EP4632115A4 - Solution d'électroplacage d'or et utilisation correspondante - Google Patents

Solution d'électroplacage d'or et utilisation correspondante

Info

Publication number
EP4632115A4
EP4632115A4 EP23910890.5A EP23910890A EP4632115A4 EP 4632115 A4 EP4632115 A4 EP 4632115A4 EP 23910890 A EP23910890 A EP 23910890A EP 4632115 A4 EP4632115 A4 EP 4632115A4
Authority
EP
European Patent Office
Prior art keywords
electroplatting
gold
solution
gold electroplatting
electroplatting solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP23910890.5A
Other languages
German (de)
English (en)
Other versions
EP4632115A1 (fr
Inventor
Chang You Ren
Tong Wang
Chuan Deng
Song Liu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Publication of EP4632115A1 publication Critical patent/EP4632115A1/fr
Publication of EP4632115A4 publication Critical patent/EP4632115A4/fr
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
EP23910890.5A 2022-12-29 2023-12-29 Solution d'électroplacage d'or et utilisation correspondante Pending EP4632115A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202211706098.3A CN116240597B (zh) 2022-12-29 2022-12-29 电镀金镀液及其应用
PCT/CN2023/143014 WO2024140976A1 (fr) 2022-12-29 2023-12-29 Solution d'électroplacage d'or et utilisation correspondante

Publications (2)

Publication Number Publication Date
EP4632115A1 EP4632115A1 (fr) 2025-10-15
EP4632115A4 true EP4632115A4 (fr) 2026-04-22

Family

ID=86626865

Family Applications (1)

Application Number Title Priority Date Filing Date
EP23910890.5A Pending EP4632115A4 (fr) 2022-12-29 2023-12-29 Solution d'électroplacage d'or et utilisation correspondante

Country Status (3)

Country Link
EP (1) EP4632115A4 (fr)
CN (1) CN116240597B (fr)
WO (1) WO2024140976A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116240597B (zh) * 2022-12-29 2024-03-26 华为技术有限公司 电镀金镀液及其应用

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0867528A1 (fr) * 1997-03-27 1998-09-30 Allgemeine Gold- Und Silberscheideanstalt Ag Electrolyte sous forme de gel comportant un métal noble
US20160145756A1 (en) * 2014-11-21 2016-05-26 Rohm And Haas Electronic Materials Llc Environmentally friendly gold electroplating compositions and methods
CN106460213A (zh) * 2014-06-11 2017-02-22 美泰乐科技(日本)股份有限公司 氰系电解镀金浴及使用其的凸点形成方法
CN111705343A (zh) * 2020-07-24 2020-09-25 深圳市铭轩珠宝首饰有限公司 一种k金制品用电铸液及其应用
CN113832508A (zh) * 2021-09-30 2021-12-24 深圳市联合蓝海黄金材料科技股份有限公司 无氰电镀金镀液及其应用和电镀制金凸块的方法以及金凸块和电子部件

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009150915A1 (fr) * 2008-06-11 2009-12-17 日本高純度化学株式会社 Solution de dorure électrolytique et pellicule d’or obtenue en utilisant ladite solution
CN104862752B (zh) * 2015-06-12 2016-02-17 深圳市联合蓝海投资控股集团有限公司 改性无氰镀金液及其应用和硬质黄金的制备方法
CN106521464B (zh) * 2016-12-02 2019-03-15 长沙理工大学 一种还原化学镀金液以及镍钯金镀金方法
CN107419307A (zh) * 2017-09-29 2017-12-01 佛山市春暖花开科技有限公司 一种碱性氰化金的电镀液
CN114892225B (zh) * 2021-09-30 2023-03-14 深圳市联合蓝海黄金材料科技股份有限公司 用于在镍镀层上电镀金的镀液和在镍镀层上电镀金的方法和镀金件与应用
CN114717618B (zh) * 2022-04-26 2023-01-31 深圳市联合蓝海黄金材料科技股份有限公司 无氰电镀金浴及其应用、半导体镀金件及其制备方法
CN114703520B (zh) * 2022-04-27 2023-03-31 深圳市联合蓝海黄金材料科技股份有限公司 无氰电镀金液及其制备方法和应用、镀金件及其制备方法
CN115928161B (zh) * 2022-12-29 2024-08-27 华为技术有限公司 电镀金镀液及其应用、金凸块及其制备方法、电子部件和电子设备
CN116240597B (zh) * 2022-12-29 2024-03-26 华为技术有限公司 电镀金镀液及其应用

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0867528A1 (fr) * 1997-03-27 1998-09-30 Allgemeine Gold- Und Silberscheideanstalt Ag Electrolyte sous forme de gel comportant un métal noble
CN106460213A (zh) * 2014-06-11 2017-02-22 美泰乐科技(日本)股份有限公司 氰系电解镀金浴及使用其的凸点形成方法
US20160145756A1 (en) * 2014-11-21 2016-05-26 Rohm And Haas Electronic Materials Llc Environmentally friendly gold electroplating compositions and methods
CN111705343A (zh) * 2020-07-24 2020-09-25 深圳市铭轩珠宝首饰有限公司 一种k金制品用电铸液及其应用
CN113832508A (zh) * 2021-09-30 2021-12-24 深圳市联合蓝海黄金材料科技股份有限公司 无氰电镀金镀液及其应用和电镀制金凸块的方法以及金凸块和电子部件

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2024140976A1 *

Also Published As

Publication number Publication date
CN116240597B (zh) 2024-03-26
CN116240597A (zh) 2023-06-09
EP4632115A1 (fr) 2025-10-15
WO2024140976A1 (fr) 2024-07-04

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