EP4400258A4 - WAFER POLISHING SYSTEM - Google Patents

WAFER POLISHING SYSTEM

Info

Publication number
EP4400258A4
EP4400258A4 EP22866477.7A EP22866477A EP4400258A4 EP 4400258 A4 EP4400258 A4 EP 4400258A4 EP 22866477 A EP22866477 A EP 22866477A EP 4400258 A4 EP4400258 A4 EP 4400258A4
Authority
EP
European Patent Office
Prior art keywords
polishing system
wafer polishing
wafer
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP22866477.7A
Other languages
German (de)
French (fr)
Other versions
EP4400258A1 (en
Inventor
Xiaoyu Xu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hangzhou Sizone Electronic Technology Inc
Original Assignee
Hangzhou Sizone Electronic Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hangzhou Sizone Electronic Technology Inc filed Critical Hangzhou Sizone Electronic Technology Inc
Publication of EP4400258A1 publication Critical patent/EP4400258A1/en
Publication of EP4400258A4 publication Critical patent/EP4400258A4/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B24B47/16—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces performing a reciprocating movement, e.g. during which the sense of rotation of the working-spindle is reversed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
EP22866477.7A 2021-09-07 2022-08-30 WAFER POLISHING SYSTEM Pending EP4400258A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN202122142759 2021-09-07
CN202111445239.6A CN114147611B (en) 2021-09-07 2021-11-30 Wafer polishing system
PCT/CN2022/115771 WO2023036011A1 (en) 2021-09-07 2022-08-30 Wafer polishing system

Publications (2)

Publication Number Publication Date
EP4400258A1 EP4400258A1 (en) 2024-07-17
EP4400258A4 true EP4400258A4 (en) 2025-10-08

Family

ID=80455020

Family Applications (1)

Application Number Title Priority Date Filing Date
EP22866477.7A Pending EP4400258A4 (en) 2021-09-07 2022-08-30 WAFER POLISHING SYSTEM

Country Status (7)

Country Link
US (1) US20240367283A1 (en)
EP (1) EP4400258A4 (en)
JP (1) JP7728045B2 (en)
KR (1) KR102837898B1 (en)
CN (3) CN216781428U (en)
TW (1) TWI818688B (en)
WO (1) WO2023036011A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN216781428U (en) * 2021-09-07 2022-06-21 杭州众硅电子科技有限公司 Wafer polishing system
CN113910099A (en) * 2021-09-07 2022-01-11 杭州众硅电子科技有限公司 Wafer polishing system
CN115338718B (en) * 2022-10-18 2023-03-24 杭州众硅电子科技有限公司 Wafer polishing system

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070141954A1 (en) * 2005-12-16 2007-06-21 Applied Materials, Inc. Paired pivot arm
US20150105005A1 (en) * 2013-10-16 2015-04-16 Applied Materials, Inc. Chemical mechanical polisher with hub arms mounted
CN109304670A (en) * 2018-09-20 2019-02-05 杭州众硅电子科技有限公司 A kind of polishing handling parts module flexible

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1303654C (en) * 1995-09-13 2007-03-07 株式会社日立制作所 Polishing method and device
JP2000061833A (en) * 1998-08-19 2000-02-29 Speedfam-Ipec Co Ltd Polishing device
KR100710915B1 (en) * 1999-03-05 2007-04-26 가부시키가이샤 에바라 세이사꾸쇼 Polishing device
US6616509B1 (en) * 2000-03-31 2003-09-09 Lam Research Corporation Method for performing two wafer preparation operations on vertically oriented semiconductor wafer in single enclosure
KR101502130B1 (en) * 2008-07-10 2015-03-13 주식회사 원익아이피에스 A transfer apparatus, a transfer chamber in which the transfer apparatus is installed, and a vacuum processing system
JP5653073B2 (en) * 2010-05-19 2015-01-14 キヤノン株式会社 Robot cell device and production system
TW201309415A (en) * 2011-08-18 2013-03-01 Chinwin Technology Co Ltd Glass substrate surface grinding method
JP6039187B2 (en) * 2012-02-03 2016-12-07 キヤノン株式会社 Assembly apparatus, gripping hand, and article assembling method
SG10201404086XA (en) * 2013-07-19 2015-02-27 Ebara Corp Substrate cleaning device, substrate cleaning apparatus, method for manufacturing cleaned substrate and substrate processing apparatus
JP6299769B2 (en) * 2013-11-19 2018-03-28 株式会社安川電機 Robot system
JP6587379B2 (en) * 2014-09-01 2019-10-09 株式会社荏原製作所 Polishing equipment
JP6573520B2 (en) * 2015-09-29 2019-09-11 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing method and substrate processing apparatus
JP2017092347A (en) * 2015-11-13 2017-05-25 株式会社Sumco Wafer polishing method
CN107221491B (en) * 2016-03-22 2021-10-22 东京毅力科创株式会社 Substrate cleaning device
JP2019123057A (en) * 2018-01-18 2019-07-25 キヤノン株式会社 Production system and assembly method of components using the same
CN109015314A (en) * 2018-09-07 2018-12-18 杭州众硅电子科技有限公司 A kind of based CMP apparatus
CN109262444A (en) * 2018-12-03 2019-01-25 杭州众硅电子科技有限公司 Wafer planarization unit
WO2020048311A1 (en) * 2018-09-07 2020-03-12 杭州众硅电子科技有限公司 Chemical-mechanical planarization device, wafer transfer method and wafer planarization unit
CN110103119A (en) * 2018-09-20 2019-08-09 杭州众硅电子科技有限公司 A kind of polishing handling parts module
CN109514421A (en) * 2019-01-14 2019-03-26 杭州众硅电子科技有限公司 A kind of chemical-mechanical polisher
JP2020138278A (en) * 2019-02-28 2020-09-03 株式会社キッツ Valve automatic assembling system and valve automatic assembling method
TWI859239B (en) * 2019-05-29 2024-10-21 美商應用材料股份有限公司 Apparatus and method for steam treatment stations for chemical mechanical polishing system
CN216781428U (en) * 2021-09-07 2022-06-21 杭州众硅电子科技有限公司 Wafer polishing system

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070141954A1 (en) * 2005-12-16 2007-06-21 Applied Materials, Inc. Paired pivot arm
US20150105005A1 (en) * 2013-10-16 2015-04-16 Applied Materials, Inc. Chemical mechanical polisher with hub arms mounted
CN109304670A (en) * 2018-09-20 2019-02-05 杭州众硅电子科技有限公司 A kind of polishing handling parts module flexible

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2023036011A1 *

Also Published As

Publication number Publication date
JP7728045B2 (en) 2025-08-22
TW202310972A (en) 2023-03-16
KR20240033046A (en) 2024-03-12
KR102837898B1 (en) 2025-07-24
CN114147611B (en) 2022-10-04
US20240367283A1 (en) 2024-11-07
EP4400258A1 (en) 2024-07-17
CN114147611A (en) 2022-03-08
TWI818688B (en) 2023-10-11
CN216781428U (en) 2022-06-21
CN216542663U (en) 2022-05-17
JP2024531412A (en) 2024-08-29
WO2023036011A1 (en) 2023-03-16

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