EP4458478A2 - Procédé de fabrication d'un composant structuré et composant structuré - Google Patents

Procédé de fabrication d'un composant structuré et composant structuré Download PDF

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Publication number
EP4458478A2
EP4458478A2 EP24173407.8A EP24173407A EP4458478A2 EP 4458478 A2 EP4458478 A2 EP 4458478A2 EP 24173407 A EP24173407 A EP 24173407A EP 4458478 A2 EP4458478 A2 EP 4458478A2
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EP
European Patent Office
Prior art keywords
layer
solid particles
substrate
composite material
matrix material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP24173407.8A
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German (de)
English (en)
Other versions
EP4458478A3 (fr
Inventor
Ulrich Plachetka
Desislava Daskalova
Benny Ku
Jasper Ruhkopf
Aguila Flores Gonzalo
Max Christian Lemme
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Amo GmbH
Original Assignee
Amo GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amo GmbH filed Critical Amo GmbH
Publication of EP4458478A2 publication Critical patent/EP4458478A2/fr
Publication of EP4458478A3 publication Critical patent/EP4458478A3/fr
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/40—Distributing applied liquids or other fluent materials by members moving relatively to surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/02—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a matt or rough surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2601/00—Inorganic fillers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2602/00—Organic fillers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0254—After-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/12—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures

Definitions

  • the present invention relates to a method for producing a structured component.
  • the invention further relates to a structured component.
  • the present invention is concerned with the structuring of coated components, i.e. components in which a substrate is provided with a coating and in which a structure is or will be formed in or on the coating.
  • Coatings can be used to improve the service life, certain functions or mechanical properties of the component. For example, a coating can be used to improve corrosion, scratch or wear resistance. A coating can also influence the decorative or optical properties of the component.
  • a structure provided in or on such a coating can also provide different functions.
  • Such a structure can, for example, provide optical functions.
  • a structure can be used to guide fluids (e.g. liquids or gases) along a component surface. Structures of components can also influence their optical impression or the feel of the component. Such structures can also provide pores or pore systems.
  • Such structures can (in conjunction with a suitable coating material) promote the course of chemical reactions or catalytic processes or even make them possible in the first place.
  • a structure is introduced into the layer prior to, during and/or subsequent to the curing of the layer in order to form a structural layer from the layer.
  • the substrate can be a suitable body to which a composite material can be applied.
  • the substrate can be rigid or flexible (e.g. bendable, foldable, rollable, etc.).
  • the substrate can be a flat body, i.e. have a plane (even) surface.
  • the substrate can be in the form of a film.
  • the substrate can have a shape that differs from a flat body.
  • the substrate can have a surface profile.
  • the substrate can have a smooth surface or a rough surface in places or completely.
  • the substrate can be a three-dimensional object.
  • the substrate can be based on or made from silicon, metal, glass, ceramic or a plastic, for example.
  • the substrate can be single-layered or multi-layered.
  • the layers can be made from the same or different materials.
  • the substrate can act as a holder/carrier for a layer placed on it (or to be placed on it).
  • the substrate can be a Si or glass wafer.
  • the substrate can be designed in such a way that it can be rolled up on a roll.
  • the composite material can be in any form in which it can be applied to the substrate.
  • the composite material can be flowable, in particular liquid.
  • the flowability is provided in particular by the matrix material.
  • the solid particles can be distributed in the matrix material, for example dispersed or suspended.
  • the composite material can also be viscous.
  • the solid particles may have already been introduced into the matrix material before the composite material is applied to the substrate.
  • the composite material is then initially composed of matrix material and solid particles introduced into it.
  • solid particles can also be introduced into the matrix material when the composite material is applied to the substrate. If solid particles are only introduced into the matrix material when the composite material is applied to the substrate, it goes without saying that the "composite material" is created “in-situ” when it is applied to the substrate.
  • “Curing” can mean complete curing or partial curing. Partial curing can mean that a curing process is completed to a certain degree (in terms of time) (e.g. curing is 80% complete), while partial curing can mean that certain (local) areas of the layer are completely cured, but other areas are not yet completely cured. In this case, partial curing can therefore refer to a local curing state.
  • the process of curing means in particular the "solidification" of the layer.
  • Curing can be achieved through drying processes, for example through evaporation of solvent (which can be a component of the composite material), but also through chemical processes such as polymerization.
  • Curing can be initiated or accelerated by exposing the layer to thermal energy or irradiating it with electromagnetic radiation (of a suitable wavelength). Depending on the material, this can either trigger or accelerate curing.
  • a “structure” can be understood as a surface structure or a deep structure in the layer.
  • a structure can be regular or irregular.
  • a structure can have height structures and depth structures.
  • a structure can have patterns that repeat periodically, for example.
  • a structure can provide a surface profile.
  • a structure is formed in particular by structural elements that are arranged adjacent to one another or in a pattern. Structural elements can be arranged regularly or irregularly.
  • a structure can also be formed by different structural elements that can differ from one another, for example in their size or shape.
  • the layer mentioned can have a structure in places and no structure in places. However, the layer can also be structured throughout.
  • the structure can be introduced into the layer before it hardens.
  • the structure can be introduced into the layer particularly easily, as the composite material is easy to shape and therefore structure because it has not yet hardened.
  • the hardening takes place after the structuring.
  • a tool used for structuring remains in the layer during hardening and is only removed afterwards (in the sense of a mask).
  • the structure can also be introduced into the layer while it is curing.
  • the structure can be introduced into the layer particularly easily, as the composite material is easy to shape and thus can be structured because it has not yet fully cured.
  • Structuring during curing can be advantageous, as the medium to be structured (here the composite material) can already have a certain strength (degree of curing) and thus "flowing" as a result of shaping can be avoided/reduced. The stability during shaping can be improved in this way.
  • a simple form of structuring can be achieved by stamping or embossing, for example.
  • a stamping tool, an embossing tool or another shaping tool e.g. a mask
  • the tool can removed and the curing process can be started. It can also be planned to leave the tool in the layer during the curing process.
  • the structure can also be introduced into the layer after it has hardened. This means that the layer is already completely hardened before structuring takes place.
  • structuring is carried out in particular by material ablation, i.e. material removal.
  • Material ablation can be chemical and/or mechanical. Mechanical material ablation can be engraving, for example, but can also be carried out by laser processing (laser structuring).
  • Chemical material ablation can, for example, involve a wet-chemical process, in particular an etching or pickling process.
  • Structuring can also be carried out by partially (selectively) dissolving the composite material, e.g. with a solvent. The solvent then dissolves the matrix material, which drags along the solid particles arranged in it.
  • the method of removing matrix material from the layer can depend on the type of matrix material. If the matrix material is volatile, it can be removed by applying thermal energy (for example by liquefaction, evaporation or sublimation). The matrix material can also be removed by irradiation with electromagnetic radiation (e.g. light of a suitable wavelength), chemically or mechanically. Mechanical removal can also be achieved by laser processing.
  • thermal energy for example by liquefaction, evaporation or sublimation.
  • the matrix material can also be removed by irradiation with electromagnetic radiation (e.g. light of a suitable wavelength), chemically or mechanically. Mechanical removal can also be achieved by laser processing.
  • the at least partial removal of the matrix material from the layer also takes place before and/or during the curing of the layer (i.e. the above-mentioned step c).
  • solid particles are incorporated into the composite material. These remain in the layer after curing and at least partial removal of the matrix material. They are also contained in the structural layer, which is formed by introducing the structure into the layer.
  • the present process therefore not only enables solid particles to be introduced into a layer applied to a substrate in a gentle and environmentally friendly manner, but also solid particles to be introduced into a structured layer (structural layer).
  • the solid particles therefore enable specific properties of the layer to be set in a targeted manner, for example specific adjustment of the porosity, pore sizes (distribution), pore shapes, etc.
  • the structure introduced into the layer can give the component certain functions.
  • the process in question also enables different types of solids to be introduced into a layer.
  • the proposed method enables the tailor-made design and adjustment of certain component properties or component functionalities, namely on the one hand by the solid particles in the layer and on the other hand by the structure introduced into the layer.
  • Certain properties can be influenced by both the solid particles and the structure, other properties or functionalities only by the solid particles or the structure.
  • the structure introduced into the layer can increase the surface area of the component, which can be advantageous when used as a catalyst, in particular a photocatalyst.
  • the catalytically active (accessible) surface is thus increased.
  • the layer can be catalytically active in particular if the solid particles are made of a metal, in particular a conductor or semiconductor.
  • the structure can also increase the absorption surface for incident light.
  • the structure can also be used to provide certain optical functions. Adjustment parameters can be the layer thickness of the structural elements forming the structure, the shape of the structural elements and their dimensions.
  • the structure is a nanostructure.
  • the structural elements forming the structure are nanostructure elements.
  • Nanostructure elements have dimensions that are generally smaller than 100 nm.
  • the structural elements can also have dimensions of 100 nm or larger up to a few micrometers, and can therefore also be referred to as microstructure elements in this case.
  • Structural elements can have different shapes (regardless of their size), for example a disk shape, a rod shape, a cylinder shape, a tube shape, a pyramidal shape, a cone shape, a cuboid shape, etc.
  • structural elements can have a polygon shape or a rounded shape (e.g. circular shape, oval shape, etc.). Any other shapes are possible.
  • Structural elements can be raised in relation to the layer or the substrate.
  • a respective structural element protrudes from a surface of the layer or a surface of the substrate away from this surface. This directly increases the component surface.
  • a structural element that is raised in relation to a An arrangement of the structural elements raised on the surface can bring about advantageous optical properties. This can be used, for example, to specifically form a diffraction grating structure, a desired reflection surface structure or an optical trap.
  • the structural elements can also be embedded in the layer. For example, this can mean that the structural elements are implemented in the form of holes formed in the layer.
  • the structure can be designed in such a way that electromagnetic radiation of certain wavelengths or wavelength ranges is absorbed or reflected.
  • the structure is not absolutely necessary for the structure to be made up of only nanostructure elements or microstructure elements. A mixture of nanostructure elements and microstructure elements is also possible.
  • the structural elements can be arranged in an ordered or unordered (i.e. random) manner.
  • the structural elements can be arranged in a pattern. This can, for example, be a periodically repeating pattern.
  • the structure does not necessarily have to be made up of clearly defined structural elements such as nanostructure elements or microstructure elements.
  • the structure can also be generally designed as a nanostructure or microstructure.
  • a microstructure is a microscopically resolvable fine structure that describes, for example, the structure of a material.
  • a nanostructure describes the smallest arrangements whose size lies between microstructures and molecular structures.
  • a nanostructure can also include a fine structure.
  • a fine structure can be regular or irregular.
  • an organic material in particular an organic lacquer
  • Organic materials are based on carbon compounds.
  • the use of an organic material or an organic lacquer as the matrix material does not mean that the matrix cannot contain other components (e.g. inorganic in nature).
  • a varnish, including an organic varnish can also contain binders, film formers, non-volatile or volatile auxiliary materials, solvents (organic or water-based), pigments, fillers, etc.
  • a varnish whether organic or inorganic, can be in the form of a liquid or powder.
  • a varnish can be applied to an object such as a substrate and built up into a solid film (layer) by chemical and/or physical processes (e.g. the evaporation of a solvent).
  • the varnish can be a photoresist.
  • inorganic or organic particles are used as solid particles.
  • the solid particles can be semiconductor materials, insulating materials, or conductive materials.
  • Various of the aforementioned solid particles can also be provided.
  • the solid particles can comprise graphene.
  • the semiconductor material can be metal oxides, nitrides, carbon compounds (gC 3 N 4 ), transition metal dichalcogenides (TMDs), MXENE, etc. and their combinations.
  • the composite material is applied to the substrate by spraying, spinning, pouring, painting, printing, rinsing or by immersing the substrate in the composite material.
  • Spraying can be understood as spray coating.
  • the composite material which is in a flowable, e.g. liquid, state (the solid particles can be dispersed in the liquid matrix material), can be atomized into a mist and sprayed onto the substrate.
  • An air spray system, an ultrasonic spray system or an electrostatic spray system (so-called electrospray) can be used.
  • spin coating can be understood as “spin coating”, for example.
  • the composite material can spread itself (flow) to a certain extent on the surface of the substrate.
  • “Spreading” composite material is usually done using a spreading tool, e.g. a surface brush, a brush, a roller, a paintbrush or the like.
  • Printing can be letterpress, gravure, planographic, through-printing, pad printing, stamp printing, embossed printing, thermal direct printing, thermal transfer printing, thermal sublimation printing, screen printing or 3D printing.
  • Printing can include digital printing.
  • “Spraying” can be understood as a slot die coating (so-called “slot die”).
  • “Dipping” involves dipping a substrate into the composite material provided. This can be a dip coating.
  • the composite material can also be applied using a flooding technique (flooding the substrate with composite material).
  • the composite material can also be rolled onto the substrate.
  • the layer can be heated and/or exposed during curing.
  • the substrate together with the layer applied to it is arranged for curing in a room or container in which there is a higher temperature than room temperature (normal temperature) (heating).
  • Heating can also be carried out in a targeted manner using a heating device or heating container.
  • Heating can also be carried out by irradiation with electromagnetic radiation, e.g. by irradiation with infrared radiation.
  • Heating can enable or accelerate curing processes, e.g. by evaporating solvents.
  • Heating and exposure can also initiate or accelerate chemical curing reactions. This can, for example, provide activation energy required for a chemical reaction.
  • Exposure means irradiation with electromagnetic radiation of a suitable wavelength.
  • the matrix material is at least partially removed by thermal treatment, chemical treatment, physical treatment and/or mechanical processing of the layer.
  • thermal treatment can mean that the matrix material is exposed to an ambient temperature above room temperature (normal temperature). This can also be done in a suitable heating device or a corresponding heating container.
  • Thermal treatment can also be carried out by applying electromagnetic radiation. Depending on the wavelength of the electromagnetic radiation, thermal energy can also be introduced with the application of the radiation (e.g. when irradiating with IR radiation).
  • the application of laser radiation or electron beams can also be understood as thermal treatment, but can also be mechanical processing (laser ablation). Laser processing is therefore a hybrid of thermal and mechanical treatment or processing.
  • Chemical treatment can in particular be wet-chemical treatment, e.g. with an acid (etching), an alkali (e.g. NaOH or KOH) or another suitable agent.
  • the matrix material can also be dissolved or removed with a solvent (as a remover), for example with acetone, 1-methyl-2-pyrrolidone, dimethyl sulfoxide, etc.
  • Chemical treatment can also involve removing the matrix material by means of dry chemical combustion in oxygen plasma (so-called O 2 ashing).
  • a hybrid of chemical and physical treatment is plasma etching, which is mentioned here as an example of a possible treatment.
  • Physical treatment can be understood as simple pressure application, for example. Under a certain pressure, certain substances can evaporate.
  • Mechanical processing can be understood as milling, drilling, cutting or, as mentioned, laser processing, etc.
  • the matrix material can be completely or partially removed. If only partially removed, a portion of the matrix material remains in the layer. The porosity of the layer can be adjusted by removing the matrix material.
  • Other options for complete or partial removal of the matrix material include the following processes: material ablation (e.g. laser ablation, electron beam ablation), use of ion beams (e.g. focused ion beams, FIB for short), sputtering (e.g. Ar or He sputtering) as a purely physical process, the use of radiological radiation (e.g. alpha or beta radiation) or microwave radiation, plasma processes (e.g. reactive ion etching, RIE for short).
  • material ablation e.g. laser ablation, electron beam ablation
  • ion beams e.g. focused ion beams, FIB for short
  • sputtering e.g. Ar or He
  • a porosity in the layer is set by setting an initial proportion of solid particles in the composite material and/or by the amount of matrix material removed from the layer.
  • a targeted setting of the porosity can be important for a variety of applications, for example in catalytic applications. This is because many chemical-catalytic processes depend on the pore system, in particular the porosity.
  • the absorption of gas molecules or liquid is also influenced by the porosity.
  • a pore size distribution or certain pore shapes can also be set using this.
  • the structure in particular the nanostructure or microstructure, is introduced into the layer in such a way that it has a specific surface functionality, for example an optical functionality.
  • a surface functionality can mean a functionality of a surface in relation to the interaction with substances or environmental substances arranged on it.
  • a specific surface functionality can mean hydrophilic, hydrophobic, lipophilic, lipophobic properties of the surface.
  • the specific surface functionality can mean the wettability with certain substances. The provision of a lotus effect can be an example of a specific surface functionality.
  • Absorption properties of the structure (or the surface) in relation to the accumulation and interaction of substances e.g.
  • gases, liquids or individual molecules) or electromagnetic radiation can also provide a specific surface functionality, for example the targeted absorption of electromagnetic radiation (e.g. radar waves, microwaves, etc.) of certain wavelengths or wavelength ranges.
  • Electrical properties of the structure or surface can also provide specific surface functionalities, e.g. For example, the surface can provide transistor functionality and be activated by electromagnetic radiation. Magnetic properties can also provide specific surface functionality.
  • the material of the solid particles, the size of the solid particles, the shape of the solid particles, and/or the proportion of Solid particles in the composite material are selected such that the solid particles have a catalytic, in particular photocatalytic function, an electrically conductive function, a material transport function, and/or an electrode function.
  • the aforementioned selection of the material, size, shape and/or proportion of the solid particles in the composite material can also be made such that certain absorption properties of the structure can be provided, be this in relation to the absorption of substances (e.g. gases, liquids or individual molecules) or the absorption of electromagnetic radiation of certain wavelengths or wavelength ranges (e.g. radar waves or microwaves). This can also apply to the targeted reflection of electromagnetic radiation.
  • What is essential for the present invention is that it is precisely the interaction of the generated (macroscopic) structure with (intrinsic) properties of the introduced solid particles, i.e., for example, the material of the introduced solid particles, the size of the solid particles, the shape of the solid particles, and/or the proportion of solid particles in the composite material, that opens up the possibility of being able to tailor certain of the aforementioned properties (e.g., the specific surface functionalities mentioned).
  • different types of solid particles are used in relation to the material, size and/or shape.
  • the different types of solid particles can be present in predetermined proportions (which can differ from one another) in relation to the matrix material.
  • the use of different types of solid particles increases the multifunctional design of the component, i.e. its multifunctional usability.
  • a functional metal structure is applied to the layer, in particular by vapor deposition or sputtering, wherein the functional metal structure is formed in particular in the form of an island, and wherein the functional metal structure in particular has a plasmonic function and/or a co-catalytic function.
  • the aforementioned properties can also be achieved by the solid particles per se. can be provided, i.e. the application of a separate functional metal structure is not mandatory but only optional.
  • the functional metal structure or the solid particles can be made of gold, silver, platinum, palladium, copper, aluminum, ruthenium, a mixture of the metals listed, or a doped semiconductor compound.
  • Gold and silver in particular have advantageous plasmonic properties.
  • the solid particles can be made of an electrochemically, in particular photoelectrochemically, active material or can provide such a layer.
  • Photoelectrochemistry deals with semiconductor-electrolyte systems when irradiated with light.
  • the semiconductor represents an electrode, as does the layer mentioned here, which together with an electrolyte forms a half-cell.
  • an electron-hole pair is formed, which is involved in a subsequent electrochemical reaction.
  • the component proposed by the invention can thus be used as an electrode in a half-cell.
  • the electrode surface forms the layer on its own, or the layer together with the structure incorporated into it. The latter also causes a more efficient (easier) formation of electron-hole pairs when irradiated with light of certain wavelengths.
  • the layer with the structure introduced therein forms an optical grating, and/or a nanoantenna structure, and/or a conductor, and/or a material transport layer, and/or an electrode.
  • An optical grating can also be called a diffraction grating.
  • the structural elements that form the structure, or the nanostructure or microstructure, form structures for the diffraction of light.
  • the nanoantenna structure can be a plasmonic nanoantenna structure.
  • Plasmonic nanoantennas are metallic structures with typical dimensions that are smaller than the wavelength of light (e.g. from a few tens or hundreds of nanometers to a few micrometers), which allow the optical radiation incident on a surface to be converted into very intense, local fields on the surface itself.
  • the electrons are excited to collective oscillations - the plasmons - which in turn can lead to high field increases at the edges of a subwavelength structure.
  • standing waves form perpendicular to the direction of propagation of the incident light; the evanescent field extends beyond the physical boundaries of the structure.
  • These standing waves can be viewed as two charge carrier density oscillations with opposite directions and therefore canceling impulses.
  • the trigger for the standing wave is the oscillating electric field, the frequency of which is determined by the material and geometry of the nanoantenna. The precise geometry allows for a discrete number of possible resonances.
  • a “conductor” can be understood as an electrical conductor.
  • An electrical conductor is designed to conduct electrical current and is based on the electrical conductivity of the materials used.
  • the layer can also be used to guide (in particular flow guidance) materials (substances).
  • preferential flow surfaces or channels can be defined along which a substance can be transported or flow (directly).
  • the layer can be used to guide fluids such as gases or liquids.
  • the structure can also be used to specifically adjust flow speeds, retention rates, turbulence levels, etc. of fluids.
  • the invention also relates to a structured component as such.
  • the structural layer has a porosity that is specifically adjusted by an initial proportion of solid particles in the composite material and/or by selective removal of matrix material.
  • the structured component can be produced using a method according to the invention.
  • a composite material is applied to the substrate 2 to form a layer 3, wherein the composite material comprises a matrix material M and solid particles F incorporated therein, cf. Fig. 1
  • the solid particles F are distributed in the matrix material M, e.g. dispersed therein.
  • Layer 3 can then harden (not shown).
  • the matrix material M can be removed from layer 3 (at least partially).
  • Fig. 3 shows an example of the component with matrix material M completely removed from layer 3.
  • a structure 4 is introduced into the layer 3 prior to, during and/or subsequent to the curing of the layer 3 in order to form a structural layer 5 from the layer 3.
  • Figure 2 illustrates a structure 4 introduced into layer 3 before removal of the matrix material M.
  • the structure 4 is indicated with dashed lines, here in the form of a triangular structure. Any structural shape is possible.
  • pores can be specifically formed in layer 3 and a porosity can be adjusted accordingly ( Fig. 3 ).

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EP24173407.8A 2023-05-03 2024-04-30 Procédé de fabrication d'un composant structuré et composant structuré Pending EP4458478A3 (fr)

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Application Number Priority Date Filing Date Title
DE102023111441.7A DE102023111441A1 (de) 2023-05-03 2023-05-03 Verfahren zur Herstellung eines strukturierten Bauteils, sowie strukturiertes Bauteil

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EP4458478A2 true EP4458478A2 (fr) 2024-11-06
EP4458478A3 EP4458478A3 (fr) 2025-02-19

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