EP4400258A4 - Système de polissage de tranche - Google Patents

Système de polissage de tranche

Info

Publication number
EP4400258A4
EP4400258A4 EP22866477.7A EP22866477A EP4400258A4 EP 4400258 A4 EP4400258 A4 EP 4400258A4 EP 22866477 A EP22866477 A EP 22866477A EP 4400258 A4 EP4400258 A4 EP 4400258A4
Authority
EP
European Patent Office
Prior art keywords
polishing system
wafer polishing
wafer
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP22866477.7A
Other languages
German (de)
English (en)
Other versions
EP4400258A1 (fr
Inventor
Xiaoyu Xu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hangzhou Sizone Electronic Technology Inc
Original Assignee
Hangzhou Sizone Electronic Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hangzhou Sizone Electronic Technology Inc filed Critical Hangzhou Sizone Electronic Technology Inc
Publication of EP4400258A1 publication Critical patent/EP4400258A1/fr
Publication of EP4400258A4 publication Critical patent/EP4400258A4/fr
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B24B47/16—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces performing a reciprocating movement, e.g. during which the sense of rotation of the working-spindle is reversed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
EP22866477.7A 2021-09-07 2022-08-30 Système de polissage de tranche Pending EP4400258A4 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN202122142759 2021-09-07
CN202111445239.6A CN114147611B (zh) 2021-09-07 2021-11-30 一种晶圆抛光系统
PCT/CN2022/115771 WO2023036011A1 (fr) 2021-09-07 2022-08-30 Système de polissage de tranche

Publications (2)

Publication Number Publication Date
EP4400258A1 EP4400258A1 (fr) 2024-07-17
EP4400258A4 true EP4400258A4 (fr) 2025-10-08

Family

ID=80455020

Family Applications (1)

Application Number Title Priority Date Filing Date
EP22866477.7A Pending EP4400258A4 (fr) 2021-09-07 2022-08-30 Système de polissage de tranche

Country Status (7)

Country Link
US (1) US20240367283A1 (fr)
EP (1) EP4400258A4 (fr)
JP (1) JP7728045B2 (fr)
KR (1) KR102837898B1 (fr)
CN (3) CN216781428U (fr)
TW (1) TWI818688B (fr)
WO (1) WO2023036011A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN216781428U (zh) * 2021-09-07 2022-06-21 杭州众硅电子科技有限公司 晶圆抛光系统
CN113910099A (zh) * 2021-09-07 2022-01-11 杭州众硅电子科技有限公司 一种晶圆抛光系统
CN115338718B (zh) * 2022-10-18 2023-03-24 杭州众硅电子科技有限公司 一种晶圆抛光系统

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070141954A1 (en) * 2005-12-16 2007-06-21 Applied Materials, Inc. Paired pivot arm
US20150105005A1 (en) * 2013-10-16 2015-04-16 Applied Materials, Inc. Chemical mechanical polisher with hub arms mounted
CN109304670A (zh) * 2018-09-20 2019-02-05 杭州众硅电子科技有限公司 一种柔性的抛光装卸部件模块

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CN1303654C (zh) * 1995-09-13 2007-03-07 株式会社日立制作所 抛光方法和设备
JP2000061833A (ja) * 1998-08-19 2000-02-29 Speedfam-Ipec Co Ltd ポリッシング装置
KR100710915B1 (ko) * 1999-03-05 2007-04-26 가부시키가이샤 에바라 세이사꾸쇼 폴리싱장치
US6616509B1 (en) * 2000-03-31 2003-09-09 Lam Research Corporation Method for performing two wafer preparation operations on vertically oriented semiconductor wafer in single enclosure
KR101502130B1 (ko) * 2008-07-10 2015-03-13 주식회사 원익아이피에스 반송장치, 그가 설치된 반송챔버 및 이를 포함하는진공처리시스템
JP5653073B2 (ja) * 2010-05-19 2015-01-14 キヤノン株式会社 ロボットセル装置及び生産システム
TW201309415A (zh) * 2011-08-18 2013-03-01 Chinwin Technology Co Ltd 玻璃基板表面處理方法
JP6039187B2 (ja) * 2012-02-03 2016-12-07 キヤノン株式会社 組立装置、把持ハンドおよび物品の組立方法
SG10201404086XA (en) * 2013-07-19 2015-02-27 Ebara Corp Substrate cleaning device, substrate cleaning apparatus, method for manufacturing cleaned substrate and substrate processing apparatus
JP6299769B2 (ja) * 2013-11-19 2018-03-28 株式会社安川電機 ロボットシステム
JP6587379B2 (ja) * 2014-09-01 2019-10-09 株式会社荏原製作所 研磨装置
JP6573520B2 (ja) * 2015-09-29 2019-09-11 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP2017092347A (ja) * 2015-11-13 2017-05-25 株式会社Sumco ウェーハ研磨方法
CN107221491B (zh) * 2016-03-22 2021-10-22 东京毅力科创株式会社 基板清洗装置
JP2019123057A (ja) * 2018-01-18 2019-07-25 キヤノン株式会社 生産システムおよびそれを用いた部品の組立方法
CN109015314A (zh) * 2018-09-07 2018-12-18 杭州众硅电子科技有限公司 一种化学机械平坦化设备
CN109262444A (zh) * 2018-12-03 2019-01-25 杭州众硅电子科技有限公司 晶圆平坦化单元
WO2020048311A1 (fr) * 2018-09-07 2020-03-12 杭州众硅电子科技有限公司 Dispositif de planarisation chimico-mécanique, procédé de transfert de tranches et unité de planarisation de tranches
CN110103119A (zh) * 2018-09-20 2019-08-09 杭州众硅电子科技有限公司 一种抛光装卸部件模块
CN109514421A (zh) * 2019-01-14 2019-03-26 杭州众硅电子科技有限公司 一种化学机械抛光设备
JP2020138278A (ja) * 2019-02-28 2020-09-03 株式会社キッツ バルブ自動組立システムとバルブ自動組立方法
TWI859239B (zh) * 2019-05-29 2024-10-21 美商應用材料股份有限公司 用於化學機械研磨系統的蒸氣處置站的設備及方法
CN216781428U (zh) * 2021-09-07 2022-06-21 杭州众硅电子科技有限公司 晶圆抛光系统

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070141954A1 (en) * 2005-12-16 2007-06-21 Applied Materials, Inc. Paired pivot arm
US20150105005A1 (en) * 2013-10-16 2015-04-16 Applied Materials, Inc. Chemical mechanical polisher with hub arms mounted
CN109304670A (zh) * 2018-09-20 2019-02-05 杭州众硅电子科技有限公司 一种柔性的抛光装卸部件模块

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2023036011A1 *

Also Published As

Publication number Publication date
JP7728045B2 (ja) 2025-08-22
TW202310972A (zh) 2023-03-16
KR20240033046A (ko) 2024-03-12
KR102837898B1 (ko) 2025-07-24
CN114147611B (zh) 2022-10-04
US20240367283A1 (en) 2024-11-07
EP4400258A1 (fr) 2024-07-17
CN114147611A (zh) 2022-03-08
TWI818688B (zh) 2023-10-11
CN216781428U (zh) 2022-06-21
CN216542663U (zh) 2022-05-17
JP2024531412A (ja) 2024-08-29
WO2023036011A1 (fr) 2023-03-16

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