EP4702589A1 - Verfahren zur herstellung eines photonischen substrats und verfahren zur herstellung oder herstellung eines photonischen wellenleiters - Google Patents

Verfahren zur herstellung eines photonischen substrats und verfahren zur herstellung oder herstellung eines photonischen wellenleiters

Info

Publication number
EP4702589A1
EP4702589A1 EP24726718.0A EP24726718A EP4702589A1 EP 4702589 A1 EP4702589 A1 EP 4702589A1 EP 24726718 A EP24726718 A EP 24726718A EP 4702589 A1 EP4702589 A1 EP 4702589A1
Authority
EP
European Patent Office
Prior art keywords
optical waveguide
substrate
copper
layer
silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP24726718.0A
Other languages
English (en)
French (fr)
Inventor
Marta DIVALL
Zheru QIU
Rui Ning WANG
Tobias Kippenberg
Xinru JI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ecole Polytechnique Federale de Lausanne EPFL
Original Assignee
Ecole Polytechnique Federale de Lausanne EPFL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ecole Polytechnique Federale de Lausanne EPFL filed Critical Ecole Polytechnique Federale de Lausanne EPFL
Publication of EP4702589A1 publication Critical patent/EP4702589A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P36/00—Gettering within semiconductor bodies
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind

Landscapes

  • Optical Integrated Circuits (AREA)
EP24726718.0A 2023-04-25 2024-04-19 Verfahren zur herstellung eines photonischen substrats und verfahren zur herstellung oder herstellung eines photonischen wellenleiters Pending EP4702589A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP23169810 2023-04-25
PCT/IB2024/053818 WO2024224247A1 (en) 2023-04-25 2024-04-19 Photonic substrate preparation method and photonic waveguide preparation or fabrication method

Publications (1)

Publication Number Publication Date
EP4702589A1 true EP4702589A1 (de) 2026-03-04

Family

ID=86226567

Family Applications (1)

Application Number Title Priority Date Filing Date
EP24726718.0A Pending EP4702589A1 (de) 2023-04-25 2024-04-19 Verfahren zur herstellung eines photonischen substrats und verfahren zur herstellung oder herstellung eines photonischen wellenleiters

Country Status (2)

Country Link
EP (1) EP4702589A1 (de)
WO (1) WO2024224247A1 (de)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6620632B2 (en) * 2000-04-06 2003-09-16 Seh America, Inc. Method for evaluating impurity concentrations in semiconductor substrates
JP2003017497A (ja) * 2001-07-04 2003-01-17 Nec Corp 半導体装置の製造方法
US20030104680A1 (en) * 2001-11-13 2003-06-05 Memc Electronic Materials, Inc. Process for the removal of copper from polished boron-doped silicon wafers
US7657390B2 (en) * 2005-11-02 2010-02-02 Applied Materials, Inc. Reclaiming substrates having defects and contaminants
JP6427946B2 (ja) * 2014-05-13 2018-11-28 株式会社Sumco エピタキシャルシリコンウェーハの製造方法、エピタキシャルシリコンウェーハ、および固体撮像素子の製造方法
KR20150134543A (ko) * 2014-05-22 2015-12-02 삼성전자주식회사 소자 제조용 기판 및 반도체 소자
US10191215B2 (en) 2015-05-05 2019-01-29 Ecole Polytechnique Federale De Lausanne (Epfl) Waveguide fabrication method
US11187532B2 (en) * 2020-03-06 2021-11-30 Anello Photonics, Inc. Process flow for fabricating integrated photonics optical gyroscopes
CN113506733A (zh) * 2021-06-22 2021-10-15 华虹半导体(无锡)有限公司 降低硅片金属杂质的方法
JP7487407B2 (ja) * 2021-09-30 2024-05-20 信越半導体株式会社 エピタキシャルウェーハの製造方法

Also Published As

Publication number Publication date
WO2024224247A1 (en) 2024-10-31

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