EP4583642A1 - Procédé de fabrication de carte magnétique et carte magnétique - Google Patents

Procédé de fabrication de carte magnétique et carte magnétique Download PDF

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Publication number
EP4583642A1
EP4583642A1 EP23860048.0A EP23860048A EP4583642A1 EP 4583642 A1 EP4583642 A1 EP 4583642A1 EP 23860048 A EP23860048 A EP 23860048A EP 4583642 A1 EP4583642 A1 EP 4583642A1
Authority
EP
European Patent Office
Prior art keywords
magnetic
layer
mass
resin
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP23860048.0A
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German (de)
English (en)
Inventor
Takayuki Tanaka
Shunsuke Morimoto
Tatsuya HOMMA
Hideki Ooyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
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Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Publication of EP4583642A1 publication Critical patent/EP4583642A1/fr
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
    • H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
    • H01F1/24—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
    • H01F1/26—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors

Definitions

  • the present invention relates to a production method of a magnetic substrate and to a magnetic substrate.
  • a substrate having an inductor is used in many information terminals such as a mobile phone and a smart phone.
  • an independent inductor component has been mounted on a substrate such as a circuit board.
  • Patent Literature 1 a method of forming a coil by a conductor layer of a substrate, and thereby installing an inductor directly on the substrate has been proposed.
  • Patent Literature 1 Japanese Patent Application Laid-open No. 2021-086856
  • the method using the combination of the electroless plating with the electroplating requires many steps relating to formation of the conductor layer.
  • the control items for plating increases, and this leads to a tendency to require a longer time for forming the conductor layer.
  • a strict control is required in the composition of the plating solution that is used as a chemical solution for the electroless plating. Therefore, to control the composition of the plating solution requires much labor, so that the composition control of the plating solution is cumbersome.
  • an object of the present invention is to provide: a production method of a magnetic substrate, including forming a conductor layer on the surface of a magnetic layer by an electroplating; and a magnetic substrate containing a magnetic layer and a conductor layer that is formed on the surface of the magnetic layer by an electroplating.
  • the inventor of the present invention has extensively studied to solve the problems described above. As a result, the inventor of the present invention has found that it is possible to form a conductor layer by an electroplating on the surface of a cured product of a resin composition containing, in combination with (B) a thermosetting resin, (A) a magnetic powder that contains (A-1) an alloy powder with the amount in a particular range. Then, the inventor has found that it is possible to solve the problems described above by using the above-mentioned cured product as the magnetic layer. On the basis of this finding, the present invention has been completed.
  • a production method of a magnetic substrate including forming a conductor layer on the surface of a magnetic layer by an electroplating; and a magnetic substrate including a magnetic layer and a conductor layer formed on the surface of the magnetic layer by an electroplating.
  • resin component in the resin composition means the components excluding inorganic particles such as (A) a magnetic powder from the nonvolatile components included in the resin composition, unless otherwise specifically mentioned.
  • the production method is the production method of the magnetic substrate including a magnetic layer and a conductor layer formed on a surface of the magnetic layer.
  • the magnetic layer contains a cured product of a resin composition containing (A) a magnetic powder and (B) a thermosetting resin.
  • (A) The magnetic powder contains (A-1) an alloy powder with the amount thereof in a particular range. Because it is possible to form a conductor layer on the surface of the magnetic layer described above by an electroplating, it is possible to omit the formation of a conductor layer (seed layer) by an electroless plating. Therefore, the production method according to the present embodiment can include the step (EP) of forming the conductor layer on the surface of the magnetic layer by an electroplating.
  • the aforementioned conductor layer formed on the surface of the magnetic layer by an electroplating may be referred to as "electroplated layer”.
  • the production method of the present embodiment because it is possible to omit the formation of the conductor layer (seed layer) by an electroless plating, the number of the steps can be reduced, thereby enabling to form the electroplated layer conveniently and in a short time.
  • the electroless plating is not required, a chemical solution for the electroless plating is not required. Therefore, there is no need to control the composition of the chemical solution, and thus the process for producing the magnetic substrate can be made simple.
  • a metal ion in a plating solution is reduced and deposited on the surface of the cathode, which serves as the plating target, to form a conductor layer.
  • the reduction of a metal ion requires applying of an electric current, it has been a conventional technical common sense among those skilled in the art that the reduction of the metal ion occurs only on the surface of a cathode formed by a conductor. For example, even when the electroplating is attempted, it has been impossible to form a conductor layer on the surface of a conventional magnetic layer, which has a high volume resistance.
  • the present embodiment it is possible to form the electroplated layer as the conductor layer on the surface of the magnetic layer by the electroplating even though the magnetic layer containing (A) the magnetic powder that contains (A-1) the alloy powder with the amount in a particular range has a greater resistance than the conductor. Even when the magnetic layer according to the present embodiment has the same volume resistance as the conventional magnetic layer, it is possible to form the electroplated layer by the electroplated layer on the surface of the magnetic layer according to the present embodiment containing (A) the magnetic powder that contains (A-1) the alloy powder with the amount in a particular range. This phenomenon is surprising to those skilled in the art.
  • the inventor presumes the mechanism by which the electroplated layer is formed on the surface of the magnetic layer by the electroplating as described above as follows.
  • the alloy powder has electrical conductivity, but all or most of the particles of (A-1) the alloy powder are usually insulated from each other by a resin component. Therefore, the magnetic layer is usually insulating.
  • the particles of (A-1) the alloy powder in (A) the magnetic powder are close to each other in the distance. Then, when a sufficient voltage is applied, an insulation breakdown of the resin component occurs, and thus an electric current can flow between the particles of (A-1) the alloy powder.
  • the alloy powder when there are areas in the magnetic layer where the particles of (A-1) the alloy powder are in contact with each other, these particles of (A-1) the alloy powder can form a conductive path. Through the conductive path, an electric current can flow. When the electric current flows, a metal ion is reduced on the surface of the particles of (A-1) the alloy powder through which the electric current flows, resulting in deposition of the metal on it. Therefore, the electroplating in which the magnetic layer functions as a cathode becomes possible, thereby enabling to form the electroplated layer without conducting the electroless plating.
  • the production method according to the present embodiment may include, before the step (EP), a step (LF) of forming a resin composition layer containing the resin composition and a step (CU) of curing the resulting resin composition layer to form a magnetic layer. Therefore, the production method according to the present embodiment may include the step (LF) of forming a resin composition layer, the step (CU) of curing the resin composition layer to form a magnetic layer, and the step (EP) of forming an electroplated layer on the surface of the magnetic layer by the electroplating, in this order.
  • the production method of the present embodiment it is possible to produce the magnetic substrate without including, between the step (CU) and the step (EP), a step of forming a conductor layer on the surface of the magnetic layer by a method other than the electroplating.
  • the resin composition used in the production method of the magnetic substrate according to one embodiment of the present invention contains (A) a magnetic powder and (B) a thermosetting resin.
  • the resin composition may also contain an optional component in combination with (A) the magnetic powder and (B) the thermosetting resin.
  • the resin composition according to the present embodiment contains (A) a magnetic powder as the component (A).
  • the magnetic powder may be a particle of the material having a relative magnetic permeability of more than 1.
  • the material of (A) the magnetic powder is an inorganic material, and may be any of a soft magnetic material and a hard magnetic material.
  • the material of (A) the magnetic powder may be used singly or in a combination of two or more of them. Therefore, (A) the magnetic powder may be any of a soft magnetic powder, a hard magnetic powder, and a combination of a soft magnetic powder and a hard magnetic powder.
  • the magnetic powder contains a soft magnetic powder, and it is more preferable that (A) the magnetic powder contains only a soft magnetic powder.
  • the magnetic powder may be used singly or in a combination of two or more of them.
  • the magnetic powder contains (A-1) an alloy powder.
  • the alloy powder as the component (A-1) is a particle of an alloy.
  • the alloy powder may include a Fe-Si type alloy powder, a Fe-Si-Al type alloy powder, a Fe-Cr type alloy powder, a Fe-Cr-Si type alloy powder, a Fe-Ni-Cr type alloy powder, a Fe-Cr-Al type alloy powder, a Fe-Ni type alloy powder, a Fe-Ni-Si type alloy powder, a Fe-Ni-B type alloy powder, a Fe-Ni-Mo type alloy powder, a Fe-Ni-Mo-Cu type alloy powder, a Fe-Co type alloy powder, a Fe-Ni-Co type alloy powder, and a Co-based amorphous alloy powder.
  • the alloy that is included in (A-1) the alloy powder may be crystalline, amorphous, or a combination of these.
  • an iron alloy powder as the particle of the alloy containing iron is more preferable.
  • an iron alloy powder containing an element Fe as well as at least one element selected from the group consisting of Ni, Cr, and Si is more preferable; and at least one iron alloy powder selected from the group consisting of a Fe-Ni type alloy powder, a Fe-Cr-Si type alloy powder, and a Fe-Ni-Cr type alloy powder is especially preferable.
  • the Fe-Ni type alloy powder represents the alloy powder containing Fe and Ni.
  • the Fe-Cr-Si type alloy powder represents the alloy powder containing Fe, Cr, and Si.
  • the Fe-Ni-Cr type alloy powder represents the alloy powder containing Fe, Ni, and Cr.
  • these preferable (A-1) alloy powders are used, a magnetic layer having excellent magnetic properties can be obtained, and the electroplated layer can be formed on the surface of the magnetic layer by the electroplating without much problem.
  • the alloy powder As for (A-1) the alloy powder, a commercially available product may be used. Illustrative examples of the commercially available (A-1) the alloy powder may include: "AKT-PB(5)” (Fe-Ni type alloy powder) and “AKT-PB-3Si(5)” (Fe-Ni-Si type alloy powder) manufactured by Mitsubishi Steel Mfg.
  • the alloy powder has an average particle diameter within a particular range.
  • the range of the average particle diameter of (A-1) the alloy powder is preferably 0.001 ⁇ m or more, more preferably 0.01 ⁇ m or more, and still more preferably 0.1 ⁇ m or more, and is preferably 800 ⁇ m or less, more preferably 300 ⁇ m or less, and still more preferably 100 ⁇ m or less.
  • the average particle diameter is the median diameter on a volume basis, unless otherwise specifically mentioned.
  • the average particle diameter can be measured with a laser diffraction scattering method based on the Mie scattering theory. Specifically, the particle diameter distribution thereof is prepared on a volume basis by using a laser diffraction scattering type particle diameter distribution analyzer, in which the median diameter thereof can be measured as the average particle diameter.
  • the powders that are dispersed in water by means of an ultrasonic wave can be suitably used as the measurement sample.
  • Illustrative examples of the laser diffraction scattering type particle diameter distribution analyzer that can be used may include "LA-500" manufactured by Horiba Ltd. and "SALD-2200" manufactured by Shimadzu Corp.
  • the specific surface area of (A-1) the alloy powder is preferably 0.05 m 2 /g or more, more preferably 0.1 m 2 /g or more, and still more preferably 0.3 m 2 /g or more, and is preferably 10 m 2 /g or less, more preferably 8 m 2 /g or less, and still more preferably 5 m 2 /g or less.
  • the specific surface area of (A-1) the alloy powder can be measured by the BET method.
  • the specific surface area can be measured according to the BET method by adsorbing a nitrogen gas onto the sample surface using a specific surface area measurement instrument ("Macsorb HM Model 1210" manufactured by Mountech Co., Ltd.) with the BET multipoint method.
  • a specific surface area measurement instrument Macsorb HM Model 1210 manufactured by Mountech Co., Ltd.
  • the range of the true specific gravity of (A-1) the alloy powder may be, for example, in the range of 4 g/cm 3 to 10 g/cm 3 .
  • the magnetic powder contains (A-1) the alloy powder with the amount in a particular range.
  • the range of the amount (% by mass) of (A-1) the alloy powder relative to 100% by mass of (A) the magnetic powder is usually 30% by mass or more, preferably 40% by mass or more, and more preferably 50% by mass or more; this may be even 60% by mass or more.
  • the upper limit thereof is usually 100% by mass or less.
  • the range of the amount (% by volume) of (A-1) the alloy powder relative to 100% by volume of (A) the magnetic powder is preferably 20% by volume or more, more preferably 30% by volume or more, and still more preferably 40% by volume or more; this may be even 50% by volume or more.
  • the upper limit thereof is usually 100% by volume or less.
  • the amount of each component included in the resin composition on the volume basis may be determined by calculation from the mass of the component included in the resin composition. Specifically, the volume of each component is obtained by dividing the mass with the specific gravity; and the amount based on the volume (% by volume) can be calculated from the volume of each component obtained.
  • the range of the amount (% by mass) of (A-1) the alloy powder relative to 100% by mass of the nonvolatile components in the resin composition is preferably 10% by mass or more, more preferably 15% by mass or more, and still more preferably 20% by mass or more, and is preferably 99% by mass or less, more preferably 98% by mass or less, and still more preferably 97% by mass or less.
  • (A-1) the alloy powder with the amount in the above-mentioned range is used, it is possible to obtain the magnetic layer having excellent magnetic properties, and the electroplated layer can be formed on the surface of the magnetic layer by the electroplating without much problem. Furthermore, preferably it is possible to improve the surface smoothness of the resulting electroplated layer.
  • the range of the amount (% by volume) of (A-1) the alloy powder relative to 100% by volume of the nonvolatile components in the resin composition is preferably 10% by volume or more, more preferably 13% by volume or more, and still more preferably 16% by volume or more, and is preferably 90% by volume or less, more preferably 85% by volume or less, and still more preferably 80% by volume or less.
  • (A-1) the alloy powder with the amount in the above-mentioned range is used, it is possible to obtain the magnetic layer having excellent magnetic properties, and the electroplated layer can be formed on the surface of the magnetic layer by the electroplating without much problem. Furthermore, preferably it is possible to improve the surface smoothness of the resulting electroplated layer.
  • the magnetic powder may contain (A-2) an optional magnetic powder other than (A-1) the alloy powder.
  • the optional magnetic powder may include a magnetic metal oxide powder and a magnetic metal powder other than (A-1) the alloy powder.
  • the magnetic metal oxide powder may include ferrite powders such as a Fe-Mn type ferrite powder, a Fe-Mn-Mg type ferrite powder, a Fe-Mn-Mg-Sr type ferrite powder, a Fe-Mg-Zn type ferrite powder, a Fe-Mg-Sr type ferrite powder, a Fe-Zn-Mn type ferrite powder, a Fe-Cu-Zn type ferrite powder, a Fe-Ni-Zn type ferrite powder, a Fe-Ni-Zn-Cu type ferrite powder, a Fe-Ba-Zn type ferrite powder, a Fe-Ba-Mg type ferrite powder, a Fe-Ba-Ni type ferrite powder, a Fe-Ba-Co type ferrite powder, a Fe-Ba-Ni-Co type ferrite powder, and a Fe-Y type ferrite powder; and iron oxide powders such as an iron (III),
  • the magnetic metal powder other than (A-1) the alloy powder may include, for example, a pure iron powder.
  • the optional magnetic powders a magnetic metal oxide powder is preferable, and a ferrite powder is more preferable.
  • the ferrite powder is formed of a composite oxide containing an iron oxide as the main component, and is chemically stable. Therefore, the ferrite powder offers advantages such as a high corrosion resistance, a low risk of ignition, and a resistance to demagnetization.
  • the ferrite powders containing at least one element selected from the group consisting of Mn and Zn are preferable, and the ferrite powders containing Mn are more preferable, and a Fe-Mn type ferrite powder and a Fe-Mn-Zn type ferrite powder are particularly preferable.
  • the Fe-Mn type ferrite powder represents the ferrite powder containing Fe and Mn
  • the Fe-Mn-Zn type ferrite powder represents the ferrite powder containing Fe, Mn, and Zn.
  • the optional magnetic powder a commercially available product may be used.
  • the optional magnetic powder that is commercially available may include "M001", “M03S”, “M05S”, “MZ03S”, and “MZ05S”, manufactured by Powdertech Co., Ltd.; “AW2-08” manufactured by Epson Atmix Corp.; "LD-M”, “LD-MH”, “KNI-106”, “KNI-106GSM”, “KNI-106GS”, “KNI-109”, and “KNI-109GSM”, manufactured by JFE Chemical Corp.; and "KNS-415", “BSF-547", “BSF-029”, “BSN-125”, “BSN-714", and “BSN-828", manufactured by Toda Kogyo Corp.
  • the optional magnetic powder may be used singly or in a combination of two or more of them.
  • the average particle diameter of (A-2) the optional magnetic powder is not particularly restricted.
  • the average particle diameter of (A-2) the optional magnetic powder is preferably less than the average particle diameter of (A-1) the alloy powder.
  • the optional magnetic powder that is smaller than (A-1) the alloy powder can enter the spaces among the particles of (A-1) the alloy powder. Therefore, the filling density of (A) the magnetic powder in the magnetic layer as a whole is increased, resulting in excellent enhancement of the magnetic properties thereof.
  • the distance between particles of (A-1) the alloy powder is restrained from expanding by the excluding volume of the particles of (A-2) the optional magnetic powder, thereby allowing the electric current to flow more smoothly during the electroplating, which in turn allowing an efficient forming of the electroplated layer.
  • the range of the average particle diameter of (A-2) the optional magnetic powder is preferably 0.001 ⁇ m or more, more preferably 0.01 ⁇ m or more, and still more preferably 0.1 ⁇ m or more, and is preferably 500 ⁇ m or less, more preferably 100 ⁇ m or less, and still more preferably 50 ⁇ m or less.
  • the specific surface area of (A-2) the optional magnetic powder is not particularly restricted. From the viewpoint of enhancing the relative magnetic permeability, the range of the specific surface area of (A-2) the optional magnetic powder is preferably the same as the range of the specific surface area of (A-1) the alloy powder.
  • the shape of (A-2) the optional magnetic powder is not particularly restricted.
  • (A-2) the optional magnetic powder may have the same shape as the particles of (A-1) the alloy powder. Therefore, the range of the aspect ratio of the particle of (A-2) the optional magnetic powder may be the same as the range of the aspect ratio of the particle of (A-1) the alloy powder.
  • the true specific gravity of (A-2) the optional magnetic powder is not particularly restricted.
  • the range of the true specific gravity of (A-2) the optional magnetic powder may be the same as the range of the true specific gravity of (A-1) the alloy powder.
  • the range of the amount (% by mass) of (A) the magnetic powder relative to 100% by mass of the nonvolatile components in the resin composition is preferably 60% by mass or more, more preferably 70% by mass or more, and still more preferably 80% by mass or more, and is preferably 99% by mass or less, more preferably 98% by mass or less, and still more preferably 97% by mass or less.
  • the amount of (A) the magnetic powder as a whole, including (A-1) the alloy powder and (A-2) the optional magnetic powder is within the above-mentioned range, the magnetic layer having excellent magnetic properties can be obtained, and the electroplated layer can be formed on the surface of the magnetic layer by the electroplating without much problem.
  • the range of the amount (% by volume) of (A) the magnetic powder relative to 100% by volume of the nonvolatile components in the resin composition is preferably 30% by volume or more, more preferably 40% by volume or more, and still more preferably 50% by volume or more, and is preferably 90% by volume or less, more preferably 85% by volume or less, and still more preferably 80% by volume or less.
  • the amount of (A) the magnetic powder as a whole, including (A-1) the alloy powder and (A-2) the optional magnetic powder is within the above-mentioned range, the magnetic layer having excellent magnetic properties can be obtained, and the electroplated layer can be formed on the surface of the magnetic layer by the electroplating without much problem.
  • the amount (% by volume) of (A) the magnetic powder is preferably 55% by volume or more.
  • the amount of (A) the magnetic powder is so much as described above, it is possible to densely distribute (A-1) the alloy powder, which serves as the initial deposition point for the metal ion to form the electroplated layer, thereby decreasing the degree of the variation in deposition and realizing the efficient formation of the electroplated layer having a smooth surface.
  • the resin composition according to the present embodiment contains (B) a thermosetting resin as the component (B).
  • the thermosetting resin can bind (A) the magnetic powder.
  • the thermosetting resin can undergo a reaction by heat to form a bond, with which the resin composition can be cured. Therefore, the resin composition containing (A) the magnetic powder and (B) the thermosetting resin in combination can cure to form a cured product.
  • the magnetic layer can be formed by this cured product.
  • thermosetting resin may include an epoxy resin, a phenol type resin, an active ester type resin, an amine type resin, an acid anhydride type resin, a benzoxazine type resin, a cyanate ester type resin, and a carbodiimide type resin.
  • the thermosetting resin may be used singly or in a combination of two or more of them.
  • the thermosetting resin includes (B-1) an epoxy resin.
  • the epoxy resin represents the resin having one or more epoxy groups in the molecule.
  • the epoxy resin may include a bixylenol type epoxy resin; a bisphenol A type epoxy resin; a bisphenol F type epoxy resin; a bisphenol S type epoxy resin; a bisphenol AF type epoxy resin; a dicyclopentadiene type epoxy resin; a trisphenol type epoxy resin; a phenolic novolac type epoxy resin; a glycidylamine type epoxy resin; a glycidyl ester type epoxy resin; a cresol novolac type epoxy resin; a biphenyl type epoxy resin; a linear aliphatic epoxy resin; an epoxy resin containing a butadiene structure; an alicyclic epoxy resin; an alicyclic epoxy resin containing an ester skeleton; a heterocyclic epoxy resin; an epoxy resin containing a spiro
  • the epoxy resin includes an epoxy resin having two or more epoxy groups in one molecule thereof.
  • the ratio of the epoxy resin having two or more epoxy groups in one molecule thereof relative to 100% by mass of the total amount of (B-1) the epoxy resin is preferably 50% by mass or more, more preferably 60% by mass or more, and still more preferably 70% by mass or more.
  • (B-1) the epoxy resin contains an aromatic structure.
  • the aromatic structure is the chemical structure that is generally defined as aromatic, including a polycyclic aromatic ring and an aromatic heterocycle.
  • the epoxy resin there are an epoxy resin that is in the state of liquid at 20°C (hereinafter, this may be referred to as "liquid epoxy resin”) and an epoxy resin that is in the state of solid at 20°C (hereinafter, this may be referred to as "solid epoxy resin”).
  • the epoxy resin may be only the liquid epoxy resin, or only the solid epoxy resin, or a combination of the liquid epoxy resin and the solid epoxy resin.
  • the epoxy resin preferably includes the liquid epoxy resin, and especially preferably includes only the liquid epoxy resin.
  • the liquid epoxy resin having two or more epoxy groups in one molecule thereof is preferable.
  • the liquid epoxy resin is preferably a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a bisphenol AF type epoxy resin, a naphthalene type epoxy resin, a glycidyl ester type epoxy resin, a glycidylamine type epoxy resin, a phenol novolac type epoxy resin, an alicyclic epoxy resin containing an ester skeleton, a cyclohexane type epoxy resin, a cyclohexane dimethanol type epoxy resin, an epoxy resin containing a butadiene structure, an epoxy resin containing an alkyleneoxy skeleton and a butadiene skeleton, an epoxy resin containing a fluorene structure, and a dicyclopentadiene type epoxy resin.
  • a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a glycidylamine type epoxy resin and
  • liquid epoxy resin may include "YX7400” manufactured by Mitsubishi Chemical Corp.; "HP4032”, “HP4032D”, and “HP4032SS”, manufactured by DIC Corp. (naphthalene type epoxy resin); “828US”, “828EL”, “jER828EL”, “825", and “Epikote 828EL”, manufactured by Mitsubishi Chemical Corp. (bisphenol A type epoxy resin); “jER807” and “1750”, manufactured by Mitsubishi Chemical Corp. (bisphenol F type epoxy resin); “jER152” manufactured by Mitsubishi Chemical Corp. (phenol novolac type epoxy resin); "630", “630LSD", and “604", manufactured by Mitsubishi Chemical Corp. (glycidylamine type epoxy resin); “ED-523T” manufactured by Adeka Corp.
  • the solid epoxy resin As for the solid epoxy resin, the solid epoxy resin having three or more epoxy groups in one molecule thereof is preferable; the aromatic solid epoxy resin having three or more epoxy groups in one molecule thereof is more preferable.
  • the solid epoxy resin is preferably a bixylenol type epoxy resin, a naphthalene type epoxy resin, a naphthalene type four-functional epoxy resin, a cresol novolac type epoxy resin, a dicyclopentadiene type epoxy resin, a trisphenol type epoxy resin, a naphthol type epoxy resin, a biphenyl type epoxy resin, a naphthylene ether type epoxy resin, an anthracene type epoxy resin, a bisphenol A type epoxy resin, a bisphenol AF type epoxy resin, or a tetraphenylethane type epoxy resin; among these, the dicyclopentadiene type epoxy resin is especially preferable.
  • the solid epoxy resin may include "HP4032H” manufactured by DIC Corp. (naphthalene type epoxy resin); “HP-4700” and “HP-4710” manufactured by DIC Corp. (naphthalene type four-functional epoxy resin); “N-690” manufactured by DIC Corp. (cresol novolac type epoxy resin); “N-695" manufactured by DIC Corp. (cresol novolac type epoxy resin); "HP-7200”, “HP-7200HH", and “HP-7200H” manufactured by DIC Corp.
  • the mass ratio of the liquid epoxy resin with respect to the solid epoxy resin is preferably 0.5 or more, more preferably 1 or more, still more preferably 5 or more, and still more preferably 10 or more.
  • the epoxy equivalent of (B-1) the epoxy resin is preferably in the range of 50 g/eq. to 5000 g/eq., more preferably in the range of 60 g/eq. to 3000 g/eq., still more preferably in the range of 80 g/eq. to 2000 g/eq., and far still more preferably in the range of 110 g/eq. to 1000 g/eq.
  • the epoxy equivalent is the mass of the resin per one equivalent of the epoxy group.
  • the epoxy equivalent can be measured by the method in accordance with JIS K7236.
  • the weight-average molecular weight (Mw) of (B-1) the epoxy resin is preferably in the range of 100 to 5000, more preferably in the range of 250 to 3000, and still more preferably in the range of 400 to 1500.
  • the weight-average molecular weight of the resin can be measured in terms of polystyrene by a gel permeation chromatography (GPC) method.
  • the range of the amount (% by mass) of (B-1) the epoxy resin included in the resin composition is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, and still more preferably 1% by mass or more, and is preferably 20% by mass or less, more preferably 15% by mass or less, and still more preferably 10% by mass or less, relative to 100% by mass of the nonvolatile components in the resin composition.
  • the amount of (B-1) the epoxy resin is within the above-mentioned range, the magnetic layer having excellent magnetic properties can be obtained, and the electroplated layer can be formed on the surface of the magnetic layer by the electroplating without much problem.
  • the range of the amount (% by mass) of (B-1) the epoxy resin included in the resin composition is preferably 10% by mass or more, more preferably 20% by mass or more, and still more preferably 30% by mass or more, and is preferably 96% by mass or less, more preferably 93% by mass or less, and still more preferably 90% by mass or less, relative to 100% by mass of the resin components in the resin composition.
  • the amount of (B-1) the epoxy resin is within the above-mentioned range, the magnetic layer having excellent magnetic properties can be obtained, and the electroplated layer can be formed on the surface of the magnetic layer by the electroplating without much problem.
  • the range of the amount (% by mass) of (B-1) the epoxy resin included in the resin composition is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, and still more preferably 1% by mass or more, and is preferably 20% by mass or less, more preferably 16% by mass or less, and still more preferably 12% by mass or less, relative to 100% by mass of (A) the magnetic powder.
  • the amount of (B-1) the epoxy resin is within the above-mentioned range, the magnetic layer having excellent magnetic properties can be obtained, and the electroplated layer can be formed on the surface of the magnetic layer by the electroplating without much problem.
  • thermosetting resin contains (B-1) the epoxy resin
  • thermosetting resin contains a resin that is capable of undergoing the reaction with (B-1) the epoxy resin to form a bond.
  • the resin that is capable of undergoing the reaction with (B-1) the epoxy resin to form a bond may be referred to as "(B-2) curing agent".
  • the curing agent may include a phenol type resin, an active ester type resin, an amine type resin, a carbodiimide type resin, an acid anhydride type resin, a benzoxazine type resin, a cyanate ester type resin, and a thiol type resin.
  • the (B-2) curing agent may be used singly or in a combination of two or more of them. In particular, a phenol type resin is preferable.
  • the phenol type resin a resin having one or more, preferably two or more, hydroxyl groups bonding to an aromatic ring such as a benzene ring or a naphthalene ring in one molecule thereof may be used.
  • a phenol type resin containing a novolac structure is preferable.
  • a nitrogen-containing phenol type resin is preferable, and a phenol type resin containing a triazine skeleton is more preferable.
  • a phenol novolac resin containing a triazine skeleton is preferable.
  • phenol type resin may include "MEH-7700”, “MEH-7810", “MEH-7851”, and “MEH-8000H”, manufactured by Meiwa Plastic Industries, Ltd.; “NHN”, “CBN”, and “GPH”, manufactured by Nippon Kayaku Co., Ltd.; “SN-170”, “SN-180”, “SN-190”, “SN-475”, “SN-485”, “SN-495”, “SN-495V”, “SN-375”, and “SN-395”, manufactured by Nippon Steel Chemical & Material Co., Ltd.; "TD-2090”, “TD-2090-60M", “LA-7052", “LA-7054”, “LA-1356", “LA-3018”, “LA-3018-50P”, “EXB-9500”, "HPC-9500”, "KA-1160”, “KA-1163”, and “KA-1165”, manufactured by DIC Corp.; and “GDP-6115L”, “GDP-6115H”, and “ELPC75”, manufactured by Gunei Chemical Industry Co., Ltd.
  • the active ester type resin a compound having one or more, and preferably two or more, active ester groups in one molecule thereof may be used.
  • the compound having two or more highly reactive ester groups in one molecule thereof are preferable as the active ester type resin, such as a phenol ester type compound, a thiophenol ester type compound, an N-hydroxylamine ester type compound, and an ester compound of a heterocyclic hydroxy compound.
  • the active ester type resin is preferably the compound that is obtained by condensation reaction of a carboxylic acid compound and/or a thiocarboxylic acid compound with a hydroxy compound and/or a thiol compound.
  • an active ester type resin obtained from a carboxylic acid compound and a hydroxy compound is preferable, while an active ester type resin obtained from a carboxylic acid compound and a phenol compound and/or a naphthol compound is more preferable.
  • the carboxylic acid compound may include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, and pyromellitic acid.
  • Illustrative examples of the phenol compound or the naphthol compound may include hydroquinone, resorcin, bisphenol A, bisphenol F, bisphenol S, phenolphthalin, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o-cresol, m-cresol, p-cresol, catechol, ⁇ -naphthol, ⁇ -naphthol, 1,5-dihydroxy naphthalene, 1,6-dihydroxy naphthalene, 2,6-dihydroxy naphthalene, dihydroxy benzophenone, trihydroxy benzophenone, tetrahydroxy benzophenone, phloroglucin, benzene triol, a dicyclopentadiene type diphenol compound, and phenol novolac.
  • the "dicyclopentadiene type diphenol compound” means a diphenol compound obtained by condensation of one dicyclopentadiene molecule with two phenol molecules
  • amine type resin may include 4,4'-methylenebis(2,6-dimethylaniline), diphenyl diaminosulfone, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl sulfone, 3,3'-diaminodiphenyl sulfone, m-phenylenediamine, m-xylylenediamine, diethyltoluenediamine, 4,4'-diaminodiphenyl ether, 3,3'-dimethyl-4,4'-diaminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dihydroxybenzidine, 2,2-bis(3-amino-4-hydroxyphenyl)propane, 3,3-dimethyl-5,5-diethyl-4,4-diphenylmethanediamine, 2,2-bis(4-aminophenyl)propan
  • the number of the active groups in (B-2) the curing agent is preferably 0.01 or more, more preferably 0.1 or more, and still more preferably 0.5 or more, and is preferably 10 or less, more preferably 5 or less, and still more preferably 2 or less, relative to one epoxy group in (B-1) the epoxy resin.
  • the active group in (B-2) the curing agent is, for example, an active hydroxy group; they are different depending on the curing agent.
  • the number of the epoxy groups in (B-1) the epoxy resin is the total value obtained by dividing the mass of each epoxy resin with the epoxy equivalent and adding the divided values for all the epoxy resins.
  • the number of the active groups in (B-2) the curing agent is the total value obtained by dividing the mass of each curing agent with the active group equivalent and adding the divided values for all the curing agents.
  • the reactive diluent may contain a reactive group such as an epoxy group and an active group as described earlier.
  • a reactive group such as an epoxy group and an active group as described earlier.
  • preferable reactive group contained in the reactive diluent may include an epoxy group, an acrylic group, a methacrylic group, and an oxetane group. Among these, an epoxy group is especially preferable. Therefore, it is preferable to use (B-1) the epoxy resin having a low viscosity as the reactive diluent.
  • Illustrative examples of the reactive diluent that is commercially available may include “EX-201" (cyclic aliphatic glycidyl ether), “EX-830” and “EX-821” (ethylene glycol type epoxy resin), “EX-212” (hexanediol type epoxy resin), and “ZX1658” and “ZX1658GS” (liquid 1,4-glycidylcyclohexane), manufactured by Nippon Steel Chemical & Material Co., Ltd.; "EP-3980S” (glycidylamine type epoxy resin), “EP-4088S” and “EP-4088L” (dicyclopentadiene type epoxy resin), and “ED-509S” (tert-butylphenyl glycidyl ether), manufactured by ADEKA Corp.; and “X-22-163" (siloxane type epoxy resin) manufactured by Shin-Etsu Chemical Co., Ltd.
  • the reactive diluent may be used singly or
  • the amount (% by mass) of the reactive diluent included in the resin composition is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, and still more preferably 1% by mass or more, and is preferably 20% by mass or less, more preferably 10% by mass or less, and still more preferably 7% by mass or less, relative to 100% by mass of the nonvolatile components in the resin composition.
  • the amount (% by mass) of the reactive diluent included in the resin composition is preferably 5% by mass or more, more preferably 10% by mass or more, and still more preferably 20% by mass or more, and is preferably 80% by mass or less, more preferably 70% by mass or less, and still more preferably 60% by mass or less, relative to 100% by mass of the resin components in the resin composition.
  • the amount (% by mass) of the reactive diluent included in the resin composition is preferably 5% by mass or more, more preferably 10% by mass or more, and still more preferably 20% by mass or more, and is preferably 90% by mass or less, more preferably 80% by mass or less, and still more preferably 70% by mass or less, relative to 100% by mass of (B) the thermosetting resin.
  • the weight-average molecular weight (Mw) of (B) the thermosetting resin may usually be in the same range as that of the weight-average molecular weight of (B-1) the epoxy resin described above.
  • the range of the amount (% by mass) of (B) the thermosetting resin included in the resin composition is preferably 0.1% by mass or more, more preferably 1% by mass or more, and still more preferably 2% by mass or more, and is preferably 15% by mass or less, more preferably 13% by mass or less, and still more preferably 10% by mass or less, relative to 100% by mass of the nonvolatile components in the resin composition.
  • the amount of (B) the thermosetting resin is within the above-mentioned range, the magnetic layer having excellent magnetic properties can be obtained, and the electroplated layer can be formed on the surface of the magnetic layer by the electroplating without much problem.
  • the range of the amount (% by mass) of (B) the thermosetting resin included in the resin composition is preferably 40% by mass or more, more preferably 50% by mass or more, and still more preferably 60% by mass or more, and is preferably 98% by mass or less, more preferably 94% by mass or less, and still more preferably 90% by mass or less, relative to 100% by mass of the resin components in the resin composition.
  • the amount of (B) the thermosetting resin is within the above-mentioned range, the magnetic layer having excellent magnetic properties can be obtained, and the electroplated layer can be formed on the surface of the magnetic layer by the electroplating without much problem.
  • the curing accelerator may include a phosphorous type curing accelerator, an amine type curing accelerator, an imidazole type curing accelerator, a guanidine type curing accelerator, and a metal type curing accelerator. Among these, an imidazole type curing accelerator is preferable.
  • the curing accelerator may be used singly or in a combination of two or more of them.
  • Illustrative examples of the polycarbonate resin may include a hydroxy group-containing carbonate resin, a phenolic hydroxy group-containing carbonate resin, a carboxy group-containing carbonate resin, an acid anhydride group-containing carbonate resin, an isocyanate group-containing carbonate resin, and a urethane group-containing carbonate resin.
  • Specific examples of the polycarbonate resin may include "FPC0220” manufactured by Mitsubishi Gas Chemical Company, Inc., "T6002" and “T6001” (polycarbonate diol) manufactured by Asahi Kasei Chemicals; and "C-1090", “C-2090", and “C-3090” (polycarbonate diol) manufactured by Kuraray Co., Ltd.
  • the amount (% by mass) of (D) the thermoplastic resin included in the resin composition may be 0% by mass, or more than 0% by mass, and is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, and still more preferably 0.1% by mass or more, and is preferably 5% by mass or less, more preferably 3% by mass or less, and still more preferably 1% by mass or less, relative to 100% by mass of the nonvolatile components in the resin composition.
  • a polyether phosphate ester type dispersant is preferable.
  • the polyether phosphate ester type dispersant is the phosphate ester type dispersant containing a poly(alkyleneoxy) structure in the molecule.
  • Illustrative examples of the polyether phosphate ester type dispersant may include a polyoxyalkylene alkyl ether phosphate ester and a polyoxyalkylene alkyl phenyl ether phosphate ester. Among these, the polyoxyalkylene alkyl ether phosphate ester is preferable.
  • Illustrative examples of the alkyl group may include a decyl group, an undecyl group, a dodecyl group, a tridecyl group, a tetradecyl group, a pentadecyl group, a hexadecyl group, a heptadecyl group, and an octadecyl group.
  • the polyoxyalkylene alkyl ether phosphate ester has a plurality of alkyl-oxy-poly(alkyleneoxy) groups
  • a plurality of alkyl groups may be the same or different.
  • a plurality of alkylene groups may be the same or different.
  • Illustrative examples of the commercially available phosphate ester type dispersant may include polyether phosphate ester type dispersants (e.g., "ED152”, “ED153”, “ED154”, “ED118”, “ED174”, and “ED251" of the HIPLAAD series), all being manufactured by Kusumoto Chemicals, Ltd.; and "RS-410", “RS-610", and “RS-710” of the Phosphanol series manufactured by Toho Chemical Industry Co., Ltd.
  • polyether phosphate ester type dispersants e.g., "ED152”, “ED153”, “ED154”, “ED118”, “ED174”, and "ED251" of the HIPLAAD series
  • Illustrative examples of the polyoxyalkylene type dispersant may include a polyoxyethylene alkyl ether, a polyoxyethylene alkyl ester, a polyoxyethylene sorbitan fatty acid ester, a polyoxyethylene alkyl phenyl ether, a polyoxyethylene alkylamine, and a polyoxyethylene alkylamide.
  • Illustrative examples of the commercially available polyoxyalkylene type dispersant may include "AKM-0531", “AFB-1521”, “SC-0505K”, “SC-1015F”, “SC-0708A”, and "HKM-50A" of the "Malialim” series manufactured by NOF Corp.
  • Illustrative examples of the acetylene type dispersant may include acetylene glycol.
  • Illustrative examples of the commercially available acetylene type dispersant may include "82", “104", “440”, “465", “485", and "Olefin Y" of the "Surfynol” series manufactured by Air Products and Chemicals Inc.
  • the resin composition may further contain (G) a solvent as the volatile component in combination with the nonvolatile components such as the components (A) to (F) described above.
  • An organic solvent is usually used as (G) the solvent.
  • the organic solvent may include: ketone type solvents such as acetone, methyl ethyl ketone (MEK), methyl isobutyl ketone, and cyclohexanone; ester type solvents such as methyl acetate, ethyl acetate, butyl acetate, isobutyl acetate, isoamyl acetate, methyl propionate, ethyl propionate, and ⁇ -butyrolactone; ether type solvents such as tetrahydropyran, tetrahydrofuran, 1,4-dioxane, diethyl ether, diisopropyl ether, dibutyl ether, and diphenyl ether; alcohol type solvents such as
  • the cured product of the resin composition according to the present embodiment can have a high relative magnetic permeability ⁇ '.
  • the range of the relative magnetic permeability ⁇ ' of the cured product is preferably 10 or more, more preferably 12 or more, and still more preferably 15 or more.
  • the upper limit of the relative magnetic permeability ⁇ ' is not particularly restricted; the upper limit may be, for example, 35 or less, 30 or less, or 25 or less.
  • the electroplated layer can be formed by the electroplating on the surface of the magnetic layer containing the cured product of the resin composition without much problem.
  • the magnetic loss tangent tan ⁇ of the cured product can be measured at the measurement frequency of 20 MHz and at a room temperature of 23°C.
  • the resin composition is cured for the measurement of the magnetic loss tangent tan ⁇
  • the cured product as a measurment sample can be obtained by thermally curing the resin composition under the conditions of 190°C for 90 minutes.
  • the specific measurment method of the magnetic loss tangent tan ⁇ the method to be described later in [Examples] may be employed.
  • the liquid resin composition such as the magnetic paste and the magnetic ink has fluidity; thus, it may be suitably used to form the magnetic layer by means of a printing method.
  • the liquid resin composition is preferably in a liquid form at 23°C.
  • the viscosity of the liquid resin composition at 23°C is preferably 20 Pa ⁇ s or more, more preferably 25 Pa ⁇ s or more, still more preferably 30 Pa ⁇ s or more, and especially preferably 50 Pa ⁇ s or more, and is preferably 200 Pa ⁇ s or less, more preferably 180 Pa ⁇ s or less, and still more preferably 160 Pa ⁇ s or less.
  • Illustrative examples of the support may include a film formed of a plastic material, metal foil, and a releasing paper, in which the film formed of a plastic material and the metal foil are preferable.
  • a releasing layer-attached support having a releasing layer on the surface to be bonded with the resin composition layer may be used.
  • the releasing agent to be used in the releasing layer of the releasing layer-attached support may be one or more releasing agents selected from the group consisting of, for example, an alkyd type releasing agent, a polyolefin type releasing agent, a urethane type releasing agent, and a silicone type releasing agent.
  • a commercially available product may be used as for the releasing layer-attached support.
  • Illustrative examples thereof may include “PET501010”, “SK-1”, “AL-5”, and “AL-7”, all being manufactured by Lintec Inc.; “Lumirror T60” manufactured by Toray Industries, Inc.; “PUREX” manufactured by Teijin Limited; and “UNIPEEL” manufactured by Unitika, Ltd., all of which are PET films having the releasing layer composed of mainly a silicone type releasing agent or an alkyd resin type releasing agent.
  • the thickness of the support is preferably 1 ⁇ m or more, more preferably 5 ⁇ m or more, and still more preferably 10 ⁇ m or more, and is preferably 75 ⁇ m or less, more preferably 60 ⁇ m or less, and still more preferably 50 ⁇ m or less.
  • the thickness of the entire releasing layer-attached support is within the above-mentioned range.
  • the application of the resin composition may be performed using coating equipment such as a die coater. Drying may be carried out, for example, by a drying method such as heating or blowing a hot air.
  • the drying condition is not particularly restricted. Drying is carried out in such a way as to bring the content of the solvent in the resin composition layer preferably to 10% by mass or less, and more preferably to 5% by mass or less. Drying may be performed, for example, under the conditions of 50°C to 150°C and 3 minutes to 10 minutes, although these conditions may vary depending on the boiling point of the solvent.
  • the production method of the magnetic substrate according to the present embodiment may include, before the step (EP), a step (LF) of forming the resin composition layer.
  • a step (LF) of forming the resin composition layer At the step (LF), usually the resin composition layer is formed on a suitable substrate.
  • this substrate may be referred to as "inner layer substrate”.
  • a member including a supporting substrate may be used as the inner layer substrate.
  • the supporting substrate may include insulating substrates such as a glass epoxy substrate, a metal substrate, a polyester substrate, a polyimide substrate, a BT resin substrate, and a thermosetting type polyphenylene ether substrate.
  • the inner layer substrate may be provided with a conductor layer such as a wiring layer and an electrode layer, as needed.
  • the conductor layer that is included in the inner layer substrate may be referred to as "substrate conductor layer".
  • the substrate conductor layer may be formed on one surface of the supporting substrate, or on both surfaces of the supporting substrate, or inside the supporting substrate.
  • the substrate conductor layer a layer formed of a metal such as copper may be mentioned.
  • the inner layer substrate may have a hole formed therein such as a through hole, as needed.
  • the hole formed in the inner layer substrate may be referred to as "first hole".
  • the first hole may be formed by a processing method such as a drilling, a laser irradiation, or a plasma irradiation. If necessary, the substrate conductor layer may be formed on the surface of the inner layer substrate in the first hole.
  • the resin composition layer may be formed by applying the resin composition onto the inner layer substrate.
  • the resin composition layer may be formed by applying the resin composition onto the inner layer substrate using an applicator such as a dispenser and a die coater.
  • the resin composition layer may also be formed by applying the resin composition layer onto the inner layer substrate by a printing method such as a full-area printing or a pattern printing.
  • the resin composition layer may be formed on the inner layer substrate by laminating the resin sheet and the inner layer substrate such that the resin composition layer is bonded to the inner layer substrate. Bonding of the resin composition layer to the inner layer substrate can be performed, for example, by a hot-press bonding of the resin sheet to the inner layer substrate from the side of the support.
  • a hot-press bonding member may include a heated metal plate (such as a stainless (SUS) mirror plate) or a heated metal roll (such as a SUS roll).
  • the hot-press bonding member is not pressed in direct contact with the resin sheet but pressed via a sheet or the like formed of an elastic material such as a heat-resistant rubber in such a way that the resin sheet can well follow the irregularity on the surface of the inner layer substrate.
  • the temperature at the time of the hot-press bonding is preferably in the range of 80°C to 160°C, more preferably in the range of 90°C to 140°C, and still more preferably 100°C to 120°C.
  • the pressure at the time of the hot-press bonding is preferably in the range of 0.098 MPa to 1.77 MPa, and more preferably in the range of 0.29 MPa to 1.47 MPa.
  • the period at the time of the hot-press bonding is preferably in the range of 20 seconds to 400 seconds, and more preferably in the range of 30 seconds to 300 seconds. It is preferable that the bonding of the resin sheet to the inner layer substrate is conducted under the reduced pressure condition of 26.7 hPa or less.
  • Bonding of the resin composition layer of the resin sheet to the inner layer substrate may be performed by a commercially available vacuum laminator.
  • the commercially available vacuum laminator may include a vacuum pressing laminator manufactured by Meiki Co., Ltd. and a vacuum applicator manufactured by Nikko-Materials Co., Ltd.
  • the laminated resin sheet may be subjected to a flattening treatment, for example, by pressing the hot-press bonding member from the side of the support under a normal pressure (under an atmospheric pressure).
  • the pressing conditions of the flattening treatment may be the same as the hot-press bonding conditions in the aforementioned lamination.
  • the flattening treatment can be performed using a commercially available laminator.
  • the lamination and the flattening treatments may be performed continuously by using the aforementioned commercially available vacuum laminator.
  • the support is usually removed after the step (LF).
  • the removal of the support may be performed before the step (CU) or after the step (CU), and it is preferable to perform before the step (EP).
  • the step (LF) may include forming of the resin composition layer in the first hole.
  • the resin composition layer is formed by filling the resin composition into the first hole.
  • the formation of the resin composition layer in the first hole may be performed by applying the resin composition in the form of liquid onto the inner layer substrate having the first hole formed therein to fill the first hole with the resin composition.
  • the formation of the resin composition layer in the first hole may be performed by laminating the inner layer substrate having the first hole formed therein with the resin sheet to fill the first hole with the resin composition.
  • the magnetic layer may be subjected to a heat treatment before the polishing in order to further increase the curing degree of the cured product included in the magnetic layer.
  • the aforementioned curing temperature may be applied.
  • the heat treatment temperature is preferably 120°C or higher, more preferably 130°C or higher, and still more preferably 150°C or higher, and is preferably 245°C or lower, more preferably 220°C or lower, and still more preferably 200°C or lower.
  • the heat treatment time is preferably 5 minutes or longer, more preferably 10 minutes or longer, and still more preferably 15 minutes or longer, and is preferably 90 minutes or shorter, more preferably 70 minutes or shorter, and still more preferably 60 minutes or shorter.
  • the production method of the magnetic substrate according to the present embodiment may include, before the step (EP), a step (HF) of forming a hole in the magnetic layer.
  • the hole formed in the magnetic layer may be referred to as "second hole”.
  • the formation of the second hole is carried out after the step (CU).
  • the formation of the second hole may be performed before polishing at the step (PO), but is usually performed after the polishing at the step (PO).
  • the second hole may include, for example, a via hole and a through hole.
  • the second hole in the case where the second hole is formed in the magnetic layer that is formed in the first hole of the inner layer substrate, the second hole may be a through hole that penetrates through the magnetic layer.
  • the second hole in the case where the second hole is formed in the magnetic layer that is formed on the main surface of the inner layer substrate, the second hole may be a via hole that penetrates through the magnetic layer but does not penetrate through the inner layer substrate, or may be a through hole that penetrates through both the magnetic layer and the inner layer substrate.
  • the second hole may be formed by the processing method such as a drilling, a laser processing, a plasma irradiation, or an etching.
  • the production method of the magnetic substrate according to the present embodiment may include a step (RO) of subjecting the magnetic layer to a roughening treatment before the step (EP).
  • the roughening treatment is usually performed after the step (PO).
  • the roughening treatment is usually performed after the step (HF).
  • the roughening treatment causes the surface roughness of the magnetic layer to be increased thereby enhancing the adhesion strength between the magnetic layer and the electroplated layer.
  • a resin residue (smear) that may be formed during the formation of the second hole can be removed.
  • the roughening treatment may be performed by a wet process, but a dry process is preferable. As for the dry roughening treatment, for example, a plasma treatment may be mentioned.
  • the production method of the magnetic substrate according to the present embodiment includes a step (EP) of forming the electroplated layer as the conductor layer on the surface of the magnetic layer by the electroplating.
  • the electroplated layer is formed on the surface of the magnetic layer usually in a plating solution that is a solution containing a metal ion.
  • the magnetic layer and an electrode are placed in a plating solution, and a direct current is applied between the magnetic layer and the electrode from a power source.
  • the metal ion is reduced on the surface of the magnetic layer, and the resulting metal is deposited to form the electroplated layer containing the metal.
  • the metal to be used for the electroplating copper is preferable.
  • an aqueous solution of a metal salt is used as the plating solution.
  • the metal salt may include copper sulfate such as copper sulfate pentahydrate, copper halide such as copper chloride, copper acetate, copper nitrate, copper tetrafluoroborate, copper alkylsulfonate, copper arylsulfonate, copper sulfamate, copper perchlorate, and copper gluconate.
  • copper sulfate is preferable.
  • the concentration of the metal salt in the plating solution may be, for example, 50 g/L or more and 400 g/L or less.
  • the concentration of the metal salt in the plating solution is more preferably a saturate concentration.
  • the plating solution contains an acid.
  • the acid may include sulfuric acid; hydrochloric acid; acetic acid; nitric acid; phosphoric acid; fluoroboric acid; alkanesulfonic acids such as methanesulfonic acid, ethanesulfonic acid, propanesulfonic acid, and trifluoromethanesulfonic acid; arylsulfonic acids such as benzenesulfonic acid, p-toluenesulfonic acid, and sulfamic acid; hydrobromic acid; perchloric acid; and chromic acid.
  • sulfuric acid methanesulfonic acid, ethanesulfonic acid, propanesulfonic acid, hydrochloric acid, and a combination of these acids are preferable; sulfuric acid is more preferable.
  • the concentration of the acid in the plating solution may be, for example, 1 mL/L or more and 400 mL/L or less.
  • the concentration of sulfuric acid is preferably 40 mL/L or more, and preferably 200 mL/L or less.
  • the plating solution may contain an additive.
  • the additive that the plating solution may contain may include a halide ion provider, a brightening agent, and a surfactant.
  • Illustrative examples of the halide ion provider may include chloride compounds such as sodium chloride and potassium chloride.
  • the concentration of the halide ion provider in the plating solution may be, for example, 0.5 mg/L or more and 300 mg/L or less.
  • the brightening agent may include organosulfur compounds such as bis(3-sulfopropyl) disulfide salt.
  • the concentration of the brightening agent in the plating solution may be, for example, 0.1 ppm or more and 1000 ppm or less.
  • Illustrative examples of the surfactant may include an anionic surfactant, a cationic surfactant, and a nonionic surfactant.
  • the concentration of the surfactant in the plating solution may be, for example, 1 mL/L or more and 60 mL/L or less.
  • the temperature of the plating solution is not restricted as long as the electroplated layer can be formed; and the temperature is preferably 2°C or higher, more preferably 10°C or higher, and still more preferably 15°C or higher, and is preferably 80°C or lower, more preferably 50°C or lower, and still more preferably 30°C or lower.
  • the current density of the current applied during the electroplating is not restricted as long as the electroplated layer can be formed; and the current density is preferably 0.5 A/dm 2 or more, more preferably 1.0 A/dm 2 or more, and is preferably 8.0 A/dm 2 or less, and more preferably 7.0 A/dm 2 or less.
  • the electroplating may be performed with flowing the plating solution.
  • the flowing speed of the plating solution may be, for example, 3 cm/sec or more and 200 cm/sec or less.
  • the electroplated layer can be formed directly on the surface of the magnetic layer.
  • the term "directly" used in the formation of the electroplated layer on the surface of the magnetic layer means that there is no other layer between the magnetic layer and the electroplated layer, and thereby the magnetic layer and the electroplated layer are in contact with each other. There is an interface formed between the magnetic layer and the electroplated layer that are in contact with each other, but usually there is no plating catalyst at the interface.
  • a plating catalyst such as palladium, gold, silver, or platinum remains between the magnetic layer and the conductor layer. Therefore, the electroplated layer can be distinguished from the conductor layer formed by the electroless plating with the existence of the plating catalyst.
  • the electroplating described above it is possible to form the electroplated layer without forming a thin conductor layer (seed layer) by the electroless plating. Therefore, the electroless plating can be omitted, and it is possible to reduce the number of the steps in the production method of the magnetic substrate. From the viewpoint of effectively utilizing this advantage, it is preferable that, between the step (CU) of curing the resin composition layer to form the magnetic layer and the step (EP) of forming the electroplated layer on the surface of the magnetic layer, the production method of the magnetic substrate according to the present embodiment does not include the step of forming the conductor layer on the surface of the magnetic layer by a method other than the electroplating.
  • the step (EP) of forming the electroplated layer may include forming the electroplated layer by the electroplating on the surface in the second hole of the magnetic layer. From the viewpoint of promoting the formation of the electroplated layer in the second hole, it is preferable to perform the electroplating with flowing the plating solution so that the plating solution can easily enter the second hole. From the viewpoint of further increase the efficiency in formation of the electroplated layer in the second hole, an ultrasonic wave may be applied to the plating solution.
  • the production method of the magnetic substrate according to the present embodiment may include a step (annealing step) of subjecting the magnetic layer and the electroplated layer to an annealing treatment after the electroplating.
  • the treatment temperature range for the annealing treatment is preferably 150°C or higher, more preferably 160°C or higher, and still more preferably 170°C or higher, and is preferably 260°C or lower, more preferably 250°C or lower, and still more preferably 240°C or lower.
  • the treatment time range for the annealing treatment is preferably 10 minutes or longer, more preferably 20 minutes or longer, and still more preferably 30 minutes or longer, and is preferably 10 hours or shorter, more preferably 5 hours or shorter, and still more preferably 2 hours or shorter.
  • the annealing treatment may be performed in an inert atmosphere such as a nitrogen gas atmosphere. By performing the annealing treatment, it is possible to increase the adhesion strength between the magnetic layer and the electroplated layer.
  • the thickness of the electroplated layer is preferably 1 ⁇ m or more, more preferably 3 ⁇ m or more, and still more preferably 5 ⁇ m or more, and is preferably 70 ⁇ m or less, more preferably 60 ⁇ m or less, and still more preferably 50 ⁇ m or less.
  • the production method of the magnetic substrate may include, for example, a step of forming an optional conductor layer.
  • the production method of the magnetic substrate may include a step for forming the optional conductor layer.
  • Illustrative examples of the method for forming the optional conductor layer may include a plating method, a sputtering method, and a vapor deposition method.
  • the optional conductor layer may be processed into an intended wiring pattern by a suitable method such as a semi-additive method or a full-additive method.
  • the production method of the magnetic substrate may include, for example, a step of forming an optional insulating layer.
  • the optional insulating layer may be formed when the electroplated layer is desired to be insulated from other conductor layers.
  • an insulating layer that fills the second hole may be formed.
  • the insulating layer may be formed by a curd product of a thermosetting resin composition or by a curd product of a photo-curable resin composition.
  • the insulating layer may be formed by forming a layer of a thermosetting resin composition or a layer of a photo-curable resin composition on the magnetic substrate, which is followed by curing this layer.
  • the formation of the magnetic layer and the formation of the electroplated layer, as well as the formation of the optional conductor layer and the formation of the optional insulating layer described above may be repeated.
  • the magnetic layer and the electroplated layer may be alternately built up by repeating the formation of the magnetic layer and the formation of the electroplated layer.
  • the magnetic substrate produced by the production method described above includes the magnetic layer and the electroplated layer formed on the surface of this magnetic layer.
  • the structure of the magnetic substrate as long as this has the magnetic layer and the electroplated layer. Therefore, there is no restriction with regard to the use of the magnetic substrate to be produced by the production method described above.
  • the magnetic substrate includes the magnetic layer having the second hole formed therein and the electroplated layer formed in the second hole.
  • FIG. 1 to FIG. 12 are schematic cross-sectional views to explain each steps of the production method of the magnetic substrate according to one example.
  • the production method of the magnetic substrate according to this example includes the step of preparing an inner layer substrate 10, as illustrated in FIG. 1 .
  • the plate-shaped inner layer substrate 10 including a supporting substrate 11 and substrate conductor layers 12 formed on both sides of the supporting substrate 11 will be described.
  • the production method of the magnetic substrate includes the step of forming a first hole 10H as the through hole in the inner layer substrate 10, as illustrated in FIG. 2 .
  • the first hole 10H is formed so as to penetrate through the inner layer substrate 10 in the thickness direction.
  • the diameter may be, for example, in the range of 200 ⁇ m to 800 ⁇ m.
  • the production method of the magnetic substrate includes the step of forming a resin composition layer 20 in the first hole 10H of the inner layer substrate 10 (step (LF)), as illustrated in FIG. 3 .
  • step (LF) the step of forming a resin composition layer 20 in the first hole 10H of the inner layer substrate 10
  • main surfaces 20U and 20D of the resin composition layer 20 formed at the opening of the first hole 10H are often raised, so that they are not flat.
  • the production method of the magnetic substrate includes the step of polishing the resin composition layer 20 (step (PO)), as illustrated in FIG. 4 .
  • the polishing removes the excess resin composition protruding or adhering to the outside of the first hole 10H, so that the main surfaces 20U and 20D of the resin composition layer 20 can be flattened.
  • the main surface 20U of the resin composition layer 20 after polishing is flush with one main surface 10U of the inner layer substrate 10
  • the main surface 20D of the resin composition layer 20 after polishing is flush with the other main surface 10D of the inner layer substrate 10.
  • flush for a plurality of surfaces means that these surfaces are in the same plane.
  • the production method of the magnetic substrate includes the step of curing the resin composition layer 20 to obtain a magnetic layer 30 (step (CU)), as illustrated in FIG. 5 .
  • step (CU) a magnetic layer 30
  • an example is described in which curing is performed after polishing of the resin composition layer 20, but polishing of the magnetic layer 30 may be performed after this magnetic layer 30 is obtained by curing the resin composition layer 20.
  • the production method of the magnetic substrate includes the step of forming a second hole 30H as the through hole in the magnetic layer 30 (step (HF)), as illustrated in FIG. 6 .
  • the second hole 30H is formed so as to penetrate through the magnetic layer 30 in the thickness direction.
  • the diameter of the second hole 30H may be formed smaller than the diameter of the first hole 10H. Specifically, there is no particular restriction with regard to the dimension thereof.
  • the production method of the magnetic substrate includes the step of forming an electroplated layer 40 on a surface 30S of the magnetic layer 30 (step (EP)), as illustrated in FIG. 7 .
  • the magnetic layer 30 includes, as a surface 30S not bonded to the inner layer substrate 10, main surfaces 30U and 30D formed at the opening of the first hole 10H, and a hole inner circumferential surface 30I formed in the second hole 30H.
  • the electroplated layer 40 is usually formed on both the main surfaces 30U and 30D of the magnetic layer 30 and on the hole inner circumferential surface 30I.
  • the whole of the second hole 30H may be filled by the electroplated layer 40, but there may be the case that part of the second hole 30H is not filled.
  • the production method of the magnetic substrate according to this example may include the step of forming an insulating layer 50 in that part in the electroplated layer 40 that is not filled by the electroplated layer 40, as illustrated in FIG. 8 .
  • the insulating layer 50 may be formed, for example, by filling the part with a curable resin such as a thermosetting resin composition or a photo-curable resin composition followed by curing it.
  • the insulating layer 50 may be polished.
  • the electroplated layer 40 may be polished at the same time.
  • the main surface 10U of the inner layer substrate 10, the main surface 30U of the magnetic layer 30, the main surface 40U of the electroplated layer 40, and the main surface 50U of the insulating layer 50 are made to be flush with each other.
  • the main surface 10D of the inner layer substrate 10, the main surface 30D of the magnetic layer 30, the main surface 40D of the electroplated layer 40, and the main surface 50D of the insulating layer 50 are made to be flush with each other.
  • the production method of the magnetic substrate may include the step of forming an optional conductor layer 60 on the inner layer substrate 10, on the magnetic layer 30, on the electroplated layer 40, and on the insulating layer 50, as illustrated in FIG. 10 .
  • the optional conductor layer 60 may be formed, for example, by an electroless plating and by an electroplating.
  • an etching resist 70 having an intended pattern is formed on the optional conductor layer 60, as illustrated in FIG. 11 .
  • the substrate conductor layer 12, the electroplated layer 40, and the optional conductor layer 60 in the area not covered by the etching resist 70 are removed, and then the etching resist 70 is removed.
  • FIG. 12 is the schematic cross-sectional view of the magnetic substrate according to one example.
  • the magnetic substrate 100 illustrated in FIG. 12 can be obtained.
  • the conductor layers such as the substrate conductor layer 12, the electroplated layer 40, and the optional conductor layer 60 in a helical shape as a whole
  • an inductor can be formed by these conductor layers, so that an inductor built-in substrate can be obtained as the magnetic substrate 100.
  • the production method according to this example may further form a conductor layer other than the substrate conductor layer 12, the electroplated layer 40, and the optional conductor layer 60.
  • the magnetic substrate 100 includes the magnetic layer 30 having the second hole 30H formed therein and the electroplated layer 40 formed on the surface 30S of this magnetic layer 30.
  • the electroplated layer 40 is formed in the second hole 30H. Because the electroplated layer 40 is formed without conducting an electroless plating, the electroplated layer 40 formed in the second hole 30H is in direct contact with the magnetic layer 30. There is no plating catalyst for the electroless plating at the interface between the electroplated layer 40 and the magnetic layer 30 (corresponding to the hole inner circumferential surface 30I), which are in contact as described above. Formation of the conductor layer without using the plating catalyst on the surface of the magnetic layer in the second hole formed in the magnetic layer has not been realized by a conventional technology. Therefore, the aforementioned magnetic substrate 100 has not been unknown, neither in its production method nor in its structure.
  • the magnetic substrate described above may be used, for example, to produce an inductor component.
  • the inductor component includes the magnetic substrate described above.
  • the inductor component usually has an inductor pattern formed of the conductor layers such as the substrate conductor layer, the electroplated layer, and the optional conductor layer, in at least part around the magnetic layer described above.
  • the inductor component described above for example, the one described in Japanese Patent Application Laid-open No. 2016-197624 may be used.
  • the inductor component includes the inductor built-in substrate described above.
  • the inductor component may be used as a wiring board to mount an electronic component such as a semiconductor chip, and may also be used as a (multilayered) printed wiring board that uses this wiring board as an inner layer substrate.
  • this may also be used as a chip inductor component obtained by dicing the wiring board, and may also be used as a printed wiring board having the chip inductor component surface-mounted.
  • the semiconductor device including the wiring board may be suitably used in electric products (for example, a computer, a mobile phone, a digital camera, and a television), vehicles (for example, a motor bike, an automobile, a train, a marine ship, and an airplane), and so forth.
  • electric products for example, a computer, a mobile phone, a digital camera, and a television
  • vehicles for example, a motor bike, an automobile, a train, a marine ship, and an airplane
  • the amount of the ferrite powder (“M03S” manufactured by Powdertech, Inc.; Fe-Mn type ferrite; average particle diameter of 0.5 ⁇ m; specific gravity of 5.1 m 2 /g) was changed from 22.09 parts by mass to 30.00 parts by mass.
  • the amount of the alloy powder (“AKT-PB(5)” manufactured by Mitsubishi Steel Mfg. Co., Ltd.; Fe-Ni type alloy; average particle diameter of 5.0 ⁇ m; specific gravity of 8.0 m 2 /g) was changed from 73.74 parts by mass to 30.00 parts by mass.
  • a magnetic varnish 2 was produced in the same way as in Example 1 except for the above-mentioned matters.
  • the amount of the ferrite powder (“M03S” manufactured by Powdertech, Inc.; Fe-Mn type ferrite; average particle diameter of 0.5 ⁇ m; specific gravity of 5.1 m 2 /g) was changed from 22.09 parts by mass to 50.00 parts by mass.
  • the amount of the alloy powder (“AKT-PB(5)” manufactured by Mitsubishi Steel Mfg. Co., Ltd.; Fe-Ni type alloy; average particle diameter of 5.0 ⁇ m; specific gravity of 8.0 m 2 /g) was changed from 73.74 parts by mass to 22.00 parts by mass.
  • a magnetic varnish 3 was produced in the same way as in Example 1 except for the above-mentioned matters.
  • a magnetic varnish 4 was produced in the same way as in Example 1, except that 22.09 parts by mass of the ferrite powder ("M03S” manufactured by Powdertech, Inc.; Fe-Mn type ferrite; average particle diameter of 0.5 ⁇ m; specific gravity of 5.1 m 2 /g) was changed to 30.92 parts by mass of the alloy powder (fine alloy powder "CVD Iron Powder” manufactured by JFE Mineral & Alloy Co., Ltd., Fe-Cr-Si type alloy, average particle diameter of 0.7 ⁇ m, specific gravity of 6.9 m 2 /g).
  • M03S manufactured by Powdertech, Inc.
  • Fe-Mn type ferrite average particle diameter of 0.5 ⁇ m; specific gravity of 5.1 m 2 /g
  • the alloy powder fine alloy powder "CVD Iron Powder” manufactured by JFE Mineral & Alloy Co., Ltd., Fe-Cr-Si type alloy, average particle diameter of 0.7 ⁇ m, specific gravity of 6.9 m 2 /g.
  • a magnetic varnish 5 was produced in the same way as in Example 1, except that 22.09 parts by mass of the ferrite powder ("M03S” manufactured by Powdertech, Inc.; Fe-Mn type ferrite; average particle diameter of 0.5 ⁇ m; specific gravity of 5.1 m 2 /g) was changed to 22.09 parts by mass of the ferrite powder ("MZ03S” manufactured by Powdertech, Inc.; Fe-Mn-Zn type ferrite, average particle diameter of 0.5 ⁇ m, specific gravity of 5.1 m 2 /g).
  • M03S manufactured by Powdertech, Inc.
  • Fe-Mn type ferrite average particle diameter of 0.5 ⁇ m; specific gravity of 5.1 m 2 /g
  • a magnetic varnish 6 was produced in the same way as in Example 1, except that 73.74 parts by mass of the alloy powder ("AKT-PB(5)” manufactured by Mitsubishi Steel Mfg. Co., Ltd.; Fe-Ni type alloy; average particle diameter of 5.0 ⁇ m; specific gravity of 8.0 m 2 /g) was changed to 73.74 parts by mass of the alloy powder ("AKT-PB-3Si(5)” manufactured by Mitsubishi Steel Mfg. Co., Ltd.; Fe-Ni-Si type alloy; average particle diameter of 5.0 ⁇ m; specific gravity of 8.0 m 2 /g).
  • the alloy powder (“AKT-PB(5)” manufactured by Mitsubishi Steel Mfg. Co., Ltd.; Fe-Ni type alloy; average particle diameter of 5.0 ⁇ m; specific gravity of 8.0 m 2 /g)
  • a magnetic varnish 7 was produced in the same way as in Example 1, except that 73.74 parts by mass of the alloy powder ("AKT-PB(5)” manufactured by Mitsubishi Steel Mfg. Co., Ltd.; Fe-Ni type alloy; average particle diameter of 5.0 ⁇ m; specific gravity of 8.0 m 2 /g) was changed to 50.00 parts by mass of the alloy powder ("AW2-08 PF3F” manufactured by Epson Atmix Corp.; Fe-Si-Cr type alloy; average particle diameter of 3.0 ⁇ m; specific gravity of 6.9 m 2 /g) .
  • the alloy powder (“AKT-PB(5)” manufactured by Mitsubishi Steel Mfg. Co., Ltd.; Fe-Ni type alloy; average particle diameter of 5.0 ⁇ m; specific gravity of 8.0 m 2 /g) was changed to 50.00 parts by mass of the alloy powder (“AW2-08 PF3F” manufactured by Epson Atmix Corp.; Fe-Si-Cr type alloy; average particle diameter of 3.0 ⁇ m; specific gravity of 6.9 m 2
  • the amount of the ferrite powder (“M03S” manufactured by Powdertech, Inc.; Fe-Mn type ferrite; average particle diameter of 0.5 ⁇ m; specific gravity of 5.1 m 2 /g) was changed from 22.09 parts by mass to 50.00 parts by mass.
  • the amount of the alloy powder (“AKT-PB(5)” manufactured by Mitsubishi Steel Mfg. Co., Ltd.; Fe-Ni type alloy; average particle diameter of 5.0 ⁇ m; specific gravity of 8.0 m 2 /g) was changed from 73.74 parts by mass to 8.00 parts by mass. Besides, 3 parts by mass of the solvent (cyclohexanone) was not used.
  • a magnetic varnish 10 was produced in the same way as in Example 1 except for the above-mentioned matters.
  • a PET film (“Lumirror R80” manufactured by Toray Industries, Inc.; thickness of 38 ⁇ m; softening temperature of 130°C; hereinafter, this may be referred to as "release PET") that had been subjected to releasing treatment with an alkyd resin type releasing agent ("AL-5" manufactured by Lintec Inc.) was prepared as the support.
  • the resin varnishes 1 to 7 and 10 produced in Examples 1 to 7 and Comparative Example 1 each were applied using a die coater such that the thickness of the resin composition layer after drying would become 100 ⁇ m, which was then followed by drying at 65°C to 115°C (average 100°C) for 7 minutes to obtain a resin sheet.
  • Both sides of a double-sided copper clad epoxy resinimpregnated glass cloth substrate ("R5715ES” manufactured by Panasonic Corp.; thickness of the copper foil: 18 ⁇ m, thickness of the substrate: 0.3 mm) were etched by 1 ⁇ m using a micro-etching agent ("CZ8100” manufactured by MEC Co., Ltd.) for roughening the copper surface to prepare the inner layer substrate.
  • a micro-etching agent (“CZ8100” manufactured by MEC Co., Ltd.)
  • a regular square sheet piece of a 200 mm square was cut out.
  • the cut-out sheet piece (200 mm square) was laminated onto both surfaces of the inner layer substrate by using a batch-type vacuum pressure laminator (two-stage build-up laminator, "CVP700” manufactured by Nikko-Materials Co., Ltd.) such that the resin composition layer would be in contact with the center of the inner layer substrate.
  • the lamination was carried out by evacuating over 30 seconds to bring the pressure to 13 hPa or less, followed by press-bonding with the pressure of 0.74 MPa at 100°C for 30 seconds. Then, after heating at 130°C for 30 minutes, this was further heated at 180°C for 30 minutes to thermally cure the resin composition layer to form the magnetic layer.
  • the surface of the resulting magnetic layer was buff-polished.
  • copper sulfate electroplating was applied as electroplating.
  • the electroplating was performed using the magnetic layer as the cathode and a copper plate as the anode, by flowing an electric current with a current density of 2.0 A/dm 2 in a copper sulfate solution as the plating solution for 60 minutes.
  • the composition of the plating solution was as follows.
  • the annealing treatment was performed at 180°C for 60 minutes to obtain an evaluation substrate.
  • the resulting evaluation substrate was observed to determine whether or not the conductor layer (electroplated layer) was formed on the surface of the magnetic layer.
  • the evaluation was made “Good” when the electroplated layer was formed over the entire surface of the magnetic layer, and "Not Good” when the electroplated layer was not formed.
  • Both sides of a double-sided copper clad epoxy resinimpregnated glass cloth substrate ("R5715ES” manufactured by Panasonic Corp.; thickness of the copper foil: 18 ⁇ m, thickness of the substrate: 0.3 mm) were etched by 1 ⁇ m using a micro-etching agent ("CZ8100” manufactured by MEC Co., Ltd.) for roughening the copper surface to prepare the inner layer substrate.
  • a micro-etching agent (“CZ8100” manufactured by MEC Co., Ltd.)
  • Magnetic property test 1 measurement of relative magnetic permeability and magnetic loss tangent of magnetic layer obtained from resin sheet>
  • the lamination was carried out by evacuating over 30 seconds to bring the pressure to 13 hPa or less, followed by press-bonding with the pressure of 0.74 MPa at 100°C for 30 seconds. With this lamination, a multi-layer film having a layered structure of support/resin composition layer/polyimide film was obtained.
  • the resin composition layer was heated at 190°C for 90 minutes for thermal curing.
  • the polyimide film was then removed to obtain the sheet-shaped cured product.
  • This cured product corresponds to the magnetic layer obtained from the resin sheet.
  • the resulting sheet-shaped cured product was cut to obtain the doughnut-shaped evaluation sample having the outer diameter of 19.2 mm and the inner diameter of 8.2 mm.
  • the relative magnetic permeability ( ⁇ ') and the magnetic loss tangent (tan ⁇ ) of the evaluation sample were measured using a magnetic material test fixture "16454A" manufactured by Keysight Technologies Inc. and an impedance analyzer "E4991B” manufactured by Keysight Technologies Inc. at the measurement frequency of 20 MHz and at a room temperature of 23°C.
  • Magnetic property test 2 measurement of relative magnetic permeability and magnetic loss tangent of magnetic layer obtained from magnetic paste or magnetic ink>
  • PET film (“PET501010", manufactured by Lintech Corp., thickness of 50 ⁇ m) having been treated with a silicone type release agent was prepared as the support.
  • the magnetic paste produced in Example 8 and the magnetic ink produced in Example 9 each were uniformly applied onto the release surface of the above-mentioned PET film using a doctor blade such that the thickness of the magnetic layer after curing would be 100 ⁇ m to obtain a resin sheet including the support and the resin composition layer.
  • the resulting resin sheet was heated at 190°C for 90 minutes to thermally cure the resin composition layer.
  • the support was then removed to obtain a sheet-shaped cured product.
  • This cured product corresponds to the magnetic layer obtained from the magnetic paste or from the magnetic ink.
  • the resulting sheet-shaped cured product was cut to obtain the doughnut-shaped evaluation sample having the outer diameter of 19.2 mm and the inner diameter of 8.2 mm.
  • the relative magnetic permeability ( ⁇ ') and the magnetic loss tangent (tan ⁇ ) of the evaluation sample were measured using a magnetic material test fixture "16454A" manufactured by Keysight Technologies Inc. and an impedance analyzer "E4991B” manufactured by Keysight Technologies Inc. at the measurement frequency of 20 MHz and at a room temperature of 23°C.
  • the arithmetic average roughness values Ra of the electroplated layers formed in the electroplating test 1 and the electroplating test 2 described above were obtained using a non-contact surface roughness meter (WYKO NT3300 manufactured by Veeco Instruments Inc.) with VSI mode using a lens of 50 magnifications with the measurement area of 121 ⁇ m ⁇ 92 ⁇ m; from this, the Ra value was determined. The value was determined as the average value of 10 randomly selected areas.

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EP23860048.0A 2022-09-02 2023-08-16 Procédé de fabrication de carte magnétique et carte magnétique Pending EP4583642A1 (fr)

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