same

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US5734226A (en) 1992-08-12 1998-03-31 Micron Technology, Inc. Wire-bonded getters useful in evacuated displays
KR100188103B1 (ko) 1995-12-05 1999-06-01 삼성전자주식회사 탭-아이시
KR100920354B1 (ko) 2003-03-03 2009-10-07 삼성전자주식회사 박막 트랜지스터 표시판
KR100724479B1 (ko) * 2003-11-07 2007-06-04 엘지.필립스 엘시디 주식회사 액정표시소자 및 구동회로와의 본딩상태 검사방법
JP2005223054A (ja) * 2004-02-04 2005-08-18 Fujikura Ltd フレキシブル配線基板の端子部の超音波接合方法
US7710739B2 (en) 2005-04-28 2010-05-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and display device
JP2007073817A (ja) 2005-09-08 2007-03-22 Seiko Epson Corp 半導体装置の製造方法
JP2007086409A (ja) 2005-09-22 2007-04-05 Sanyo Epson Imaging Devices Corp 電気光学装置の製造方法及び接続部材の接続方法
JP4781097B2 (ja) 2005-12-05 2011-09-28 ルネサスエレクトロニクス株式会社 テープキャリアパッケージ及びそれを搭載した表示装置
KR100830100B1 (ko) * 2006-08-30 2008-05-20 엘지디스플레이 주식회사 평판 표시장치
JP2016075896A (ja) * 2014-10-07 2016-05-12 凸版印刷株式会社 表示パネルおよびその製造方法
KR102654925B1 (ko) 2016-06-21 2024-04-05 삼성디스플레이 주식회사 디스플레이 장치 및 이의 제조 방법
KR102849523B1 (ko) 2016-12-16 2025-08-26 삼성디스플레이 주식회사 기판, 전자 장치 및 이를 구비하는 표시 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050111961A (ko) * 2004-05-24 2005-11-29 앰코 테크놀로지 코리아 주식회사 내장형 카메라 모듈 및 그에 사용되는 회로 기판
KR101324554B1 (ko) * 2006-12-21 2013-11-01 엘지디스플레이 주식회사 액정표시장치모듈
US20170357122A1 (en) * 2016-06-08 2017-12-14 Samsung Display Co., Ltd. Display apparatus and method of manufacturing the same
US20180110122A1 (en) * 2016-10-13 2018-04-19 Samsung Display Co., Ltd. Display device
US20180182839A1 (en) * 2016-12-28 2018-06-28 Lg Display Co., Ltd. Flexible display device and method for manufacturing the same

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2020032340A1 *

Also Published As

Publication number Publication date
WO2020032340A1 (ko) 2020-02-13
US11925077B2 (en) 2024-03-05
CN112655095A (zh) 2021-04-13
US20210351262A1 (en) 2021-11-11
KR102603403B1 (ko) 2023-11-17
EP3836219B1 (de) 2025-09-03
JP7349493B2 (ja) 2023-09-22
KR20200018749A (ko) 2020-02-20
CN112655095B (zh) 2024-11-12
JP2021534446A (ja) 2021-12-09
EP3836219A1 (de) 2021-06-16

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