EP4596142A4 - Kupferpulver, kupferpaste damit und verfahren zur herstellung eines leitfähigen films - Google Patents

Kupferpulver, kupferpaste damit und verfahren zur herstellung eines leitfähigen films

Info

Publication number
EP4596142A4
EP4596142A4 EP23872525.3A EP23872525A EP4596142A4 EP 4596142 A4 EP4596142 A4 EP 4596142A4 EP 23872525 A EP23872525 A EP 23872525A EP 4596142 A4 EP4596142 A4 EP 4596142A4
Authority
EP
European Patent Office
Prior art keywords
copper
producing
conductive film
paste
copper powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP23872525.3A
Other languages
English (en)
French (fr)
Other versions
EP4596142A1 (de
Inventor
Mizuki Akizawa
Hiroki Sawamoto
Takafumi Sasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Kinzoku Co Ltd
Original Assignee
Mitsui Kinzoku Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Kinzoku Co Ltd filed Critical Mitsui Kinzoku Co Ltd
Publication of EP4596142A1 publication Critical patent/EP4596142A1/de
Publication of EP4596142A4 publication Critical patent/EP4596142A4/de
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/052—Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/07—Metallic powder characterised by particles having a nanoscale microstructure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/09—Mixtures of metallic powders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
    • B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/0425—Copper-based alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Nanotechnology (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Conductive Materials (AREA)
EP23872525.3A 2022-09-29 2023-09-28 Kupferpulver, kupferpaste damit und verfahren zur herstellung eines leitfähigen films Pending EP4596142A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022157049 2022-09-29
PCT/JP2023/035411 WO2024071303A1 (ja) 2022-09-29 2023-09-28 銅粉及びこれを含む銅ペースト並びに導電膜の製造方法

Publications (2)

Publication Number Publication Date
EP4596142A1 EP4596142A1 (de) 2025-08-06
EP4596142A4 true EP4596142A4 (de) 2026-01-21

Family

ID=90478056

Family Applications (1)

Application Number Title Priority Date Filing Date
EP23872525.3A Pending EP4596142A4 (de) 2022-09-29 2023-09-28 Kupferpulver, kupferpaste damit und verfahren zur herstellung eines leitfähigen films

Country Status (5)

Country Link
EP (1) EP4596142A4 (de)
JP (1) JP7498378B1 (de)
CN (1) CN119816388A (de)
TW (1) TW202423573A (de)
WO (1) WO2024071303A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025070074A1 (ja) * 2023-09-28 2025-04-03 古河ケミカルズ株式会社 銅粉の製造方法および導電性ペーストの製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012117146A (ja) * 2010-11-12 2012-06-21 Mitsui Mining & Smelting Co Ltd 低炭素銅粒子
JP2015168878A (ja) * 2014-03-10 2015-09-28 三井金属鉱業株式会社 銅粉
JP2021025115A (ja) * 2019-08-08 2021-02-22 三井金属鉱業株式会社 銅粒子
WO2021199512A1 (ja) * 2020-03-31 2021-10-07 三井金属鉱業株式会社 銅粒子及びその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4227373B2 (ja) 2001-08-07 2009-02-18 三井金属鉱業株式会社 フレーク銅粉及びそのフレーク銅粉を用いた銅ペースト
JP2007234330A (ja) * 2006-02-28 2007-09-13 Tdk Corp 導電体ペーストおよび電子部品
WO2015122251A1 (ja) 2014-02-14 2015-08-20 三井金属鉱業株式会社 銅粉
WO2018168186A1 (ja) * 2017-03-15 2018-09-20 日立化成株式会社 接合用金属ペースト、接合体及びその製造方法、並びに半導体装置及びその製造方法
SG11202109544SA (en) * 2019-03-29 2021-10-28 Mitsui Mining & Smelting Co Bonding material and bonded structure

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012117146A (ja) * 2010-11-12 2012-06-21 Mitsui Mining & Smelting Co Ltd 低炭素銅粒子
JP2015168878A (ja) * 2014-03-10 2015-09-28 三井金属鉱業株式会社 銅粉
JP2021025115A (ja) * 2019-08-08 2021-02-22 三井金属鉱業株式会社 銅粒子
WO2021199512A1 (ja) * 2020-03-31 2021-10-07 三井金属鉱業株式会社 銅粒子及びその製造方法

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
See also references of WO2024071303A1 *
SHIN YONG MOO ET AL: "Formation of Sub-Micrometer-Sized Cu Particles by Wet Chemical Processing Under Air Using Hydrazine Hydrate", JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, AMERICAN SCIENTIFIC PUBLISHERS, US, vol. 16, no. 11, 1 November 2016 (2016-11-01), pages 11523 - 11528, XP009540140, ISSN: 1533-4880, DOI: 10.1166/JNN.2016.13544 *

Also Published As

Publication number Publication date
WO2024071303A1 (ja) 2024-04-04
TW202423573A (zh) 2024-06-16
CN119816388A (zh) 2025-04-11
JP7498378B1 (ja) 2024-06-11
EP4596142A1 (de) 2025-08-06
JPWO2024071303A1 (de) 2024-04-04

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