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  • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
  • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
  • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
  • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
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  • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
  • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
  • H10D86/441—Interconnections, e.g. scanning lines
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  • H10H20/01—Manufacture or treatment
  • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
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  • H10H20/01—Manufacture or treatment
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  • H10H20/01—Manufacture or treatment
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  • H10H20/01—Manufacture or treatment
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  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/80—Constructional details
  • H10H20/81—Bodies
  • H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
  • H10H20/812—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
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  • H10H20/80—Constructional details
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  • H10H20/80—Constructional details
  • H10H20/83—Electrodes
  • H10H20/831—Electrodes characterised by their shape
  • H10H20/8314—Electrodes characterised by their shape extending at least partially onto an outer side surface of the bodies
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  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/80—Constructional details
  • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
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  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/80—Constructional details
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  • H10H20/8506—Containers
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  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/80—Constructional details
  • H10H20/85—Packages
  • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
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  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W90/00—Package configurations

Definitions

• the present disclosure relates to a light emitting diode (LED) structure and a method for manufacturing the LED structure, and more particularly, to a LED structure with a plurality of individually functionable LED units while sharing a doping layer and the method for manufacturing the same.
• LED light emitting diode
• LEDs have become popular in lighting applications. As light sources, LEDs have many advantages including higher light efficiency, lower energy consumption, longer lifetime, smaller size, and faster switching.
• Micro-LED displays have arrays of micro-LEDs forming the individual pixel elements.
• a pixel may be a minute area of illumination on a display screen, one of many from which an image is composed.
• pixels may be small discrete elements that together constitute an image as on a display.
• Pixels are normally arranged in a two-dimensional (2D) matrix, and are represented using dots, squares, rectangles, or other shapes. Pixels may be the basic building blocks of a display or digital image and with geometric coordinates.
• an etching process such as a dry etching or a wet etching process, is frequently used to electrically isolate individual micro-LEDs.
• the conventional process typically etches away the continuous functional epitaxy layer completely.
• the fully isolated functional micro-LED mesas may easily peel off from the substrate because the adhesion of the micro-LED mesas is weak. The problem is even more significant when the micro-LED mesas become even smaller.
• the sidewalls of the micro-LED mesas may be damaged and impact the optical and electrical properties of the LED structure.
• Embodiments of the disclosure address the above problems by providing a LED structure with a plurality of individually functionable LED units while sharing a doping layer or a bonding layer and the method for manufacturing the same.
• Embodiments of the LED structure and method for forming the LED structure are disclosed herein.
• a LED structure in one example, includes a substrate and a plurality of LED units formed on the substrate.
• Each LED unit includes a bonding layer formed on the substrate, a first doping type semiconductor layer formed on the bonding layer, a second doping type semiconductor layer formed on the first doping type semiconductor layer, a passivation layer formed on the second doping type semiconductor layer and a portion of the first doping type semiconductor layer, and an electrode layer formed on a portion of the passivation layer and contacting the second doping type semiconductor layer.
• the plurality of LED units include a first LED unit and a second LED unit adjacent to the first LED unit.
• the first doping type semiconductor layer of the first LED unit horizontally extends and physically connect to the first doping type semiconductor layer of the second LED unit adjacent to the first LED unit, and the first LED unit and the second LED unit are individually functionable LED units.
• a LED structure in another example, includes a substrate and a plurality of LED units formed on the substrate.
• Each LED unit includes a p-n diode layer formed on the substrate, a passivation layer formed on the p-n diode layer, and an electrode layer formed on the passivation layer and contacting the p-n diode layer.
• the plurality of LED units include a first LED unit and a second LED unit adjacent to the first LED unit.
• the first LED unit and the second LED unit have a common anode, and the first LED unit and the second LED unit are individually functionable LED units.
• a method for manufacturing a LED structure is disclosed.
• a semiconductor layer is formed on a first substrate.
• the semiconductor layer includes a first doping type semiconductor layer and a second doping type semiconductor layer.
• a first etching operation is performed to remove a portion of the second doping type semiconductor layer and expose a portion of the first doping type semiconductor layer.
• a second etching operation is performed to remove a portion of the first doping type semiconductor layer and expose a portion of the first substrate with contact of pixel circuit.
• a passivation layer is formed on the second doping type semiconductor layer and the exposed first doping type semiconductor layer.
• a third etching operation is performed to form a first opening on the passivation layer on the second doping type semiconductor layer, and second opening on the passivation layer on the first substrate with contact of pixel circuit.
• An electrode layer is formed on the passivation layer covering the first opening and contacting the second doping type semiconductor layer, the second opening and contacting the first substrate with contact of pixel circuit.
• FIG. 1 illustrates a top view of an exemplary LED structure, according to some implementations of the present disclosure.
• FIG. 2 illustrates a cross-section view of an exemplary LED structure, according to some implementations of the present disclosure.
• FIG. 3 illustrates another cross-section view of an exemplary LED structure, according to some implementations of the present disclosure.
• FIG. 4 illustrates another top view of an exemplary LED structure, according to some implementations of the present disclosure.
• FIG. 5 illustrates a top view of another exemplary LED structure, according to some implementations of the present disclosure.
• FIGs. 6A-6H illustrate cross sections of an exemplary LED structure at different stages of a manufacturing process, according to some implementations of the present disclosure.
• FIG. 7 is a flowchart of an exemplary method for manufacturing a LED structure, according to some implementations of the present disclosure.
• terminology may be understood at least in part from usage in context.
• the term “one or more” as used herein, depending at least in part upon context may be used to describe any feature, structure, or characteristic in a singular sense or may be used to describe combinations of features, structures or characteristics in a plural sense.
• terms, such as “a, ” “an, ” or “the, ” again, may be understood to convey a singular usage or to convey a plural usage, depending at least in part upon context.
• the term “based on” may be understood as not necessarily intended to convey an exclusive set of factors and may, instead, allow for existence of additional factors not necessarily expressly described, again, depending at least in part on context.
• spatially relative terms such as “beneath, ” “below, ” “lower, ” “above, ” “upper, ” and the like, may be used herein for ease of description to describe one element or feature’s relationship to another element (s) or feature (s) as illustrated in the figures.
• the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures.
• the apparatus may be otherwise oriented (rotated90degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.
• a layer refers to a material portion including a region with a thickness.
• a layer can extend over the entirety of an underlying or overlying structure or may have an extent less than the extent of an underlying or overlying structure. Further, a layer can be a region of a homogeneous or inhomogeneous continuous structure that has a thickness less than the thickness of the continuous structure. For example, a layer can be located between any pair of horizontal planes between, or at, a top surface and a bottom surface of the continuous structure. A layer can extend horizontally, vertically, and/or along a tapered surface.
• a substrate can be a layer, can include one or more layers therein, and/or can have one or more layers thereupon, thereabove, and/or therebelow.
• a layer can include multiple layers.
• a semiconductor layer can include one or more doped or undoped semiconductor layers and may have the same or different materials.
• the term “substrate” refers to a material onto which subsequent material layers are added.
• the substrate itselfcan be patterned. Materials added on top of the substrate can be patterned or can remain unpatterned.
• the substrate can include a wide array of semiconductor materials, such as silicon, silicon carbide, gallium nitride, germanium, gallium arsenide, indium phosphide, etc.
• the substrate can be made from an electrically non-conductive material, such as a glass, a plastic, or a sapphire wafer. Further alternatively, the substrate can have semiconductor devices or circuits formed therein.
• micro LED, micro” p-n diode or micro refers to the descriptive size of certain devices or structures according to implementations of the invention.
• micro devices or structures are meant to refer to the scale of 0.1 to 100 ⁇ m.
• implementations of the present invention are not necessarily so limited, and that certain aspects of the implementations may be applicable to larger, and possibly smaller size scales.
• Implementations of the present invention describe LED structure or micro LED structure and a method for manufacturing the structure.
• an epitaxy layer is bonded to a receiving substrate.
• the receiving substrate for example, may be, but is not limited to, a display substrate including CMOS backplane or TFT glass substrate.
• the epitaxy layer is formed with an array of micro LEDs on the receiving substrate.
• the plurality of small functional mesas may peel off from the receiving substrate and cause failure of a display (dead pixel) during the manufacturing process.
• the present disclosure introduces a solution in which the functional epitaxy layer is partially patterned/etched and allows a thin continuous functional layer and a bonding layer to remain to avoid potential peeling off.
• the manufacturing method described in the present disclosure can further reduce physical damage of sidewalls of functional mesas, reduce damage of quantum well structure which is the light emitting region of the LED, and improve the optical and electrical properties of functional mesas.
• FIG. 1 illustrates a top view of an exemplary LED structure 100, according to some implementations of the present disclosure
• FIG. 2 illustrates a cross-section view of an exemplary LED structure 100 along line A-A’, according to some implementations of the present disclosure.
• LED structure 100 includes a first substrate 102 and a plurality of LED units 116 (e.g., LED units 116-1, 116-2, 116-3, and 116-4 as shown in FIG. 2) .
• LED units 116 are bonded on first substrate 102 through a bonding layer 104.
• first substrate 102 may include a semiconductor material, such as silicon, silicon carbide, gallium nitride, germanium, gallium arsenide, indium phosphide. In some implementations, first substrate 102 may be made from an electrically non-conductive material, such as a glass, a plastic or a sapphire wafer. In some implementations, first substrate 102 may have driving circuits formed therein, and first substrate 102 may be CMOS backplane or TFT glass substrate. The driving circuit provides the electronic signals to LED units 116 to control the luminance. In some implementations, the driving circuit may include an active matrix driving circuit, in which each individual LED unit 116 corresponds to an independent driver. In some implementations, the driving circuit may include a passive matrix driving circuit, in which the plurality of LED units 116 are aligned in an array and are connected to the data lines and the scan lines driven by the driving circuit.
• Bonding layer 104 is a layer of an adhesive material formed on first substrate 102 to bond first substrate 102 and LED units 116.
• bonding layer 104 may include a conductive material, such as metal or metal alloy.
• bonding layer 104 may include Au, Sn In Cu or Ti.
• bonding layer 104 may include a non-conductive material, such as polyimide (PI) , polydimethylsiloxane (PDMS) .
• bonding layer 104 may include a photoresist, such as SU-8 photoresist.
• bonding layer 104 may be hydrogen silsesquioxane (HSQ) or divinylsiloxane-bis-benzocyclobutene (DVS-BCB) . It is understood that the descriptions of the material of bonding layer 104 are merely illustrative and are not limiting, and those skilled in the art can change according to requirements, all of which are within the scope of the present application.
• HSQ hydrogen silsesquioxane
• DVD-BCB divinylsiloxane-bis-benzocyclobutene
• each LED unit 116 includes its portion of bonding layer 104, a first doping type semiconductor layer 106 and a second doping type semiconductor layer 108.
• First doping type semiconductor layer 106 is formed on bonding layer 104.
• first doping type semiconductor layer 106 and second doping type semiconductor layer 108 may include one or more layers based on II-VI materials, such as ZnSe or ZnO, or III-V nitride materials, such as GaN, AlN, InN, InGaN, GaP, AlInGaP, AlGaAs, and their alloys.
• first doping type semiconductor layer 106 may be a p-type semiconductor layer that extends across multiple LED units 116 (e.g., four LED units 116 as illustrated in FIG. 2) and forms a common anode of these LED units 116.
• first doping type semiconductor layer 106 of LED unit 116-2 extends to its adjacent LED units 116-1 and 116-3, and similarly, first doping type semiconductor layer 106 of LED unit 116-3 extends to its adjacent LED units 116-2 and 116-4.
• first doping type semiconductor layer 106 that extend across the LED units may be relatively thin.
• the thickness of first doping type semiconductor layer 106 may be between about 0.05 ⁇ m and about 1 ⁇ m.
• the thickness of first doping type semiconductor layer 106 may be between about 0.05 ⁇ m and about 0.7 ⁇ m. In some alternative implementations, the thickness of first doping type semiconductor layer 106 may be between about 0.05 ⁇ m and about 0.5 ⁇ m.
• first doping type semiconductor layer 106 may be p-type GaN. In some implementations, first doping type semiconductor layer 106 may be formed by doping magnesium (Mg) in GaN. In some implementations, first doping type semiconductor layer 106 may be p-type InGaN. In some implementations, first doping type semiconductor layer 106 may be p-type AlInGaP.
• Each of LED units 116 has an anode and a cathode connected to the driving circuit, e.g., one that is formed in substrate 102 (driving circuit not explicitly shown) . For example, each LED unit 116 has the anode connected to a constant voltage source and has the cathode connected to a source/drain electrode of the driving circuit. In other words, by forming the continuous first doping type semiconductor 106 across the individual LED units 116, the plurality of LED units 116 have a common anode formed by first doping type semiconductor layer 106 and bonding layer 104.
• second doping type semiconductor layer 108 may be a n-type semiconductor layer and form a cathode of each LED unit 116.
• second doping type semiconductor layer 108 may be n-type GaN.
• second doping type semiconductor layer 108 may be n-type InGaN.
• second doping type semiconductor layer 108 may be n-type AlInGaP.
• Second doping type semiconductor layers 108 of different LED units 116 are electrically isolated, thus each LED unit 116 has a cathode that can have a voltage level different from the other units.
• a plurality of individually functionable LED units 116 are formed with their first doping type semiconductor layers 106 horizontally extended across the adjacent LED units, and their second doping type semiconductor layers 108 electrically isolated between the adjacent LED units.
• Each LED unit 116 further includes a multiple quantum well (MQW) layer 110 formed between first doping type semiconductor layer 106 and second doping type semiconductor layer 108.
• MQW layer 110 is the active region of LED unit 116.
• the thickness including first doping type semiconductor layer 106, MQW layer 110 and second doping type semiconductor layer 108 may be between about 0.3 ⁇ m and about 5 ⁇ m. In some other implementations, the thickness including first doping type semiconductor layer 106, MQW layer 110 and second doping type semiconductor layer 108 may be between about 0.4 ⁇ m and about 4 ⁇ m. In some alternative implementations, the thickness including first doping type semiconductor layer 106, MQW layer 110 and second doping type semiconductor layer 108 may be between about 0.5 ⁇ m and about3 ⁇ m.
• a passivation layer 112 is formed on second doping type semiconductor layer 108 and a portion of first doping type semiconductor layer 106. Passivation layer 112 may be used for protecting and isolating LED units 116.
• passivation layer 112 may include SiO 2 , Al 2 O 3 , SiN or other suitable materials.
• passivation layer 112 may include polyimide, SU-8 photoresist, or other photo-patternable polymer.
• An electrode layer 114 is formed on a portion of passivation layer 112, and electrode layer 114 electrically connects second doping type semiconductor layer 108 through an opening on passivation layer 112.
• electrode layer 114 may be conductive materials, such as indium tin oxide (ITO) , Cr, Ti, Pt, Au, Al, Cu, Ge or Ni.
• FIG. 3 illustrates another cross-section view of the exemplary LED structure 100 along line B-B’, according to some implementations of the present disclosure.
• First substrate 102 has driving circuits formed therein for driving LED units 116.
• a contact 118 of the driving circuit is exposed between two LED units 116, and contact 118 is electrically connected with second doping type semiconductor layer 108 through electrode layer 114.
• the electrical connection of second doping type semiconductor layer 108 and contact 118 of the driving circuit is accomplished by electrode layer 114.
• second doping type semiconductor layer 108 forms the cathode of each LED unit 116, hence contact 118 provides a driving voltage of the cathode of each LED unit 116 from the driving circuit to second doping type semiconductor layer 108 through electrode layer 114.
• FIG. 4 illustrates another top view of LED structure 100, according to some implementations of the present disclosure.
• the layers beneath electrode layer 114 and passivation layer 112 are illustrated with dash lines for the purpose of explanation.
• LED structure 100 includes 16 LED units 116.
• Each LED unit 116 includes a p-n diode layer formed by first doping type semiconductor layer 106 and second doping type semiconductor layer 108 and multiple quantum well 110.
• Passivation layer 112 is formed on the p-n diode layer, and electrode layer 114 is formed on passivation layer 112.
• An opening 120 is formed on passivation layer 112 exposing second doping type semiconductor layer 108, and an opening 122 is formed on passivation layer 112 exposing contact 118.
• Electrode layer 114 is formed on a portion of passivation layer 112 covering opening 120 and opening 122, and therefore electrode layer 114 electrically connects with second doping type semiconductor layer 108 and contact 118.
• opening 120 is located at the center of each LED unit 116 and opening 122 is located at the interspace of adjacent LED units 116. It is understood that the locations and designs (such as shapes and sizes) of opening 120, opening 122 and electrode layer 114 may deviate from the examples shown in FIG. 4 based on the requirements and are not limited here.
• LED structure 100 includes 16 LED units 116, and each LED unit 116 is individually functionable.
• First doping type semiconductor layer 106 locates under second doping type semiconductor layer 108 and passivation layer 112, and first doping type semiconductor layer 106 is the common anode of these 16 LED units 116.
• a plurality of LED units are referred to as “individually functionable” when first doping type semiconductor layer 106 of these LED units (e.g., the 16 LED units 116) is electrically connected not only during the manufacturing process of forming LED structure 100 but also after the manufacturing process and each LED unit 116 can be individually driven by a different driving circuit.
• FIG. 5 illustrates a top view of another LED structure 500, according to some implementations of the present disclosure.
• the shape of second doping type semiconductor layer 108 in the top view in FIG. 5 is circular, which is different from the shape of second doping type semiconductor layer 108 in the top view of LED structure 100 shown in FIG. 4. It is understood that, in some implementations, the position and shape of second doping type semiconductor layer 108 in the top view may be changed according to various designs or applications, and the shape of second doping type semiconductor layer 108 or LED unit 116 in the top view is not limited here. In some implementations, the position and shape of opening 120, opening 122, electrode layer 114 or contact 118 in the top view may be changed according to various designs and applications as well, and is not limited here.
• FIGs. 6A-6H illustrate cross sections of the exemplary LED structure 100 during a manufacturing process, according to some implementations of the present disclosure
• FIG. 7 is a flowchart of an exemplary method 700 for manufacturing LED structure 100, according to some implementations of the present disclosure.
• a driving circuit is formed in first substrate 102 and the driving circuit includes contact 118.
• the driving circuit may include CMOS devices manufactured on a silicon wafer and some wafer-level packaging layers or fan-out structures are stacked on the CMOS devices to form contact 118.
• the driving circuit may include TFTs manufactured on a glass substrate and some wafer-level packaging layers or fan-out structures are stacked on the TFTs to form contact 118.
• a semiconductor layer is formed on a second substrate 124, and the semiconductor layer includes first doping type semiconductor layer 106, second doping type semiconductor layer 108 and MQW layer 110.
• first substrate 102 or second substrate 124 may include a semiconductor material, such as silicon, silicon carbide, gallium nitride, germanium, gallium arsenide, indium phosphide.
• first substrate 102 or second substrate 124 may be made from an electrically non-conductive material, such as a glass, a plastic or a sapphire wafer.
• first substrate 102 may have driving circuits formed therein, and first substrate 102 may include CMOS backplane or TFT glass substrate.
• first doping type semiconductor layer 106 and second doping type semiconductor layer 108 may include one or more layers based on II-VI materials, such as ZnSe or ZnO, or III-V nitride materials, such as GaN, AlN, InN, InGaN, GaP, AlInGaP, AlGaAs, and their alloys.
• first doping type semiconductor layer 106 may include a p-type semiconductor layer
• second doping type semiconductor layer 108 may include a n-type semiconductor layer.
• bonding layer 104 is formed on first substrate 102.
• bonding layer 104 may include a conductive material, such as metal or metal alloy.
• bonding layer 104 may include Au, Sn In Cu or Ti.
• bonding layer 104 may include a non-conductive material, such as polyimide (PI) , polydimethylsiloxane (PDMS) .
• bonding layer 104 may include a photoresist, such as SU-8 photoresist.
• bonding layer 104 may include hydrogen silsesquioxane (HSQ) or divinylsiloxane-bis-benzocyclobutene (DVS-BCB) .
• HSQ hydrogen silsesquioxane
• DVD-BCB divinylsiloxane-bis-benzocyclobutene
• a conductive layer 126 may be formed on first doping type semiconductor layer 106. In some implementations, conductive layer 126 may form a common electrode covering first doping type semiconductor layer 106. In some implementations, conductive layer 126 may form an ohmic contact on first doping type semiconductor layer 106. In some implementations, conductive layer 126 and bonding layer 104 may be collectively referred to one layer in later operations.
• second substrate 124 and the semiconductor layer including first doping type semiconductor layer 106, second doping type semiconductor layer 108 and MQW layer 110, are flipped over and bonded to first substrate 102through bonding layer 104 and conductive layer 126. Then, second substrate 124 may be removed from the semiconductor layer.
• FIG. 6C shows bonding layer 104 between first substrate 102 and first doping type semiconductor layer 106.
• bonding layer 104 may include one or multiple layers to bond first substrate 102 and first doping type semiconductor layer 106.
• bonding layer 104 may include a single conductive or non-conductive layer.
• bonding layer 104 may include an adhesive material and a conductive or non-conductive layer.
• bonding layer 104 and conductive layer 126 may be collectively referred to as one layer after operation 702. It is understood that the descriptions of the material of bonding layer 104 are merely illustrative and are not limiting, and those skilled in the art can change according to requirements, all of which are within the scope of the present application.
• a thinning operation may be performed on second doping type semiconductor layer 108 to remove a portion of second doping type semiconductor layer 108.
• the thinning operation may include a dry etching or a wet etching operation.
• the thinning operation may include a chemical-mechanical polishing (CMP) operation.
• the thickness including first doping type semiconductor layer 106, MQW layer 110 and second doping type semiconductor layer 108 may be between about 0.3 ⁇ m and about 5 ⁇ m. In some other implementations, the thickness including first doping type semiconductor layer 106, MQW layer 110 and second doping type semiconductor layer 108 may be between about 0.4 ⁇ m and about 4 ⁇ m. In some alternative implementations, the thickness including first doping type semiconductor layer 106, MQW layer 110 and second doping type semiconductor layer 108 may be between about 0.5 ⁇ m and about 3 ⁇ m.
• a first etching operation may be performed to remove a portion of second doping type semiconductor layer 108 and expose a portion of first doping type semiconductor layer 106.
• a portion of first doping type semiconductor layer 106 is exposed until a pre-defined thickness of first doping type semiconductor layer 106 remains on first substrate 102.
• the remained first doping type semiconductor layer 106 horizontally extends across a plurality of LED units 116 of LED structure 100 (such as the four LED units 116 shown in FIG. 6E) .
• the pre-defined thickness of first doping type semiconductor layer 106 may be between about 0.05 ⁇ m and about 1 ⁇ m.
• the pre-defined thickness of first doping type semiconductor layer 106 may be between about 0.05 ⁇ m and about 0.7 ⁇ m. In some alternative implementations, the pre-defined thickness of first doping type semiconductor layer 106 may be between about 0.05 ⁇ m and about 0.5 ⁇ m.
• second doping type semiconductor layer 108 and MQW layer 110 of each LED unit 116 may be electrically separated, and first doping type semiconductor layer 106 of adjacent LED units 116 (such as LED units 116-1, 116-2, 116-3 and 116-4) may be electrically connected.
• the first etching operation may be performed to remove a portion of second doping type semiconductor layer 108 and expose a portion of MQW layer 110.
• a portion of MQW layer 110 is exposed until a pre-defined thickness of first doping type semiconductor layer 106 and MQW layer 110 remains on first substrate 102.
• the remained first doping type semiconductor layer 106 and MQW layer 110 horizontally extends across a plurality of LED units 116 of LED structure 100 (such as the four LED units 116 shown in FIG. 6E) .
• the pre-defined thickness of first doping type semiconductor layer 106 and MQW layer 110 may be between about 0.05 ⁇ m and about 1 ⁇ m.
• the pre-defined thickness of first doping type semiconductor layer 106 and MQW layer 110 may be between about 0.05 ⁇ m and about 0.7 ⁇ m. In some alternative implementations, the pre-defined thickness of first doping type semiconductor layer 106 and MQW layer 110 may be between about 0.05 ⁇ m and about 0.5 ⁇ m.
• second doping type semiconductor layer 108 of each LED unit 116 may be electrically separated, and first doping type semiconductor layer 106 and MQW layer 110 of adjacent LED units 116 (such as LED units 116-1, 116-2, 116-3 and 116-4) may be electrically connected.
• a second etching operation may be performed to remove a portion of first doping type semiconductor layer 106 and expose contact 118.
• the second etching operation may be a dry etching or a wet etching operation.
• a hard mask e.g., a photoresist
• a hard mask may be formed on second doping type semiconductor layer 108 and a portion of first doping type semiconductor layer 106 by photolithography process. Then, the uncovered portion of first doping type semiconductor layer 106 is removed by dry etching plasma or wet etching solution to expose contact 118.
• passivation layer 112 is formed on second doping type semiconductor layer 108, exposed first doping type semiconductor layer 106 and exposed contact 118.
• passivation layer 112 may include SiO 2 , Al 2 O 3 , SiN or other suitable materials for isolation and protection.
• passivation layer 112 may include polyimide, SU-8 photoresist, or other photo-patternable polymer.
• opening 120 and opening 122 are formed, as shown in FIG. 6G. Opening 120 exposes a portion of second doping type semiconductor layer 108 and opening 122 exposes contact 118.
• operation 708 may be performed by a third etching operation to remove a portion of passivation layer 112 and form opening 120 and opening 122.
• provided passivation layer 112 is formed by a photo-sensitive material (e.g., polyimide, SU-8 photoresist, or other photo-patternable polymer)
• operation 708 may be performed by a photolithography operation to pattern passivation layer 112 and expose opening 120 and opening 122.
• electrode layer 114 is formed on passivation layer 112 covering opening 120 and opening 122. Therefore, electrode layer 114 electrically connects second doping type semiconductor layer 108 and contact 118, and forms an electrical path to connect the LED unit with the driving circuit in substrate 102.
• the driving circuit may control the voltage and current level of second doping type semiconductor layer 108 through contact 118 and electrode layer 114.
• electrode layer 114 may include conductive materials, such as indium tin oxide (ITO) , Cr, Ti, Pt, Au, Al, Cu, Ge or Ni.
• the present disclosure provides a LED structure and a method for manufacture the LED structure in which the functional epitaxy layer, such as first doping type semiconductor layer 106 and second doping type semiconductor layer 108, is partially patterned/etched to allow a thin continuous functional layer (such as first doping type semiconductor layer 106) to remain in order to avoid potential peeling off. Further, the present disclosure provides another option to remain MQW layer on first doping type semiconductor layer 106.
• the manufacturing method introduced in the present disclosure can further reduce physical damage of sidewalls of functional mesas (such as LED unit 116) , reduce damage of quantum well structure which is the light emitting region of the LED, and improve the optical and electrical properties of functional mesas.
• a LED structure includes a substrate and a plurality of LED units formed on the substrate.
• Each LED unit includes a bonding layer formed on the substrate, a first doping type semiconductor layer formed on the bonding layer, a second doping type semiconductor layer formed on the first doping type semiconductor layer, a passivation layer formed on the second doping type semiconductor layer and a portion of the first doping type semiconductor layer; and an electrode layer formed on a portion of the passivation layer and contacting the second doping type semiconductor layer.
• the plurality of LED units include a first LED unit and a second LED unit adjacent to the first LED unit.
• the first doping type semiconductor layer of the first LED unit horizontally extends to the first doping type semiconductor layer of the second LED unit adjacent to the first LED unit, and the first LED unit and the second LED unit are individually functionable LED units.
• each LED unit further includes a multiple quantum well (MQW) layer formed between the first doping type semiconductor layer and the second doping type semiconductor layer.
• MQW multiple quantum well
• the first doping type semiconductor layer is a p-type semiconductor layer and is a common anode of the first LED unit and the second LED unit.
• the second doping type semiconductor layer is a n-type semiconductor layer and is a cathode of the first LED unit and the second LED unit.
• the substrate includes a driving circuit to drive the plurality of LED units.
• the electrode layer of each LED unit is connected to the driving circuit through an opening on the first doping type semiconductor layer.
• a LED structure includes a substrate and a plurality of LED units formed on the substrate.
• Each LED unit includes a p-n diode layer formed on the substrate, a passivation layer formed on the p-n diode layer, and an electrode layer formed on the passivation layer and contacting the p-n diode layer.
• the plurality of LED units include a first LED unit and a second LED unit adjacent to the first LED unit.
• the first LED unit and the second LED unit have a common anode, and the first LED unit and the second LED unit are individually functionable LED units.
• the p-n diode layer includes a p-doped layer, a n-doped layer, and a multiple quantum well (MQW) layer formed between the p-doped layer and the n-doped layer.
• the p-doped layer is the common anode of the first LED unit and the second LED unit.
• the n-doped layer of the first LED unit and the second LED unit is electrically isolated.
• each LED unit further includes a bonding layer formed between the substrate and the p-n diode layer.
• the substrate includes a driving circuit to drive the plurality of LED units.
• the electrode layer of each LED unit is connected to the driving circuit through an opening on the p-n diode layer.
• a method for manufacturing a LED structure is disclosed.
• a semiconductor layer is formed on a first substrate.
• the semiconductor layer includes a first doping type semiconductor layer and a second doping type semiconductor layer.
• a first etching operation is performed to remove a portion of the second doping type semiconductor layer and expose a portion of the first doping type semiconductor layer.
• a passivation layer is formed on the second doping type semiconductor layer and the exposed first doping type semiconductor layer.
• a first opening is formed on the passivation layer.
• An electrode layer is formed on the passivation layer covering the first opening and contacting the second doping type semiconductor layer.
• performing the first etching operation further includes removing a portion of the second doping type semiconductor layer, and exposing a portion of the first doping type semiconductor layer until a pre-defined thickness of the first doping type semiconductor layer remains on the first substrate.
• the remained first doping type semiconductor layer horizontally extends across a plurality of LED units of the LED structure.
• forming the semiconductor layer on the first substrate further includes bonding the semiconductor layer onto the first substrate through a bonding layer. In some implementations, forming the semiconductor layer on the first substrate further includes forming a driving circuit in the first substrate, forming the semiconductor layer on a second substrate, bonding the semiconductor layer onto the first substrate through the bonding layer, and removing the second substrate.
• forming the first opening on the passivation layer further includes forming a second opening on the passivation layer to expose the contact of the driving circuit.
• forming the electrode layer on the passivation layer covering the first opening and contacting the second doping type semiconductor layer further includes forming the electrode layer on the passivation layer covering the first opening and the second opening to electrically connect the second doping type semiconductor layer and the contact of the driving circuit.

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• 2021
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