ES2067561T3 - Soporte de circuito integrado de alta densidad y su procedimiento de fabricacion. - Google Patents

Soporte de circuito integrado de alta densidad y su procedimiento de fabricacion.

Info

Publication number
ES2067561T3
ES2067561T3 ES89402242T ES89402242T ES2067561T3 ES 2067561 T3 ES2067561 T3 ES 2067561T3 ES 89402242 T ES89402242 T ES 89402242T ES 89402242 T ES89402242 T ES 89402242T ES 2067561 T3 ES2067561 T3 ES 2067561T3
Authority
ES
Spain
Prior art keywords
high density
manufacturing procedure
integrated high
circuit support
density circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES89402242T
Other languages
English (en)
Inventor
Gerard Dehaine
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bull SAS
Original Assignee
Bull SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bull SAS filed Critical Bull SAS
Application granted granted Critical
Publication of ES2067561T3 publication Critical patent/ES2067561T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/453—Leadframes comprising flexible metallic tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/047—Attaching leadframes to insulating supports, e.g. for tape automated bonding [TAB]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

SOBRE EL SOPORTE TAB (10), QUE CONSTA DE UNA ARAÑA TAB (13) ENCOLADA EN UN SUBSTRATO PREFORMADO (15) Y DOTADA DE PATAS (12) CUYOS EXTREMOS ILB DESCANSAN EN UN MARCO AISLANTE (20), ESTE MARCO ES UN ELEMENTO UNIDO A LAS PATAS, INDEPENDIENTE DEL SUBSTRATO Y DE MENOR ESPESOR QUE EL DE ESTE.
ES89402242T 1988-08-23 1989-08-09 Soporte de circuito integrado de alta densidad y su procedimiento de fabricacion. Expired - Lifetime ES2067561T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8811107A FR2635916B1 (fr) 1988-08-23 1988-08-23 Support de circuit integre de haute densite et son procede de fabrication

Publications (1)

Publication Number Publication Date
ES2067561T3 true ES2067561T3 (es) 1995-04-01

Family

ID=9369456

Family Applications (1)

Application Number Title Priority Date Filing Date
ES89402242T Expired - Lifetime ES2067561T3 (es) 1988-08-23 1989-08-09 Soporte de circuito integrado de alta densidad y su procedimiento de fabricacion.

Country Status (6)

Country Link
US (1) US5057456A (es)
EP (1) EP0356300B1 (es)
JP (1) JPH0642503B2 (es)
DE (1) DE68919589T2 (es)
ES (1) ES2067561T3 (es)
FR (1) FR2635916B1 (es)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2923096B2 (ja) * 1991-09-10 1999-07-26 株式会社日立製作所 テープキャリアパッケージおよび高周波加熱はんだ接合装置
DE4135654A1 (de) * 1991-10-29 2003-03-27 Lockheed Corp Dichtgepackte Verbindungsstruktur, die eine Abstandshalterstruktur und einen Zwischenraum enthält
JP3215424B2 (ja) * 1992-03-24 2001-10-09 ユニシス・コーポレイション 微細自己整合特性を有する集積回路モジュール
JP2833996B2 (ja) * 1994-05-25 1998-12-09 日本電気株式会社 フレキシブルフィルム及びこれを有する半導体装置
US5567654A (en) * 1994-09-28 1996-10-22 International Business Machines Corporation Method and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packaging
FR2728392A1 (fr) * 1994-12-16 1996-06-21 Bull Sa Procede et support de connexion d'un circuit integre a un autre support par l'intermediaire de boules
US5652185A (en) * 1995-04-07 1997-07-29 National Semiconductor Corporation Maximized substrate design for grid array based assemblies
US6030857A (en) * 1996-03-11 2000-02-29 Micron Technology, Inc. Method for application of spray adhesive to a leadframe for chip bonding
US5810926A (en) * 1996-03-11 1998-09-22 Micron Technology, Inc. Method and apparatus for applying atomized adhesive to a leadframe for chip bonding
US6132798A (en) * 1998-08-13 2000-10-17 Micron Technology, Inc. Method for applying atomized adhesive to a leadframe for chip bonding
KR100209760B1 (ko) * 1996-12-19 1999-07-15 구본준 반도체 패키지 및 이의 제조방법
US5844308A (en) * 1997-08-20 1998-12-01 Cts Corporation Integrated circuit anti-bridging leads design
US6335225B1 (en) * 1998-02-20 2002-01-01 Micron Technology, Inc. High density direct connect LOC assembly

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3832769A (en) * 1971-05-26 1974-09-03 Minnesota Mining & Mfg Circuitry and method
US3838984A (en) * 1973-04-16 1974-10-01 Sperry Rand Corp Flexible carrier and interconnect for uncased ic chips
JPS5669850A (en) * 1979-11-09 1981-06-11 Citizen Watch Co Ltd Method for sealing semiconductor device
JPS5834934A (ja) * 1981-08-26 1983-03-01 Toshiba Corp 半導体装置
US4435740A (en) * 1981-10-30 1984-03-06 International Business Machines Corporation Electric circuit packaging member
FR2527036A1 (fr) * 1982-05-14 1983-11-18 Radiotechnique Compelec Procede pour connecter un semiconducteur a des elements d'un support, notamment d'une carte portative
JPS6035527A (ja) * 1983-08-08 1985-02-23 Hitachi Ltd 半導体装置の製造法およびそれに用いるテ−プ
JPS60113932A (ja) * 1983-11-26 1985-06-20 Mitsubishi Electric Corp 樹脂封止半導体装置の組立方法
JPS6230342A (ja) * 1985-07-31 1987-02-09 Nec Corp 半導体装置
JPS62216337A (ja) * 1986-03-18 1987-09-22 Fujitsu Ltd 半導体装置用のフイルムキヤリア
JPS62272546A (ja) * 1986-05-20 1987-11-26 Hitachi Cable Ltd 半導体装置用フイルムキヤリア
JPH0246744A (ja) * 1988-08-08 1990-02-16 Chisso Corp フイルムキヤリヤー

Also Published As

Publication number Publication date
US5057456A (en) 1991-10-15
DE68919589T2 (de) 1995-04-20
JPH02162746A (ja) 1990-06-22
JPH0642503B2 (ja) 1994-06-01
FR2635916A1 (fr) 1990-03-02
DE68919589D1 (de) 1995-01-12
FR2635916B1 (fr) 1990-10-12
EP0356300A1 (fr) 1990-02-28
EP0356300B1 (fr) 1994-11-30

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