ES2105000T3 - Placa de circuitos impresos de capas multiples. - Google Patents

Placa de circuitos impresos de capas multiples.

Info

Publication number
ES2105000T3
ES2105000T3 ES93107094T ES93107094T ES2105000T3 ES 2105000 T3 ES2105000 T3 ES 2105000T3 ES 93107094 T ES93107094 T ES 93107094T ES 93107094 T ES93107094 T ES 93107094T ES 2105000 T3 ES2105000 T3 ES 2105000T3
Authority
ES
Spain
Prior art keywords
smd
circuit board
printed circuit
multiple layers
ohmic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES93107094T
Other languages
English (en)
Inventor
Georg Koch
Dinorah Steiner
Rolf Dipl-Ing Osterwitz
Hans Schlitter
Adam Dipl-Ing Lennert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19924215553 external-priority patent/DE4215553A1/de
Priority claimed from DE19924224925 external-priority patent/DE4224925A1/de
Priority claimed from DE19934313389 external-priority patent/DE4313389A1/de
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Application granted granted Critical
Publication of ES2105000T3 publication Critical patent/ES2105000T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

LAS RESISTENCIAS OHMICAS DE LOS SUBGRUPOS SMD ESTAN REALIZADAS PARA LA CONFORMACION CON AHORRO DE ESPACIO COMO RESISTENCIAS IMPRESAS POR SERIGRAFIA (3), PARA LO CUAL UNA PASTA DE RESISTENCIA SE APLICA POR MEDIO DE UN TAMIZ O DE UNA PLANTILLA SOBRE UN MATERIAL BASE DE LA PLACA CONDUCTORA Y A CONTINUACION SE ENDURECE POR APORTACION DE CALOR. PARA UNA CONFIGURACION QUE AHORRE ESPACIO DE UNA CAPA MULTIPLE (5), ESTA PREVISTO QUE LOS ELEMENTOS CONSTITUYENTES (3) OHMICOS, INDUCTIVOS Y/O CAPACITIVOS REALIZADOS POR LA TECNICA DE IMPRESION, SE COMPRIMAN EN LAS CAPAS INTERNAS DE PLACAS CONDUCTORAS (1) PROVISTAS POR LAS DOS CARAS CON PISTAS CONDUCTORAS Y SOBRE LAS CAPAS EXTERNAS ESTAN DISPUESTOS SMD. LAS PLACAS CONDUCTORAS ESTAN DISPUESTAS Y PRENSADAS CON LA CARA INTERNA UNA VUELTA HACIA LA OTRA APOYANDO SOBRE UNA CAPA INTERMEDIA (4) DE MATERIAL AISLANTE ELASTICO.
ES93107094T 1992-05-12 1993-04-30 Placa de circuitos impresos de capas multiples. Expired - Lifetime ES2105000T3 (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19924215553 DE4215553A1 (de) 1992-05-12 1992-05-12 SMD-Baugruppe
DE19924224925 DE4224925A1 (de) 1992-07-28 1992-07-28 Mehrlagen-Leiterplatte
DE19934313389 DE4313389A1 (de) 1993-04-23 1993-04-23 Mehrlagen-Leiterplatte

Publications (1)

Publication Number Publication Date
ES2105000T3 true ES2105000T3 (es) 1997-10-16

Family

ID=27203729

Family Applications (1)

Application Number Title Priority Date Filing Date
ES93107094T Expired - Lifetime ES2105000T3 (es) 1992-05-12 1993-04-30 Placa de circuitos impresos de capas multiples.

Country Status (6)

Country Link
EP (1) EP0569801B1 (es)
JP (1) JPH0661651A (es)
AT (1) ATE155310T1 (es)
DE (1) DE59306859D1 (es)
DK (1) DK0569801T3 (es)
ES (1) ES2105000T3 (es)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6356455B1 (en) * 1999-09-23 2002-03-12 Morton International, Inc. Thin integral resistor/capacitor/inductor package, method of manufacture
KR100754065B1 (ko) 2003-11-05 2007-08-31 삼성전기주식회사 매립된 저항을 갖는 인쇄회로기판 제조 방법
DE102006033222B4 (de) * 2006-07-18 2014-04-30 Epcos Ag Modul mit flachem Aufbau und Verfahren zur Bestückung
US9786354B2 (en) 2013-07-10 2017-10-10 Samsung Electronics Co., Ltd. Memory module
EP3800361A1 (de) * 2019-10-02 2021-04-07 Siemens Aktiengesellschaft Verankerungseinheit, verfahren zum befestigen einer anlage mit einer verankerungseinheit und anlageneinheit mit verankerungseinheit

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4870746A (en) * 1988-11-07 1989-10-03 Litton Systems, Inc. Method of making a multilayer printed circuit board having screened-on resistors

Also Published As

Publication number Publication date
DE59306859D1 (de) 1997-08-14
EP0569801A1 (de) 1993-11-18
ATE155310T1 (de) 1997-07-15
JPH0661651A (ja) 1994-03-04
DK0569801T3 (da) 1998-02-23
EP0569801B1 (de) 1997-07-09

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