JPS5210568A - Method of manufacturing multilayered printed wiring substrate - Google Patents

Method of manufacturing multilayered printed wiring substrate

Info

Publication number
JPS5210568A
JPS5210568A JP406775A JP406775A JPS5210568A JP S5210568 A JPS5210568 A JP S5210568A JP 406775 A JP406775 A JP 406775A JP 406775 A JP406775 A JP 406775A JP S5210568 A JPS5210568 A JP S5210568A
Authority
JP
Japan
Prior art keywords
printed wiring
wiring substrate
multilayered printed
manufacturing multilayered
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP406775A
Other languages
Japanese (ja)
Inventor
Hideo Machida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP406775A priority Critical patent/JPS5210568A/en
Priority to DE19752558367 priority patent/DE2558367A1/en
Priority to NL7515090A priority patent/NL7515090A/en
Priority to FR7539660A priority patent/FR2296347A1/en
Priority to DE19752558744 priority patent/DE2558744A1/en
Publication of JPS5210568A publication Critical patent/JPS5210568A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
JP406775A 1974-12-28 1974-12-28 Method of manufacturing multilayered printed wiring substrate Pending JPS5210568A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP406775A JPS5210568A (en) 1974-12-28 1974-12-28 Method of manufacturing multilayered printed wiring substrate
DE19752558367 DE2558367A1 (en) 1974-12-28 1975-12-23 METHOD OF MAKING A MULTI-LAYER PRINTED CIRCUIT
NL7515090A NL7515090A (en) 1974-12-28 1975-12-24 PROCEDURE FOR MANUFACTURING PRINTED WIRES.
FR7539660A FR2296347A1 (en) 1974-12-28 1975-12-24 Multi-ply laminate, printed circuit - mfd. by metallising a base etching a circuit, coating the bared part with dielectric applying conductor lines, and re-coating (NL-300676)
DE19752558744 DE2558744A1 (en) 1974-12-28 1975-12-24 METHOD OF MAKING A MULTI-LAYER PRINTED CIRCUIT

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP406775A JPS5210568A (en) 1974-12-28 1974-12-28 Method of manufacturing multilayered printed wiring substrate

Publications (1)

Publication Number Publication Date
JPS5210568A true JPS5210568A (en) 1977-01-26

Family

ID=11574472

Family Applications (1)

Application Number Title Priority Date Filing Date
JP406775A Pending JPS5210568A (en) 1974-12-28 1974-12-28 Method of manufacturing multilayered printed wiring substrate

Country Status (4)

Country Link
JP (1) JPS5210568A (en)
DE (2) DE2558367A1 (en)
FR (1) FR2296347A1 (en)
NL (1) NL7515090A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63272097A (en) * 1987-04-30 1988-11-09 Mitsui Mining & Smelting Co Ltd Manufacture of multilayer circuit substrate
CN107484358A (en) * 2017-07-26 2017-12-15 江门崇达电路技术有限公司 It is a kind of without pressing the manufacturing method of multi-layer circuit board without drilling

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3006117C2 (en) * 1980-02-19 1981-11-26 Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern Process for the production of printed circuit boards with at least two conductor additions
US4416914A (en) * 1980-12-29 1983-11-22 General Electric Company Electrical conductors arranged in multiple layers and preparation thereof
EP0062084A1 (en) * 1981-04-06 1982-10-13 Herbert Irwin Schachter Multi-level circuit and method of making same
DE3137279C2 (en) * 1981-09-18 1986-12-11 Wilhelm Ruf KG, 8000 München Process for the production of multilayer printed circuit boards as well as multilayer printed circuit board produced by the process
DE3407799A1 (en) * 1984-03-02 1985-09-05 Brown, Boveri & Cie Ag, 6800 Mannheim Method for producing a multilayer hybrid circuit
US4566186A (en) * 1984-06-29 1986-01-28 Tektronix, Inc. Multilayer interconnect circuitry using photoimageable dielectric
JPS6276600A (en) * 1985-09-29 1987-04-08 株式会社　アサヒ化学研究所 Forming method for conductive circuit on substrate
US4735676A (en) * 1986-01-14 1988-04-05 Asahi Chemical Research Laboratory Co., Ltd. Method for forming electric circuits on a base board
US4724040A (en) * 1986-01-14 1988-02-09 Asahi Chemical Research Laboratory Co., Ltd. Method for producing electric circuits on a base boad
US4801489A (en) * 1986-03-13 1989-01-31 Nintendo Co., Ltd. Printed circuit board capable of preventing electromagnetic interference
AU8107987A (en) * 1986-09-30 1988-04-21 Wilde Membran Impulstechnik G.m.b.H. Electrically conductive structure with applied metallization
US4837050A (en) * 1986-09-30 1989-06-06 Asahi Chemical Research Laboratory Co., Ltd. Method for producing electrically conductive circuits on a base board
DE3733002A1 (en) * 1986-09-30 1988-04-07 Wilde Membran Impuls Tech Electroconductive pattern metallised additively
DE3704497A1 (en) * 1987-02-13 1988-08-25 Aristo Graphic Systeme METHOD FOR PRODUCING A DIGITALIZED TABLET
DE3704498A1 (en) * 1987-02-13 1988-08-25 Aristo Graphic Systeme METHOD FOR PRODUCING A DIGITALIZED TABLET
DE3741918A1 (en) * 1987-12-10 1989-06-22 Heino Pachschwoell Method for producing an electronic circuit device
KR900005308B1 (en) * 1987-12-31 1990-07-27 정풍물산 주식회사 Printed circuit board method
JPH0682926B2 (en) * 1988-04-22 1994-10-19 日本電気株式会社 Method for manufacturing multilayer wiring board
DE68913941T2 (en) * 1988-11-29 1994-10-20 Nippon Cmk Kk Process for the production of a printed circuit board.

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4878470A (en) * 1972-01-28 1973-10-22

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4878470A (en) * 1972-01-28 1973-10-22

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63272097A (en) * 1987-04-30 1988-11-09 Mitsui Mining & Smelting Co Ltd Manufacture of multilayer circuit substrate
CN107484358A (en) * 2017-07-26 2017-12-15 江门崇达电路技术有限公司 It is a kind of without pressing the manufacturing method of multi-layer circuit board without drilling
CN107484358B (en) * 2017-07-26 2019-06-21 江门崇达电路技术有限公司 It is a kind of without pressing the manufacturing method of multi-layer circuit board without drilling

Also Published As

Publication number Publication date
FR2296347A1 (en) 1976-07-23
DE2558367A1 (en) 1976-07-08
NL7515090A (en) 1976-06-30
DE2558744A1 (en) 1976-07-01

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