EP3903376B1 - Système de guide creux - Google Patents

Système de guide creux

Info

Publication number
EP3903376B1
EP3903376B1 EP20824942.5A EP20824942A EP3903376B1 EP 3903376 B1 EP3903376 B1 EP 3903376B1 EP 20824942 A EP20824942 A EP 20824942A EP 3903376 B1 EP3903376 B1 EP 3903376B1
Authority
EP
European Patent Office
Prior art keywords
circuit board
waveguide
substrate
board material
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP20824942.5A
Other languages
German (de)
English (en)
Other versions
EP3903376C0 (fr
EP3903376A1 (fr
Inventor
Timo JAESCHKE
Simon Kueppers
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
2Pi Labs GmbH
Original Assignee
2Pi Labs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 2Pi Labs GmbH filed Critical 2Pi Labs GmbH
Publication of EP3903376A1 publication Critical patent/EP3903376A1/fr
Application granted granted Critical
Publication of EP3903376C0 publication Critical patent/EP3903376C0/fr
Publication of EP3903376B1 publication Critical patent/EP3903376B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
    • H01P11/002—Manufacturing hollow waveguides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/12—Hollow waveguides
    • H01P3/121—Hollow waveguides integrated in a substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/082—Transitions between hollow waveguides of different shape, e.g. between a rectangular and a circular waveguide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
    • H01P5/107—Hollow-waveguide/strip-line transitions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/12—Hollow waveguides
    • H01P3/123—Hollow waveguides with a complex or stepped cross-section, e.g. ridged or grooved waveguides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package

Definitions

  • the present invention relates to a waveguide arrangement for guiding electromagnetic waves in a cavity surrounded by conductive material and to a method for producing a waveguide arrangement.
  • Waveguides are well-known in the art as waveguides for electromagnetic waves, primarily those in the GHz frequency range, i.e., especially for applications between 1 GHz and 1 THz. Waveguides are typically metal tubes or cavities surrounded by metal, usually with a rectangular, circular, or elliptical cross-section. The most relevant in practice and therefore always used here as an example without loss of generality are so-called rectangular waveguides, i.e., waveguides with a generally rectangular or square cross-section.
  • the present invention further relates to a waveguide arrangement comprising a printed circuit board material having a backing and an (electrically conductive) conductive layer.
  • the printed circuit board material is a so-called PCB material for the production of printed circuit boards.
  • the "back” refers in particular to the part of the circuit board material that provides mechanical stability to the circuit board material or the waveguide arrangement. Accordingly, the back is preferably plate-shaped.
  • the backing consists—at least predominantly—of an electrically conductive material, for example, a metal such as copper or the like.
  • the circuit board material preferably has an electrically insulating substrate (dielectric) arranged at least partially between the backing and the conductive layer.
  • a metallic backing offers the advantage that it can directly function as a ground reference surface for high-frequency structures such as striplines.
  • the backing in principle, however, it is also possible for the backing to consist – at least predominantly – of an electrically insulating material or dielectric.
  • the backing preferably forms the substrate or has the substrate.
  • An additional substrate between the backing and the conductive layer can be omitted.
  • the conductive layer is usually significantly thinner than the backing, which, for applications in the high-frequency range, as in this case, is preferably also electrically conductive and usually made of metal, especially copper, which can provide stability to the circuit board material.
  • the backing typically serves to dissipate heat.
  • the substrate insulates the conductive backing from the conductive layer, allowing the conductive layer to be used, for example, to create striplines that use the backing as a ground or reference electrode. Accordingly, the material is preferably a so-called double-sided circuit board material.
  • the EP 2 500 978 B1 This relates to a so-called waveguide transition between a substrate-integrated waveguide implemented in a circuit board substrate and a hollow conductor.
  • the hollow conductor is manufactured using split-block technology.
  • the tubular cross-section of a hollow conductor is created by surface structuring two corresponding blocks, which, when assembled, then create the desired hollow conductor structure, for example, a rectangular hollow conductor with a rectangular cross-section surrounded by conductive material.
  • a printed circuit board material is inserted into the split-block construction.
  • the waveguide manufactured using split-block technology has a comb-shaped coupling structure for coupling the substrate-integrated waveguide to the waveguide.
  • This coupling structure covers the waveguiding substrate of the substrate-integrated waveguide and extends from the ceiling onto the substrate-integrated waveguide at a distance from the side walls.
  • the comb-shaped coupling structure has steps, at the end of which a rectangular waveguide with a completely rectangular cavity is connected. The coupling of a signal from the substrate-integrated waveguide into the waveguide occurs through the comb-shaped coupling structure perpendicular to the main extension plane of the printed circuit board material inserted into a split-block base.
  • the back comprises or consist of an electrically insulating material or dielectric, at least substantially or predominantly. This can simplify the design of the waveguide arrangement.
  • an electrically conductive back especially one made of solid metallic material such as copper, is preferred.
  • the present invention teaches a departure from the usual uses of the back of printed circuit board material solely for mechanical stabilization and/or to form a flat ground reference surface with low surface resistance.
  • the back as proposed, has a surface structure that deviates from the flat, plate-like, usual structure of the back of the printed circuit board material and is designed to conduct electromagnetic waves. in particular serves to couple or generate modes for waveguiding purposes, i.e. is designed for this purpose and is preferably coupled.
  • the surface structure is one or more recesses in the back as part of or for forming the wave-guiding cavity of the waveguide.
  • the surface structure insofar as it forms at least part of the waveguide or delimits the cavity, is free of perforations. It is thus formed in the surface, but preferably does not perforate the back transversely to its main extension plane.
  • a waveguide preferably has a diameter transverse to a transmission direction of less than 15 mm, preferably less than 10 mm, and/or more than/at least 0.2 mm, preferably more than/at least 0.5 mm.
  • the surface structure extends at least substantially laterally or parallel to the main extension plane of the circuit board material in order to form the waveguide in the direction of the main extension plane of the circuit board material or parallel thereto.
  • the surface structure preferably comprises or is coated with an electrically conductive material.
  • the waveguide is formed in split-block technology by connecting the circuit board material as a split-block lower part with a corresponding cover as a split-block upper part.
  • the electrically conductive, plate-shaped back of the printed circuit board material is preferably used in a structured manner to form part of a split-block waveguide.
  • Using the back to form the waveguide instead of a traditional split-block base milled from solid metal has proven to be very resource-efficient and advantageous for constructing particularly compact waveguide arrangements and transitions to waveguides.
  • the division of the waveguide into two substructures is particularly advantageous because with fine Milling structures allow the lengths of milling tools to be reduced, thereby increasing manufacturing accuracy. Furthermore, combining a split-block part and the substrate material into a single component can reduce manufacturing costs, and the joint milling process of the circuit board and split-block part significantly eliminates tolerances between the circuit board and the waveguide structure.
  • a "waveguide arrangement" in the sense of the present invention is preferably an arrangement which has or forms at least one waveguide.
  • a "waveguide” in the sense of the present invention is, as already explained at the beginning, preferably an elongated cavity with electrically conductive boundary surfaces surrounding the cavity on the sides. Electromagnetic waves or modes can propagate along the cavity and the boundary surfaces, preferably in frequency bands between 5 GHz and 1 THz.
  • a “printed circuit board material” in the sense of the present invention comprises a preferably electrically conductive, plate-shaped back, a substrate (dielectric) and at least one conductive layer arranged on a side of the substrate facing away from the back.
  • the back is made of an electrically conductive material, especially metal, particularly preferably copper.
  • the back can be mechanically stable and/or impart mechanical stability to the circuit board material.
  • the back is preferably made of a dimensionally stable material, for example, with a material thickness between 0.1 and 5 mm, particularly preferably between 0.5 and 2 mm.
  • the back is formed from a one-piece, electrically conductive material.
  • the back can also be formed from an electrically insulating material and/or be constructed in multiple layers.
  • a preferably conductive layer adjacent to the substrate which preferably has the surface structure completely or at least substantially, to be connected to another preferably conductive carrier layer, in particular glued, soldered or otherwise connected in a preferably electrically conductive manner. This can be used for stabilization and/or assembly
  • the surface structure can optionally extend into such a carrier layer, preferably without completely breaking through the back.
  • a “substrate” in the sense of the present invention is preferably understood to mean an insulating material, an insulator, or dielectric.
  • it is a dielectric suitable for the high-frequency range, especially for frequencies above 10 GHz.
  • This can be PTFE, ceramic, or a PTFE-ceramic composite material. However, other materials can also be used.
  • a “conductive layer” is preferably understood to mean an electrically conductive layer, in particular a so-called copper cladding or conductor layer.
  • the conductive layer is particularly preferably a mechanically or chemically structurable metal layer, preferably comprising or consisting of copper, with which, for example, strip lines, in particular microstrip lines, can be produced by structuring.
  • a conductive layer is preferably thin compared to the substrate and/or backing. While the conductive layer typically has a material thickness of between 5 and 35 ⁇ m, the substrate can typically have a material thickness of between 100 ⁇ m and 400 ⁇ m.
  • Split-block technology within the meaning of the present invention preferably refers to a technology in which corresponding or complementary electrically conductive, surface-structured parts are joined together to form a waveguide. In this case, at least two parts are joined together in an electrically conductive manner, hereinafter referred to as “split-block lower part” and “split-block upper part.” It should be noted that the terms “lower part” and “upper part” preferably serve only to differentiate the different parts and do not prescribe a specific installation position.
  • the split-block lower part is preferably provided with a surface structure, in particular a groove or the like.
  • the surface structures of these complement each other to form the waveguide.
  • the split-block lower part and the split-block upper part have corresponding alignment aids for specifying a position of the surface structures relative to one another, whereby an exact Formation of the waveguide is facilitated or enabled by assembly.
  • this is not mandatory.
  • a “cover” within the meaning of the present invention is a device designed to cover the printed circuit board material by applying the cover to the printed circuit board material in such a way that surface structures in the printed circuit board material are covered and thereby sealed along a flat side of the printed circuit board material.
  • a cover within the meaning of the present invention has an electrically conductive flat side corresponding to or complementary to the surface structure of the printed circuit board material, with which recesses in the printed circuit board material are or can be bridged, resulting in at least one waveguide when the cover rests against the printed circuit board material, in particular the conductive layer.
  • the cover preferably has a surface structure, in particular with recesses, but can also be flat or cover the surface structures of the printed circuit board material with a flat surface in a corresponding manner in order to seal them off to form waveguides. It is understood that “covering” and “closing” leave open the possibility that the waveguide or cavity formed by “covering” or “closing” may be opened to the environment.
  • the waveguide arrangement 1 comprises a printed circuit board material 5, which preferably has a plate-shaped back 6 and a conductive layer 8.
  • the conductive layer 8 is electrically conductive.
  • the back 6 is preferably made of a mechanically stable or dimensionally stable material. This can impart mechanical stability to the waveguide arrangement 1 or the part thereof formed by the circuit board material 5.
  • the back 6, particularly when made of a thermally conductive material such as a metal, is preferably designed to dissipate heat from an electrical circuit, preferably a high-frequency circuit for generating, receiving, and/or converting frequencies propagable in the cavity 4, particularly an integrated circuit or a chip of the waveguide arrangement 1.
  • an electrical circuit preferably a high-frequency circuit for generating, receiving, and/or converting frequencies propagable in the cavity 4, particularly an integrated circuit or a chip of the waveguide arrangement 1.
  • a recess is preferably formed in the back 6, particularly by removing material from the back 6, and the circuit, an active component thereof, or the chip arranged in the recess is connected, for example, by adhesive bonding, to the back 6 in a particularly thermally conductive manner.
  • the back 6 is formed from an electrically conductive material, in particular a metal, particularly preferably copper, gold, or the like.
  • the circuit board material 5 comprises, in addition to the back 6 and the conductive layer 8, a substrate 7 (dielectric), wherein the conductive layer 8 is arranged on a side of the substrate 7 facing away from the back 6.
  • the substrate 7 consists in particular of a non-conductive or electrically insulating material.
  • the back 6 is also possible for the back 6 to be made of a non-conductive material, for example FR-4.
  • the back 6 forms the substrate 7, or an additional substrate 7 may be provided between the back 6 and The substrate 7 arranged above the conductive layer can be omitted.
  • a heat-conducting region or insert can be provided in the back 6 to dissipate heat for the circuit.
  • the substrate 7 most preferably consists of PTFE (polytetrafluoroethylene), ceramic (in particular aluminum oxide and/or aluminum nitride), PTFE-ceramic composite, or comprises PTFE, ceramic, or PTFE-ceramic composite.
  • PTFE-ceramic composite is preferably an at least substantially homogeneous mixture of PTFE and ceramic particles.
  • the substrate 7 is preferably deformable.
  • the conductive layer or plating 45 is represented by a dotted area. In the illustrations in Fig. 3 and 5 The conductive layer or plating 45 has been omitted for illustrative purposes. Nevertheless, the waveguide arrangement 1 preferably also has the conductive layer or plating 45.
  • the adaptation structure 15 preferably has one or more steps 16. These are preferably formed at least partially by the back 6.
  • the steps 16 can widen or narrow a diameter of the cavity 4 transversely to the transmission direction.
  • the cover 11 can project over further components of the waveguide arrangement 1 such as a chip, an electrical circuit or the like or can serve as mechanical protection and/or electrical shielding for these components.
  • the conductive layer 8 is electrically connected to the back 6 of the circuit board material 5, preferably at least substantially perpendicular to a main extension direction 19 of the circuit board material 5, by electrically conductive walls 20.
  • the walls 20 laterally delimit the cavity 4. This can form a rectangular waveguide 18 or a part, and in particular a split-block lower part, thereof.
  • the walls 20 and/or side walls 21 are formed by the conductive layer or plating 45 or boundary surfaces 12 or the walls 20 and/or side walls 21 have the conductive layer or plating 45 or boundary surfaces 12.
  • the electrically conductive connection is preferably made through the conductive layer or plating 45 or boundary surfaces 12.
  • the walls 20, or the sections of the walls that cover or cover the substrate 7, are preferably aligned with the side walls 21 of the cover 11.
  • the walls 20 between the back 6 and the conductive layer 8, as well as the side walls 21 of the cover 11, are electrically conductively connected to one another, so that they form an electrically conductive lateral boundary for the cavity 4.
  • the result is preferably a rectangular waveguide 18.
  • the Fig. 2 shows a partial perspective top view of the circuit board material 5 of the proposed waveguide arrangement 1.
  • the view according to Fig. 1 corresponds, as far as the printed circuit board material 5 is concerned, to a section along the section line II from Fig. 2 .
  • this eliminates at least substantially any play in establishing the connection between a conventionally constructed substrate-integrated waveguide and a coupling structure for coupling the substrate-integrated waveguide to a conventional hollow guide. Reflections and losses due to tolerances in this environment are thus advantageously reduced.
  • the substrate-integrated waveguide 22 can merge directly into the hollow guide formed by the cavity 4 with the circuit board material 5, thus enabling a remarkably compact design.
  • the substrate-integrated waveguide 22 particularly preferably has an interface 24, preferably adjacent to an electrically conductive material on all (four) sides and/or at the front, with which the substrate 7 of the substrate-integrated waveguide 22 directly adjoins the cavity 4.
  • the interface 24 is therefore, in particular, not covered with an electrically conductive material 3.
  • the interface 24 is surrounded by conductive material 3 in the form of the conductive layer 8, the back 6 and the walls 20 or the conductive layer or plating 45, a window for the electromagnetic waves 2 results between the substrate-integrated waveguide 22 and the cavity 4.
  • the cavity 4 of the waveguide arrangement 1 is completely and continuously surrounded by conductive material 3, with the exception of the window or interface 24 and any openings and coupling points of the cavity formed by the cavity 4.
  • Waveguide - for example for connecting to external components such as antennas or the like.
  • the interface 24 preferably extends transversely or perpendicularly to the transmission direction for electromagnetic waves 2 indicated by the arrow 13 and/or perpendicularly to the plane spanned by the main extension direction(s) 19 of the circuit board material 5.
  • the coupling of the substrate-integrated waveguide 22 into the cavity 4 thus enabled again enables a very compact design compared to solutions in which coupling out of the substrate-integrated waveguide 22 occurs essentially perpendicularly to its main extension direction 19.
  • an electromagnetic wave 2 guided through the substrate-integrated waveguide 22 is therefore not deflected or is deflected only insignificantly in order to couple into the cavity 4 or vice versa in order to couple from the cavity 4 into the substrate 7 of the substrate-integrated waveguide 22.
  • the interface 24 is preferably produced in that, after structuring the circuit board material 5 and - if necessary after producing the conductive layer, coating with the plating 45 or deposition of conductive material 3 on the walls 20 or side walls 21 for connecting the back 6 to the conductive layer 8 - the material 3 forming the wall 20, the conductive layer or the plating 45 is or will be removed again in the region of the interface 24, in particular by a machining process, preferably milling, or by laser or the like. This has proven to be particularly efficient for producing the proposed waveguide arrangement 1.
  • the surface structure 9 of the back 9 is preferably structured starting from a, in particular commercially available, (HF) circuit board base material by structuring the side having the conductive layer 8 and/or the substrate 7. This is particularly preferably done by a machining process, in particular milling, by laser or the like.
  • the cavity 4 is therefore preferably created at least partially by removing the conductive layer 8, the substrate 7, and parts of the back 6 in sections from an (HF) circuit board base material.
  • the surface structure 9 of the back 6 is first manufactured in a (HF) printed circuit board base material by structuring the conductive layer 8, the substrate 7, and the back 6. Subsequently, the substrate 7 is exposed laterally to the structured areas and accordingly electrically separates the conductive layer 8 from the back 6.
  • HF HF
  • an electrically conductive connection can be established between the conductive layer 8 and the back 6. This creates the previously described wall 20 or plating 45. This can be achieved by depositing conductive material 3, in particular by so-called “copper plating.”
  • one or more electrically conductive layers are subsequently deposited on the surface.
  • the conductive surface is coated, passivated, and/or gold-plated. This preferably forms the aforementioned conductive layer or plating 45. This offers the advantage of good long-term stability through corrosion protection while simultaneously maintaining low surface resistance, which is advantageous for the formation of low-loss waveguide structures.
  • the interface 24 is then preferably formed by removing the wall 20, the conductive layer or plating 45 in the region of an end face of the substrate 7 forming the substrate-integrated waveguide 22. This results in the previously explained interface 24, in which the substrate 7 forming the substrate-integrated waveguide 22 directly adjoins the cavity 4.
  • the formation of the window or the interface 24 can also be carried out by a machining process, particularly preferably by milling.
  • the opening of the window or formation of the interface 24 can in principle also take place at a different phase of the manufacturing process, for example after formation of the walls 20 or plating 45 and before a gold plating process, so that no conductive or metallic material 3 is present in the region of the interface 24 at the time of gold plating and in a preferred galvanic gold plating, deposition of conductive material 3 or other passivation no conductive material 3 is deposited, so that the interface 24 retains or maintains the described function.
  • Fig. 2A shows a simplified schematic view of the printed circuit board material 5 in its unprocessed state (also called printed circuit board base material or PCB base material).
  • the conductive layer 8 preferably runs at least substantially parallel to the back 6 and/or uninterrupted in the unprocessed circuit board material 5.
  • the conductive layer 8 is preferably also an at least substantially planar layer with flat sides that run at least substantially parallel to its main extension plane, which more preferably run parallel to the flat side(s) of the back 6.
  • the back 6 and the conductive layer 8 are therefore preferably arranged parallel or in parallel planes to one another.
  • the substrate 7 is arranged between the back 6 and the conductive layer 8, which substrate also runs in one plane in unprocessed areas, has flat sides or boundary surfaces to the back 6 on the one hand and to the conductive layer 8 on the other hand and/or is an at least substantially constant and, prior to processing, at least substantially uninterrupted layer of constant material thickness.
  • the circuit board material 5 is accordingly preferably a sandwich structure consisting of the back 6, the substrate 7 and the conductive layer 8.
  • the back 6, which primarily provides the circuit board material 5 with its mechanical stability, is formed from a conductive material.
  • a metal back for example, made of copper and/or brass.
  • the printed circuit board material 5 prior to its processing i.e. the printed circuit board base material, has the back 6 and the conductive layer 8 as well as optionally the substrate 7 directly adjacent to each other and connected to each other. This does not preclude the composite of the conductive layer 8 and the substrate 7 being first applied to a back 6 prior to further processing, i.e. being fully connected to the back 6, so that the result is the schematically shown in Fig. 2A shown structure results.
  • the circuit board material 5 is coated by depositing electrically conductive material.
  • the circuit board material 5 is plated, as explained above by way of example. This allows the (respective) wall 20 to be formed. In the illustrated example, the coating is shown only in the area of the recess 10. However, it can extend beyond the conductive layer 8.
  • the substrate-integrated waveguide 22 is formed by the electrically insulating substrate 7 between the electrically conductive back 6 and the conductive layer 8.
  • a section of the substrate 7 is conductively delimited on the one hand by the conductive layer 8 and the back 6 and on the other hand by slots or grooves 23, which are preferably also provided with conductive material 3 and form a conductive lateral boundary surface for the substrate 7, which preferably extends uninterruptedly between the conductive layer 8 and the back 6. Accordingly, in the region of the grooves 23, the substrate 7 is surrounded on four sides with conductive material, and an electromagnetic wave can then propagate in the surrounded substrate 7, so that the substrate-integrated waveguide 22 is formed.
  • the slots or grooves 23 can be filled or at least partially filled with electrically conductive material 3, in particular the same electrically conductive material 3 that is preferably deposited to form the walls 20.
  • electrically conductive material 3 in particular the same electrically conductive material 3 that is preferably deposited to form the walls 20.
  • the electrically conductive lateral boundaries for forming the substrate-integrated waveguide 22 are formed in a joint process with the walls 20, in particular during the same deposition of conductive material 3.
  • the section of the side of the circuit board material 5 in which the recess 10 and the substrate-integrated waveguide 22 (to be formed) or the structures delimiting it, such as the grooves 23, are provided, is plated together.
  • the surface of the conductive layer 8 can optionally be plated as well, which is not shown for reasons of simplification.
  • the interface 24 of the substrate 7 is formed or opened, via which the substrate 7 directly adjoins the recess 10, the surface structures 9 or the cavity 4.
  • the interface 24 forms a window for the entry and/or exit of electromagnetic waves 2 from the substrate-integrated waveguide 22 into the cavity 4 and/or from the cavity 4 into the substrate-integrated waveguide 22.
  • a structure for impedance matching can be provided additionally, as already described in connection with Fig. 2 explained by example.
  • the cavity 4 and/or the recess 10 forming or delimiting the cavity 4 preferably extends in a slot-like or groove-like manner primarily along the main extension direction or in the main extension plane 19 of the circuit board material 5.
  • the recess 10 is or forms a groove or an elongated slot which extends through the conductive layer 8 into the back 6, preferably through the substrate 7, and preferably extends longer in the direction of the main extension plane or main extension direction 19 of the circuit board material 5 than perpendicular thereto.
  • the The surface structure 9 or recess 10 thus comprises a groove covered by a cover 11, forming the cavity 4 in which modes can propagate in the direction of the longitudinal extension or main extension of the groove.
  • the walls 20 and/or floor of the groove-shaped recess 10 or groove preferably extend at least substantially parallel or perpendicular to the main extension plane or main extension direction 19 of the circuit board material 5.
  • Fig. 3 shows the circuit board material 5 and at least one, in the illustrated example two or more, different covers 11, which (each) correspond to the circuit board material 5 in such a way that an assembly of these to one another (each) forms or can form the cavity 4 or the waveguide formed with the cavity 4.
  • the waveguide arrangement 1 can have a conductor track, in particular a stripline 25, formed with the circuit board material 5 and produced in particular by structuring the conductive layer 8.
  • the conductor track or stripline 25 can serve or be used to establish an electrical connection, signal connection, and/or the connection or assembly of electronic components.
  • the stripline 25 can have a transition 27 at a stripline end 26 for coupling to the substrate-integrated waveguide 22.
  • the stripline 25 can have or form a transition 27 at the stripline end 26 for coupling to the cavity 4 or the waveguide formed thereby (not shown).
  • the one or more conductor tracks or striplines 25 is/are/are preferably produced by structuring the conductive layer 8.
  • it is one or more microstrip lines, for which the back 6 acts as a reference electrode or ground plane, which is separated from the stripline(s) 25 formed in the conductive layer 8 or by structuring the conductive layer 8 by the substrate 7 (dielectric).
  • the conductor tracks or stripline(s) 25 can be used, for example, to be connected via one or more bond wires, flip-chip connections, or the like to a semiconductor component, in particular to its outputs for transmitting and/or inputs for receiving signals.
  • Signals can form the electromagnetic wave 2 by coupling into the substrate-integrated waveguide 22 or the cavity 4 or, conversely, the signals can be generated from the electromagnetic wave 2 from the cavity 4 or the substrate-integrated waveguide 22 in the stripline 25.
  • striplines 25, which can also be designed as differential striplines, are at least essentially realized only with the printed circuit board material 5
  • the cavity 4 for forming the waveguide of the waveguide arrangement 1 is preferably formed by combining a part of the cavity 4 formed in the printed circuit board material 5 with a part of the cavity 4 formed in the cover 11.
  • the corresponding surface structure 9 of the printed circuit board material 5 or back 6 and the preferably corresponding and/or complementary surface structure 17 of the (respective) cover 11 is shown in Fig. 3 shown.
  • the cover 11 can advantageously also be formed with or from circuit board material 5, or, as in the illustrated example, from a structured, electrically conductive (solid) material.
  • the waveguide arrangement 1 can have an orthomode transducer 28.
  • the orthomode transducer 28 is particularly suitable for Fig. 4 to 6 shown.
  • the waveguide arrangement 1 can comprise a plurality of waveguide functional elements 14, in particular connected in series.
  • the waveguide functional elements 14 each or continuously formed at least partially by the circuit board material 5, in particular the surface structure 9 of the back 6.
  • the same circuit board material 5 comprises or forms the substrate-integrated waveguide 22, a transition therefrom to the cavity 4 and, formed by the cavity 4 or the waveguide formed therewith, one or more waveguide functional elements 14, which, starting from the substrate-integrated waveguide 22, are implemented successively as waveguide functional elements 14.
  • the transition between the substrate-integrated waveguide 22 and the cavity 4 is followed first by the adaptation structure 15 and then, optionally or as an example for a waveguide functional element 14, the orthomode transducer 28 or an input 29 of the orthomode transducer 28.
  • the orthomode transducer 28 is particularly preferably coupled via the matching structure 15, which is formed at least partially by the back 6 of the circuit board material 5, to the substrate-integrated waveguide 22, which is preferably also formed at least partially by the back 6 of the circuit board material 5.
  • the matching structure 15 is therefore preferably arranged between the substrate-integrated waveguide 22 and the orthomode transducer 28.
  • the waveguide arrangement 1 particularly preferably has at least two, preferably at least or exactly three, adaptation structures 15 formed with the back 6, each of which couples an input 29 of the orthomode transducer 28 to a substrate-integrated waveguide 22.
  • Fig. 3 shows two differently designed covers 11, each corresponding to the same surface structure 9 of the circuit board material 5 of the back 6 of the circuit board material 5.
  • the properties of the waveguide formed by the cavity 4 depend on and can be varied by the fact that the same back 6 having the same Surface structure 9 with different covers 11 combined to form different cavities 4 or waveguides formed thereby.
  • a waveguide arrangement 1 is preferably produced as described above, wherein the circuit board material 5 with the back 6, which has the surface structure 9, is combined with one of several available, different covers 11 to form a cavity 4 of a waveguide.
  • the waveguide arrangement 1 is combined from the back 6 of the circuit board material 5 and one of several different covers 11, each of which can be directly or indirectly connected to the back 6 to form a waveguide.
  • a waveguide with only one opening 32 is formed when this cover 11 is connected to the circuit board material 5.
  • the orthomode transducer 28, which is formed with corresponding surface structures 9, 17 of the back 6 and the cover 11, is designed to separately transmit electromagnetic waves 2 introduced into the cavity 4 from the outside, in particular into horizontal and vertical components.
  • the transmission preferably takes place via adaptation structures 15 and/or substrate-integrated waveguides 22, as already fundamentally explained above.
  • a waveguide arrangement 1 with a different function can be realized.
  • three openings 32 and at least one cavity 4 can be formed.
  • Further surface structures 17 can optionally be delimited only by the conductive layer 8, wherein in any case one cavity 4 is formed with the circuit board material 5.
  • Further cavities can be formed by surface structures 17 which, on the part of the circuit board material 5, are only delimited by the conductive layer 8. In this way, several cavities 4 or waveguides can be formed, in particular each with an opening 32.
  • the surface structure 9 of the circuit board material 5 or back 6, which previously formed part of the orthomode transducer 28, no longer fulfills or realizes the function of an orthomode transducer 28.
  • the surface structure 9 of the circuit board material 5 or back 6 is supplemented by the cover 11 or its surface structure 17 in such a way that another function is fulfilled, for example an adaptation or merely transmission or filtering of electromagnetic waves 2.
  • the further openings 32 of cavities 4 can be used to couple separate electromagnetic waves 2 into separate cavities 4.
  • completely different functions can be achieved by selecting or replacing the cover 11 with the same circuit board material 5 with the same surface structure 9, for example the formation of a circularly polarized electromagnetic wave 2 by combining orthogonally linearly polarized electromagnetic waves 2 in one case or a multi-channel transmitting and/or receiving function in the other case.
  • the waveguide arrangement 1 preferably comprises, in particular depending on the choice of cover 11, a plurality of separate cavities 4, waveguide functional elements 14, substrate-integrated waveguides 22, and/or striplines 25. This advantageously enables the realization of different waveguide functions depending on the choice of a corresponding cover 11, but alternatively or additionally, preferably also depending on the choice of cover 11, these functions to be combined into (more complex) functions.
  • the circuit board material 5, and in particular the back 6, preferably has one or more mounting and/or adjustment means 30.
  • these are recesses or openings, in particular bores, threaded holes, grooves, tongues, pins, and/or the like.
  • the cover(s) 11 preferably has/have (the same) corresponding or complementary mounting and/or adjustment means 31.
  • Corresponding techniques for precisely joining a split-block lower part, which in this case may be formed by the circuit board material 5, to a split-block upper part, which in this case is preferably formed by the cover 11 or one of the covers 11, in order to form the cavity 4 or, hence, the waveguide, are generally known in the prior art and can be applied accordingly in the present case.
  • a special feature in this context is the preferred use of the circuit board material 5, and in particular the back 6, to form a mounting and/or alignment means 30, or rather, the fact that the circuit board material 5 or the back 6 comprises this.
  • the fact that the circuit board material 5 or the back 6 comprises the mounting and/or alignment means 30 makes it possible to achieve a particularly compact design.
  • Fig. 4 shows a partial, perspective view of the waveguide arrangement 1 with a view of the outer surface 1A or into the cavity 4, in particular through the opening 32.
  • the opening 32 is initially bordered by a waveguide section 33, which merely fulfils the function of conducting the electromagnetic wave 2.
  • the orthomode transducer 28 has a back element 34, which, preferably together with the other structures forming the cavity 4, effects the function of the orthomode transducer 28.
  • the back element 34 is particularly in Fig. 5 shown.
  • the back element 34 is preferably web-like and/or protrudes into the cavity 4 in a web-like manner.
  • the back element 34 preferably has one or more steps.
  • the orthomode transducer 28 with its back element 34 is implemented separately from the adaptation structure 15, which, although directly adjacent to the structure of the orthomode transducer 28 with its back element 34, does not overlap.
  • an adaptation has already been at least substantially completed at the boundary between the adaptation structure 15 and the back element 34 of the orthomode transducer 28. Accordingly, the orthomode transducer 28 can be omitted if necessary.
  • the opening 32 of the waveguide arrangement 1 for coupling and/or decoupling the electromagnetic waves 2 can be used directly, for example, for coupling and/or decoupling the electromagnetic waves 2 into or out of a waveguide element 35 and/or into or out of an antenna 36.
  • the waveguide element 35 and/or the antenna 36 can be attached to the waveguide arrangement 1 by means of one or more fastening means 37. For example, screwing is possible.
  • the waveguide element 35 and the antenna 36 are merely shown in reduced form and schematically. In principle, numerous different add-on components compatible with waveguides can be combined with the proposed waveguide arrangement 1 as needed.
  • the add-on components in the form of the waveguide element 35 and the antenna 36, which are only shown schematically, are therefore merely examples.
  • the antenna 36 may in particular be as shown in WO 2009/100891 A1
  • the antenna can be a dielectric antenna as described. Such a dielectric antenna makes it particularly easy to realize a compact antenna with high aperture efficiency.
  • the WO 2009/100891 A1 The antenna described is hereinafter referred to as dielectric antenna 38.
  • the dielectric antenna 38 is particularly Figs. 7 and 8 shown.
  • the dielectric antenna 38 has a coupling element 39 for coupling and/or decoupling electromagnetic waves 2 into or out of the dielectric antenna 38 and a lens 40 made of a dielectric material.
  • the dielectric antenna 38 is preferably designed for, in particular simultaneous, transmission and reception of electromagnetic waves 2.
  • the antenna 38 or lens 40 preferably has a transmission area 41 for transmitting and/or receiving electromagnetic waves 2.
  • the transmission area 41 is preferably arranged on a side of the lens 40 facing away from the coupling element 39.
  • the lens 40 is - at least in the transmission area 41 - at least substantially ellipsoidal in shape.
  • the antenna 38 or lens 40 preferably has a main axis 42.
  • the antenna 38 or lens 40 is preferably symmetrical, in particular rotationally symmetrical, to the main axis 42.
  • the main axis 42 preferably forms a main or symmetry axis of the ellipsoid defined by the transmission area 41.
  • the transmission area of the lenses defines several ellipses whose main axes are aligned essentially coaxially.
  • the ellipses essentially share a common focal point because this allows the desired properties of the emitted electromagnetic radiation to be achieved.
  • the coupling element 39 is preferably arranged at least substantially at a focal point of the ellipsoid defined by the at least ellipsoidally shaped transmission region 41 of the lens 40, because the focal point property of the ellipsoidally shaped transmission region 41 of the lens 40 can be particularly advantageously utilized in conjunction with the geometric-optical refraction properties of electromagnetic waves 2 at the edge of the lens 40 or at the dielectric jump edge of the dielectric material of the lens 40 to the surroundings of the lens 40.
  • the coupling element 39 is designed to couple electromagnetic waves 2 from the waveguide or cavity 4 of the waveguide arrangement 1 into the dielectric antenna 38 or lens 40 and/or from the dielectric antenna 38 or lens 40 into the waveguide or cavity 4.
  • the cavity 4 is preferably arranged at least substantially coaxially with the main axis 42.
  • the waveguide arrangement 1 can be constructed as a flat or planar, compact module using the measures described above.
  • the waveguide arrangement 1 is thinner than 3 cm, preferably thinner than 2 cm, and especially thinner than 1.5 cm. This allows the waveguide arrangement 1 to form a particularly compact system by plugging it onto or into another structure, such as an antenna 36.
  • mounting of add-on parts on the waveguide arrangement 1 for coupling and/or decoupling electromagnetic waves 2 into or out of the cavity 4 can particularly advantageously also be carried out at least substantially perpendicular to the main extension plane of the entire waveguide arrangement 1, which preferably corresponds to the main extension direction 19 of the circuit board material 5.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)

Claims (12)

  1. Procédé de fabrication d'un agencement de guide d'ondes (1) présentant une cavité (4) entourée d'un matériau conducteur (3) pour la conduction d'ondes électromagnétiques (2),
    dans lequel au moins une partie de la cavité (4) est produite par le fait que d'un matériau de carte de circuit imprimé (5) pour la fabrication de circuits imprimés, présentant au moins un dos en forme de plaque (6) et une couche conductrice (8), la couche conductrice (8) et des parties du dos (6) sont enlevées par sections, ce qui permet de former une structure de surface (9) sous la forme d'un évidement (10) qui ne traverse de préférence pas le dos (6) transversalement à sa direction d'extension principale (19), une paroi électriquement conductrice (20) étant ensuite formée par dépôt de matériau conducteur (3), laquelle paroi délimite la cavité (4), et
    dans lequel la cavité (4) est formée en technologie de bloc divisé par liaison du matériau de carte de circuit imprimé (5) en tant que partie inférieure de bloc divisé avec un recouvrement correspondant (11) en tant que partie supérieure de bloc divisé, le recouvrement (11) présentant une structure de surface (17) qui est réalisée de manière correspondante ou complémentaire à la structure de surface (9) du dos (6).
  2. Procédé selon la revendication 1, caractérisé en ce que le matériau de carte de circuit imprimé (5) présente un substrat électriquement isolant (7) entre le dos (6) et la couche conductrice (8), le substrat (7) étant également enlevé par sections en plus de la couche conductrice (8) et des parties du dos (6), ce qui permet de former la structure de surface (9) sous la forme d'un évidement (10), le substrat (7) étant ouvert latéralement par rapport aux zones structurées et la paroi électriquement conductrice (20) recouvrant ensuite le substrat (7) par le dépôt du matériau conducteur (3).
  3. Procédé selon la revendication 2, caractérisé en ce que le dos (6) est constitué au moins principalement d'un matériau électriquement conducteur et la couche conductrice (8) est reliée électriquement au dos (6) du matériau de carte de circuit imprimé (5) - de préférence au moins sensiblement perpendiculairement à un plan d'extension principale (19) du matériau de carte de circuit imprimé (5) - au moyen de la paroi (20).
  4. Procédé selon la revendication 2 ou 3, caractérisé en ce que le matériau de carte de circuit imprimé (5) présente un guide d'ondes (22) intégré au substrat, qui est formé par le substrat (7) du matériau de carte de circuit imprimé (5) et est couplé à la cavité (4).
  5. Procédé selon la revendication 4, caractérisé en ce qu'une surface limite (24) du guide d'ondes (22) intégré au substrat, avec laquelle le substrat (7) du guide d'ondes (22) intégré au substrat est directement adjacent à la cavité (4), est fabriquée en ce que la paroi (20) est enlevée à nouveau dans la zone de la surface limite (24).
  6. Procédé selon la revendication 5, caractérisé en ce qu'une fenêtre pour les ondes électromagnétiques (2) entre le guide d'ondes (22) intégré au substrat et la cavité (4) résulte en ce que la surface limite (24) est entourée par un matériau conducteur sous la forme de la couche conductrice (8), du dos (6) et des parois (20).
  7. Procédé selon la revendication 5 ou 6, caractérisé en ce que la surface limite (24) s'étend transversalement ou perpendiculairement à une direction de transmission pour des ondes électromagnétiques (2) et/ou perpendiculairement au plan qui est tendu par la ou les direction(s) d'extension principales (19) du matériau de carte de circuit imprimé (5).
  8. Procédé selon l'une quelconque des revendications précédentes, caractérisé en ce que l'agencement de guide d'ondes (1) présente un élément fonctionnel de guide d'ondes (14), l'élément fonctionnel de guide d'ondes (14) étant formé au moins en partie par ou dans le dos (6) du matériau de carte de circuit imprimé (5).
  9. Procédé selon l'une quelconque des revendications précédentes, caractérisé en ce que parmi plusieurs recouvrements (11) pouvant être reliés respectivement au matériau de carte de circuit imprimé (5) pour la formation de la cavité (4), qui sont réalisés pour former des cavités (4) de différentes propriétés de conduction d'ondes par la liaison avec le matériau de carte de circuit imprimé (5), un recouvrement (11) est sélectionné et relié au matériau de carte de circuit imprimé (5), moyennant quoi la cavité (4) est produite avec les propriétés de conduction d'ondes correspondant au recouvrement sélectionné (11).
  10. Agencement de guide d'ondes (1) pour la conduction d'ondes électromagnétiques (2) avec une cavité (4) entourée d'un matériau conducteur (3), l'agencement de guide d'ondes (1) présentant un matériau de carte de circuit imprimé PCB (5) pour la fabrication de circuits imprimés, qui présente au moins un dos en forme de plaque (6) et une couche conductrice (8),
    dans lequel le dos (6) présente une structure de surface (9), par laquelle la cavité de guidage d'ondes (4) est au moins en partie limitée, et dans lequel l'agencement de guide d'ondes (1) présente dans le matériau de carte de circuit imprimé (5) un guide d'ondes (22) intégré au substrat, qui est couplé à la cavité (4),
    dans lequel la cavité (4) est formée en technologie de bloc divisé par liaison du matériau de carte de circuit imprimé (5) en tant que partie inférieure de bloc divisé avec un recouvrement correspondant (11) en tant que partie supérieure de bloc divisé, le recouvrement (11) présentant une structure de surface (17) qui est réalisée de manière correspondante ou complémentaire à la structure de surface (9) du dos (6), et
    caractérisé en ce que le dos (6) est constitué au moins principalement d'un matériau électriquement conducteur et le matériau de carte de circuit imprimé (5) présente au moins par sections entre le dos (6) et la couche conductrice (8) un substrat électriquement isolant (7).
  11. Agencement de guide d'ondes selon la revendication 10, caractérisé en ce qu'une surface de délimitation (12) du guide d'ondes (22) intégré au substrat et de la cavité (4) est formée d'une seule pièce et/ou sans interruption par le dos (6) du matériau de carte de circuit imprimé (5).
  12. Agencement de guide d'ondes selon la revendication 10 ou 11, caractérisé en ce que l'agencement de guide d'ondes (1) présente un élément fonctionnel de guide d'ondes (14), l'élément fonctionnel de guide d'ondes (14) étant formé au moins en partie par le dos (6) du matériau de carte de circuit imprimé (5).
EP20824942.5A 2019-12-20 2020-12-18 Système de guide creux Active EP3903376B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP19218936 2019-12-20
EP20167973 2020-04-03
PCT/EP2020/086948 WO2021123111A1 (fr) 2019-12-20 2020-12-18 Agencement de guide d'ondes creux

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EP3903376A1 EP3903376A1 (fr) 2021-11-03
EP3903376C0 EP3903376C0 (fr) 2025-10-01
EP3903376B1 true EP3903376B1 (fr) 2025-10-01

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DE102020132330B3 (de) 2020-12-04 2022-06-09 CiTEX Holding GmbH THz-Sensor und THz-Messverfahren zum Vermessen eines Messobjektes
DE102023206267A1 (de) 2023-07-03 2025-01-09 Robert Bosch Gesellschaft mit beschränkter Haftung Wellenleiterelement und Verfahren zur Herstellung eines Wellenleiterelements, sowie Hochfrequenzanordnung und Radarsystem
US12166262B1 (en) * 2024-04-19 2024-12-10 Imam Mohammad Ibn Saud Islamic University Apparatus, methods and design system for wide-band millimeter wave RWG to air-filled SIW transition

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US6323818B1 (en) * 1997-03-25 2001-11-27 University Of Virginia Patent Foundation Integration of hollow waveguides, channels and horns by lithographic and etching techniques
US20080280583A1 (en) * 2006-06-19 2008-11-13 California Institute Of Technology Submillimeter wave heterodyne receiver
WO2010104486A1 (fr) * 2009-03-12 2010-09-16 Linkstar Llc Coupleur orthomode à micro-ondes et appareil émetteur/récepteur duplex basé sur ce modèle

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US6882762B2 (en) * 2001-09-27 2005-04-19 Intel Corporation Waveguide in a printed circuit board and method of forming the same
DE102008008715A1 (de) 2008-02-11 2009-08-13 Krohne Meßtechnik GmbH & Co KG Dielektrische Antenne
EP2500978B1 (fr) 2011-03-17 2013-07-10 Sivers Ima AB Transition de guide d'onde
GB2489950A (en) * 2011-04-12 2012-10-17 Filtronic Plc A substrate integrated waveguide (SIW) to air filled waveguide transition comprising a tapered dielectric layer
US10468736B2 (en) 2017-02-08 2019-11-05 Aptiv Technologies Limited Radar assembly with ultra wide band waveguide to substrate integrated waveguide transition
US11482767B2 (en) * 2020-04-17 2022-10-25 Honeywell Federal Manufacturing & Technologies, Llc Method of manufacturing a waveguide comprising stacking dielectric layers having aligned metallized channels formed therein to form the waveguide
US11527838B2 (en) * 2020-12-31 2022-12-13 Universal Microwave Technology, Inc. Dual polarized array waveguide antenna

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US6323818B1 (en) * 1997-03-25 2001-11-27 University Of Virginia Patent Foundation Integration of hollow waveguides, channels and horns by lithographic and etching techniques
US20080280583A1 (en) * 2006-06-19 2008-11-13 California Institute Of Technology Submillimeter wave heterodyne receiver
WO2010104486A1 (fr) * 2009-03-12 2010-09-16 Linkstar Llc Coupleur orthomode à micro-ondes et appareil émetteur/récepteur duplex basé sur ce modèle

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EP3903376C0 (fr) 2025-10-01
US12119532B2 (en) 2024-10-15
EP3903376A1 (fr) 2021-11-03
WO2021123111A1 (fr) 2021-06-24
US20230016951A1 (en) 2023-01-19

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