ES2010390A6 - Procedimiento y aparato para llevar a cabo procesos electroquimicos. - Google Patents

Procedimiento y aparato para llevar a cabo procesos electroquimicos.

Info

Publication number
ES2010390A6
ES2010390A6 ES8900270A ES8900270A ES2010390A6 ES 2010390 A6 ES2010390 A6 ES 2010390A6 ES 8900270 A ES8900270 A ES 8900270A ES 8900270 A ES8900270 A ES 8900270A ES 2010390 A6 ES2010390 A6 ES 2010390A6
Authority
ES
Spain
Prior art keywords
voltages
alternation
independently
electrochemical processes
independently controlled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES8900270A
Other languages
English (en)
Inventor
Richard M Ellis
John Francis Houlston
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JCT CONTROLS Ltd
Original Assignee
JCT CONTROLS Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JCT CONTROLS Ltd filed Critical JCT CONTROLS Ltd
Publication of ES2010390A6 publication Critical patent/ES2010390A6/es
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/623—Porosity of the layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Hybrid Cells (AREA)

Abstract

PROCEDIMIENTO Y APARATO PARA LLEVAR A CABO PROCESOS ELECTROQUIMICOS. EL PROCEDIMIENTO COMPRENDE APLICAR, EN ALTERNANCIA, AL MENOS DOS TENSIONES INDEPENDIENTEMENTE CONTROLADAS. EL APARATO COMPRENDE AL MENOS DOS FUENTES DE ALIMENTACION ELECTRICA INDEPENDIENTEMENTE CONTROLADAS (7, 8) Y UN MEDIO CONMUTADOR (9) PARA APLICARLAS EN ALTERNANCIA A UNA CELDA (4) EN LA CUAL ESTAN SUSPENDIDAS UNA PIEZA DE TRABAJO (2) Y OTRO ELECTRODO (3). EN EL CASO DE QUE SE UTILICEN MAS DE DOS TENSIONES INDEPENDIENTEMENTE CONTROLADAS, ESTAS PUEDEN APLICARSE CICLICAMENTE. CON PREFERENCIA, UNA DE LAS DOS O MAS TENSIONES SERA INVERTIDA Y PUEDE SER PULSADA Y EL ELECTROLITO COMPRENDE PREFERIBLEMENTE AL MENOS DOS ADITIVOS ORGANICOS, SIENDO AL MENOS UNO DE ELLOS UN POLARIZADOR CUYOS EFECTOS SON INHIBIDOS POR LAS TENSIONES INVERSAS Y SIENDO EL OTRO UN DESPOLARIZADOR QUE PREFERENTEMENTE ES ADSORBIDO.
ES8900270A 1988-01-27 1989-01-26 Procedimiento y aparato para llevar a cabo procesos electroquimicos. Expired ES2010390A6 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB888801827A GB8801827D0 (en) 1988-01-27 1988-01-27 Improvements in electrochemical processes

Publications (1)

Publication Number Publication Date
ES2010390A6 true ES2010390A6 (es) 1989-11-01

Family

ID=10630626

Family Applications (1)

Application Number Title Priority Date Filing Date
ES8900270A Expired ES2010390A6 (es) 1988-01-27 1989-01-26 Procedimiento y aparato para llevar a cabo procesos electroquimicos.

Country Status (5)

Country Link
EP (1) EP0396610A1 (es)
AU (1) AU2947189A (es)
ES (1) ES2010390A6 (es)
GB (2) GB8801827D0 (es)
WO (1) WO1989007162A1 (es)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19539865A1 (de) * 1995-10-26 1997-04-30 Lea Ronal Gmbh Durchlauf-Galvanikanlage
DE19545231A1 (de) * 1995-11-21 1997-05-22 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Metallschichten
DE19547948C1 (de) * 1995-12-21 1996-11-21 Atotech Deutschland Gmbh Verfahren und Schaltungsanordnung zur Erzeugung von Strompulsen zur elektrolytischen Metallabscheidung
DE19633796B4 (de) * 1996-08-22 2012-02-02 Hans Höllmüller Maschinenbau GmbH Vorrichtung zum Galvanisieren von elektronischen Leiterplatten
DE19653681C2 (de) * 1996-12-13 2000-04-06 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Kupferschichten mit gleichmäßiger Schichtdicke und guten optischen und metallphysikalischen Eigenschaften und Anwendung des Verfahrens
DE19707905C1 (de) * 1997-02-27 1998-02-05 Atotech Deutschland Gmbh Verfahren zur Pulsstromversorgung von Galvanisieranlagen
MY144574A (en) 1998-09-14 2011-10-14 Ibiden Co Ltd Printed circuit board and method for its production
USRE40386E1 (en) 1998-11-06 2008-06-17 Hitachi Ltd. Chrome plated parts and chrome plating method
JP3918142B2 (ja) * 1998-11-06 2007-05-23 株式会社日立製作所 クロムめっき部品、クロムめっき方法およびクロムめっき部品の製造方法
BR0007639A (pt) * 1999-01-21 2001-11-06 Atotech Deutschland Gmbh Processo para formação galvânica de estruturas condutoras de cobre de alta pureza na produção de circuitos integrados
US6297155B1 (en) * 1999-05-03 2001-10-02 Motorola Inc. Method for forming a copper layer over a semiconductor wafer
WO2001021294A2 (en) * 1999-09-24 2001-03-29 Semitool, Inc. Pattern dependent surface profile evolution of electrochemically deposited metal
GB2358194B (en) * 2000-01-17 2004-07-21 Ea Tech Ltd Electrolytic treatment
US6991526B2 (en) 2002-09-16 2006-01-31 Applied Materials, Inc. Control of removal profile in electrochemically assisted CMP
US6848970B2 (en) 2002-09-16 2005-02-01 Applied Materials, Inc. Process control in electrochemically assisted planarization
US20050061674A1 (en) 2002-09-16 2005-03-24 Yan Wang Endpoint compensation in electroprocessing
US7112270B2 (en) 2002-09-16 2006-09-26 Applied Materials, Inc. Algorithm for real-time process control of electro-polishing
US7842169B2 (en) 2003-03-04 2010-11-30 Applied Materials, Inc. Method and apparatus for local polishing control
EP1598449B1 (en) 2004-04-26 2010-08-04 Rohm and Haas Electronic Materials, L.L.C. Improved plating method
US7084064B2 (en) 2004-09-14 2006-08-01 Applied Materials, Inc. Full sequence metal and barrier layer electrochemical mechanical processing
SE0403047D0 (sv) * 2004-12-14 2004-12-14 Polymer Kompositer I Goeteborg Pulse-plating method and apparatus
EP2072644A1 (en) * 2007-12-21 2009-06-24 ETH Zürich, ETH Transfer Device and method for the electrochemical deposition of chemical compounds and alloys with controlled composition and or stoichiometry

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2575712A (en) * 1945-09-29 1951-11-20 Westinghouse Electric Corp Electroplating
US2524912A (en) * 1945-09-29 1950-10-10 Westinghouse Electric Corp Process of electrodepositing copper, silver, or brass
GB676565A (en) * 1949-07-18 1952-07-30 Du Pont Improvements in current reversal electroplating
GB779906A (en) * 1954-09-30 1957-07-24 Electro Chem Eng Improvements in or relating to electro-plating process and apparatus
GB794930A (en) * 1955-11-25 1958-05-14 Marconi Wireless Telegraph Co Improvements in or relating to methods of electro-depositing metal
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
DE2360892A1 (de) * 1972-12-14 1974-06-20 M & T Chemicals Inc Waessriges saures galvanisches kupferbad
US4517059A (en) * 1981-07-31 1985-05-14 The Boeing Company Automated alternating polarity direct current pulse electrolytic processing of metals
US4666567A (en) * 1981-07-31 1987-05-19 The Boeing Company Automated alternating polarity pulse electrolytic processing of electrically conductive substances
US4466864A (en) * 1983-12-16 1984-08-21 At&T Technologies, Inc. Methods of and apparatus for electroplating preselected surface regions of electrical articles
US4555315A (en) * 1984-05-29 1985-11-26 Omi International Corporation High speed copper electroplating process and bath therefor

Also Published As

Publication number Publication date
EP0396610A1 (en) 1990-11-14
WO1989007162A1 (en) 1989-08-10
GB8801827D0 (en) 1988-02-24
GB2214520A (en) 1989-09-06
AU2947189A (en) 1989-08-25
GB8901091D0 (en) 1989-03-15

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Legal Events

Date Code Title Description
FD1A Patent lapsed

Effective date: 20041004