ES2037115T3 - Procedimiento para la fabricacion de una bandeja de digitalizacion. - Google Patents

Procedimiento para la fabricacion de una bandeja de digitalizacion.

Info

Publication number
ES2037115T3
ES2037115T3 ES198888101905T ES88101905T ES2037115T3 ES 2037115 T3 ES2037115 T3 ES 2037115T3 ES 198888101905 T ES198888101905 T ES 198888101905T ES 88101905 T ES88101905 T ES 88101905T ES 2037115 T3 ES2037115 T3 ES 2037115T3
Authority
ES
Spain
Prior art keywords
conductor paths
procedure
manufacture
dielectric material
groups
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES198888101905T
Other languages
English (en)
Inventor
Hans-Joachim Schrodt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aristo Graphic Systeme GmbH and Co KG
Original Assignee
Aristo Graphic Systeme GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aristo Graphic Systeme GmbH and Co KG filed Critical Aristo Graphic Systeme GmbH and Co KG
Application granted granted Critical
Publication of ES2037115T3 publication Critical patent/ES2037115T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/16—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation by cathodic sputtering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Input From Keyboards Or The Like (AREA)
  • Printing Methods (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
  • Packaging Frangible Articles (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

PARA LA FABRICACION DE UNA BANDEJA DE DIGITALIZAR CON DOS GRUPOS DE PISTAS DE CONDUCTORES (2,3,4,5;2'',3'',4'') PARALELOS Y DENTRO DEL GRUPO RESPECTIVAMENTE, QUE ESTAN DISPUESTAS COPLANARIO Y QUE DESVIAN VERTICALMENTE UNAS A OTRAS, SE FABRICAN LAS PISTAS DE CONDUCTORES (2,3,4,5;2'',3'',4''), A TRAVES DE LA PULVERIZACION O METALIZAR EN VACIO DE METAL, Y SE CUBREN ELLAS CON UNA CAPA DE SUSTANCIA AISLANTE (13,13''). LOS FINALES (6,7,8,9;6'',7'',8'') DE LAS PISTAS DE CONDUCTORES (2,3,4,5,;2'',3'',4'') SE DEJAN CON TODO ESTO LIBRE DE SUSTANCIAS AISLANTES Y SE CONECTAN ELLOS A TRAVES DE IMPRESIONES DE TINTA DE IMPRENTA METALIZABLE O CONDUCTIVO ELECTRICO.
ES198888101905T 1987-02-13 1988-02-10 Procedimiento para la fabricacion de una bandeja de digitalizacion. Expired - Lifetime ES2037115T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19873704497 DE3704497A1 (de) 1987-02-13 1987-02-13 Verfahren zur herstellung eines digitalisiertabletts

Publications (1)

Publication Number Publication Date
ES2037115T3 true ES2037115T3 (es) 1993-06-16

Family

ID=6320895

Family Applications (1)

Application Number Title Priority Date Filing Date
ES198888101905T Expired - Lifetime ES2037115T3 (es) 1987-02-13 1988-02-10 Procedimiento para la fabricacion de una bandeja de digitalizacion.

Country Status (5)

Country Link
EP (1) EP0278485B1 (es)
AT (1) ATE83569T1 (es)
DE (2) DE3704497A1 (es)
ES (1) ES2037115T3 (es)
GR (1) GR3007346T3 (es)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2233157B (en) * 1989-06-13 1992-10-21 British Aerospace Printed circuit board
US5295869A (en) 1992-12-18 1994-03-22 The Siemon Company Electrically balanced connector assembly
DE19632866C2 (de) * 1995-08-18 2001-12-06 Alps Electric Co Ltd Kapazitive Koordinaten-Eingabevorrichtung und Verfahren zu deren Herstellung
DE19603971A1 (de) * 1996-01-26 1997-07-31 Emi Tec Elektronische Material Verfahren zur Herstellung einer Dateneingabevorrichtung

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1281829A (fr) * 1960-03-30 1962-01-12 Hughes Aircraft Co Grille de connexion d'éléments électriques et son procédé de fabrication
DE2201034A1 (de) * 1971-05-17 1972-11-30 Hochvakuum Dresden Veb Verfahren zum Herstellen von Leiterplatten nach der Aufbaumethode
DE2401609A1 (de) * 1974-01-14 1975-07-17 Siemens Ag Verfahren zum herstellen von durch bedampfung aufgebrachten, konturenscharfen, flaechenhaften bereichen aus elektrisch wirksamem material
JPS5210568A (en) * 1974-12-28 1977-01-26 Hideo Machida Method of manufacturing multilayered printed wiring substrate
GB2078448B (en) * 1980-06-19 1984-03-14 Standard Telephones Cables Ltd Electrical printed circuits
US4513043A (en) * 1982-10-08 1985-04-23 Sanders Associates, Inc. Precision wire grid glass digitizing tablets
FR2562335B1 (fr) * 1984-04-03 1988-11-25 Rogers Corp Circuit multicouche flexible avec connexions entre couches soudees par voie ultrasonique
DE3527967A1 (de) * 1985-08-03 1987-02-05 Standard Elektrik Lorenz Ag Verfahren zur herstellung von leiterplatten

Also Published As

Publication number Publication date
GR3007346T3 (es) 1993-07-30
DE3704497A1 (de) 1988-08-25
EP0278485A2 (de) 1988-08-17
EP0278485B1 (de) 1992-12-16
EP0278485A3 (en) 1989-09-20
DE3876644D1 (de) 1993-01-28
ATE83569T1 (de) 1993-01-15

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