ES2065174T3 - Dispositivo para la proteccion de lineas de campo en una instalacion para el tratamiento electrolitico de materias a tratar en forma esencialmente de placas. - Google Patents

Dispositivo para la proteccion de lineas de campo en una instalacion para el tratamiento electrolitico de materias a tratar en forma esencialmente de placas.

Info

Publication number
ES2065174T3
ES2065174T3 ES92905631T ES92905631T ES2065174T3 ES 2065174 T3 ES2065174 T3 ES 2065174T3 ES 92905631 T ES92905631 T ES 92905631T ES 92905631 T ES92905631 T ES 92905631T ES 2065174 T3 ES2065174 T3 ES 2065174T3
Authority
ES
Spain
Prior art keywords
screen
rods
goods carrier
pct
facility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES92905631T
Other languages
English (en)
Inventor
Kurt Astor
Peter Haase
Manfred Gute
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Application granted granted Critical
Publication of ES2065174T3 publication Critical patent/ES2065174T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0621—In horizontal cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S204/00—Chemistry: electrical and wave energy
    • Y10S204/07—Current distribution within the bath

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Pretreatment Of Seeds And Plants (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)

Abstract

LA INVENCION SE REFIERE A UN DISPOSITIVO PARA EL APANTALLAMIENTO DE LINEAS DE FLUJO ELECTRICO EN UNA INSTALACION PARA EL PROCESADO ELECTROLITICO ESENCIALMENTE DE ELEMENTOS (8) PLANOS COMPUESTO DE UNA O VARIAS PIEZAS SUJETAS DEBAJO DE UN SOPORTE (4) Y SUMERGIDAS EN UN BAÑO CUANDO EL SOPORTE ES DESCENDIDO, DISPONIENDO DE UNA PANTALLA (10) QUE PUEDE SER AJUSTADA VERTICALMENTE MEDIANTE SUJETADORES (5) ACOPLADOS AL MOVIMIENTO DEL SOPORTE. PARA EVITAR LOS INCONVENIENTES DE LAS GUIAS CONOCIDAS SEGUN EL ESTADO TECNOLOGICO ACTUAL DE LAS PANTALLAS EN LOS TANQUES DE PLACAS SIN PERDER LAS VENTAJAS OBTENIDAS GRACIAS A LOS SUJETADORES CON UNA ESTRUCTURA COMPACTA, SIMPLE, CON BARRAS (5) QUE SE PROYECTAN HACIA ABAJO Y SOPORTADOS EN AMBOS EXTREMOS (10'') DE LA PANTALLA (10), UTILIZADOS COMO SUJETADORES PARA EL SOPORTE; LOS EXTREMOS INFERIORES DE LAS BARRAS (5) Y LOS EXTREMOS (10'') DE LA PANTALLA (10) ESTAN DISEÑADOS DE TAL FORMA QUE LA PANTALLA NO PUEDE SER MOVIDA CON RESPECTO A LAS BARRAS, AL MENOS EN SU DIRECCION LONGITUDINAL, Y DE FORMA QUE LA DISTANCIA ENTRE LAS BARRAS (5) ES MAS ANCHA QUE LA AMPLITUD DE LOS ELEMENTOS (8) LOCALIZADOS DURANTE EL PROCESO ENTRE LAS BARRAS. SE DISPONE DE MEDIOS PARA EL TRANSPORTE DE LA PANTALLA A PARTIR DE SU POSICION DE TRABAJO MAS INFERIOR A LA POSICION DE APARCADO SUPERIOR. LOS ELEMENTOS A SER PROCESADOS CUELGAN DE SU SOPORTE (4) SIN GUIAS LATERALES Y NO SE HA PREVISTO DE GUIAS ENTRE EL TANQUE (1) DE PLACAS Y LA PANTALLA (10).
ES92905631T 1991-03-02 1992-02-28 Dispositivo para la proteccion de lineas de campo en una instalacion para el tratamiento electrolitico de materias a tratar en forma esencialmente de placas. Expired - Lifetime ES2065174T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4106733A DE4106733A1 (de) 1991-03-02 1991-03-02 Vorrichtung zum abblenden von feldlinien in einer galvanikanlage (iii)

Publications (1)

Publication Number Publication Date
ES2065174T3 true ES2065174T3 (es) 1995-02-01

Family

ID=6426361

Family Applications (1)

Application Number Title Priority Date Filing Date
ES92905631T Expired - Lifetime ES2065174T3 (es) 1991-03-02 1992-02-28 Dispositivo para la proteccion de lineas de campo en una instalacion para el tratamiento electrolitico de materias a tratar en forma esencialmente de placas.

Country Status (8)

Country Link
US (1) US5391276A (es)
EP (1) EP0574451B1 (es)
AT (1) ATE114174T1 (es)
CA (1) CA2105389A1 (es)
DE (2) DE4106733A1 (es)
ES (1) ES2065174T3 (es)
HK (1) HK53397A (es)
WO (1) WO1992015727A1 (es)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT399074B (de) * 1991-12-23 1995-03-27 Lenhard Ges M B H Vorrichtung zum halten von leiterplatten
GB9325297D0 (en) 1993-12-10 1994-02-16 Process Automation Internation Improvements in or relating to clamps and the use thereof
US5720813A (en) 1995-06-07 1998-02-24 Eamon P. McDonald Thin sheet handling system
DE19736352C1 (de) 1997-08-21 1998-12-10 Atotech Deutschland Gmbh Vorrichtung zur Kontaktierung von flachem Behandlungsgut in Durchlaufgalvanisieranlagen
GB2330151A (en) * 1997-10-07 1999-04-14 Process Automation Internation An electroplating apparatus with movable diaphragms
US6274010B1 (en) 1997-10-07 2001-08-14 Process Automation International Limited Electroplating apparatus
DE19932785C1 (de) * 1999-07-14 2000-11-16 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum präzisen Justieren von Abschirmmasken bei der elektrochemischen Behandlung von stabförmigem Behandlungsgut
US6818115B2 (en) * 2001-10-19 2004-11-16 Viasystems Group, Inc. System and method for electrolytic plating
US20050061660A1 (en) * 2002-10-18 2005-03-24 Kempen Hein Van System and method for electrolytic plating
US20060037865A1 (en) * 2004-08-19 2006-02-23 Rucker Michael H Methods and apparatus for fabricating gas turbine engines
CN101437365B (zh) * 2007-11-15 2011-05-11 富葵精密组件(深圳)有限公司 固持装置及固持方法
CN102162119B (zh) * 2011-04-11 2012-07-04 衢州威盛精密电子科技有限公司 电镀薄板浮架装置及其使用方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55145199A (en) * 1979-04-25 1980-11-12 Hitachi Ltd Shielding board for plating
DE3726571C1 (en) * 1987-08-10 1989-03-23 Siemens Ag Screening and positioning frame
US4879007B1 (en) * 1988-12-12 1999-05-25 Process Automation Int L Ltd Shield for plating bath
DE9007542U1 (de) * 1990-02-20 1992-06-25 Schering Ag Berlin Und Bergkamen, 1000 Berlin Vorrichtung zum Abblenden von Feldlinien in einer Galvanikanlage

Also Published As

Publication number Publication date
ATE114174T1 (de) 1994-12-15
WO1992015727A1 (de) 1992-09-17
US5391276A (en) 1995-02-21
DE4106733C2 (es) 1993-07-29
EP0574451A1 (de) 1993-12-22
EP0574451B1 (de) 1994-11-17
HK53397A (en) 1997-05-02
DE59200793D1 (de) 1994-12-22
DE4106733A1 (de) 1992-09-03
CA2105389A1 (en) 1992-09-03

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