EP3949009A1 - Dispositif d'antenne plate et son procédé de fabrication - Google Patents

Dispositif d'antenne plate et son procédé de fabrication

Info

Publication number
EP3949009A1
EP3949009A1 EP19716402.3A EP19716402A EP3949009A1 EP 3949009 A1 EP3949009 A1 EP 3949009A1 EP 19716402 A EP19716402 A EP 19716402A EP 3949009 A1 EP3949009 A1 EP 3949009A1
Authority
EP
European Patent Office
Prior art keywords
aob
module
pcb
cavity
mold material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP19716402.3A
Other languages
German (de)
English (en)
Inventor
Stefan Martens
Chih I LIN
Achim Strass
Martin Nirschl
Xianchao ZHENG
Dominic Maurath
Stefan RAATZ
Ezio Perrone
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Publication of EP3949009A1 publication Critical patent/EP3949009A1/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/183—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components mounted in and supported by recessed areas of the PCBs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09772—Conductors directly under a component but not electrically connected to the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1136—Conversion of insulating material into conductive material, e.g. by pyrolysis
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/241—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements
    • H10W44/248—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements for antennas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/02—Manufacture or treatment of conductive package substrates serving as an interconnection, e.g. of metal plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Definitions

  • the present invention relates to the field of antennas, in particular to an Antenna-on-Board (AoB) technology.
  • the invention proposes a flat antenna module and antenna device including a radio chip, a circuit board, and antennas arranged inside and/or above the circuit board.
  • Radio dies are radio frequency integrated circuit (RFIC) dies, including transceiver and receiver chips
  • AoB technology has been proposed for different radio communication bands, e.g. the Ka-Band (28 GHz to 40 GHz) or the V-Band (60 GHz), as well as gesture radars. It can also provide effective antenna solutions to 5G and beyond, operating in the millimeter-wave bands and above.
  • AoB technology adoption in 5G requires scalability to a high number of radio dies and antennas, a high level of integration between radio die and antennas in the AoB, as well as between the AoB and a system Printed Circuit Board (PCB), high reliability, and low cost.
  • PCB Printed Circuit Board
  • TIM thermal interface material
  • the TIM layer has typically only low thermal conductivity in the range of 3-5 W/mK. This leads to an inefficient thermal management.
  • dimensional tolerances of the radio die and the system PCB lead to variation in the TIM thickness, preventing a uniform thermal distribution over several radio dies.
  • eWLB embedded wafer level ball grid array
  • FoWLP fan-out wafer-level packaging
  • embodiments of the present invention aim to provide an improved antenna device.
  • an objective is to overcome the challenges of PCB based AoB technologies, especially with respect to the thermal management of the RFICs.
  • a flat AoB antenna module and device are desired.
  • a first aspect of the invention provides an AoB module, comprising: a PCB comprising a cavity and at least one radiating element arranged in and/or on the PCB, and a RFIC die mounted inside the cavity and embedded into a mold material, wherein a bottom surface of the PCB and a surface of the mold material are on the same level.
  • a flat AoB module by use of a cavity PCB is realized by the AoB module of the first aspect.
  • the RFIC die is overmolded or embedded in, for instance, an epoxy compound.
  • the mold surface has advantageously the same level as the bottom of the PCB, and as a consequence, the whole AoB module is easier to implement with improved thermal management into an AoB device, e.g. as of the second aspect.
  • the bottom side of the AoB module is flat.
  • the fully flat AoB module allows using a standard surface-mount technology (SMT) process when assembling the AoB module to a mother/system board.
  • SMT surface-mount technology
  • the RFIC die is overmolded with the mold material in the cavity.
  • the RFIC die can be exposed as well as over-molded with a mold layer.
  • the mold material protects the RFIC die and enables a flat surface of the AoB module.
  • the mold material can also be used to implement further functionalities.
  • the mold material is a resin material, in particular epoxy.
  • the RFIC die is a bare-die with wirebonds, solder bumps or flip-chip interconnections connected to the PCB.
  • these interconnections allow the RFIC die to be physically attached to, and electrically connected to the PCB.
  • the RFIC die comprises one of a WLP, a chip scale package (CSP), or a lead frame or a laminate-PCB-based land grid array (LGA) package.
  • the RFIC itself may be a molded plastic package.
  • the mold material comprises a laser activatable material.
  • Using the laser activatable material as the mold material allows forming, for instance, a laser direct structuring (LDS) heat spreader or adding other functionalities.
  • LDS laser direct structuring
  • the bottom surface of the mold material is metallized to form a LDS heat spreader.
  • the cavity comprises two side walls, wherein the RFIC die is mounted in the cavity between the two side walls.
  • a second aspect of the invention provides an AoB device, comprising a plurality of AoB modules arranged side-by-side, wherein each AoB module is an AoB module according to the first aspect or an implementation of the first aspect, and a respective bottom side of each AoB module is on the same level.
  • the AoB device of the second aspect overcomes the challenges of PCB based AoB technologies, especially with respect to the thermal management of the RFICs.
  • the thermal management is significantly improved by using the AoB modules of the first aspect.
  • the AoB modules are assembled to a system board by a standard SMT process.
  • the whole AoB device is a flat LGA component, it can be soldered to the system PCB in a SMT process.
  • the LDS heat spreader according to an implementation of the first aspect is soldered to the system board by the SMT process.
  • the RFIC thermal interface can be soldered to the system board, particularly in the same SMT process used to connect the AoB module to the system PCB. This leads to a uniform thermal distribution of the RFIC over the large AoB device.
  • a third aspect of the invention provides a method for manufacturing an AoB device, the method comprising: manufacturing a plurality of AoB modules, comprising: forming a plurality of PCBs side-by-side, wherein for each PCB a cavity is formed and at least one radiating element is arranged in and/or on the PCB, and mounting one or more RFIC die inside of each cavity and embedding the RFIC die into a mold material, wherein a bottom surface of the PCB and a surface of the mold material are on the same level.
  • the method further comprises: assembling the plurality of AoB modules to a system board by a standard SMT process.
  • the method further comprises: connecting the RFIC die to the PCB with wirebonds, solder bumps or flip-chip interconnections.
  • the method further comprises: metallizing the bottom surface of the mold material to form a LDS heat spreader. In an implementation form of the second aspect, the method further comprises: soldering the EDS heat spreader to the system board in the SMT process.
  • the method may be provided with further implementation forms according to the above implementation forms of the first aspect.
  • the method of the second aspect thus achieves the same advantages and effects as the antenna device of the first aspect.
  • FIG. 1 shows an AoB module according to an embodiment of the invention.
  • FIG. 2 shows an AoB module according to an embodiment of the invention.
  • FIG. 3 shows an AoB module according to an embodiment of the invention.
  • FIG. 4 shows an AoB device according to an embodiment of the invention.
  • FIG. 5 shows an AoB device according to an embodiment of the invention.
  • FIG. 6 shows an AoB device according to an embodiment of the invention.
  • FIG. 7 shows an AoB device according to an embodiment of the invention.
  • FIG. 8 shows an AoB device according to an embodiment of the invention.
  • FIG. 9 shows a method according to an embodiment of the invention.
  • FIG. 1 shows an AoB module 100 according to an embodiment of the invention.
  • the AoB module 100 comprises a PCB 101, which comprises a cavity 102 and at least one radiating element 103 arranged in and/or on the PCB 102.
  • the AoB module 100 further comprises a RFIC die 104 mounted inside the cavity 102 and embedded into a mold material. A bottom surface of the PCB 101 and a surface of the mold material are on the same level.
  • a flat AoB module with cavity is proposed by embodiments of this invention.
  • the RFIC die 104 is to this end mounted inside the cavity 102 of the AoB module 100, in particular, is molded into the cavity 102.
  • the surface of the mold material having the same level as the bottom surface of the PCB 101, enables the whole AoB module 100 to become flat.
  • the bottom side of the AoB module 100 may be flat.
  • the RFIC die 104 may be overmolded with the mold material in the cavity.
  • the mold material may be a resin material, in particular an epoxy compound.
  • FIG. 2 and FIG. 3 both show AoB modules 100 according to embodiments of the invention.
  • the AoB module 100 as shown in FIG. 2 is based on the AoB module 100 as shown in FIG. 1, with further interconnections 105 between the PCB 101 and the RFIC die 104.
  • the RFIC die 104 can be a so-called bare-die with bonding wires, solder bumps or flip-chip interconnections 105 (e.g. Cu Pillar flip-chip interconnections), as shown in FIG. 2, connected to the PCB 101.
  • the RFIC die 104 can be mounted to the PCB 101 in many different ways.
  • the interconnections 105 allow the RFIC die 104 to be physically attached to, and electrically connected to the PCB 101.
  • the RFIC die 104 may comprise one of a WLP, a CSP, or a lead frame or a laminate - PCB-based LGA package. That means, the RFIC die 101 itself may be a molded plastic package.
  • the mold material may comprise a laser activatable material. That means, the cavity 102 may be formed from a commercially available laser activatable material.
  • the AoB module 100 as shown in FIG. 3 is based on the AoB module 100 as shown in FIG. 1 or FIG. 2, further comprising a LDS heat spreader 106.
  • the bottom surface of the mold material is metallized to form the LDS heat spreader 106.
  • the LDS heat spreader 106 may be arranged beneath the RFIC die 104.
  • the cavity 102 may comprise two side walls, wherein the RFIC die 104 is mounted in the cavity 102 between the two side walls. This allows an easy implementation of a two- wall cavity design for a flat AoB antenna, as shown in FIG. 8.
  • the PCB 101 of the AoB module 100 in all embodiments can comprise a plurality of PCB layers.
  • an amount of total PCB layers can vary from 6 to 20, depending on a type of PCB technology used.
  • a dimension of the cavity 102 can also vary, depending on a dimension of the RFIC die 104 and the technology used to create the cavity 102 into the PCB 101.
  • the cavity 102 can extend over 2 to 10 layers in total PCB layers of the PCB 101.
  • FIG. 4 - FIG. 8 show AoB devices 200 according to embodiments of the invention.
  • Each of these AoB devices 200 includes AoB modules 100 according to an embodiment of the invention, as shown in FIG. 1 - FIG. 3. Same elements in the figures are labelled with the same reference signs and function likewise.
  • FIG. 4 shows an AoB device 200 comprising a plurality of AoB modules 100 arranged side- by-side, wherein each AoB module 100 is an AoB module 100 according to an embodiment of the invention, as shown in either one of FIG. 1- FIG. 3. Further, a respective bottom side of each AoB module 100 of the AoB device 200 is on the same level.
  • the AoB device 200 may comprise 4 AoB modules 100. This is merely an example implementation of the AoB device 200 according to an embodiment of the invention.
  • the AoB device 200 may comprise a plurality of AoB modules 100 arranged side-by-side. Particularly, the plurality of AoB modules 100 may also be an array of AoB modules 100.
  • FIG. 5 shows an AoB device 200 based on the AoB device 200 as shown in FIG. 4.
  • the AoB modules 100 may be assembled to a system board 201, as shown in FIG.
  • each AoB module 100 has the same level as the bottom of the PCB 101 of each AoB module 100. Due to flat AoB modules 100 according to embodiments of this invention, there is no more need of BGA balls, when mounting AoB modules 100 onto the system board 201. Furthermore, there is also no more need for holes in the system board 201 to connect a heat sink to the RFIC dies 104 by a TIM.
  • BGA ball grid array
  • the AoB module 100 is the AoB module 100 as shown in FIG. 3, the AoB module 100 further comprises the LDS heat spreader 106.
  • a SMT process may be used to connect the AoB modules 100, particularly the PCBs 101, to the system PCB 201.
  • the LDS heat spreader 106 can be soldered to the system PCB 201 in the same SMT process which is used to connect the PCB 101 to the system PCB 201. This efficiently simplifies a manufacturing process of the AoB device 200.
  • the AoB module 100 with a combination of LDS metallization on the mold, i.e. the LDS heat spreader 106, leads to a direct and well controlled thermal interface of the RFIC die 104 with the system PCB 201. This results in an effective and uniform thermal management of whole AoB systems, allowing higher power and bigger size systems.
  • FIG. 6 shows an AoB device 200 based on the AoB device 200 as shown in FIG. 5.
  • the AoB device 200 is further arranged above a heat sink, as shown in FIG. 6.
  • the heat sink is arranged beneath the system PCB 201.
  • FIG. 7 particularly shows an AoB device 200 comprising, an AoB module 100 without a LDS heat spreader 106 (left side of FIG. 7), and an AoB module 100 with a LDS heat spreader 106 (right side of FIG. 7). It should also be noted that, with or without the LDS heat spreader 106, all the AoB modules 100 have a flat bottom side, and can be assembled to the system board 201 in the same SMT process.
  • FIG. 8 shows an AoB device 200 with an easy implementation of a two-wall cavity design.
  • each cavity 102 comprises two side walls, wherein the RFIC die 104 is mounted between the two side walls.
  • FIG. 9 shows a flow-diagram of a method 900 according to an embodiment of the invention.
  • the method 900 is for manufacturing an AoB device 100 according to an embodiment of the invention.
  • the method 900 comprises: a step 901 of manufacturing a plurality of AoB modules 100, which comprising a step 9011 of forming a plurality of PCB 101 side-by-side, wherein for each PCB 101 a cavity 102 is formed and at least one radiating element 103 is arranged in and/or on the PCB 101, and a step 9012 of mounting one or more RFIC die 104 inside of each cavity 102 and embedding the RFIC die 104 into a mold material.
  • a bottom surface of the PCB 102 and a surface of the mold material are on the same level.
  • the RFIC die 104 can be exposed as well as over-molded with a mold layer.
  • the method 900 of FIG. 9 may further comprise a step of assembling the plurality of AoB modules 100 to a system board 201 by a standard SMT process.
  • the method 600 may further comprise a step of connecting the RFIC die 104 to the PCB 101 with wirebonds, solder bumps or flip-chip interconnections 105.
  • the method 600 further comprises a step of metallizing the bottom surface of the mold material to form a LDS heat spreader 106.
  • the mold layer itself can be made with a laser activatable material, meaning it can form a LDS heat spreader after a metallization process.
  • the method 600 may further comprise a step of soldering the LDS heat spreader 106 to the system board 201 in the SMT process.
  • the SMT process is the same SMT process used to assemble the plurality of AoB modules 100 to the system board 201. This leads to an effective and uniform thermal management of AoB systems, allowing higher power and bigger size systems.
  • the embodiments of the present invention overcome the challenges with PCB based AoB technologies, especially for simplifying an AoB assembly process.
  • a flat AoB module and device are achieved by a combination of an AoB PCB with cavities combined with a molding technology. This decouples assembly tolerances, and allows, in combination with a LDS heat spreader, a uniform thermal management of AoB systems.
  • the embodiments of this invention offer at least the following benefits:
  • the encapsulation of the RFIC die leads to an improved reliability.
  • the RFIC thermal interface is soldered to the system board and leads to a uniform thermal distribution of the RFIC over the large AoB.
  • the whole AoB module is a flat LGA component and can be soldered to the system PCB in the same SMT process which is used to connect other components to the system PCB.
  • the system PCB will become easier and cheaper since there is no more need for holes in the system PCB to connect the heat sink to the RFIC dies by a TIM.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

La présente invention concerne un module AoB et un dispositif. Le module AoB comprend une PCB comprenant une cavité et au moins un élément rayonnant disposé dans et/ou sur la PCB. Le module AoB comprend en outre une puce RFIC montée à l'intérieur de la cavité et incorporée dans un matériau de moule. En particulier, une surface inférieure de la PCB et une surface du matériau de moule sont sur le même niveau. En conséquence, le dispositif AoB comprend une pluralité de modules AoB disposés côte à côte. En particulier, un côté inférieur respectif de chaque module AoB est sur le même niveau. L'invention porte aussi sur un procédé de fabrication d'un tel dispositif AoB.
EP19716402.3A 2019-04-05 2019-04-05 Dispositif d'antenne plate et son procédé de fabrication Pending EP3949009A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2019/058663 WO2020200475A1 (fr) 2019-04-05 2019-04-05 Dispositif d'antenne plate et son procédé de fabrication

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EP3949009A1 true EP3949009A1 (fr) 2022-02-09

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US11201119B2 (en) 2018-06-06 2021-12-14 At&S Austria Technologie & Systemtechnik Aktiengesellschaft RF functionality and electromagnetic radiation shielding in a component carrier

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US9818680B2 (en) * 2011-07-27 2017-11-14 Broadpak Corporation Scalable semiconductor interposer integration
JP5945326B2 (ja) * 2012-07-30 2016-07-05 パナソニック株式会社 放熱構造を備えた半導体装置
US9368425B2 (en) * 2013-12-20 2016-06-14 Globalfoundries Inc. Embedded heat spreader with electrical properties

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