EP4342268A1 - Enrobage étanche aux fluides de cartes de circuits imprimés électroniques avec mise en contact extérieure - Google Patents

Enrobage étanche aux fluides de cartes de circuits imprimés électroniques avec mise en contact extérieure

Info

Publication number
EP4342268A1
EP4342268A1 EP22729090.5A EP22729090A EP4342268A1 EP 4342268 A1 EP4342268 A1 EP 4342268A1 EP 22729090 A EP22729090 A EP 22729090A EP 4342268 A1 EP4342268 A1 EP 4342268A1
Authority
EP
European Patent Office
Prior art keywords
circuit board
conductor track
printed circuit
section
protective layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP22729090.5A
Other languages
German (de)
English (en)
Inventor
Grégory Schaffner
Arthur RÖNISCH
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Duotec GmbH
Original Assignee
Duotec GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Duotec GmbH filed Critical Duotec GmbH
Publication of EP4342268A1 publication Critical patent/EP4342268A1/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/038—Textiles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor

Definitions

  • the invention relates to a printed circuit board arrangement according to the preamble of claim 1 and a method for producing the printed circuit board arrangement.
  • Plastic protective layer sealed enclosed The background to such printed circuit board arrangements is that they are intended to provide electronic components whose electronic components or at least one electronic component are sealed from the environment, so that short circuits between the electronic components can be avoided if, for example, the respective electronic component with its electronic components is immersed in water .
  • sealed electronic components are used in vehicle construction or in medical technology.
  • the use of such sealed electronic components has the advantage, for example, that maintenance and/or cleaning of a device in which the electronic components are installed is simplified and For example, the manufacture of easy-to-maintain and/or easy-to-clean devices is simplified by using these electronic components.
  • the object of the present invention is to provide a printed circuit board arrangement with a printed circuit board on which electronic components are arranged which are sealed from the environment, with which at least one of the above-mentioned disadvantages or one of the above-mentioned problems of conventional printed circuit board arrangements can be at least partially eliminated.
  • the invention proposes a printed circuit board arrangement with the features according to claim 1 .
  • the printed circuit board arrangement has a printed circuit board which extends horizontally with its board surface.
  • the printed circuit board has a top and a bottom, with the top facing vertically up and the bottom facing vertically down. Top and bottom are the respective sides of the plate surface.
  • the printed circuit board which is designed like a plate, has board narrow sides, in addition to the top and bottom, like any conventional board, which connect the top and bottom and run along the vertical.
  • the printed circuit board has a flat component section on which at least one electronic component, in particular several electronic components, for example logic modules, resistors, transistors, capacitors, etc., are arranged.
  • the component section is in one
  • the plastic protective layer is enclosed in a sealed manner, ie the component section is sealed off from the environment around the printed circuit board arrangement and is therefore protected from the environment by the plastic protective layer.
  • the component section is preferably enclosed in the plastic protective layer in a sealed manner in such a way that the plastic protective layer can be in particular a duration of 60 minutes, prevents water from reaching the component section.
  • the component section is a flat section of the board surface of the printed circuit board, ie a flat section on the top and/or underside of the printed circuit board. Because the component section is enclosed in a sealed manner in the plastic protective layer, the electronic components arranged on the component section are also in the
  • the plastic protective layer thus encloses the flat component section and the electronic components arranged on it in a sealed manner. Generally preferably, the sealing meets the requirements of IP68.
  • the top and bottom are the two board surface sides of the printed circuit board that face away from each other vertically. They are thus defined relative to one another, but not with reference to a specific position of the printed circuit board in space.
  • the component section extends exclusively on the upper side of the printed circuit board; in a further embodiment, the component section extends on the upper and lower side.
  • the component section can be a coherent planar component section or have several separate planar component subsections, in which case each of the component subsections is sealed and enclosed in the plastic protective layer, in which case the plastic protective layer can be continuous or several
  • Plastic protective layer sub-sections may have, which are each associated with at least one of the component sub-sections and enclose them sealingly.
  • a top demarcation trace is located on top of the circuit board.
  • the demarcation track is made of a metal or a metal alloy, for example copper or a copper alloy.
  • the delimiting conductor track is produced on the printed circuit board using a conventional manufacturing process.
  • the delineation trace has a trace length and a trace width, thereby defining the horizontal dimensions of the trace.
  • the trace runs over its trace length with its trace width at the top and divides the top into two top regions that are completely and uninterruptedly separated from one another.
  • the trace width can vary or be constant along the trace length.
  • the delimitation conductor track on the upper side runs with its conductor track length on the upper side in such a way that it divides the upper side into two upper-side regions which are defined by it and are uninterruptedly separated from one another by it.
  • the conductor track thus runs over its conductor track length either in an uninterruptedly closed manner around a first upper side area - with the provision of several component subsections on the upper side, the delimiting conductor track has several conductor track sections, which are each assigned to one of the component subsections and continuously run around them - and separates this first upper side area thus from the remaining area of the top, or the demarcation trace runs uninterrupted between two ends of the top of the printed circuit board, so that the demarcation trace together with the course of the extension end of the top between the two said ends of the top defines the first top-side region which is defined by the demarcation trace is demarcated from the rest of the top area.
  • the delimiting conductor track also has a conductor track section that is assigned to a component subsection, the conductor track section running between two ends of the top side of the printed circuit board and, together with the extension end of the top side running between the two ends, separating the component subsection from the rest of the top side.
  • a first of the upper side regions, into which the delimiting conductor track divides the upper side is formed by the component section, and a second of these upper side regions is formed by a flat contact section of the printed circuit board.
  • the contact section is arranged at least in sections, in particular in sections, outside of the plastic protective layer.
  • the first upper side region is directly adjacent to the demarcation conductor track and is thus arranged directly next to the demarcation conductor track, whereas the demarcation conductor track is arranged on the second upper side region.
  • the delimitation conductor track on the upper side is arranged uninterrupted over its conductor track length, at least with part of its conductor track width, within the plastic protective layer and is connected to it in a sealed manner.
  • the top-side delimiting conductor track is preferably arranged with at least that part of its conductor track width that is uninterrupted over its conductor track length within the plastic protective layer and is connected to it in a sealed manner that faces the first top side area, in particular directly adjoins the first top side area.
  • An adhesion promoter is particularly preferably applied to the top-side delimiting conductor along its length of the conductor, which ensures a sealing connection between the plastic protective layer and the delimiting conductor.
  • the adhesion promoter is preferred over the Conductor track length of the conductor track applied continuously in that part of the conductor track width of the delimitation conductor track, which is arranged inside the plastic protective layer.
  • the delimitation trace extends uninterrupted with its trace length, starting from a first end, to a second end.
  • first and second ends of the demarcation trace are directly adjacent to each other, so that the demarcation trace forms a closed ring, or the first and second end of the demarcation trace are each at an edge of the printed circuit board, which delimits the top side of the printed circuit board and at which the top side is divided into a Board narrow side of the circuit board passes.
  • the adhesion promoter is preferably applied continuously, starting from the first to the second end of the delimiting conductor track.
  • An adhesive for example a polymer-based adhesive, is provided as an adhesion promoter.
  • At least two spaced-apart contacts are arranged on the contact section outside the plastic protective layer, from each of which an electrical line leads to the electronic components and electrically conductively connects the respective contact to the electronic components.
  • the electronic components can thus be contacted via the contact sections from outside the volume enclosed by the plastic protective layer, in which the electronic components are located.
  • Different potentials can be applied to the two contacts in order, for example, to supply at least one of the electronic components with electrical energy and/or to supply at least one of the electronic components with a data signal and/or to read a data signal from it.
  • the two contacts thus represent each represents a connection option for an electronic connection of at least one of the electronic components.
  • the electrical line can be formed by a conductor track, for example.
  • at least one of the contacts can be defined by a
  • Surface section of the contact section can be formed, to which a connection line can be connected, with an electrical line designed as a conductor track leading from this surface section of the contact section into the volume closed off by the plastic protective layer.
  • a conductor track can, for example, run from the surface section to an intermediate layer of the circuit board and in this intermediate layer of the circuit board, i. H. spaced from the vertical upper side and vertical lower side, extend into the horizontal extent of the component section and lead from there to the upper side, on which it, enclosed by the plastic protective layer, rests in an electrically conductive manner on at least one electronic component arranged in the component section.
  • At least one of the contacts is therefore preferably at a distance from the top-side delimiting conductor track so that it is not electrically conductively connected to it, with the electrical line leading from this contact to the at least one electronic component preferably being formed by a connecting conductor track which is at least partially within the Printed circuit board and thus runs vertically spaced from the top and bottom of the circuit board.
  • the printed circuit board is preferably designed as a multilayer printed circuit board, with the connecting conductor running at least over a horizontal section, starting from the horizontal position of the contact to the horizontal area of the component section in an intermediate layer of the multilayer printed circuit board.
  • At least one is generally preferred, in particular precisely one of the contacts is formed at least in sections by the top-side delimitation conductor track.
  • the delimiting conductor track is used to form one of the contacts at least in sections, the delimiting conductor track itself can ensure electrical contacting of the contact with the at least one electronic component provided in the component section.
  • the contact can be formed entirely by the top-side delimiting conductor track or by an electrically conductive surface section of the contact section, which is directly electrically conductively connected to the delimiting conductor track.
  • three or more contacts spaced apart from one another can also be provided on the contact section outside the plastic protective layer, via which a respective different connection of electronic components arranged in the component section can be contacted.
  • the various contacts are therefore not directly connected to one another in an electrically conductive manner, but at most via electronic components arranged in the component section.
  • the provision of more than two contacts can further improve the variability or applicability of the printed circuit board arrangement, since more complex communication or supply can be achieved between external connection lines and the at least one electronic component.
  • At least one of the contacts is designed as a recess, in particular for receiving a conductive thread.
  • the recess is provided in the printed circuit board.
  • the cutout can, for example, be a hole-like lead-through in the circuit board which is therefore completely surrounded by the circuit board be, which extends vertically through the circuit board.
  • the cutout can, for example, also be a cutout starting from an edge region of the printed circuit board. Forming the contact as a recess in the printed circuit board makes it particularly possible for the contact to be able to be contacted via a conductive yarn that is accommodated in the recess.
  • the cutout is particularly preferably designed to enable the contact to be contacted by a conductive thread, which at the same time serves to fasten the printed circuit board arrangement to a piece of clothing.
  • the thread can preferably be arranged in the recess by means of an embroidery process, so that it is accommodated in the recess and can serve to fasten the circuit board arrangement to a piece of clothing.
  • the cutout preferably has a diameter of at least 0.5 mm, in particular from 0.5 mm to 5 mm, in particular from 0.5 mm to 2 mm, in particular from 1 mm to 2 mm.
  • the recess preferably runs vertically through the printed circuit board and is completely delimited by a printed circuit board area over its extent running horizontally within the printed circuit board.
  • the geometry of the cutout is thus defined by the printed circuit board area that delimits it.
  • the cutout can be open towards the edge of the printed circuit board, for example, or can be designed as a hole-like passage.
  • the printed circuit board area delimiting the cutout is preferably coated to prevent water arranged in the cutout from penetrating into the printed circuit board via the printed circuit board area.
  • the coating can be formed, for example, by an electrically conductive coating, which brings with it the particular advantage that the coating of the printed circuit board area prevents water from penetrating into the printed circuit board at the boundary of the cutout can as well as promoting electrical contactability with a conductive thread that runs vertically through the cutout and rests against the printed circuit board area delimiting the cutout, with the contact of the conductive thread with the printed circuit board area coated with an electrically conductive material directly creating an electrical connection between the conductive thread acting as a lead wire and the contact is achieved.
  • the coating can also be formed by an insulating layer, with the contact forming an electrically conductive surface section of the printed circuit board on the top and/or bottom of the cutout.
  • the cutout is particularly preferably designed as a hollow-cylindrical lead-through in the circuit board, the hollow-cylindrical wall of which, continuous from the top to the underside of the circuit board, is continuously coated, for example with an electrically conductive or an insulating coating.
  • the top-side delimitation conductor track encloses the first top-side region in a closed, annular manner.
  • a delimiting conductor track on the underside which runs over its conductor path length with its conductor path width on the underside and over its conductor path length divides the underside into two underside areas that are completely and uninterruptedly separated from one another .
  • a first of these underside areas is formed by the component section.
  • a second of these underside areas is formed by the contact portion of the printed circuit board.
  • the underside delineation trace is uninterrupted along its trace length with at least one Part of their trace width arranged within the plastic layer and connected to this sealing.
  • An adhesion promoter is particularly preferably applied to the underside delimiting conductor track over its conductor track length, which ensures a sealing connection between the plastic protective layer and the underside delimiting conductor track.
  • the delimiting conductor track on the underside preferably encloses the first underside region in a closed manner.
  • the component section thus has the first upper side area and the first underside area, with at least one electronic component preferably being arranged in the first upper side area under the first underside area.
  • First top area and first bottom area can extend over the same horizontal area. The same can be said for the second
  • Top side area and second bottom side area apply.
  • Separating the component sub-section from the contact section can be applied to corresponding embodiments with correspondingly designed delimiting conductor tracks on the underside.
  • the component section can extend over the top and bottom of the printed circuit board and thus have a larger area, so that electronic components can be arranged particularly variably on the component section.
  • the demarcation traces at the top and bottom ensure in each case a watertight sealing connection of the plastic protective layer and thus a watertight volume closed off by the plastic protective layer, in which electronic components can be arranged protected from water.
  • a first of the contacts is at least partially formed by the top-side demarcation trace and a second of the contacts is at least partially formed by the bottom-side demarcation trace.
  • the formation of the contact through the lower-side delimitation conductor track can be implemented in corresponding embodiments as in various embodiments with regard to the formation of a contact through the upper-side delimitation conductor track.
  • the top demarcation trace and the bottom one extend
  • Delimitation traces each with their trace lengths from a first end to a second end, the first ends of the top and bottom delineation traces being connected to one another by a first board narrow side section of the circuit board and the second ends of the top and bottom delineation circuit traces being connected to one another by a second board narrow side section of the circuit board are connected to each other.
  • Delimitation conductor tracks thus open with their conductor track ends in each case on a board narrow side of the circuit board and thus on an absolute horizontal extension end of the top or bottom.
  • the plastic protective layer is particularly preferably connected to the first and second board narrow side sections in a sealing manner, forming a sealing ring that runs around the printed circuit board and delimits a volume in the plastic protective layer in which the first upper side area and the first lower side area are enclosed in a sealed manner.
  • Board narrow side sections of the printed circuit board are sections of the respective board narrow sides that run across the respective board narrow sides and thus vertically over the extension of the circuit board, via which the first and second ends of upper and lower-side delimiting conductor tracks are connected to one another. Since the protective plastic layer is connected in a sealed manner to the upper and lower-side delimiting conductor track and to the first and second board narrow side sections, a sealing ring is formed between the plastic protective layer and the printed circuit board that is closed around the printed circuit board, namely via the sealing connection of the plastic protective layer to the ones applied to the printed circuit board Delimitation conductor tracks and the plate narrow side sections.
  • This sealing ring defines, in a certain horizontal direction, one end of the volume in the protective plastic layer in which the first upper side area and the first lower side area are sealingly enclosed.
  • the volume extends along the given horizontal direction to the opposite one End, which can be given, for example, by a further delimiting conductor track section or an absolute geometric extension end of the volume at an absolute geometric extension end of the circuit board or outside this end of the circuit board, wherein, for example, the volume can be a blind hole-like volume in the plastic protective layer, the end of which at the open Side of the blind hole is limited by the sealing ring by the circuit board is arranged with its cross-section perpendicular to said specific horizontal direction.
  • the provision of such a sealing ring that is closed around the printed circuit board is particularly advantageous for ensuring a reliably sealed volume and for providing a large-area component section.
  • the inventors have found that the plate narrow side sections can be formed with a sufficient roughness that can enable a sealing connection of the plastic protective layer with the respective plate narrow side section.
  • the board narrow-side sections each have a narrow-side conductor track that extends between the ends of the delimiting conductor tracks connected by the respective board narrow-side section and connects them to one another, forming a sealing conductor track that is formed by the delimitation conductor tracks and the plate narrow-side conductor tracks and runs uninterruptedly around the conductor track.
  • Plate narrow-side section thus has a first narrow-side conductor track, which connects the first ends of the upper and lower-side delimiting conductor tracks to one another connects, and the second plate edge portion has a second edge conductive trace that connects the second ends of top and bottom side demarcation conductive traces together.
  • the implementation of the peripheral sealing conductor track, which is formed by the top and bottom delimiting conductor tracks and the narrow side conductor tracks, is particularly advantageous for the reliable sealing of the plastic layer on the sealing ring, which is thus formed by the peripheral sealing conductor track.
  • an adhesion promoter ring running uninterruptedly around the printed circuit board is applied to the upper and lower-side delimiting conductor tracks and the board narrow-side sections, in particular the narrow-side conductor tracks of the board narrow-side sections, and connected to these, i. H. the top and side demarcation traces and the
  • the adhesion promoter ring can be realized by an adhesion promoter as explained above.
  • the provision of an adhesion promoter ring, which forms the sealing ring, is particularly advantageous for the reliably sealing connection with the plastic protective layer.
  • the adhesion promoter ring ensures a reliable, watertight sealing connection of the plastic protective layer with the delimiting conductor tracks or the narrow side sections of the board.
  • the top-side delimiting conductor track has a first conductor track section with which it forms the first top-side region in a ring shape encloses closed, and a second conductor track section, wherein the second conductor track section and the underside
  • Delimitation traces each extend with their trace lengths from a first end to a second end, the first end of the second trace section of the delimitation trace on the top and the first end of the delimitation trace on the underside being connected to one another by the first board narrow side section of the printed circuit board and the second end of the second trace section of the
  • the upper-side delimitation conductor track and the second end of the lower-side delimitation conductor track are connected to one another by the second board narrow-side section of the printed circuit board, the plastic protective layer being sealingly connected to the first and second board narrow-side sections, respectively, and to the second conductor track section of the upper-side delimitation conductor track and the lower-side delimitation conductor track being sealingly connected under formation of the sealing ring that is closed around the printed circuit board.
  • first conductor track section and a second conductor track section of the top-side delimiting conductor track is particularly advantageous, since this allows two sealing zones to be provided in series one behind the other.
  • first upper side region which is enclosed in a ring-shaped manner by the first conductor track section, lies within the volume delimited by the sealing ring in the plastic protective layer.
  • the underside demarcation conductor track also has a first and a second conductor track section, the first conductor track section of the underside demarcation conductor track enclosing the first underside region in a closed manner and the second conductor track section of the lower-side delimitation conductor track forms the first and the second end of the lower-side delimitation conductor track, which are connected to the first and second ends of the second conductor track section of the upper-side delimitation conductor track via the board narrow side sections of the printed circuit board.
  • an electronic component arranged in the first underside area can be sealed particularly reliably watertight, as explained for the top side.
  • the contact portion is continuously coated with a protective layer on each surface that runs vertically between the top and bottom of the circuit board.
  • the protective layer is a waterproof layer that prevents water from penetrating the circuit board at all vertical surface portions of the circuit board. More preferably, the contact portion is coated on its entire surface, so that water penetration at any
  • the coating is preferably electrically conductive in first surface sections of the contact section and electrically insulating in second surface sections of the contact section, the contacts explained above being formed from the first surface sections and the second
  • the invention also relates to a method for producing a printed circuit board arrangement comprising a printed circuit board which extends horizontally with its plate surface and has a top and bottom side, at least one electronic component being arranged on a flat component section of the printed circuit board.
  • a top-side at the top of the circuit board Arranged delimitation conductor track, which runs over a conductor track length with a conductor track width at the top and divides the top into two completely and continuously separated upper-side regions over its conductor track length.
  • a first of these upper side areas is formed by the component section, and a second of these upper side areas is formed by a flat contact section of the printed circuit board.
  • a plastic protective layer is then applied to the printed circuit board, in particular by means of an injection molding process, in such a way that the component section is completely enclosed in the plastic protective layer and the top-side delimiting conductor track is arranged uninterrupted over its conductor track length at least with part of its conductor track width within the plastic protective layer and is connected to it in a sealed manner .
  • the protective plastic layer is applied, it is connected to the conductor track in a waterproof manner.
  • An adhesion promoter is particularly preferably applied to the top-side delimiting conductor track over its conductor track length before the protective plastic layer is applied to the printed circuit board.
  • the contact portion is clamped in a tool carrier, while the
  • Plastic protective layer is applied.
  • the tool carrier is preferably arranged exclusively outside the component section on the printed circuit board, while the plastic protective layer is being applied.
  • Electronic components are preferably provided exclusively in the component section, so that the contact section is free of electronic components.
  • all electronic components of the printed circuit board arrangement are sealed watertight within the component section and thus by the protective plastic layer encapsulated.
  • the invention also relates to a washable item of clothing comprising a printed circuit board arrangement according to the invention.
  • the circuit board assembly is integrated into the garment in such a way that when the garment is immersed in water at 30° C. for 30 minutes
  • Circuit board assembly is directly in contact with the water and is thus exposed to the water.
  • the printed circuit board arrangement is therefore not arranged in a protected, watertight, sealed area of the article of clothing, but can be directly exposed to the water if the article of clothing is correspondingly submerged. It is thus possible to dispense with watertight encapsulation measures, which can be disadvantageous for the wearing comfort of a piece of clothing, since the printed circuit board arrangement itself ensures adequate sealing of its electronic components due to its configuration according to the invention.
  • FIG. 1 a first embodiment of a printed circuit board arrangement according to the invention in a schematic representation of the principle
  • FIG. 2 in a schematic representation of the principles, a second embodiment of a printed circuit board arrangement according to the invention
  • Figure 3 in a schematic representation of a third embodiment of a printed circuit board assembly according to the invention.
  • FIG. 1 is an embodiment of an inventive Printed circuit board assembly 100 shown schematically simplified.
  • the printed circuit board arrangement 100 comprises a printed circuit board 1 with its board surface extending horizontally.
  • FIG. 1 shows the upper side of the printed circuit board 1 and two of its board narrow sides.
  • the top of circuit board 1 consists of a first top area 120 and a second top area 110.
  • the two top areas 120, 110 are separated from one another without interruption by a top-side delimitation conductor track 41, so that top-side delimitation conductor track 41 divides the top side of circuit board 1 into two top-side areas.
  • the top-side delimitation conductor track is still completely assigned to the second top-side area 110 so that it is by definition completely arranged in the second top-side area 110 and directly adjoins the first top-side area 120 .
  • the first upper side area 120 is formed by a flat component section of the printed circuit board 1 .
  • the component section designates the section of the printed circuit board 1 on which at least one electronic component 3 is arranged. In the present case, exactly one electronic component 3 is arranged in the component section. According to the invention, no electronic component 3 is arranged in the contact section. The component section and thus also the electronic component 3 is sealed in a plastic protective layer 2 .
  • a top-side demarcation conductor track 41 and a bottom-side demarcation conductor track are arranged on the top and bottom sides (the underside is not shown here), with the top-side demarcation conductor track 41 and the bottom-side demarcation conductor track with their conductor track lengths of extend a first end to a second end and the first ends of upper and lower side
  • Delimitation conductor track and the second ends of the upper and lower-side delimitation conductor tracks are connected to one another via narrow-side conductor tracks 42, so that the upper and lower-side delimitation conductor tracks and narrow-side conductor tracks 42 together form a sealing ring 4 that runs uninterruptedly around the printed circuit board 1.
  • the top-side delimiting conductor track 41 divides the top into a first top-side area 120 and a second top-side area 110
  • the narrow-side conductor track 42 which can be seen in Figure 1, divides the lateral narrow side shown in Figure 1 into a first narrow-side area 12 and a second narrow-side area 11 divided.
  • the first upper side area 120 and the first narrow side area 12 are arranged completely encapsulated in the plastic protective layer 2 and are sealed watertight with respect to the environment of the circuit board arrangement 100 by the sealing ring 4, on which the plastic protective layer 2 bears in a sealing manner and which is connected to the circuit board 1 in a sealing manner.
  • the sealing ring 4 runs completely within the horizontal extension of the plastic protective layer 2. If the circuit board arrangement 100 is submerged, water can still get into the plastic protective layer 2, starting from the second upper side region 110 on the top side of the circuit board 1, but only until the sealing ring 4 is reached, where further penetration of water is prevented by the sealing connection of the sealing ring 4 with the printed circuit board 1 and the plastic protective layer 2 . From Figure 1 can also be seen that in the second Top area 110, which is formed by the contact portion of the circuit board 1, three contacts 5 are provided. The contacts 5 are each designed as recesses running through the printed circuit board 1 along the vertical, these recesses being designed as bushings in the printed circuit board 1 in the manner of hollow cylinders.
  • An uninterrupted electrically conductive coating is provided both around the hollow-cylindrical lead-through on the upper side and over the entire hollow-cylinder wall.
  • This electrically conductive coating serves to allow an electrically conductive yarn to be inserted into the respective feedthrough or the respective contact 5 using an embroidery process in order to contact the respective contact 5 by using the electrically conductive yarn as a connection line on the electrically conductive coating of the printed circuit board 1 is applied, as well as the further sealing of the printed circuit board 1. Because the coating is provided over the entire hollow cylinder wall of the bushings or contacts 5, penetration of water through the hollow cylinder wall and thus through the printed circuit board area of the printed circuit board 1 delimiting the recess is avoided .
  • FIG. 2 shows a further embodiment of a printed circuit board arrangement 100 according to the invention in a simplified, schematic manner.
  • the printed circuit board arrangement 100 according to FIG. 2 differs from that
  • Circuit board arrangement 100 according to FIG extends. With this out of the
  • the plastic protective layer 2 extending section forms the upper-side delimitation conductor track 41 a contact 5 of the circuit board 1 from.
  • only one further contact 5 is provided in the lower surface area 110 of the printed circuit board 1, which, analogously to the contacts 5 explained in the exemplary embodiment according to FIG.
  • Plastic protective layer 2 with the circuit board 1 by being sealingly connected to both the circuit board 1 and the plastic protective layer 2. On the other hand, it forms a contact of the printed circuit board 1 itself.
  • an electrical line leads to the electronic component 3 in each case.
  • the electrical line is not shown here.
  • the electrical line which leads from the contacts 5 designed as a feedthrough to the electronic component 3 is formed in sections by a connecting conductor track which runs within the printed circuit board 1 and is thus vertically spaced from the top and bottom of the printed circuit board 1 and which runs vertically is plated through to the electronic component 3 .
  • the connecting conductor track is provided on the first upper side region 120 and runs from the top-side delimiting conductor track 41 to the electronic component 3.
  • FIG. 3 is another embodiment of a circuit board assembly 100 according to the invention shown simplified schematically.
  • the printed circuit board arrangement 100 shown in FIG. 3 differs from the printed circuit board arrangement 100 shown in FIG.
  • the component section is provided exclusively on the upper side of the circuit board 1.
  • the upper-side delimiting conductor track 41 lies completely within the horizontal extent of the plastic protective layer 2 and provides a seal between the plastic protective layer 2 and the printed circuit board 1 that is continuously closed around the first surface area and thus around the component section.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

L'invention concerne un ensemble carte de circuits imprimés (100) comprenant une carte de circuits imprimés (1) dont la surface de carte s'étend horizontalement et qui comprend une face supérieure verticale et une face inférieure verticale, et comprenant une partie composant plane sur laquelle au moins un composant électronique (3), en particulier plusieurs composants électroniques (3) sont disposés, cette partie composant est intégrée de manière étanche dans une couche de protection en matière plastique. Un tracé conducteur de délimitation supérieur est disposé sur la face supérieure de la carte de circuits imprimés (1), s'étend sur une longueur de tracé conducteur avec une largeur de tracé conducteur sur la face supérieure, et divise, sur sa longueur de tracé conducteur, la face supérieure en deux zones de face supérieure totalement séparées l'une de l'autre de manière ininterrompue, une première de ces zones de face supérieure étant formée par la partie composant et une deuxième de ces zones de face supérieure étant formée par une zone de contact plane de la carte de circuits imprimés (1) qui est agencée dans certaines régions à l'extérieur de la couche en matière plastique, le tracé conducteur de délimitation supérieur s'étendant de manière ininterrompue sur toute sa longueur de tracé conducteur au moins avec une partie de sa largeur de tracé conducteur à l'intérieur de la couche de protection en matière plastique (2) et étant relié de manière étanche à celle-ci, un agent adhésif appliqué sur le tracé conducteur de délimitation supérieur (41) sur sa longueur de tracé conducteur assurant un liaison étanche entre la couche de protection en matière plastique (2) et le tracé conducteur de délimitation supérieur (41).
EP22729090.5A 2021-05-21 2022-05-11 Enrobage étanche aux fluides de cartes de circuits imprimés électroniques avec mise en contact extérieure Pending EP4342268A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102021113343.2A DE102021113343A1 (de) 2021-05-21 2021-05-21 Mediendichtes Umspritzen von Elektronikplatinen mit Außenkontaktierung
PCT/EP2022/062800 WO2022243134A1 (fr) 2021-05-21 2022-05-11 Enrobage étanche aux fluides de cartes de circuits imprimés électroniques avec mise en contact extérieure

Publications (1)

Publication Number Publication Date
EP4342268A1 true EP4342268A1 (fr) 2024-03-27

Family

ID=82016381

Family Applications (1)

Application Number Title Priority Date Filing Date
EP22729090.5A Pending EP4342268A1 (fr) 2021-05-21 2022-05-11 Enrobage étanche aux fluides de cartes de circuits imprimés électroniques avec mise en contact extérieure

Country Status (3)

Country Link
EP (1) EP4342268A1 (fr)
DE (1) DE102021113343A1 (fr)
WO (1) WO2022243134A1 (fr)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3553405B2 (ja) * 1999-03-03 2004-08-11 ローム株式会社 チップ型電子部品
CA2426110C (fr) * 2000-10-16 2010-06-29 Foster-Miller, Inc. Procede de fabrication d'un article en tissu destine a renfermer un circuit electronique, et article textile electro-actif
DE102005047170A1 (de) * 2004-10-05 2006-07-20 Sharp K.K. Optische Vorrichtung, optischer Verbinder und damit ausgerüstete elektronische Einrichtung
DE102009000427A1 (de) * 2009-01-27 2010-07-29 Robert Bosch Gmbh Verfahren zur Herstellung eines Sensormoduls
DE102009031568A1 (de) * 2009-06-29 2010-12-30 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Erzeugung eines elektronischen Systems, Verfahren zur Erzeugung einer Freiformfläche mit einem solchen System, sowie elektronisches System und Freiformflächen mit einem solchen System
CN104604248B (zh) * 2012-09-10 2018-07-24 罗伯特·博世有限公司 具有模制互联器件的mems麦克风封装

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WO2022243134A1 (fr) 2022-11-24
DE102021113343A1 (de) 2022-11-24

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