EP4247005A3 - Transducteur acoustique micromécanique - Google Patents
Transducteur acoustique micromécanique Download PDFInfo
- Publication number
- EP4247005A3 EP4247005A3 EP23189032.8A EP23189032A EP4247005A3 EP 4247005 A3 EP4247005 A3 EP 4247005A3 EP 23189032 A EP23189032 A EP 23189032A EP 4247005 A3 EP4247005 A3 EP 4247005A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- bending transducer
- free end
- transducer
- acoustic transducer
- bending
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
- H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
- H04R7/04—Plane diaphragms
- H04R7/06—Plane diaphragms comprising a plurality of sections or layers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
- H04R7/04—Plane diaphragms
- H04R7/06—Plane diaphragms comprising a plurality of sections or layers
- H04R7/10—Plane diaphragms comprising a plurality of sections or layers comprising superposed layers in contact
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/26—Damping by means acting directly on free portion of diaphragm or cone
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/02—Loudspeakers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R2440/00—Bending wave transducers covered by H04R, not provided for in its groups
- H04R2440/01—Acoustic transducers using travelling bending waves to generate or detect sound
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
- H04R2499/10—General applications
- H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
- Micromachines (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Circuit For Audible Band Transducer (AREA)
- Pressure Sensors (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102017208911.3A DE102017208911A1 (de) | 2017-05-26 | 2017-05-26 | Mikromechanischer Schallwandler |
| EP18729366.7A EP3632135B1 (fr) | 2017-05-26 | 2018-05-28 | Transducteur acoustique micromécanique |
| PCT/EP2018/063961 WO2018215669A2 (fr) | 2017-05-26 | 2018-05-28 | Transducteur acoustique micromécanique |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP18729366.7A Division EP3632135B1 (fr) | 2017-05-26 | 2018-05-28 | Transducteur acoustique micromécanique |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP4247005A2 EP4247005A2 (fr) | 2023-09-20 |
| EP4247005A3 true EP4247005A3 (fr) | 2023-12-06 |
Family
ID=62530200
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP23189032.8A Pending EP4247005A3 (fr) | 2017-05-26 | 2018-05-28 | Transducteur acoustique micromécanique |
| EP18729366.7A Active EP3632135B1 (fr) | 2017-05-26 | 2018-05-28 | Transducteur acoustique micromécanique |
| EP23189034.4A Active EP4247006B1 (fr) | 2017-05-26 | 2018-05-28 | Transducteur acoustique micromécanique |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP18729366.7A Active EP3632135B1 (fr) | 2017-05-26 | 2018-05-28 | Transducteur acoustique micromécanique |
| EP23189034.4A Active EP4247006B1 (fr) | 2017-05-26 | 2018-05-28 | Transducteur acoustique micromécanique |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11350217B2 (fr) |
| EP (3) | EP4247005A3 (fr) |
| JP (2) | JP7303121B2 (fr) |
| CN (2) | CN111034223A (fr) |
| DE (1) | DE102017208911A1 (fr) |
| WO (1) | WO2018215669A2 (fr) |
Families Citing this family (74)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102019201744B4 (de) | 2018-12-04 | 2020-06-18 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Mems-schallwandler |
| EP3675522A1 (fr) * | 2018-12-28 | 2020-07-01 | Sonion Nederland B.V. | Haut-parleur miniature essentiellement sans fuite acoustique |
| JP2020136800A (ja) * | 2019-02-15 | 2020-08-31 | 新日本無線株式会社 | 圧電素子 |
| DE102019116080A1 (de) * | 2019-06-13 | 2020-12-17 | USound GmbH | MEMS-Schallwandler mit einer aus Polymer ausgebildeten Membran |
| JP7522541B2 (ja) * | 2019-07-12 | 2024-07-25 | 日清紡マイクロデバイス株式会社 | 圧電素子 |
| US11042346B2 (en) * | 2019-07-30 | 2021-06-22 | International Business Machines Corporation | Artificial cochlea |
| DE102019218769A1 (de) * | 2019-12-03 | 2020-11-19 | Robert Bosch Gmbh | Mikromechanisches Bauteil für eine Aktor- und/oder Sensorvorrichtung |
| JP7433870B2 (ja) * | 2019-12-04 | 2024-02-20 | エルジー ディスプレイ カンパニー リミテッド | 表示装置及び情報処理装置 |
| EP4082961A4 (fr) * | 2019-12-25 | 2023-10-25 | Denso Corporation | Élément piézoélectrique, dispositif piézoélectrique et procédé de fabrication d'élément piézoélectrique |
| US11202138B2 (en) * | 2020-03-05 | 2021-12-14 | Facebook Technologies, Llc | Miniature high performance MEMS piezoelectric transducer for in-ear applications |
| CN111328005B (zh) * | 2020-03-10 | 2021-09-10 | 瑞声声学科技(深圳)有限公司 | 压电式mems麦克风 |
| DE112021001186T5 (de) * | 2020-04-30 | 2022-12-15 | Murata Manufacturing Co., Ltd. | Piezoelektrisches bauelement |
| WO2021242939A2 (fr) * | 2020-05-26 | 2021-12-02 | Tectonic Audio Labs, Inc. | Élément rayonnant à mode harmonisé de diaphragme à courbure variable |
| US11399228B2 (en) * | 2020-07-11 | 2022-07-26 | xMEMS Labs, Inc. | Acoustic transducer, wearable sound device and manufacturing method of acoustic transducer |
| US12028673B2 (en) | 2020-07-11 | 2024-07-02 | xMEMS Labs, Inc. | Driving circuit and wearable sound device thereof |
| US12022253B2 (en) * | 2020-07-11 | 2024-06-25 | xMEMS Labs, Inc. | Venting device |
| US11972749B2 (en) * | 2020-07-11 | 2024-04-30 | xMEMS Labs, Inc. | Wearable sound device |
| US12151934B2 (en) * | 2020-07-11 | 2024-11-26 | xMEMS Labs, Inc. | Device and method of equalizing low frequency roll off for wearable sound device |
| US12157663B2 (en) | 2020-07-11 | 2024-12-03 | xMEMS Labs, Inc. | Venting device, manufacturing method of venting device, venting method and device |
| US11323797B2 (en) * | 2020-07-11 | 2022-05-03 | xMEMS Labs, Inc. | Acoustic transducer, wearable sound device and manufacturing method of acoustic transducer |
| US11884535B2 (en) | 2020-07-11 | 2024-01-30 | xMEMS Labs, Inc. | Device, package structure and manufacturing method of device |
| US12088988B2 (en) * | 2020-07-11 | 2024-09-10 | xMEMS Labs, Inc. | Venting device and venting method thereof |
| CN213342677U (zh) * | 2020-09-27 | 2021-06-01 | 瑞声科技(南京)有限公司 | 一种压电式麦克风 |
| IT202000024469A1 (it) | 2020-10-16 | 2022-04-16 | St Microelectronics Srl | Trasduttore ultrasonico microlavorato piezoelettrico |
| IT202000024466A1 (it) | 2020-10-16 | 2022-04-16 | St Microelectronics Srl | Trasduttore ultrasonico microlavorato piezoelettrico con oscillazioni libere ridotte |
| US12261567B2 (en) | 2021-01-14 | 2025-03-25 | xMEMS Labs, Inc. | Demodulation signal generator for air pulse generator |
| US11943585B2 (en) * | 2021-01-14 | 2024-03-26 | xMEMS Labs, Inc. | Air-pulse generating device with common mode and differential mode movement |
| US12262177B2 (en) | 2021-01-14 | 2025-03-25 | xMEMS Labs, Inc. | Air-pulse generating device producing asymmetric air pulses |
| US12075213B2 (en) * | 2021-01-14 | 2024-08-27 | xMEMS Labs, Inc. | Air-pulse generating device |
| US12356141B2 (en) | 2021-01-14 | 2025-07-08 | xMEMS Labs, Inc. | Air-pulse generating device, wearable sound device, bladeless fan, and airflow producing method |
| US12309548B2 (en) | 2021-01-14 | 2025-05-20 | xMEMS Labs, Inc. | Air-pulse generating device with efficient propagation |
| JP7615739B2 (ja) * | 2021-02-17 | 2025-01-17 | 株式会社リコー | 音響変換器 |
| DE102021201784A1 (de) | 2021-02-25 | 2022-08-25 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | MEMS-Schallwandler-Array |
| JP7452476B2 (ja) * | 2021-03-10 | 2024-03-19 | 株式会社デンソー | 圧電素子、圧電装置、および圧電素子の製造方法 |
| DE102021202573B3 (de) | 2021-03-16 | 2022-07-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Mems-schallwandler mit ausnehmungen und auskragungen |
| DE102021203360A1 (de) | 2021-04-01 | 2022-10-06 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Mems-schallwandler |
| US20240022859A1 (en) * | 2021-05-11 | 2024-01-18 | xMEMS Labs, Inc. | Package structure, apparatus and forming methods thereof |
| US11711653B2 (en) | 2021-05-11 | 2023-07-25 | xMEMS Labs, Inc. | Sound producing cell and manufacturing method thereof |
| US11697582B2 (en) * | 2021-06-14 | 2023-07-11 | Soundskrit Inc. | MEMS transducer |
| US12568337B2 (en) | 2021-06-17 | 2026-03-03 | Skyworks Solutions, Inc. | Acoustic devices with residual stress compensation |
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| WO2023010247A1 (fr) * | 2021-08-02 | 2023-02-09 | 天津大学 | Haut-parleur mems piézoélectrique, son procédé de conception et dispositif électronique |
| CN115914959B (zh) * | 2021-09-30 | 2025-11-25 | 上海新微技术研发中心有限公司 | 声学压电薄膜器件结构 |
| DE102021130035A1 (de) * | 2021-11-17 | 2023-05-17 | USound GmbH | MEMS-Schallwandler mit einer gekrümmten Kontur eines Kragarmelements |
| TWI803124B (zh) | 2021-12-29 | 2023-05-21 | 財團法人工業技術研究院 | 具多重振動部的微機電裝置 |
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| CN114513729B (zh) * | 2022-01-07 | 2023-07-07 | 华为技术有限公司 | 电子设备及声学换能器 |
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| TWI866097B (zh) * | 2022-03-17 | 2024-12-11 | 美商知微電子有限公司 | 通氣裝置 |
| DE102022203173B4 (de) | 2022-03-31 | 2024-11-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | MEMS-Schallwandler |
| IT202200007043A1 (it) * | 2022-04-08 | 2023-10-08 | St Microelectronics Srl | Trasduttore elettroacustico microelettromeccanico a membrana |
| EP4258691B1 (fr) * | 2022-04-08 | 2026-01-21 | STMicroelectronics S.r.l. | Transducteur électroacoustique microélectromécanique à membrane |
| EP4283610B1 (fr) * | 2022-05-28 | 2025-08-27 | xMEMS Labs, Inc. | Dispositif de génération d'impulsions d'air à propagation efficace |
| TWI880221B (zh) * | 2022-05-28 | 2025-04-11 | 美商知微電子有限公司 | 產生不對稱氣脈衝的氣脈衝產生裝置 |
| TWI878900B (zh) * | 2022-05-28 | 2025-04-01 | 美商知微電子有限公司 | 氣脈衝產生裝置 |
| TWI880224B (zh) * | 2022-05-28 | 2025-04-11 | 美商知微電子有限公司 | 具有共模及差模運動的氣脈衝產生裝置 |
| DE102022210125A1 (de) * | 2022-09-26 | 2024-03-28 | Robert Bosch Gesellschaft mit beschränkter Haftung | Mikromechanische Schallwandlervorrichtung und entsprechendes Schallwandlungsverfahren |
| KR102942649B1 (ko) * | 2022-10-19 | 2026-03-20 | 엑스멤스 랩스 인코포레이티드 | 패키지 구조체, 장치 및 그 형성 방법 |
| TWI869146B (zh) * | 2022-12-29 | 2025-01-01 | 美商知微電子有限公司 | 用於氣脈衝產生器的解調訊號產生器 |
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| JP7693996B2 (ja) * | 2023-02-21 | 2025-06-18 | エクスメムス ラブズ,インコーポレイテッド | ベント装置及びそのベント方法 |
| JP7669619B2 (ja) * | 2023-02-21 | 2025-04-30 | エクスメムス ラブズ,インコーポレイテッド | ウェアラブルサウンドデバイスのための低周波数ロールオフをイコライジングするデバイス及び方法 |
| DE102023203237B4 (de) * | 2023-04-06 | 2024-12-05 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Mems-schallwandler |
| DE102023203467A1 (de) * | 2023-04-17 | 2024-10-17 | Robert Bosch Gesellschaft mit beschränkter Haftung | Mikroelektromechanische Aktuatorstruktur, Bauelement |
| DE102023208731A1 (de) * | 2023-09-08 | 2025-03-13 | Robert Bosch Gesellschaft mit beschränkter Haftung | Verfahren zum Betrieb einer mikroelektromechanischen Vorrichtung, mikroelektromechanische Vorrichtung, mikroelektromechanischer Lautsprecher, mikroelektromechanische Fluidpumpeinrichtung und mikroelektromechanisches Kombinationsbauelement |
| DE102023133447A1 (de) * | 2023-11-29 | 2025-06-05 | USound GmbH | MEMS-Wandler mit einer Trägerschicht und zumindest zwei Piezoschichten |
| CN117729500B (zh) * | 2024-02-08 | 2024-04-30 | 成都纤声科技有限公司 | 一种声学压电结构、声学传感器和电子设备 |
| WO2025173296A1 (fr) * | 2024-02-13 | 2025-08-21 | 株式会社村田製作所 | Transducteur ultrasonore |
| DE102024207852A1 (de) | 2024-08-19 | 2026-02-19 | Robert Bosch Gesellschaft mit beschränkter Haftung | MEMS-Bauelement zur Fluidförderung mittels Ultraschall |
| EP4718875A1 (fr) * | 2024-09-30 | 2026-04-01 | STMicroelectronics International N.V. | Transducteur électroacoustique avec connexions électriques sur une membrane |
| CN119867822A (zh) * | 2024-12-26 | 2025-04-25 | 北京大学 | 基于钡钙锆钛材料的内窥镜超声换能器探头及其制备方法 |
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| EP2362686A2 (fr) * | 2010-02-26 | 2011-08-31 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung | Transducteur acoustique pour l'insertion dans une oreille |
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| CN104602170B (zh) | 2008-06-30 | 2019-08-13 | 密歇根大学董事会 | 压电mems麦克风 |
| KR101562339B1 (ko) | 2008-09-25 | 2015-10-22 | 삼성전자 주식회사 | 압전형 마이크로 스피커 및 그 제조 방법 |
| DK2254353T3 (da) | 2009-05-19 | 2017-10-23 | Sivantos Pte Ltd | Høreindretning med en lydomformer og fremgangsmåde til fremstilling af en lydomformer |
| KR101561663B1 (ko) | 2009-08-31 | 2015-10-21 | 삼성전자주식회사 | 피스톤 다이어프램을 가진 압전형 마이크로 스피커 및 그 제조 방법 |
| FR2955443B1 (fr) | 2010-01-19 | 2012-03-23 | Univ Maine | Structure de haut-parleur electrodynamique a technologie mems |
| CN101841756A (zh) | 2010-03-29 | 2010-09-22 | 瑞声声学科技(深圳)有限公司 | 振膜及应用该振膜的硅电容麦克风 |
| EP2669648A4 (fr) * | 2011-01-28 | 2017-03-01 | The University of Tokyo | Capteur de pression différentielle |
| CN103460721B (zh) | 2011-03-31 | 2017-05-24 | 韦斯伯技术公司 | 具有间隙控制几何形状的声换能器以及声换能器制造方法 |
| FR2990320B1 (fr) | 2012-05-07 | 2014-06-06 | Commissariat Energie Atomique | Haut-parleur digital a performance amelioree |
| DE102012107457B4 (de) * | 2012-08-14 | 2017-05-24 | Tdk Corporation | MEMS-Bauelement mit Membran und Verfahren zur Herstellung |
| JP6021110B2 (ja) | 2012-12-28 | 2016-11-02 | 国立大学法人 東京大学 | 感圧型センサ |
| US9092585B2 (en) | 2013-01-22 | 2015-07-28 | The Procter & Gamble Company | Computer based models for absorbent articles |
| US9212045B1 (en) | 2014-07-31 | 2015-12-15 | Infineon Technologies Ag | Micro mechanical structure and method for fabricating the same |
| KR101725728B1 (ko) * | 2016-05-30 | 2017-04-13 | 김중배 | 모션 피드백 기능을 갖는 차동 스피커 장치 |
-
2017
- 2017-05-26 DE DE102017208911.3A patent/DE102017208911A1/de active Pending
-
2018
- 2018-05-28 EP EP23189032.8A patent/EP4247005A3/fr active Pending
- 2018-05-28 CN CN201880049684.0A patent/CN111034223A/zh active Pending
- 2018-05-28 EP EP18729366.7A patent/EP3632135B1/fr active Active
- 2018-05-28 WO PCT/EP2018/063961 patent/WO2018215669A2/fr not_active Ceased
- 2018-05-28 JP JP2019565478A patent/JP7303121B2/ja active Active
- 2018-05-28 CN CN202310360853.5A patent/CN116668926A/zh active Pending
- 2018-05-28 EP EP23189034.4A patent/EP4247006B1/fr active Active
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2019
- 2019-11-22 US US16/693,016 patent/US11350217B2/en active Active
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2022
- 2022-11-28 JP JP2022189513A patent/JP2023029908A/ja active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020018334A1 (en) * | 1999-12-15 | 2002-02-14 | Hill Edward A. | MEMS device members having portions that contact a substrate and associated methods of operating |
| DE102006005048A1 (de) * | 2005-03-01 | 2006-09-07 | Denso Corp., Kariya | Ultraschallsensor mit Sendeeinrichtung und Empfangseinrichtung für Ultraschallwellen |
| EP2362686A2 (fr) * | 2010-02-26 | 2011-08-31 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung | Transducteur acoustique pour l'insertion dans une oreille |
| DE102015210919A1 (de) * | 2015-06-15 | 2016-12-15 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | MEMS-Wandler zum Interagieren mit einem Volumenstrom eines Fluids und Verfahren zum Herstellen desselben |
| DE102015213771A1 (de) * | 2015-07-22 | 2017-01-26 | Robert Bosch Gmbh | MEMS-Bauelement mit schalldruckempfindlichem Membranelement |
Also Published As
| Publication number | Publication date |
|---|---|
| EP4247006A3 (fr) | 2023-12-27 |
| EP3632135B1 (fr) | 2023-08-02 |
| EP4247005A2 (fr) | 2023-09-20 |
| EP4247006A2 (fr) | 2023-09-20 |
| JP2023029908A (ja) | 2023-03-07 |
| US20200100033A1 (en) | 2020-03-26 |
| EP3632135A2 (fr) | 2020-04-08 |
| JP2020522178A (ja) | 2020-07-27 |
| US11350217B2 (en) | 2022-05-31 |
| WO2018215669A3 (fr) | 2019-01-24 |
| CN111034223A (zh) | 2020-04-17 |
| DE102017208911A1 (de) | 2018-11-29 |
| WO2018215669A2 (fr) | 2018-11-29 |
| EP4247006B1 (fr) | 2026-04-01 |
| JP7303121B2 (ja) | 2023-07-04 |
| CN116668926A (zh) | 2023-08-29 |
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