EP4709792A1 - Compositions durcissables à faible module de stockage - Google Patents
Compositions durcissables à faible module de stockageInfo
- Publication number
- EP4709792A1 EP4709792A1 EP24728312.0A EP24728312A EP4709792A1 EP 4709792 A1 EP4709792 A1 EP 4709792A1 EP 24728312 A EP24728312 A EP 24728312A EP 4709792 A1 EP4709792 A1 EP 4709792A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- curable composition
- storage modulus
- cured
- curable
- glass transition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
L'invention concerne des compositions durcissables. En particulier, l'invention concerne des compositions durcissables comprenant un époxy et un oligomère acrylique fonctionnalisé. De telles compositions durcissables, lorsqu'elles sont durcies, peuvent présenter un faible module de stockage et une température de transition vitreuse supérieure à 65 °C. De telles compositions durcissables peuvent être utiles dans une grande variété d'applications, notamment dans l'assemblage de dispositifs électroniques.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202363501960P | 2023-05-12 | 2023-05-12 | |
| PCT/IB2024/054569 WO2024236441A1 (fr) | 2023-05-12 | 2024-05-10 | Compositions durcissables à faible module de stockage |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP4709792A1 true EP4709792A1 (fr) | 2026-03-18 |
Family
ID=91249069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP24728312.0A Pending EP4709792A1 (fr) | 2023-05-12 | 2024-05-10 | Compositions durcissables à faible module de stockage |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP4709792A1 (fr) |
| CN (1) | CN121057783A (fr) |
| WO (1) | WO2024236441A1 (fr) |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3496250A (en) | 1967-02-21 | 1970-02-17 | Borg Warner | Blends of epoxy resins and acrylonitrile butadiene-styrene graft copolymers |
| US3708296A (en) | 1968-08-20 | 1973-01-02 | American Can Co | Photopolymerization of epoxy monomers |
| GB1512982A (en) | 1974-05-02 | 1978-06-01 | Gen Electric | Salts |
| US4250311A (en) | 1974-05-02 | 1981-02-10 | General Electric Company | P, As, and Sb hexafluoride onium salts as photoinitiators |
| US4216288A (en) | 1978-09-08 | 1980-08-05 | General Electric Company | Heat curable cationically polymerizable compositions and method of curing same with onium salts and reducing agents |
| US5089536A (en) | 1982-11-22 | 1992-02-18 | Minnesota Mining And Manufacturing Company | Energy polmerizable compositions containing organometallic initiators |
| US4503211A (en) | 1984-05-31 | 1985-03-05 | Minnesota Mining And Manufacturing Co. | Epoxy resin curing agent, process and composition |
| US4985340A (en) | 1988-06-01 | 1991-01-15 | Minnesota Mining And Manufacturing Company | Energy curable compositions: two component curing agents |
| US5124417A (en) | 1990-02-12 | 1992-06-23 | Minnesota Mining And Manufacturing Company | Initiators for cationic polymerization |
| US5084586A (en) | 1990-02-12 | 1992-01-28 | Minnesota Mining And Manufacturing Company | Novel initiators for cationic polymerization |
| US8222324B2 (en) | 2003-06-09 | 2012-07-17 | Kaneka Corporation | Process for producing modified epoxy resin |
| EP2019975B1 (fr) * | 2006-05-01 | 2017-08-16 | DSM IP Assets B.V. | Composition de resine durcissable par rayonnement et procede d'imagerie tridimensionnelle rapide utilisant celle-ci |
| JP5849350B2 (ja) * | 2009-12-17 | 2016-01-27 | ディーエスエム アイピー アセッツ ビー.ブイ. | 基材を用いた積層造形法 |
| US20180016464A1 (en) * | 2014-06-08 | 2018-01-18 | Massivit 3D Printing Technologies Ltd | Method and appratus for manufacture of 3d objects |
| EP3738771B1 (fr) * | 2019-05-13 | 2023-08-16 | Henkel AG & Co. KGaA | Formulations époxy à durcissement double pour des applications d'impression 3d |
-
2024
- 2024-05-10 EP EP24728312.0A patent/EP4709792A1/fr active Pending
- 2024-05-10 CN CN202480030611.2A patent/CN121057783A/zh active Pending
- 2024-05-10 WO PCT/IB2024/054569 patent/WO2024236441A1/fr not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024236441A1 (fr) | 2024-11-21 |
| CN121057783A (zh) | 2025-12-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP3114161B1 (fr) | Systèmes de résine époxyde photodurcissables | |
| US20070267134A1 (en) | Photoinitiated Cationic Epoxy Compositions | |
| TWI422644B (zh) | 聚伸芳基醚組合物、方法及物件 | |
| KR101239296B1 (ko) | 저온 경화성 에폭시 조성물 | |
| EP1904578A1 (fr) | Composition trempee | |
| WO2019053646A1 (fr) | Film adhésif comprenant une matrice de (méth) acrylate comprenant une composition de résine époxy/thiol durcissable, ruban et procédé | |
| EP3180381B1 (fr) | Compositions adhésives durcissables pour substrats souples | |
| JPH0471100B2 (fr) | ||
| JP3671658B2 (ja) | シート状光学物品用活性エネルギー線硬化型組成物 | |
| CA2806243A1 (fr) | Composition epoxy resistant aux vapeurs chimiques | |
| JPH0762082A (ja) | 活性エネルギー線硬化型組成物 | |
| EP4709792A1 (fr) | Compositions durcissables à faible module de stockage | |
| JPH0940759A (ja) | エポキシ樹脂硬化性組成物 | |
| EP1273644A1 (fr) | Composition d'adhesif thermofusible photoreactif | |
| CN104364287A (zh) | 用于可固化组合物的潜伏型催化剂 | |
| KR100748149B1 (ko) | 광양이온 중합성 수지 조성물 및 광디스크 표면 보호용재료 | |
| JPS59147017A (ja) | 第一ヒドロキシル分を有するエポキシ及びヒドロキシル含有の有機物質に基づいた光共重合可能な組成物 | |
| JP3996334B2 (ja) | 光硬化型エポキシ樹脂組成物 | |
| JP6659964B2 (ja) | 熱硬化性樹脂組成物 | |
| US8030401B1 (en) | Photoinitiated cationic epoxy compositions | |
| US7220787B2 (en) | Photoreactive hot-melt adhesive composition | |
| JPS5840570B2 (ja) | コウカセイジユシソセイブツ | |
| JPH0155289B2 (fr) | ||
| JPH054409B2 (fr) | ||
| JPS621613B2 (fr) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: UNKNOWN |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE |
|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE |
|
| 17P | Request for examination filed |
Effective date: 20251105 |
|
| AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC ME MK MT NL NO PL PT RO RS SE SI SK SM TR |