ES2049724T3 - Soporte de datos con circuito integrado incorporado y procedimiento para su fabricacion. - Google Patents

Soporte de datos con circuito integrado incorporado y procedimiento para su fabricacion.

Info

Publication number
ES2049724T3
ES2049724T3 ES87115451T ES87115451T ES2049724T3 ES 2049724 T3 ES2049724 T3 ES 2049724T3 ES 87115451 T ES87115451 T ES 87115451T ES 87115451 T ES87115451 T ES 87115451T ES 2049724 T3 ES2049724 T3 ES 2049724T3
Authority
ES
Spain
Prior art keywords
procedure
manufacture
connection circuit
built
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES87115451T
Other languages
English (en)
Inventor
Yahya Dipl-Ing Haghiri
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GAO Gesellschaft fuer Automation und Organisation mbH
Original Assignee
GAO Gesellschaft fuer Automation und Organisation mbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=6314346&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ES2049724(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by GAO Gesellschaft fuer Automation und Organisation mbH filed Critical GAO Gesellschaft fuer Automation und Organisation mbH
Application granted granted Critical
Publication of ES2049724T3 publication Critical patent/ES2049724T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/08—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs
    • H10W70/09—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)

Abstract

EL INVENTO TRATA DE UN PORTADOR DE DATOS CON CIRCUITO DE CONEXION INTEGRADO Y UN PROCEDIMIENTO PARA FABRICACION DEL MISMO. EN LA FABRICACION SE INSERTA UN ELEMENTO PORTADOR EQUIPADO CON UN CIRCUTO DE CONEXION INTEGRADO Y CON SUPERFICIES DE CONTACTO EN UNA ESCOTADURA DEL MATERIAL BRUTO DEL PORTADOR DE DATOL. PARA FIJACION EN LA ESCOTADURA SE GUARNECE EL ELEMENTO PORTADOR CON UNA LAMINA ADHESIVA DE FUNDICION. PARA PROTECCION DEL CIRCUITO DE CONEXION INTEGRADO DE CARGAS MECANICAS SE PREVE ENTRE EL CIRCUITO DE CONEXION Y LA LAMINA ADHESIVA DE FUNDICION UNA BANDA DE LAMINA DE UN MATERIAL CON ELEVADO PODER DE DEFORMACION ELASTICO.
ES87115451T 1986-11-20 1987-10-21 Soporte de datos con circuito integrado incorporado y procedimiento para su fabricacion. Expired - Lifetime ES2049724T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19863639630 DE3639630A1 (de) 1986-11-20 1986-11-20 Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben

Publications (1)

Publication Number Publication Date
ES2049724T3 true ES2049724T3 (es) 1994-05-01

Family

ID=6314346

Family Applications (2)

Application Number Title Priority Date Filing Date
ES93103992T Expired - Lifetime ES2106906T3 (es) 1986-11-20 1987-10-21 Componente con circuitos integrados.
ES87115451T Expired - Lifetime ES2049724T3 (es) 1986-11-20 1987-10-21 Soporte de datos con circuito integrado incorporado y procedimiento para su fabricacion.

Family Applications Before (1)

Application Number Title Priority Date Filing Date
ES93103992T Expired - Lifetime ES2106906T3 (es) 1986-11-20 1987-10-21 Componente con circuitos integrados.

Country Status (7)

Country Link
US (2) US4897534A (es)
EP (2) EP0554916B1 (es)
JP (1) JP2591630B2 (es)
AT (2) ATE100615T1 (es)
DE (3) DE3639630A1 (es)
ES (2) ES2106906T3 (es)
HK (1) HK62395A (es)

Families Citing this family (120)

* Cited by examiner, † Cited by third party
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DE3788856D1 (de) 1994-03-03
EP0268830A2 (de) 1988-06-01
US4897534A (en) 1990-01-30
EP0554916A3 (es) 1994-03-23
EP0554916B1 (de) 1997-08-06
JP2591630B2 (ja) 1997-03-19
ATE100615T1 (de) 1994-02-15
EP0268830B1 (de) 1994-01-19
ATE156613T1 (de) 1997-08-15
HK62395A (en) 1995-05-05
EP0554916A2 (de) 1993-08-11
DE3752101D1 (de) 1997-09-11
JPS63212594A (ja) 1988-09-05
ES2106906T3 (es) 1997-11-16
DE3639630A1 (de) 1988-06-01
EP0268830A3 (en) 1989-03-08
US5055913A (en) 1991-10-08

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