EP4596142A4 - Poudre de cuivre, pâte de cuivre la contenant, et procédé de production de film conducteur - Google Patents

Poudre de cuivre, pâte de cuivre la contenant, et procédé de production de film conducteur

Info

Publication number
EP4596142A4
EP4596142A4 EP23872525.3A EP23872525A EP4596142A4 EP 4596142 A4 EP4596142 A4 EP 4596142A4 EP 23872525 A EP23872525 A EP 23872525A EP 4596142 A4 EP4596142 A4 EP 4596142A4
Authority
EP
European Patent Office
Prior art keywords
copper
producing
conductive film
paste
copper powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP23872525.3A
Other languages
German (de)
English (en)
Other versions
EP4596142A1 (fr
Inventor
Mizuki Akizawa
Hiroki Sawamoto
Takafumi Sasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Kinzoku Co Ltd
Original Assignee
Mitsui Kinzoku Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Kinzoku Co Ltd filed Critical Mitsui Kinzoku Co Ltd
Publication of EP4596142A1 publication Critical patent/EP4596142A1/fr
Publication of EP4596142A4 publication Critical patent/EP4596142A4/fr
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/052—Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/07—Metallic powder characterised by particles having a nanoscale microstructure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/09—Mixtures of metallic powders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
    • B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/0425—Copper-based alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Nanotechnology (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Conductive Materials (AREA)
EP23872525.3A 2022-09-29 2023-09-28 Poudre de cuivre, pâte de cuivre la contenant, et procédé de production de film conducteur Pending EP4596142A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022157049 2022-09-29
PCT/JP2023/035411 WO2024071303A1 (fr) 2022-09-29 2023-09-28 Poudre de cuivre, pâte de cuivre la contenant, et procédé de production de film conducteur

Publications (2)

Publication Number Publication Date
EP4596142A1 EP4596142A1 (fr) 2025-08-06
EP4596142A4 true EP4596142A4 (fr) 2026-01-21

Family

ID=90478056

Family Applications (1)

Application Number Title Priority Date Filing Date
EP23872525.3A Pending EP4596142A4 (fr) 2022-09-29 2023-09-28 Poudre de cuivre, pâte de cuivre la contenant, et procédé de production de film conducteur

Country Status (5)

Country Link
EP (1) EP4596142A4 (fr)
JP (1) JP7498378B1 (fr)
CN (1) CN119816388A (fr)
TW (1) TW202423573A (fr)
WO (1) WO2024071303A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025070074A1 (fr) * 2023-09-28 2025-04-03 古河ケミカルズ株式会社 Procédé de production de poudre de cuivre et procédé de production de pâte conductrice

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012117146A (ja) * 2010-11-12 2012-06-21 Mitsui Mining & Smelting Co Ltd 低炭素銅粒子
JP2015168878A (ja) * 2014-03-10 2015-09-28 三井金属鉱業株式会社 銅粉
JP2021025115A (ja) * 2019-08-08 2021-02-22 三井金属鉱業株式会社 銅粒子
WO2021199512A1 (fr) * 2020-03-31 2021-10-07 三井金属鉱業株式会社 Particules de cuivre et leur procédé de production

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4227373B2 (ja) 2001-08-07 2009-02-18 三井金属鉱業株式会社 フレーク銅粉及びそのフレーク銅粉を用いた銅ペースト
JP2007234330A (ja) * 2006-02-28 2007-09-13 Tdk Corp 導電体ペーストおよび電子部品
WO2015122251A1 (fr) 2014-02-14 2015-08-20 三井金属鉱業株式会社 Poudre de cuivre
WO2018168186A1 (fr) * 2017-03-15 2018-09-20 日立化成株式会社 Pâte métallique pour liaison, corps lié ainsi que procédé de fabrication de celui-ci, et dispositif à semi-conducteurs ainsi que procédé de fabrication de celui-ci
SG11202109544SA (en) * 2019-03-29 2021-10-28 Mitsui Mining & Smelting Co Bonding material and bonded structure

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012117146A (ja) * 2010-11-12 2012-06-21 Mitsui Mining & Smelting Co Ltd 低炭素銅粒子
JP2015168878A (ja) * 2014-03-10 2015-09-28 三井金属鉱業株式会社 銅粉
JP2021025115A (ja) * 2019-08-08 2021-02-22 三井金属鉱業株式会社 銅粒子
WO2021199512A1 (fr) * 2020-03-31 2021-10-07 三井金属鉱業株式会社 Particules de cuivre et leur procédé de production

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
See also references of WO2024071303A1 *
SHIN YONG MOO ET AL: "Formation of Sub-Micrometer-Sized Cu Particles by Wet Chemical Processing Under Air Using Hydrazine Hydrate", JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, AMERICAN SCIENTIFIC PUBLISHERS, US, vol. 16, no. 11, 1 November 2016 (2016-11-01), pages 11523 - 11528, XP009540140, ISSN: 1533-4880, DOI: 10.1166/JNN.2016.13544 *

Also Published As

Publication number Publication date
WO2024071303A1 (fr) 2024-04-04
TW202423573A (zh) 2024-06-16
CN119816388A (zh) 2025-04-11
JP7498378B1 (ja) 2024-06-11
EP4596142A1 (fr) 2025-08-06
JPWO2024071303A1 (fr) 2024-04-04

Similar Documents

Publication Publication Date Title
EP4596142A4 (fr) Poudre de cuivre, pâte de cuivre la contenant, et procédé de production de film conducteur
EP3761203A4 (fr) Procédé de traitement d'informations, noeud de chaîne de blocs et appareil électronique
EP4059619A4 (fr) Composition de revêtement aqueux, article revêtu, et procédé de formation de film de revêtement multicouche
EP4572541A4 (fr) Procédé de fabrication de feuille stratifiée plaquée de feuille métallique, composition de résine, feuille composite de résine, procédé de fabrication de carte de circuit imprimé et procédé de fabrication de dispositif semi-conducteur
EP4227029A4 (fr) Poudre métallique pour fabrication additive, procédé de fabrication d'un article fabriqué par fabrication additive l'utilisant, et article fabriqué par fabrication additive
EP4407673A4 (fr) Matériau de moulage par compression de liquide, composant électronique, dispositif à semi-conducteur et procédé de production de dispositif à semi-conducteur
EP4143024C0 (fr) Procédé de production d'un film composite multicouche, film composite multicouche, et utilisation associée
EP3689923A4 (fr) Procédé et dispositif de préparation d'un polymère de composé aromatique de vinyle-composé de cyanure de vinyle
EP4116062C0 (fr) Composition de résine pour la production de feuilles étirées, feuille étirée et procédé de production de feuille étirée
EP3887435C0 (fr) Procédé de production de film ou de revêtement comprenant un nanomatériau cellulosique
EP4474142A4 (fr) Stratifié métallique souple de type rouleau, son procédé de fabrication, et carte de circuit imprimé comprenant un stratifié métallique souple
EP3958818C0 (fr) Film pour le blanchiment des dents, procédé de fabrication et méthode pour l'utilisation d'un tel film.
EP4317269A4 (fr) Film, procédé de production de film et composition de polymère à base de propylène
ATE290460T1 (de) Verfahren zur herstellung eines elektrisch leitenden filmes
EP4205886A4 (fr) Poudre de cuivre sous forme de paillettes revêtues d'argent et procédé pour la fabrication de celle-ci
EP4299799A4 (fr) Film contenant de l'argent et son procédé de production
EP3952671C0 (fr) Procédé de fabrication d'un film de génération d'aérosol
EP3781380C0 (fr) Module électrique ou électronique ainsi que procédé de production d'une pièce électrique ou électronique
EP4427938A4 (fr) Film barrière multicouche, son procédé de production et matériau d'emballage le comprenant
EP4495991A4 (fr) Substrat de dissipation thermique, carte de circuit à dissipation thermique, élément de dissipation thermique et procédé de fabrication de substrat de dissipation thermique
EP3998153A4 (fr) Film long, procédé de production de film long, procédé de production de corps multicouche long et corps multicouche long
EP4410452A4 (fr) Poudre d'argent, pâte électroconductrice, procédé de production de poudre d'argent et poudre d'argent mélangée
EP4503902A4 (fr) Film piézoélectrique conducteur, dispositif et procédé de production de film piézoélectrique conducteur
EP4148224C0 (fr) Cadre de fenêtre avec moyen d'assemblage ayant une grande précision de positionnement et son procédé de fabrication
EP4180417A4 (fr) Composé alcoxyde, matériau de formation de couche mince et procédé de fabrication de couche mince

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20250305

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR

XX Miscellaneous (additional remarks)

Free format text: THE APPLICANT HAS FILED A TEXT WITH WHICH IT IS INTENDED TO BRING THE TRANSLATION INTO CONFORMITY WITH THE APPLICATION AS FILED (ART. 14(2) EPC).

REG Reference to a national code

Ref country code: DE

Ref legal event code: R079

Free format text: PREVIOUS MAIN CLASS: B22F0001000000

Ipc: B22F0001052000

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
RAP3 Party data changed (applicant data changed or rights of an application transferred)

Owner name: MITSUI KINZOKU COMPANY, LIMITED

A4 Supplementary search report drawn up and despatched

Effective date: 20251222

RIC1 Information provided on ipc code assigned before grant

Ipc: B22F 1/052 20220101AFI20251216BHEP

Ipc: B22F 1/00 20220101ALI20251216BHEP

Ipc: B22F 1/07 20220101ALI20251216BHEP

Ipc: B22F 1/102 20220101ALI20251216BHEP

Ipc: B22F 7/04 20060101ALI20251216BHEP

Ipc: B22F 9/00 20060101ALI20251216BHEP

Ipc: C22C 1/04 20230101ALI20251216BHEP

Ipc: C22C 9/00 20060101ALI20251216BHEP

Ipc: H01B 1/00 20060101ALI20251216BHEP

Ipc: H01B 1/02 20060101ALI20251216BHEP

Ipc: H01B 1/22 20060101ALI20251216BHEP