ES2040441T3 - Placa de circuito impreso. - Google Patents

Placa de circuito impreso.

Info

Publication number
ES2040441T3
ES2040441T3 ES198989121801T ES89121801T ES2040441T3 ES 2040441 T3 ES2040441 T3 ES 2040441T3 ES 198989121801 T ES198989121801 T ES 198989121801T ES 89121801 T ES89121801 T ES 89121801T ES 2040441 T3 ES2040441 T3 ES 2040441T3
Authority
ES
Spain
Prior art keywords
printed circuit
circuit board
electroconducting
sides
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES198989121801T
Other languages
English (en)
Inventor
Satoshi Nippon Cmk Corporation Limited Haruyama
Hirotaka Nippon Cmk Corporation Limited Okonogi
Shin Nippon Cmk Corporation Limited Kawakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon CMK Corp
Original Assignee
Nippon CMK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23751409&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ES2040441(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Nippon CMK Corp filed Critical Nippon CMK Corp
Application granted granted Critical
Publication of ES2040441T3 publication Critical patent/ES2040441T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

SE FORMA UN CUADRO DE CIRCUITOS IMPRESOS EN LOS QUE SE FORMA UN CIRCUITO IMPRESO TANTO EN UN LADO COMO EN LOS DOS LADOS DE UN MEDIO AISLANTE Y, A TRAVES DE UN AGUJERO (6) QUE PENETRA DICHO MEDIO AISLANTE (1), DONDE LOS CIRCUITOS (2, 3) SITUADOS EN LOS DOS LADOS ESTAN CONECTADOS ELECTRICAMENTE POR UNA PASTA ELECTROCONDUCTORA (7) ADOSADA DIRECTAMENTE EN EL AGUJERO, COMPRENDEN UNA PASTA DE ESPUMA ELECTROCONDUCTORA QUE FORMA LA PASTA (7).
ES198989121801T 1989-11-24 1989-11-25 Placa de circuito impreso. Expired - Lifetime ES2040441T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/441,078 US4991060A (en) 1989-11-24 1989-11-24 Printed circuit board having conductors interconnected by foamed electroconductive paste

Publications (1)

Publication Number Publication Date
ES2040441T3 true ES2040441T3 (es) 1993-10-16

Family

ID=23751409

Family Applications (1)

Application Number Title Priority Date Filing Date
ES198989121801T Expired - Lifetime ES2040441T3 (es) 1989-11-24 1989-11-25 Placa de circuito impreso.

Country Status (4)

Country Link
US (1) US4991060A (es)
EP (1) EP0429689B1 (es)
DE (1) DE68906160T2 (es)
ES (1) ES2040441T3 (es)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69229661T2 (de) * 1991-04-26 1999-12-30 Citizen Watch Co., Ltd. Verfahren zur Herstellung einer Anschlusstruktur für eine Halbleiteranordnung
US5665650A (en) * 1996-05-30 1997-09-09 International Business Machines Corporation Method for manufacturing a high density electronic circuit assembly
US6080668A (en) * 1996-05-30 2000-06-27 International Business Machines Corporation Sequential build-up organic chip carrier and method of manufacture
US5822856A (en) * 1996-06-28 1998-10-20 International Business Machines Corporation Manufacturing circuit board assemblies having filled vias
DE69942824D1 (de) * 1998-08-28 2010-11-18 Panasonic Corp Leitfähige paste, diese verwendende elektrisch leitfähige struktur, elektrisches bauteil, modul, leiterplatte, verfahren zum elektrischen verbinden, verfahren zur herstellung von einer leiterplatte he
US6175085B1 (en) * 1998-10-07 2001-01-16 Lucent Technologies Inc. Solder mask configuration for a printed wiring board with improved breakdown voltage performance
FR2848346B1 (fr) * 2002-12-05 2005-02-11 Gemplus Card Int Adaptateur pour la connexion electrique d'une mini-carte a circuits(s)integre(s)dans un connecteur pour carte a memoire
US7240425B2 (en) * 2003-04-24 2007-07-10 Amphenol Corporation Method of making an electrical connection to a conductor on an inner layer of a multi-layer printed circuit board
TWI342732B (en) * 2006-12-27 2011-05-21 Unimicron Technology Corp Circuit board structure and fabrication method thereof
EP2338319B1 (en) * 2008-09-26 2015-02-11 Parker-Hannifin Corporation Electrically-conductive foam emi shield
KR20130140618A (ko) * 2010-07-20 2013-12-24 스미토모 덴키 고교 가부시키가이샤 다층 프린트 배선판 및 그 제조 방법
JP7406067B2 (ja) * 2019-08-29 2023-12-27 日亜化学工業株式会社 配線基板及び配線基板の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3601523A (en) * 1970-06-19 1971-08-24 Buckbee Mears Co Through hole connectors
US3971610A (en) * 1974-05-10 1976-07-27 Technical Wire Products, Inc. Conductive elastomeric contacts and connectors
US4489913A (en) * 1984-03-19 1984-12-25 The Dow Chemical Company Electroconductive foams
JPS61159793A (ja) * 1984-12-31 1986-07-19 株式会社　アサヒ化学研究所 基板に導電回路を形成する方法
US4885662A (en) * 1988-08-12 1989-12-05 Leonard A. Alkov Circuit module connection system

Also Published As

Publication number Publication date
EP0429689B1 (en) 1993-04-21
US4991060A (en) 1991-02-05
DE68906160D1 (de) 1993-05-27
EP0429689A1 (en) 1991-06-05
DE68906160T2 (de) 1993-10-28

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